Modularized chip test frame

Abstract

The utility model discloses a modularized chip test frame which comprises a plurality of main control modules, each main control module is provided with a mounting plate used for placing a chip, each mounting plate is movably provided with a test seat, a power supply module is arranged below each main control module, and the power supply modules are connected with the test seats. The main control module is detachably installed on the power supply modules, the periphery of each power supply module is provided with a connecting structure, and the plurality of power supply modules are mutually spliced through the connecting structures. Compared with the prior art, the number and the arrangement mode of the power modules and the main control modules can be flexibly adjusted according to the number of the chips needing to be tested, the efficiency of chip testing work is improved, and time and cost waste caused by replacement of testing equipment or layout adjustment is reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to chip testing technical field, especially a modularization chip test frame. BACKGROUND

[0002] In the field of chip manufacturing, chip testing is a key link to ensure product quality and performance standards. However, the existing technology faces a series of challenges when conducting chip testing. Specifically, when the number of chips to be tested changes, traditional testing equipment often lacks flexibility, requiring replacement of equipment or re-adjustment of layout to adapt to new testing needs. This process is not only cumbersome, but also time-consuming, which seriously affects testing efficiency. In addition, the existing testing equipment is usually designed as a whole structure, and once a component fails, the entire device often needs to be repaired, which not only increases the difficulty of repair, but also significantly increases the repair cost. SUMMARY

[0003] In view of the problem that the existing chip testing equipment cannot flexibly adjust the layout according to the number of chips to be tested, the utility model provides a modularization chip test frame.

[0004] The technical scheme of the utility model discloses a modularization chip test frame, which comprises a plurality of master control modules, an installation plate for placing chips is arranged on the master control module, a test seat is movably arranged on the installation plate, a power module is arranged below each master control module, the master control module is detachably installed on the power module, a connecting structure is arranged around each power module, and the plurality of power modules are spliced with each other through the connecting structure.

[0005] Further, the power module is rectangular, the connecting structure comprises a horizontal parallel pin at the left end of the power module, a horizontal parallel female connector at the right end of the power module, a vertical parallel pin at the lower end of the power module and a vertical parallel female connector at the upper end of the power module.

[0006] Further, the upper surface of the power module is provided with a power supply pin for power supply, and the bottom of the master control module is provided with a master control female connector matched with the power supply pin.

[0007] Further, the bottom of the master control module is further provided with a plurality of positioning tubes, and the upper surface of the power module is provided with a positioning column matched with the positioning tube.

[0008] Further, the test seat is movably installed on the installation plate through a rotating shaft, and the end of the test seat away from the rotating shaft is in abutment or separation with the installation plate with the movement of the rotating shaft.

[0009] Further, the master module is further provided with an LED lamp for displaying test results.

[0010] Compared with the prior art, the utility model can flexibly adjust the number and arrangement mode of the power module and the master module according to the number of chips to be tested, improve the efficiency of chip testing work, and reduce the time and cost waste caused by replacing test equipment or adjusting layout. BRIEF DESCRIPTION OF DRAWINGS

[0011] In order to more clearly illustrate the technical scheme in the embodiments of the utility model, the following will briefly introduce the drawings needed to be used in the embodiment or prior art description, obviously, the drawings in the following description are only some embodiments of the utility model, and for those skilled in the art, other drawings can also be obtained according to these drawings without creative labor.

[0012] Figure 1 It is the overall structure schematic diagram of the utility model.

[0013] Figure 2 It is the schematic diagram of the master module of the utility model being installed on the power module.

[0014] Figure 3 It is the master module structure schematic diagram of the utility model.

[0015] Figure 4 It is the power module structure schematic diagram of the utility model.

[0016] Among them, master module 1, test seat 2, mounting plate 3, LED lamp 4, positioning pipe 5, master row female 6, chip 7, power module 8, positioning column 9, power supply row pin 10, horizontal parallel row pin 11, horizontal parallel row female 12, longitudinal parallel row pin 13, longitudinal parallel row female 14. DETAILED DESCRIPTION

[0017] In order to make the technical problem, technical scheme and beneficial effect to be solved by the utility model more clearly, the following will be further detailed to the utility model by combining with the drawings and embodiments.It should be understood that the specific embodiments described here are only used to explain the utility model, and are not used to limit the utility model.

[0018] Therefore, one feature indicated in the specification will be used to explain one feature of one embodiment of the utility model, and not imply that each embodiment of the utility model must have the explained feature.In addition, it should be noted that the specification describes many features.Although certain features can be combined together to show possible system design, these features can also be used in other combinations which are not explicitly explained.Thus, unless otherwise specified, the explained combination is not intended to limit.

[0019] In the description of the present application, the terms "first", "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance.

[0020] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0021] The principles and structures of the present application will be described in detail below in conjunction with the drawings and embodiments.

[0022] A modular chip test rack comprises a plurality of master control modules 1, the master control module 1 is provided with a mounting plate 3 for placing a chip 7, a test seat 2 is movably arranged on the mounting plate 3, each master control module 1 is provided with a power module 8, the master control module 1 is detachably mounted on the power module 8, a connecting structure is arranged around each power module 8, and the plurality of power modules 8 are spliced with each other through the connecting structure.

[0023] Further, the power module 8 is rectangular in shape, the connecting structure comprises a horizontal parallel pin 11 at the left end of the power module 8, a horizontal parallel female connector 12 at the right end of the power module 8, a vertical parallel pin 13 at the lower end of the power module 8, and a vertical parallel female connector 14 at the upper end of the power module 8.

[0024] Further, the upper surface of the power module 8 is provided with a power supply pin 10 for power supply, and the bottom of the master control module 1 is provided with a master control female connector 6 matched with the power supply pin 10.

[0025] Further, the bottom of the master control module 1 is further provided with a plurality of positioning tubes 5, and the upper surface of the power module 8 is provided with a positioning column 9 matched with the positioning tube 5.

[0026] Further, the test seat 2 is movably mounted on the mounting plate 3 through a rotating shaft, and the end of the test seat 2 away from the rotating shaft abuts against or separates from the mounting plate 3 with the movement of the rotating shaft.

[0027] Further, the master control module 1 is further provided with an LED lamp 4 for displaying test results.

[0028] In one specific embodiment, as Figures 1 to 4As shown, the modular chip testing rack proposed in the present application is mainly used for testing the chip 7. This is because after the chip 7 is manufactured, various tests need to be performed on the chip 7 to ensure that the quality and performance of the chip 7 meet the standards. In short, the modular chip testing rack proposed in the present application is a device for checking whether the manufactured chip 7 is intact and functions normally. The present application includes a plurality of master control modules 1 and a number of power modules 8 matched with the master control modules 1, and the master control modules 1 are detachably installed on the power modules 8.

[0029] Specifically, one master control module 1 is installed on each power module 8, and a power supply pin header 10 for power supply is arranged on the upper surface of the power module 8. Two groups of power supply pin headers 10 are arranged on each power module 8, respectively on the left and right sides of the upper surface of the power module 8. A master control female header 6 matched with the position of the power supply pin header 10 is arranged on the lower bottom surface of the master control module 1, and when the master control module 1 is installed on the power module 8, the power supply pin header 10 on the power module 8 is inserted into the master control female header 6 on the master control module 1, thereby forming an electrical connection between the master control module 1 and the power module 8.

[0030] Here, an installation plate 3 is arranged on the upper surface of each master control module 1, and the chip 7 to be tested is placed on the installation plate 3, and the installation plate 3 is provided with a slot for inserting the chip 7. The bottom end of the test seat 2 is movably installed on the installation plate 3 through a pivot, so that the test seat 2 can move with the pivot. In actual use, first, the chip 7 to be tested is inserted into the slot on the installation plate 3, and then the bottom end of the test seat 2 away from the pivot is abutted with the upper surface of the installation plate 3, at this time the test seat 2 covers the chip 7 on the installation plate 3, and the chip 7 is tested through the test seat 2, when the test is completed, the bottom end of the test seat 2 away from the pivot is separated from the upper surface of the installation plate 3, so that the chip 7 on the installation plate 3 is exposed, and the operator can take away the tested chip 7 from the installation plate 3.

[0031] And an LED lamp 4 is arranged on the upper surface of each master control module 1, and the LED lamp 4 can emit different color light signals to show the test result of the chip 7 being tested on the master control module 1. For example, if the tested chip 7 functions normally, the LED lamp 4 emits green light, and if the tested chip 7 does not function normally, the LED lamp 4 emits red light. Through the different color light signals emitted by the LED lamp 4, the operator can intuitively judge whether the tested chip 7 is qualified, so as to take away the qualified chip 7 and collect the unqualified chip 7 for processing.

[0032] To facilitate easier installation of the main control module 1 onto the power module 8, multiple positioning posts 9 are provided on the upper surface of the power module 8, and correspondingly, multiple positioning tubes 5 are provided on the lower surface of the main control module 1. When the main control module 1 needs to be installed onto the power module 8, the positioning posts 9 and positioning tubes 5 work together to quickly align the main control module 1 and the power module 8, ensuring that the main control header 6 on the main control module 1 and the power header 10 on the power module 8 are properly connected. This simplifies the installation process of the main control module 1 and improves the overall installation efficiency.

[0033] It should be noted that each power module 8 is rectangular in shape, with connection structures on all four sides. Specifically, the connection structure consists of four parts: horizontal parallel pin headers 11, horizontal parallel female headers 12, vertical parallel pin headers 13, and vertical parallel female headers 14. For example... Figure 4 As shown, horizontal parallel connectors are located at the left end of power module 8, and horizontal parallel connectors 12 are located at the right end of power module 8. This design allows power modules 8 to be joined side-by-side. For example, if another power module 8 needs to be installed on the right end of a power module 8, simply insert the horizontal parallel connectors on the left end of the latter power module 8 into the horizontal parallel connectors 12 on the right end of the former power module 8 to complete the left-right connection. Furthermore, vertical parallel connectors 13 are located at the lower end of power module 8, and vertical parallel connectors 14 are located at the upper end of power module 8. This design allows power modules 8 to be joined vertically. For example, if another power module 8 needs to be installed on top of a power module 8, simply insert the vertical parallel connectors 13 at the lower end of the latter power module 8 into the vertical parallel connectors 14 at the upper end of the former power module 8 to complete the vertical connection. This connection structure design allows power modules 8 to be freely combined vertically, horizontally, and vertically, thus achieving modular configuration. The modular design allows operators to flexibly adjust the number and arrangement of power modules 8 and main control modules 1 according to the number of chips 7 to be tested. Specifically, when the number of chips 7 to be tested changes, operators can simply add or remove the corresponding number of power modules 8 and main control modules 1 to quickly adapt the application to the new testing task. This not only improves the efficiency of chip 7 testing but also reduces the time and cost waste caused by changing testing equipment or adjusting the layout.

[0034] And since the master module 1 is detachably arranged on the power module 8, and the plurality of power modules 8 are connected in parallel, when any one of the master module 1 or the power module 8 fails, the operator can quickly replace or repair the single power module 8 or the master module 1 without replacing or repairing the whole modular chip test rack, thereby reducing the maintenance time and cost.

[0035] The above merely describes the preferred embodiments of the present application and is not intended to limit the present application, and any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A modular chip test fixture, comprising multiple main control modules (1), characterized in that, The main control module (1) is provided with a mounting plate (3) for placing the chip (7). A test socket (2) is movably provided on the mounting plate (3). Each main control module (1) is provided with a power module (8). The main control module (1) is detachably installed on the power module (8). Each power module (8) is provided with a connection structure around its perimeter. Multiple power modules (8) are spliced ​​together through the connection structure. The power module (8) is rectangular in shape. The connection structure includes a horizontal parallel pin header (11) located at the left end of the power module (8), a horizontal parallel female header (12) located at the right end of the power module (8), a vertical parallel pin header (13) located at the lower end of the power module (8), and a vertical parallel female header (14) located at the upper end of the power module (8). The upper surface of the power module (8) is provided with a power pin header (10) for power supply. The bottom of the main control module (1) is provided with a main control female header (6) that matches the power pin header (10).

2. The modular chip test fixture according to claim 1, characterized in that, The bottom of the main control module (1) is also provided with multiple positioning tubes (5), and the upper surface of the power module (8) is provided with positioning posts (9) that match the positioning tubes (5).

3. A modular chip test fixture according to claim 1, characterized in that, The test seat (2) is movably mounted on the mounting plate (3) via a rotating shaft. The end of the test seat (2) away from the rotating shaft moves with the rotating shaft and abuts against or separates from the mounting plate (3).

4. A modular chip test fixture according to claim 1, characterized in that, The main control module (1) is also equipped with an LED light (4) for displaying test results.

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