Optical module with asymmetric heat sink structure

Abstract

The utility model provides an optical module with an asymmetric heat sink structure, which comprises an upper shell, a heat sink block, a light emitting assembly, a light receiving assembly, an optical chip, a PCB (Printed Circuit Board) and a lower shell, the heat sink block is of an asymmetric structure, is integrally formed and comprises a first substrate and a second substrate which are arranged in parallel, and a first side plate and a second side plate are arranged on two sides of the first substrate; forming a first channel for installing the light emitting assembly and the optical chip; one side of the second substrate is connected with the outer wall of the lower end of the second side plate, and the other side is provided with a third side plate to form a second channel for installing the light receiving assembly; the heat sink block is fixed on the lower shell, one end of the PCB is fixed on the heat sink block, and the other end of the PCB is arranged on the lower shell; the lower shell comprises a bottom plate, a fourth side plate and a fifth side plate, wherein the fourth side plate and the fifth side plate are located on the same straight line with the first side plate and the third side plate. The two sides of the upper shell are correspondingly connected with the first side plate, the third side plate, the fourth side plate and the fifth side plate respectively. According to the utility model, each photoelectric device can be ensured to achieve a good heat dissipation effect, and signal transmission is stable.

Description

TECHNICAL FIELD

[0001] The utility model belongs to optical communication technical field, especially related to a light module with asymmetric heat sink structure. BACKGROUND

[0002] With data center to 400G and 800G high speed upgrade, optical module single channel baud rate breaks through 56Gbaud, multi-channel integration leads to power density sharp escalation. With typical 400G optical module as example, the combination of 4 CW lasers (each power consumption 2.5W) and AWG receiver makes local power density reach 20W / cm² or more. When laser chip junction temperature rises by 10 DEG C, optical power attenuation is about 5%, when temperature exceeds 85 DEG C, device life is shortened by 50% or more.

[0003] Traditional optical module adopts symmetric heat sink, and the transmitting assembly and the receiving assembly are symmetrically arranged, and the local heat flow density exceeds 10W / cm² due to the concentrated layout of the multi-channel laser, and the heat sink thermal resistance is generally higher than 0.5 DEG C / W. Due to the non-uniform distribution of heat source, the temperature difference between the light emitting area and the receiving area reaches 15 DEG C or more, which seriously affects the signal stability, and the heat dissipation efficiency is insufficient, which is difficult to meet the heat dissipation demand of 400G and 800G modules. Moreover, the symmetric structure needs to reserve a redundant heat dissipation area, and the layout of large devices such as AWG receiver is limited, which leads to an increase of 20% or more in the volume of the module, and the space utilization is low. At the same time, the symmetric layout does not effectively isolate the electromagnetic radiation of the transmitting end and the receiving end, and the EMI noise is coupled to the receiving circuit, which leads to the aggravation of signal interference and the increase of bit error rate to 10 ⁻10 order of magnitude. SUMMARY

[0004] The utility model aims at overcoming prior art defects, and provides a light module with asymmetric heat sink structure.

[0005] The light module with asymmetric heat sink structure provided by the utility model comprises:

[0006] The upper shell, the heat sink block, the light emitting assembly, the light receiving assembly, the optical chip, the PCB board and the lower shell,

[0007] The heat sink block is of asymmetric structure and is integrally formed, comprising first base plate and second base plate arranged in parallel, first side plate and second side plate are vertically extended upwards and arranged on both sides of the first base plate along the length direction, forming the first channel for mounting the light emitting assembly and the optical chip, one side of the second base plate along the length direction is connected with the lower end outer wall of the second side plate, and the third side plate is vertically extended upwards and arranged on the other side of the second base plate along the length direction, forming the second channel for mounting the light receiving assembly.

[0008] The heat sink block is fixed on the lower housing, one end of the PCB board is fixed on the heat sink block, and the other end of the PCB board is placed on the lower housing;

[0009] The lower housing includes a bottom plate, a fourth side plate and a fifth side plate extending vertically upward from both sides along the length of the bottom plate, and the fourth side plate and the fifth side plate are respectively on the same straight line as the first side plate and the third side plate;

[0010] The two sides of the upper shell are respectively connected to the first side plate and the third side plate of the heat sink block, and the fourth side plate and the fifth side plate of the lower shell.

[0011] Optionally, the first substrate includes a support plate, the front portion of the support plate has a first cavity that is horizontally open from top to bottom, the rear portion of the support plate has a first hollow area, and the optical chip is embedded in the first hollow area; a second groove is also provided between the first cavity and the first hollow area, and the emitting component is placed in the second groove.

[0012] Optionally, a second cavity with an outward opening is provided between the first side plate and the third side plate.

[0013] Optionally, the PCB board is connected to the optical chip and the optical receiving component via a first connector and a second connector, respectively.

[0014] Optionally, the inner side of the rear end of the first side plate is provided with a first positioning groove, the inner side of the fourth side plate is provided with a second positioning groove, the inner side of the fifth side plate is provided with a third positioning groove, the front end of the PCB board is provided with a first positioning block that can be locked in the first positioning groove and the third positioning groove in the outward lateral direction, and the rear end of the PCB board is provided with a second positioning block that can be locked in the second positioning groove and the third positioning groove in the outward lateral direction.

[0015] Optionally, the front end of the PCB board is provided with a fourth positioning groove that can be snapped onto the second side plate.

[0016] Optionally, the lower housing further includes a top plate located at the front end of the bottom plate, forming a stepped structure with the bottom plate. A stop is provided between the bottom plate and the top plate, and two externally connectable ends are arranged side by side on the stop.

[0017] Optionally, at least two first locking grooves are provided on both sides of the bottom of the heat sink block along the length direction, and first locking blocks that cooperate with the first locking grooves are provided on both sides of the lower housing along the length direction.

[0018] Optionally, the top of the first side plate is provided with at least two second locking slots along the length direction, the top of the third side plate is provided with at least two third locking slots along the length direction, and the bottom sides of the upper housing are provided with second locking blocks that cooperate with the second locking slots and the third locking slots.

[0019] The optical module structure provided by this utility model adopts an asymmetrical structure design for the heat sink, and the optoelectronic devices are arranged in two separate channels with isolation spaces between them, which is conducive to heat dissipation of each optoelectronic device. Furthermore, two transparent heat dissipation spaces are provided within the channels for the optical emitting component and the optical receiving component. While realizing the rational layout of the optoelectronic devices, the efficient heat dissipation of the optical module and the signal integrity are simultaneously improved, ensuring the stable operation of the optoelectronic devices and meeting the long-term reliability requirements of 400G and 800G optical modules. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the structure of an embodiment of the present utility model. Figure One ;

[0021] Figure 2 This is a schematic diagram of the structure of an embodiment of the present utility model. Figure Two ;

[0022] Figure 3 This is a schematic diagram of the asymmetric heat sink block structure in an embodiment of this utility model. Figure One ;

[0023] Figure 4 This is a schematic diagram of the asymmetric heat sink block structure in an embodiment of this utility model. Figure Two ;

[0024] Figure 5 This is a schematic diagram of the upper shell structure in an embodiment of this utility model;

[0025] Figure 6 This is a schematic diagram of the lower shell structure in an embodiment of this utility model. Detailed Implementation

[0026] To make the objectives, technical solutions, and advantages of this utility model clearer, the following detailed description is provided in conjunction with embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this utility model.

[0027] It should be noted that when a component is referred to as "connected," "provided with," or "set on" another component, it can be directly on the other component or may have an intervening component present at the same time. Furthermore, the "connection" between components includes both "mechanical connection" and "electrical connection."

[0028] It should also be noted that the directional terms such as "one end," "the other end," "upper," "lower," "front end," "rear end," and "both sides" used in the embodiments of this utility model are only relative concepts or are based on the normal use state of the product, or are based on the positions shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be considered restrictive. For ease of explanation, in the embodiments shown in this utility model, "Q" in the accompanying drawings represents the front end, and "H" represents the rear end.

[0029] See Figures 1-4 The optical module with an asymmetric heat sink structure in this embodiment of the invention includes:

[0030] The components include: upper housing 1, heat sink 2, light emitting assembly 4, light receiving assembly 5, optical chip 6, PCB board 9, and lower housing 3. (See also...) Figures 3-4 Heat sink 2 has an asymmetric structure and is made of tungsten-copper alloy material (thermal conductivity ≥200.00 W•m). -1 •K -1 The coefficient of thermal expansion is 7.4–7.9 × 10⁻⁶. -6 K -1 The optical emission assembly 4 and the optical chip 6 are integrally formed by injection molding, comprising a first substrate 21 and a second substrate 24. The first substrate 21 and the second substrate 24 are arranged in parallel. A first side plate 22 and a second side plate 23 extend vertically upward from both sides of the first substrate 21 along its length, respectively. Thus, the first substrate 21, the first side plate 22 and the second side plate 23 enclose a first channel A with an upper opening, for mounting the optical emission assembly 4 and the optical chip 6. The optical emission assembly 4 integrates a multi-channel continuous wave laser, which includes four integrated continuous wave lasers. The optical chip 6 is a silicon photonic chip used for high-speed, high-bandwidth data transmission and processing. The optical emission assembly 4 is located at the front end of the first substrate 21, and the optical chip 6 is located at the rear end of the first substrate 21. One side of the second substrate 24 along its length is horizontally connected to the lower outer wall of the second side plate 23, integrally formed. A third side plate 25 extends vertically upward from the other side of the second substrate 24 along its length. The third side plate 25 is parallel to the first side plate 22 and the second side plate 23, and is spaced at a certain distance from the rear end of the second side plate 23. A second channel B with an upper opening is formed by the second substrate 24, the second side plate 23 and the third side plate 25, which is used to install the optical receiving component 5. The optical receiving component 5 integrates a demultiplexer and a photodetector. The demultiplexer is an arrayed waveguide grating demultiplexer and the photodetector consists of 4 detectors.

[0031] See Figures 1-3 and Figure 6The heat sink 2 is fixed on the lower housing 3. The PCB board 9 is a flexible circuit board. One end of the PCB board 9 is fixed on the heat sink 2 and connected to the optical chip 6 and the optical receiving component 5. The optical chip 6 is connected to the optical emitting component 4. The other end of the PCB board 9 is placed on the lower housing 3. The lower housing 3 includes a base plate 31. A fourth side plate 32 and a fifth side plate 33 are vertically extended upward from both sides of the rear end of the lower housing 3 along the length direction of the base plate 31. When the heat sink 2 is fixed on the lower housing 3, the fourth side plate 32 is aligned with the first side plate 22 in the length direction, and the fifth side plate 33 is aligned with the third side plate 25 in the length direction, so that the fourth side plate 32 and the fifth side plate 33 are on the same straight line as the first side plate 22 and the third side plate 25, respectively.

[0032] See Figures 1-3 The two sides of the upper housing 1 are respectively connected to the first side plate 22 and the third side plate 25 in the heat sink block 2 and the fourth side plate 32 and the fifth side plate 33 in the lower housing 3, so that each device is covered in the cavity formed by the upper housing 1 and the lower housing 3 along with the heat sink block 2.

[0033] In the above structure, the heat sink block 2 adopts an asymmetrical structural design and is integrally formed, so that the optical emitting component 4 and the optical receiving component 5 are installed in two channels of different lengths in the heat sink block 2, with isolation space between them, which is conducive to the heat dissipation of each optoelectronic device. While realizing the reasonable layout of optoelectronic devices, it can achieve a good heat dissipation effect. At the same time, the upper shell 1 and the lower shell 3 form an electromagnetic shielding cavity to ensure the stable operation of optoelectronic devices, improve the signal processing capability of optical modules, and meet the requirements of optical communication field for the heat dissipation performance and operational reliability of optical modules.

[0034] See Figure 3 and Figure 4 In this embodiment of the present invention, the first substrate 21 includes a support plate 211. The front portion of the support plate 211 has a first cavity 2111 that is horizontally open from top to bottom, and the rear portion of the support plate 211 has a first hollow area 2114, in which the optical chip 6 can be embedded and installed. At the middle position of the support plate 211 along its length, there is a first groove 2113 that intersects and is perpendicular to the first cavity 2111. The first groove 2113 communicates with the first hollow area 2114 and is divided into two parts by the first cavity 2111. Between the first cavity 2111 and the first hollow area 2114, there is also a second groove 2112. The width of the second groove 2112 is greater than the width of the first groove 2113. The emitting component 4 is placed in the second groove 2112 and its bottom is embedded in the first groove 2113 for positioning and fixation. When the light emitting component 4 is placed on the support plate 211, its bottom has a transparent first cavity 2111. This ensures that the light emitting component 4 has good heat dissipation space while being installed, thus achieving a better heat dissipation effect. See also Figure 3On the front portion of the second substrate 24, a second cavity 242 that is horizontally and vertically transparent is also provided. At the midpoint of the length direction of the second substrate 24, a third groove 241 and a fourth groove 243, perpendicular to the second cavity 242, are respectively provided. The bottom of the light receiving component 5 is embedded in the third groove 241 and positioned and fixed within the fourth groove 243. Similarly, because the bottom of the light receiving component 5 has a transparent second cavity 242, the light receiving component 5 has good heat dissipation space, thus achieving a good heat dissipation effect.

[0035] Please see again. Figure 3 In this embodiment of the invention, a third cavity 26 with an outward opening is provided between the first side plate 22 and the third side plate 25, making the length of the second side plate 23 less than the length of the first side plate 22. The third cavity 26 allows the front ends of the light emitting component 4 and the light receiving component 5 to be unsupported, providing two transparent heat dissipation spaces for both the light emitting component 4 and the light receiving component 5, further improving their heat dissipation performance.

[0036] See Figure 2 In this embodiment of the invention, the PCB board 9 is connected to the optical chip 6 and the optical receiving component 5 via the first connector 7 and the second connector 8, respectively. The optical chip 6 is connected to the optical emitting component 4. The PCB board 9 is provided with a functional chip 10, which includes at least one of a driver chip, a transimpedance amplifier chip, a clock data recovery chip, a digital signal processor chip, or a microcontroller chip. Both the first connector 7 and the second connector 8 are flexible components. One end of the first connector 7 is inserted into the socket 61 of the optical chip 6, and the other end overlaps with the first connection end 94 on the PCB board 9. One end of the second connector 8 is connected to the optical receiving component 5, and the other end overlaps with the second connection end 95 on the PCB board 9.

[0037] See Figure 3 and Figure 6 In this embodiment of the present invention, a first positioning groove 222 is provided on the inner side of the rear end of the first side plate 22 of the heat sink block 2; a second positioning groove 321 is provided on the inner side of the fourth side plate 32 of the lower housing 3; and a third positioning groove 331 is provided on the inner side of the fifth side plate 33. See also... Figure 2 On the front end of the PCB board 9, outwardly laterally, there are two first positioning blocks 91 respectively, which can be respectively locked onto the first positioning groove 222 and the third positioning groove 331; on the rear end of the PCB board 9, outwardly laterally, there are two second positioning blocks 92 respectively, which can be respectively locked onto the second positioning groove 321 and the third positioning groove 331, so that one end of the PCB board 9 is fixed on the heat sink block 2 and the other end is fixed on the lower housing 3.

[0038] See alsoFigure 1 and Figure 2 In this embodiment of the present invention, a fourth positioning groove 93 is provided at the front end of the PCB board 9. When the PCB board 9 is installed on the heat sink block 2, it can be snapped onto the second side plate 23 to further ensure the positioning and fixation of the PCB board 9.

[0039] See Figure 6 The lower housing 3 also includes a top plate 34, which is located at the front end of the bottom plate 31 and forms a stepped structure with the bottom plate 31. There is a stop 35 between the bottom plate 31 and the top plate 34. Two externally connected ends 351 are arranged side by side on the stop 35 for connecting to the light emitting component 4 and the light receiving component 5.

[0040] See also Figure 2 , Figure 4 and Figure 6 In this embodiment of the invention, at least two first locking grooves 27 are provided on both sides of the bottom of the heat sink block 2 along the length direction; and on both sides of the lower housing 3 along the length direction, first locking blocks 36 are provided upwards to cooperate with the first locking grooves 27. When the heat sink block 2 is fixed on the lower housing 3, it can be fixed by the first locking blocks 36 aligning and engaging with the first locking grooves 27, ensuring the installation accuracy of the heat sink block 2 on the lower housing 3.

[0041] See also Figure 3 and Figure 5 In this embodiment of the invention, at least two second locking grooves 221 are provided along the length direction on the top of the first side plate 22 of the heat sink block 2, and at least two third locking grooves 251 are provided along the length direction on the top of the third side plate 25. On both sides of the bottom of the upper housing 1, second locking blocks 11 are provided corresponding to and cooperate with the second locking grooves 221 and the third locking grooves 251. When the upper housing 1 and the lower housing 3 are docked and fixed, the upper housing 1 can be positioned on the heat sink block 2 by aligning and engaging the second locking blocks 11 with the second locking grooves 221 and the third locking grooves 251. Then, fasteners are used to connect and fix the upper housing 1 and the lower housing 3, ensuring the installation accuracy between the upper housing 1 and the lower housing 3.

[0042] In the above structural design, the embedded cooperation of the positioning block and the positioning slot structure can effectively ensure the precise alignment and fixation between the upper shell 1, the heat sink block 2 and the lower shell 3, with a positioning accuracy error of no more than 0.01mm.

[0043] The above embodiments of this utility model are only part of the preferred embodiments of this utility model and should not be construed as limiting this utility model. Any modifications, changes, substitutions and variations made by those skilled in the art without departing from the spirit of this utility model shall be within the protection scope of this utility model.

Claims

1. An optical module with an asymmetric heat sink structure, characterized in that, include: Upper housing, heat sink, light emitting assembly, light receiving assembly, optical chip, PCB board, and lower housing. The heat sink has an asymmetrical structure and is integrally formed. It includes a first substrate and a second substrate arranged in parallel. A first side plate and a second side plate are respectively provided on both sides of the length direction of the first substrate, forming a first channel for mounting the light emitting component and the light chip. One side of the length direction of the second substrate is connected to the lower outer wall of the second side plate, and a third side plate is provided on the other side of the length direction of the second substrate, forming a second channel for mounting the light receiving component. The heat sink block is fixed on the lower housing, one end of the PCB board is fixed on the heat sink block, and the other end of the PCB board is placed on the lower housing; The lower housing includes a bottom plate, a fourth side plate and a fifth side plate extending vertically upward from both sides along the length of the bottom plate, and the fourth side plate and the fifth side plate are respectively on the same straight line as the first side plate and the third side plate; The two sides of the upper shell are respectively connected to the first side plate and the third side plate of the heat sink block, and the fourth side plate and the fifth side plate of the lower shell.

2. The optical module with an asymmetric heat sink structure according to claim 1, characterized in that, The first substrate includes a support plate, the front part of which has a first cavity that is open from top to bottom, and the rear part of which has a first hollow area. The optical chip is embedded in the first hollow area. A second groove is also provided between the first cavity and the first hollow area, and the emitting component is placed in the second groove.

3. The optical module with an asymmetric heat sink structure according to claim 1 or 2, characterized in that, There is a second cavity with an outward opening between the first side plate and the third side plate.

4. The optical module with an asymmetric heat sink structure according to claim 1, characterized in that, The PCB board is connected to the optical chip and the optical receiving component via a first connector and a second connector, respectively.

5. The optical module with an asymmetric heat sink structure according to claim 1 or 4, characterized in that, The inner side of the rear end of the first side plate is provided with a first positioning groove, the inner side of the fourth side plate is provided with a second positioning groove, the inner side of the fifth side plate is provided with a third positioning groove, the front end of the PCB board is provided with a first positioning block that can be locked in the first positioning groove and the third positioning groove in the outward lateral direction, and the rear end of the PCB board is provided with a second positioning block that can be locked in the second positioning groove and the third positioning groove in the outward lateral direction.

6. The optical module with an asymmetric heat sink structure according to claim 5, characterized in that, The front end of the PCB board is provided with a fourth positioning groove that can be snapped onto the second side plate.

7. The optical module with an asymmetric heat sink structure according to claim 1, characterized in that, The lower housing also includes a top plate, which is located at the front end of the bottom plate and forms a stepped structure with the bottom plate. There is a stop between the bottom plate and the top plate, and two externally connectable ends are arranged side by side on the stop.

8. The optical module with an asymmetric heat sink structure according to claim 1, characterized in that, At least two first locking slots are provided on both sides of the bottom of the heat sink block along the length direction, and first locking blocks that cooperate with the first locking slots are provided on both sides of the lower housing along the length direction.

9. The optical module with an asymmetric heat sink structure according to claim 1 or 8, characterized in that, The top of the first side plate has at least two second locking slots along the length direction, the top of the third side plate has at least two third locking slots along the length direction, and the bottom sides of the upper housing have corresponding second locking blocks that cooperate with the second locking slots and the third locking slots.

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