Display module and display device

Abstract

The utility model discloses a display module and a display device, the display module comprises a backlight module, a display panel and a conductive connecting part, and the backlight module comprises a back plate and a middle frame; the display panel is arranged on the light emitting side of the backlight module, and at least part of the middle frame is located between the back plate and the display panel; the conductive connecting part is arranged on the display panel; wherein one part of the back plate penetrates through the middle frame and is connected with the conductive connecting part to form a conductive path. The display effect can be improved.

Description

Technical Field

[0001] This application relates to the field of display technology, specifically to a display module and a display device. Background Technology

[0002] An open cell (OC) liquid crystal panel, which consists of a color filter substrate, an array substrate, and a liquid crystal layer between them, lacks a path for releasing static electricity. When electrostatic discharge (ESD) occurs in the liquid crystal panel, the structure of the liquid crystal panel will be damaged, affecting the display effect.

[0003] To prevent the LCD panel from being affected by electrostatic discharge, related technologies typically connect an independent grounding line to the array substrate. However, an independent grounding line leads to a complex display module structure and wiring, and an open circuit in the independent grounding line can affect the electrostatic discharge of the LCD panel, thus impacting the display effect.

[0004] Therefore, it is necessary to propose a new technical solution to solve the above-mentioned technical problems. Utility Model Content

[0005] The purpose of this application is to provide a display module and display device to improve the display effect.

[0006] To solve the above problems, the technical solution of this application is as follows:

[0007] In a first aspect, this application proposes a display module, comprising:

[0008] Backlight module, including back panel and mid-frame;

[0009] A display panel is disposed on the light-emitting side of the backlight module, and at least a portion of the middle frame is located between the back panel and the display panel; and

[0010] A conductive connection portion is provided on the display panel;

[0011] A portion of the back plate passes through the middle frame and connects to the conductive connection portion to form a conductive path.

[0012] In one embodiment of this application, the conductive connection portion is disposed on the side of the display panel near the backlight module.

[0013] In one embodiment of this application, the backplate includes:

[0014] Base plate; and

[0015] A side panel is provided around the edge of the base plate, and a portion of the side panel passes through the middle frame and connects to the conductive connection portion to form the conductive path;

[0016] The conductive connection portion connects the display panel and the side panel.

[0017] In one embodiment of this application, the side plate includes:

[0018] The first side portion surrounds the edge of the base plate and is located between the base plate and the middle frame; and

[0019] The second side is connected to the side of the first side away from the bottom plate. The second side passes through the middle frame and is connected to the conductive connection part to form the conductive path.

[0020] In one embodiment of this application, the display module further includes a first buffer portion, which is located between the conductive connection portion and the back plate. The first buffer portion connects the conductive connection portion and the back plate and forms the conductive path.

[0021] In one embodiment of this application, the first buffer portion is conductive foam;

[0022] The first buffer section is black;

[0023] The material of the conductive connection includes one of silver, copper, gold, aluminum, molybdenum, and iron;

[0024] The material of the backplate includes metal.

[0025] In one embodiment of this application, the display panel includes:

[0026] A first substrate is disposed on the light-emitting side of the backlight module; and

[0027] The second substrate is disposed on the side of the first substrate away from the backlight module, and one edge of the second substrate extends beyond the edge of the first substrate. A ground terminal is provided on the portion of the second substrate that extends beyond the first substrate.

[0028] The conductive connection portion is located at the grounding terminal.

[0029] In one embodiment of this application, a boss is provided on the side of the middle frame near the display panel;

[0030] The first buffer portion is disposed on the boss, and a portion of the back plate passes through the middle frame and the boss and is connected to the first buffer portion.

[0031] In one embodiment of this application, the display module further includes:

[0032] A flip-chip film, one end of which is bonded to the second substrate on the side extending beyond the edge of the first substrate and close to the backlight module; and

[0033] The second buffer portion is provided on the side of the protrusion near the display panel, and the side of the second buffer portion near the display panel abuts against the surface of the flip-chip film;

[0034] The first buffer section is connected to at least one end of the second buffer section.

[0035] In one embodiment of this application, the boss is integrally formed with the middle frame;

[0036] The first buffer part and the second buffer part are integrally formed.

[0037] In one embodiment of this application, the second buffer portion is an elastomer;

[0038] The hardness of the second buffer section is in the range of 30 to 50 degrees;

[0039] The first buffer section is located at both ends of the second buffer section along its length.

[0040] Secondly, this application proposes a display device including a display module, the display module including a backlight module, a display panel, and a conductive connection portion, the backlight module including a back plate and a middle frame; the display panel is disposed on the light-emitting side of the backlight module, at least a portion of the middle frame is located between the back plate and the display panel; the conductive connection portion is disposed on the display panel; wherein a portion of the back plate passes through the middle frame and connects to the conductive connection portion to form a conductive path.

[0041] In this application, a conductive path is formed by extending a portion of the back panel through the mid-frame and connecting it to a conductive connection portion located on the display panel. When static electricity is generated inside the display panel, it is released from the display panel to the back panel through the conductive path, thereby preventing electrostatic discharge from damaging the circuitry inside the display panel. Compared to the use of independent grounding lines in related technologies, this application eliminates the need for such lines. Instead, a conductive path is formed between the display panel and the back panel, utilizing the back panel to release static electricity from the display panel. This solves the problems of complex module structure and wiring caused by independent grounding lines in related technologies, and improves the display effect. Attached Figure Description

[0042] Figure 1 This is a schematic diagram of an embodiment of the display module of this application;

[0043] Figure 2 This is a schematic diagram of the display panel and conductive connection portion of this application;

[0044] Figure 3 This is a schematic diagram of another embodiment of the display module of this application;

[0045] Figure 4 This is a schematic diagram of yet another embodiment of the display module of this application. Detailed Implementation

[0046] The terms used in this specification and claims have the meanings that are commonly understood by one of ordinary skill in the art to which this application pertains. The terms used in this specification and claims are for the purpose of facilitating the description and understanding of this application only, and are not intended to limit this application to the narrow interpretation of the specific terms used in the specification and claims.

[0047] This application discloses a display device, which can be a tablet computer, e-reader, electronic display screen, laptop computer, mobile phone, augmented reality (AR) / virtual reality (VR) device, media player, wearable device, digital camera, car navigation system, etc. The display device includes a display module 100.

[0048] Please see Figure 1 This application proposes a display module 100, which includes a display panel 20.

[0049] In this application, the display panel 20 may be a liquid crystal display (LCD) panel. Subsequent embodiments will be described using the liquid crystal display panel 20 as an example.

[0050] The display panel 20 also includes a backlight module 10 and a conductive connection portion 30.

[0051] The backlight module 10 includes a back plate 11 and a mid-frame 12. A display panel 20 is disposed on the light-emitting side of the backlight module 10. At least a portion of the mid-frame 12 is located between the back plate 11 and the display panel 20. A conductive connection portion 30 is disposed on the display panel 20.

[0052] A portion of the back plate 11 passes through the middle frame 12 and connects to the conductive connection part 30 to form a conductive path.

[0053] In this embodiment, a conductive path is formed by passing a portion of the back plate 11 through the middle frame 12 and connecting it to the conductive connection portion 30 provided on the display panel 20. When static electricity is generated inside the display panel 20, the static electricity is released from the display panel 20 to the back plate 11 through the conductive path, thereby preventing electrostatic discharge from damaging the circuitry inside the display panel 20. Compared to the independent grounding lines in related technologies, this application does not require independent grounding lines. Instead, a conductive path is formed between the display panel 20 and the back plate 11, and the back plate 11 is used to release static electricity from the display panel 20. This solves the problem of complex module structure and wiring caused by independent grounding lines in related technologies and improves the display effect.

[0054] Optionally, the middle frame 12 is made of an insulating material. The middle frame 12 is typically made of plastic and is not conductive. In related technologies, the middle frame 12 is located between the display panel 20 and the back panel 11; therefore, static electricity generated by the display panel 20 cannot be discharged to the back panel 11 through the middle frame 12, requiring a separate grounding line to discharge the static electricity.

[0055] Optionally, the backplate 11 is a metal backplate 11. The material of the backplate 11 can be at least one of aluminum, iron, copper, and corresponding alloys.

[0056] Optionally, the conductive connection portion 30 is a metal connection portion. Specifically, the material of the conductive connection portion 30 can be one of silver, copper, gold, aluminum, molybdenum, and iron. Preferably, the conductive connection portion 30 is silver paste. Silver paste has excellent conductivity.

[0057] Optionally, the conductive connection portion 30 is located on the side of the display panel 20 near the backlight module 10.

[0058] In this embodiment, since the display panel 20 is located on the light-emitting side of the backlight module 10, when the conductive connection part 30 is located on the side of the display panel 20 close to the backlight module 10, it is convenient for the back plate 11 to connect to the conductive connection part 30, thereby forming a conductive path, shortening the overall path length of the conductive path, improving the stability of the conductive path, reducing the possibility of the conductive path being broken during use, thereby improving the anti-static capability of the display module 100 and improving the display effect.

[0059] Optionally, the back plate 11 includes a bottom plate 111 and a side plate 112. The side plate 112 surrounds the edge of the bottom plate 111. A portion of the side plate 112 passes through the middle frame 12 and connects to the conductive connection portion 30 to form a conductive path.

[0060] The conductive connection part 30 connects the display panel 20 and the side panel 112.

[0061] In this embodiment, the side panel 112 extends along the thickness direction of the display module 100. A portion of the side panel 112 passes through the middle frame 12 and connects to the conductive connection portion 30, thereby forming a conductive path to release static electricity inside the display panel 20, improve the antistatic capability of the display panel 20, and thus improve the display effect.

[0062] Optionally, the base plate 111 and the side plate 112 are integrally formed.

[0063] Optionally, the middle frame 12 is provided with a through hole. The through hole extends through the middle frame 12 along the thickness direction of the display module 100, and a portion of the side plate 112 passes through the through hole and is connected to the conductive connection portion 30.

[0064] Optionally, the base plate 111 and the side plate 112 form a receiving cavity.

[0065] Optionally, the backlight module 10 is a side-lit backlight module 10. The side-lit backlight module 10 also includes a light guide plate 14, an optical film, and a lamp strip 13. The light guide plate 14 and the optical film are stacked in the accommodating cavity, and the lamp strip 13 is disposed in the accommodating cavity and located on one side of the light-incident surface of the light guide plate 14.

[0066] Optionally, the backlight module 10 is a direct-lit backlight module 10. The direct-lit backlight module 10 also includes a reflective sheet, a lamp plate, a diffuser plate, and an optical film stacked together.

[0067] Optionally, the side plate 112 includes a first side portion 112a and a second side portion 112b. The first side portion 112a surrounds the edge of the base plate 111 and is located between the base plate 111 and the middle frame 12. The second side portion 112b is connected to the side of the first side portion 112a away from the base plate 111. The second side portion 112b passes through the middle frame 12 and is connected to the conductive connection portion 30 to form a conductive path.

[0068] In this embodiment, the first side portion 112a and the base plate 111 form an accommodating cavity. The second side portion 112b is connected to the first side portion 112a and passes through the through hole of the middle frame 12 to connect with the conductive connection portion 30, forming a conductive path to release static electricity inside the display panel 20, improve the antistatic capability of the display panel 20, and thus improve the display effect.

[0069] Optionally, the display panel 20 includes a first substrate 21 and a second substrate 22.

[0070] The first substrate 21 is disposed on the light-emitting side of the backlight module 10. The second substrate 22 is disposed on the side of the first substrate 21 away from the backlight module 10. One edge of the second substrate 22 extends beyond the edge of the first substrate 21. A ground terminal 23 is provided on the portion of the second substrate 22 that extends beyond the first substrate 21.

[0071] The conductive connection part 30 is located at the grounding end 23.

[0072] In this embodiment, the first substrate 21 can be one of an array substrate and a counter substrate, and the second substrate 22 can be the other of an array substrate and a counter substrate; no limitation is made here. To avoid redundancy, in subsequent embodiments, the first substrate 21 is a counter substrate, and the second substrate 22 is an array substrate. A liquid crystal layer is also disposed between the first substrate 21 and the second substrate 22.

[0073] Please see Figure 2 In this embodiment, the second substrate 22 is provided with a circuit inside, which is connected to the ground terminal 23, thereby conducting the static electricity of the circuit inside the second substrate 22 to the ground terminal 23.

[0074] Optionally, the grounding terminal 23 extends between the first substrate 21 and the second substrate 22. The internal circuitry of the first substrate 21 is electrically connected to the grounding terminal 23. In this case, the grounding terminal 23 can discharge static electricity from both the internal circuitry of the second substrate 22 and the internal circuitry of the first substrate 21, thereby improving the stability of the display panel 20 structure.

[0075] Optionally, the display panel 20 may further include a first polarizer 24 and a second polarizer 25. The first polarizer 24 is disposed on the side of the first substrate 21 away from the second substrate 22, and the second polarizer 25 is disposed on the side of the second substrate 22 away from the first substrate 21.

[0076] Please see Figure 3 Optionally, the display module 100 further includes a first buffer portion 41. The first buffer portion 41 is located between the conductive connection portion 30 and the back plate 11, and the first buffer portion 41 connects the conductive connection portion 30 and the back plate 11, forming a conductive path.

[0077] In this embodiment, since the back plate 11 is a metal back plate 11 and the conductive connection part 30 is a metal connection part, when the back plate 11 and the conductive connection part 30 are in direct contact, if the display module 100 is subjected to a drop or shock, the second side part 112b will interfere with the conductive connection part 30 in the thickness direction of the display module 100, causing the display panel 20 to break and affecting the display effect. Therefore, this embodiment provides a first buffer part 41 between the conductive connection part 30 and the back plate 11. The first buffer part 41 has conductive properties and can buffer the conductive connection part 30 and the second side part 112b in a drop or shock condition, reducing the damage to the display panel 20 caused by direct interference between the two, improving the stability of the internal structure of the display module 100, and thus improving the display effect.

[0078] Optionally, the first buffer section 41 is conductive foam. Conductive foam is a special functional material that combines the softness of foam materials with the conductivity of conductive materials, possessing excellent conductivity and cushioning and shock absorption characteristics. This material mainly uses polymer foams such as polyethylene and polyurethane as the base material, and its conductivity is acquired by adding conductive fillers (such as carbon powder, metal particles, or metal-plated fibers) or by coating the surface with conductive cloth.

[0079] Conductive foam is commonly used in electronic devices to effectively shield electromagnetic waves, provide conductive connections, and offer anti-static protection. It is lightweight, flexible, and easy to process, and can be cut into various shapes and sizes as needed. Furthermore, conductive foam possesses excellent mechanical properties, such as elasticity and flexibility, as well as corrosion resistance and oxidation resistance.

[0080] Optionally, the first buffer section 41 is black. The first buffer section 41 can also reduce lateral light leakage and improve the display effect.

[0081] Please see Figure 3 Optionally, a boss 121 is provided on the side of the middle frame 12 near the display panel 20. A first buffer portion 41 is provided on the boss 121. A portion of the back plate 11 passes through the middle frame 12 and the boss 121 and connects to the first buffer portion 41.

[0082] Because the second side portion 112b passes through the middle frame 12 and connects to the first buffer portion 41, the thickness of the second side portion 112b is relatively thin, resulting in a small contact area between the second side portion 112b and the first buffer portion 41. If directly connected, the connection between the second side portion 112b and the first buffer portion 41 will be unstable, and the first buffer portion 41 will easily detach from the second side portion 112b and the conductive connection portion 30, causing the conductive path to be broken and affecting the discharge of static electricity inside the display panel 20.

[0083] In this embodiment, a boss 121 is provided on the middle frame 12, and the first buffer portion 41 is fixed to the boss 121. It can be fixed with glue or with clips; no limitation is made here. The second side portion 112b passes through the middle frame 12 and the boss 121, connecting to the bottom of the first buffer portion 41, thereby forming a conductive path. In this embodiment, the boss 121 improves the stability of the conductive path, thereby enhancing the anti-static capability of the display module 100 and improving the display effect.

[0084] Optionally, the height of the boss 121 in the thickness direction of the display module 100 is in the range of 0.2 mm to 0.5 mm.

[0085] Optionally, the boss 121 is integrally formed with the middle frame 12.

[0086] In this embodiment, the middle frame 12 can be a plastic frame, formed by injection molding. By opening the mold, the boss 121 can be formed simultaneously during the injection molding process of the middle frame 12, so that the boss 121 and the middle frame 12 are integrally formed, which improves production efficiency and enhances the stability of the connection between the boss 121 and the middle frame 12.

[0087] Please see Figure 4 Optionally, the display module 100 also includes a flip-chip film 50. One end of the flip-chip film 50 is bonded to the side of the second substrate 22 that extends beyond the edge of the first substrate 21 and is close to the backlight module 10.

[0088] In this embodiment, in order to create a frameless display panel 20, the flip-chip film 50 is bonded to the inside of the second substrate 22 and bent backwards. Although this architecture achieves a frameless design, it results in the flip-chip film 50 being suspended in mid-air. Since there is no support below the flip-chip film 50, the signal lines are easily damaged when the flip-chip film 50 is subjected to external force.

[0089] Optionally, the display module 100 further includes a second buffer portion 42. The second buffer portion 42 is provided on the side of the boss 121 near the display panel 20. The side of the second buffer portion 42 near the display panel 20 abuts against the surface of the flip-chip film 50.

[0090] In this embodiment, a second buffer portion 42 is provided under the flip-chip film 50. The second buffer portion 42 can support and protect the portion of the flip-chip film 50 that is bonded to the second substrate 22. The second buffer portion 42 is fixed to the boss 121, which can be fixed by adhesive or by clips, and no limitation is made here. The thickness of the second buffer portion 42 is not less than the height difference between the flip-chip film 50 and the boss 121. In order to improve the support and protection effect, the thickness of the second buffer portion 42 can be set to be slightly greater than the height difference between the flip-chip film 50 and the boss 121. Since the second buffer portion 42 is elastic, it can hold the flip-chip film 50 against the second substrate 22. After the display module 100 is assembled, the flip-chip film 50, which is bonded to the second substrate 22 by the anisotropic conductive film (ACF), is limited by the second buffer portion 42. When subjected to external force, the flip-chip film 50 is not easily peeled off from the anisotropic conductive film, the signal line is protected, and thus the stable transmission of the signal is guaranteed.

[0091] Optionally, the second buffer portion 42 is an elastomer, which can be either silicone or foam.

[0092] Optionally, the hardness of the second buffer portion 42 is within the range of 30 to 50 degrees. In this embodiment, the hardness of the second buffer portion 42 refers to its Shore hardness. When the hardness of the second buffer portion 42 is within the range of 30 to 50 degrees, the second buffer portion 42 simultaneously serves as both a buffer and a support. The value of the hardness of the second buffer portion 42 can be one of the following: 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, or 50 degrees.

[0093] Optionally, the first buffer 41 is connected to at least one end of the second buffer 42.

[0094] In this embodiment, the first buffer portion 41 can be connected to at least one end of the second buffer portion 42 by adhesive bonding.

[0095] Optionally, the first buffer portion 41 is located at both ends of the second buffer portion 42 along its length.

[0096] In this embodiment, two conductive paths are formed at both ends of the second buffer section 42. When one of the conductive paths fails to release static electricity, the static electricity inside the display panel 20 can be released through the other conductive path, thereby improving the antistatic capability of the display module 100 and improving the display effect.

[0097] Optionally, the first buffer part 41 and the second buffer part 42 are integrally formed.

[0098] In this embodiment, when the material of the second buffer portion 42 is foam, the first buffer portion 41 and the second buffer portion 42 can be integrally formed. After the first buffer portion 41 and the second buffer portion 42 are integrally formed, conductive filler is filled into the first buffer portion 41 to make the first buffer portion 41 conductive.

[0099] The specific embodiments of this application have been described in detail above. The embodiments disclosed above are merely preferred embodiments of this application. Those skilled in the art can make many modifications and improvements without departing from the concept of this application. All such modifications and improvements fall within the scope of protection defined by the claims of this application.

Claims

1. A display module, characterized in that, include: Backlight module, including back panel and mid-frame; The display panel is located on the light-emitting side of the backlight module, and at least a portion of the middle frame is located between the back plate and the display panel; as well as A conductive connection portion is provided on the display panel; A portion of the back plate passes through the middle frame and connects to the conductive connection portion to form a conductive path.

2. The display module as described in claim 1, characterized in that, The conductive connection portion is located on the side of the display panel near the backlight module.

3. The display module as described in claim 2, characterized in that, The back plate includes: Base plate; and A side panel is provided around the edge of the base plate, and a portion of the side panel passes through the middle frame and connects to the conductive connection portion to form the conductive path; The conductive connection portion connects the display panel and the side panel.

4. The display module as described in claim 3, characterized in that, The side plate includes: The first side portion surrounds the edge of the base plate and is located between the base plate and the middle frame; and The second side is connected to the side of the first side away from the bottom plate. The second side passes through the middle frame and is connected to the conductive connection part to form the conductive path.

5. The display module as described in any one of claims 1-4, characterized in that, The display module further includes a first buffer section, which is located between the conductive connection section and the back plate. The first buffer section connects the conductive connection section and the back plate and forms the conductive path.

6. The display module as described in claim 5, characterized in that, The first buffer section is conductive foam; The first buffer section is black; The material of the conductive connection includes one of silver, copper, gold, aluminum, molybdenum, and iron; The material of the backplate includes metal.

7. The display module as described in claim 5, characterized in that, The display panel includes: A first substrate is disposed on the light-emitting side of the backlight module; and The second substrate is disposed on the side of the first substrate away from the backlight module, and one edge of the second substrate extends beyond the edge of the first substrate. A ground terminal is provided on the portion of the second substrate that extends beyond the first substrate. The conductive connection portion is located at the grounding terminal.

8. The display module as described in claim 7, characterized in that, A protrusion is provided on the side of the middle frame near the display panel; The first buffer portion is disposed on the boss, and a portion of the back plate passes through the middle frame and the boss and is connected to the first buffer portion.

9. The display module as described in claim 8, characterized in that, The display module also includes: A flip-chip film, one end of which is bonded to the second substrate on the side extending beyond the edge of the first substrate and close to the backlight module; and The second buffer portion is provided on the side of the protrusion near the display panel, and the side of the second buffer portion near the display panel abuts against the surface of the flip-chip film; The first buffer section is connected to at least one end of the second buffer section.

10. The display module as described in claim 9, characterized in that, The boss is integrally formed with the middle frame; The first buffer part and the second buffer part are integrally formed.

11. The display module as described in claim 9, characterized in that, The second buffer part is an elastomer; The hardness of the second buffer section is in the range of 30 to 50 degrees; The first buffer section is located at both ends of the second buffer section along its length.

12. A display device, characterized in that, Includes the display module as described in any one of claims 1-11.

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