Computer mainboard with self-cooling structure

Abstract

The utility model discloses a computer mainboard with a self-radiating structure, which comprises a composite radiating layer embedded in a PCB (printed circuit board) main body, high-heat elements and other electronic elements distributed on the outer side of the PCB main body in a dispersed manner, a radiating hole array positioned on the periphery of the edge of the PCB main body, and a phase change energy storage unit connected with the composite radiating layer, according to the utility model, the composite heat dissipation layer is embedded in the PCB main body, so that the PCB main body can be in seamless contact with a high-heat element directly to form a thermal bridge structure, the thermal resistance is reduced, the heat generated by the high-heat element can be quickly dispersed and conducted through the composite heat dissipation layer, and the problem that the heat is gathered in the PCB main body due to low heat conduction rate is avoided; meanwhile, the heat dissipation holes are matched with the array, heat can be diffused to the outer side of the mainboard through the composite heat dissipation layer in an accelerated mode, then the phase change energy storage unit rapidly absorbs the heat through the characteristics that the heat can be instantly absorbed and then slowly released, and the temperature of the PCB body is reduced.

Description

Technical Field

[0001] This utility model relates to the field of motherboard heat dissipation technology, specifically a computer motherboard with a self-heating structure. Background Technology

[0002] The motherboard, also called the mainboard, system board, or motherboard, is one of the most basic and important components of a computer. A motherboard is generally a rectangular circuit board on which the main circuitry of the computer is installed. It typically includes a BIOS chip, I / O control chip, keyboard and front panel control switch interfaces, indicator light connectors, expansion slots, and DC power supply connectors for the motherboard and expansion cards.

[0003] Traditional computer motherboard structures have the following drawbacks in terms of heat dissipation: 1. Traditional motherboards rely on external heatsinks (such as fans and heat pipes), which occupy a large space and generate significant noise. 2. The concentrated placement of high-heat components (CPU, GPU, power supply module) leads to localized temperature build-up. 3. Passive heat dissipation materials (such as aluminum heat sinks) have limited thermal conductivity, making them unsuitable for high-performance computing demands. Utility Model Content

[0004] The purpose of this invention is to provide a computer motherboard with a self-heating structure. By redesigning the motherboard structure, an independent heat dissipation system is achieved, avoiding excessive reliance on external heat dissipation systems for cooling. At the same time, the motherboard temperature is effectively controlled within a suitable range, extending the motherboard's service life and solving the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a computer motherboard with a self-heating structure, comprising:

[0006] The composite heat dissipation layer embedded inside the PCB board body, high-heat components and other electronic components distributed on the outside of the PCB board body, the heat dissipation holes arranged around the edge of the PCB board body, and the phase change energy storage unit connected to the composite heat dissipation layer.

[0007] The PCB board body includes a multilayer substrate, and the multilayer substrates are bonded to each other.

[0008] Preferably, a groove is formed on one side of the substrate facing each other, the composite heat dissipation layer is embedded in the groove, and the periphery of the composite heat dissipation layer extends outward and is flush with the edge of the PCB body.

[0009] Preferably, the high-heat elements are distributed around the perimeter and center of the outer side of the PCB board body, and the other electronic components are interspersed among the high-heat elements.

[0010] Preferably, the heat dissipation hole array includes multiple sets of heat dissipation holes, which penetrate the multilayer substrate and the composite heat dissipation layer.

[0011] Preferably, the phase change energy storage unit includes multiple phase change capsules, which are fixedly connected to the PCB board body by dispensing process and seamlessly connected to the composite heat dissipation layer.

[0012] Preferably, the PCB board has multiple sets of miniature temperature sensors distributed around high-heat components and other electronic components.

[0013] Preferably, the composite heat dissipation layer is a graphene composite material layer, and the phase change energy storage unit is a wax-based material capsule.

[0014] Compared with the prior art, the beneficial effects of this utility model are:

[0015] This invention embeds a composite heat dissipation layer inside the PCB board body, allowing for seamless direct contact with high-heat components and forming a "thermal bridge" structure. This reduces thermal resistance and enables the heat generated by the high-heat components to be quickly dispersed and conducted through the composite heat dissipation layer. This avoids the problem of low heat conduction rate, which would cause heat to accumulate inside the PCB board body and raise the motherboard temperature. Simultaneously, the arrangement of heat dissipation holes accelerates the diffusion of heat to the outside of the motherboard through the composite heat dissipation layer. Then, the phase change energy storage unit, with its ability to instantly absorb heat and then slowly release it, rapidly absorbs the heat, reducing the temperature of the PCB board body. This process of quickly releasing the heat outwards avoids excessive heat concentration and maintains a stable temperature range for the motherboard.

[0016] This invention disperses high-heat components with other electronic components, thus avoiding excessive concentration of high-heat components, which can lead to heat accumulation, reduced heat dissipation efficiency, and consequently affect the overall temperature distribution of the motherboard. Attached Figure Description

[0017] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0018] Figure 2 This is an exploded three-dimensional structural diagram of the PCB board body of this utility model;

[0019] Figure 3 This is a three-dimensional structural diagram of the substrate and composite heat dissipation layer of this utility model;

[0020] Figure 4 This is a top view of the three-dimensional structure of the substrate of this utility model.

[0021] The following are the labels in the diagram: 1. Main body of PCB board; 11. Substrate; 2. Composite heat dissipation layer; 3. High heat dissipation element; 4. Other electronic components; 5. Arrangement of heat dissipation holes; 6. Phase change energy storage unit; 7. Groove; 8. Miniature temperature sensor. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] This utility model provides, for example Figures 1-4 The computer motherboard shown has a self-heating structure, comprising:

[0024] The composite heat dissipation layer 2 embedded inside the PCB board body 1, the high-heat components 3 and other electronic components 4 distributed on the outside of the PCB board body 1, the heat dissipation holes 5 arranged around the edge of the PCB board body 1, and the phase change energy storage unit 6 connected to the composite heat dissipation layer 2.

[0025] The PCB board body 1 includes a multilayer substrate 11, the number of layers of the substrate 11 is not less than 2, and the multilayer substrates 11 are bonded to each other.

[0026] This invention embeds a composite heat dissipation layer 2 inside the PCB board body 1, which can directly and seamlessly contact the high-heat components 3 to form a "thermal bridge" structure, reducing thermal resistance. This allows the heat generated by the high-heat components 3 to be quickly dispersed and conducted through the composite heat dissipation layer 2, avoiding the accumulation of heat inside the PCB board body 1 due to low heat conduction rate, which would cause the motherboard temperature to rise. At the same time, in conjunction with the heat dissipation hole array 5, the heat can be diffused to the outside of the motherboard through the composite heat dissipation layer 2 more quickly. Then, the phase change energy storage unit 6 absorbs heat instantly and then slowly releases it, rapidly absorbing the heat and reducing the temperature of the PCB board body 1. Then, it slowly releases the heat outward, which can avoid excessive heat concentration and keep the temperature range of the motherboard stable.

[0027] Among them, such as Figure 2-3 As shown:

[0028] A groove 7 is provided on one side of the substrate 11 facing each other, and the composite heat dissipation layer 2 is embedded in the groove 7. The groove 7 facilitates the storage of the composite heat dissipation layer 2 and protects the composite heat dissipation layer 2 during the lamination of the PCB body 1, preventing the composite heat dissipation layer 2 from being squeezed and broken or thinned. The periphery of the composite heat dissipation layer 2 extends outward and is flush with the edge of the PCB body. During the lamination of the PCB body 1, a pre-formed heat dissipation layer is embedded, and the composite heat dissipation layer 2 with a micro-hole structure is formed by laser drilling. This allows the periphery of the composite heat dissipation layer 2 to extend outward in a localized manner and contact the outside, which can reduce the time taken for heat dissipation and improve heat dissipation efficiency.

[0029] Furthermore, such as Figure 1-2 and Figure 4 As shown:

[0030] The high-heat components 3 are distributed around the perimeter and center of the PCB board body 1. Other electronic components 4 are interspersed among the high-heat components 3. By distributing the high-heat components 3 around the perimeter and center of the PCB board body 1, the high-heat components 3 can be dispersed, avoiding the high-heat components 3 from being too concentrated, which would lead to the accumulation of heat, affect the heat dissipation efficiency, and cause the heat to not be able to dissipate quickly, thus affecting the service life of the motherboard.

[0031] Preferred, such as Figure 1-4 As shown:

[0032] The heat dissipation hole array 5 includes multiple sets of heat dissipation holes, which penetrate the multilayer substrate 11 and the composite heat dissipation layer 2. By defining the position of the heat dissipation holes, it is convenient to cooperate with the composite heat dissipation layer 2. The composite heat dissipation layer 2 diffuses the heat inside the PCB board body 1 from the inside to the outside. Then, the heat dissipation holes increase the contact area between the heat dissipation layer and the outside world, thereby improving the heat dissipation efficiency.

[0033] It is worth noting that, such as Figure 3 As shown:

[0034] The phase change energy storage unit 6 includes multiple phase change capsules. The phase change capsules are fixedly connected to the PCB board body 1 through a dispensing process and are seamlessly connected to the composite heat dissipation layer 2. The phase change energy storage unit 6 is directly fixed to the bottom of the chipset through a dispensing process and seamlessly connected to the composite heat dissipation layer 2 to achieve direct heat conduction. This allows the heat to diffuse directly outward through the composite heat dissipation layer 2, avoiding excessive heat diffusion through the substrate 11, which would result in low heat dissipation efficiency.

[0035] In a further preferred embodiment, such as Figure 4 As shown:

[0036] Multiple sets of miniature temperature sensors 8 are distributed on the PCB board. The miniature temperature sensors 8 are distributed around the high-heat components 3 and other electronic components 4. Through the distribution of the miniature temperature sensors 8, the heat distribution can be monitored, a dynamic heat dissipation strategy can be realized, energy efficiency and heat dissipation requirements can be balanced, and the life of components can be extended.

[0037] In addition, such as Figure 1-4 As shown:

[0038] The composite heat dissipation layer 2 is a graphene composite material layer with a thermal conductivity ≥1500W / (m·K) and a thickness of 0.5-1.2mm. The phase change energy storage unit 6 is a wax-based material capsule with a melting point of 60-80℃, suitable for the operating temperature range of common chips. The composite heat dissipation layer 2 is composed of graphene + ceramic and microporous structure. Graphene and ceramic powder are mixed in a 3:1 ratio and hot-pressed to form a 0.8mm thick composite layer. The high thermal conductivity of graphene and ceramic accelerates the heat conduction speed in the composite heat dissipation layer 2, realizing heat transfer and diffusion. Then, the phase change energy storage unit 6, processed from wax-based material, can absorb high heat instantly and then slowly release the heat. This characteristic can reduce the temperature of the PCB board body 1 and transfer the heat to the phase change energy storage unit 6 for temporary storage, which plays a significant role in regulating the overall temperature balance of the PCB board body 1.

[0039] Compared to traditional motherboards, the composite heat dissipation layer 2 reduces thermal resistance by 40% and improves heat dissipation efficiency by 60%.

[0040] The phase change energy storage unit 6 can absorb 30% of the peak heat under instantaneous high load, and the overall temperature fluctuation range of the motherboard is reduced to ±5℃.

[0041] The dynamic temperature control strategy reduces energy consumption by 25% and extends component life by more than 20%.

[0042] In actual use, the computer motherboard works normally, and then the high-heat element 3 and other electronic components 4 generate operating heat. Then, part of the heat generated on the high-heat element 3 is directly diffused into the air, and part is diffused along the substrate 11. Most of it is instantly absorbed by the phase change energy storage unit 6. Then, the phase change energy storage unit 6 slowly releases the heat, and the heat diffuses outward along the composite heat dissipation layer 2, from the periphery of the PCB board body 1 and the heat dissipation holes to the periphery of the PCB board body 1, achieving the purpose of autonomous cooling of the PCB board body 1. At the same time, the miniature temperature sensors 8 distributed around the high-heat element 3 and other electronic components 4 can monitor the temperature in real time. With the cooperation of the intelligent temperature control system, dynamic heat dissipation is achieved.

[0043] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A computer motherboard with a self-heating structure, characterized in that, include: The composite heat dissipation layer (2) embedded inside the PCB board body (1), the high heat components (3) and other electronic components (4) distributed on the outside of the PCB board body (1), the heat dissipation holes (5) arranged around the edge of the PCB board body (1), and the phase change energy storage unit (6) connected to the composite heat dissipation layer (2). The PCB board body (1) includes a multilayer substrate (11), and the multilayer substrates (11) are bonded to each other.

2. A computer motherboard with a self-heating structure according to claim 1, characterized in that: The substrate (11) has a groove (7) on one side facing each other, and the composite heat dissipation layer (2) is embedded in the groove (7). The composite heat dissipation layer (2) extends outward around its perimeter and is flush with the edge of the PCB body.

3. A computer motherboard with a self-heating structure according to claim 1, characterized in that: The high-heating element (3) is distributed around the perimeter and center of the outer side of the PCB board body (1), and the other electronic components (4) are interspersed among the high-heating elements (3).

4. A computer motherboard with a self-heating structure according to claim 1, characterized in that: The heat dissipation hole array (5) includes multiple sets of heat dissipation holes, which penetrate the multilayer substrate (11) and the composite heat dissipation layer (2).

5. A computer motherboard with a self-heating structure according to claim 1, characterized in that: The phase change energy storage unit (6) includes multiple phase change capsules, which are fixedly connected to the PCB board body (1) by dispensing process and are seamlessly connected to the composite heat dissipation layer (2).

6. A computer motherboard with a self-heating structure according to claim 1, characterized in that: Multiple sets of miniature temperature sensors (8) are distributed on the PCB board, and the miniature temperature sensors (8) are distributed around the high-heat element (3) and other electronic components (4).

7. A computer motherboard with a self-heating structure according to claim 1, characterized in that: The composite heat dissipation layer (2) is a graphene composite material layer, and the phase change energy storage unit (6) is a wax-based material capsule.

Images