Heat dissipation module capable of increasing thermal contact area and heat dissipation fins thereof

Abstract

The utility model relates to a heat dissipation module capable of increasing thermal contact area and heat dissipation fins and a manufacturing method thereof, the heat dissipation module is used for welding flux, the heat dissipation module comprises a heat dissipation fin group and a heat pipe, the heat dissipation fin group comprises a plurality of heat dissipation fins which are arranged in parallel at intervals, each heat dissipation fin is provided with a sheet-shaped body, and the sheet-shaped body is provided with a plurality of heat dissipation fins. A through hole and one or more blind holes communicated with the through hole are formed in the front face of each sheet-shaped body, and a continuous closed bottom wall, a semi-annular peripheral wall integrally formed on the inner periphery of the continuous closed bottom wall and a communication opening formed in one side of the semi-annular peripheral wall and communicated with the through hole are formed in each blind hole. The heat pipes penetrate through the through holes; the solder can be placed in each blind hole and is filled between the heat pipe and the inner periphery of each through hole through each communication port. Therefore, the heat dissipation module and the heat dissipation fins have the advantage of being excellent in heat conduction.

Description

Technical Field

[0001] This utility model relates to a heat dissipation structure with heat pipes and fins, and more particularly to a heat dissipation module and its heat dissipation fins that can increase the thermal contact area. Background Technology

[0002] In order for high-heat-generating electronic components in information systems, such as central processing units (CPUs), memory modules, graphics processing units (GPUs), and chipsets, to operate normally, additional heat dissipation modules are installed to remove excess heat from the electronic components, thereby keeping the operating electronic components within a safe temperature range so that they can operate normally.

[0003] Traditional heat dissipation modules consist of multiple heat dissipation fins and heat pipes. Each heat dissipation fin has a through hole and a solder through hole connecting the through hole. First, multiple heat dissipation fins are arranged at intervals, and the solder through hole is positioned above the through hole. Then, the heat pipe is inserted into the through hole of each heat dissipation fin. Finally, a soldering needle is inserted through the solder through hole and pulls the solder. Then, by gravity and the gap between the heat dissipation fins and the heat pipe, capillary force is formed, allowing the molten solder to flow down and fill the contact surface between the heat pipe and the heat dissipation fin, thus completing the process of heat pipes combined with multiple heat dissipation fins.

[0004] However, when the solder fills the contact surface between the heat pipe and the heat sink fins, it can also cause solder loss and create a void area at the solder through-hole. Since there is only air and no high thermal conductivity medium in the void area, the heat conduction between the heat pipe and the heat sink fins is blocked in the void area, resulting in a reduction in the thermal contact area between the heat pipe and the heat sink fins, which leads to a decrease in the heat dissipation efficiency of the heat dissipation module.

[0005] In view of this, the inventors have devoted themselves to studying the prior art and applying theoretical principles to solve the aforementioned problems, which is the inventors' development goal. Summary of the Invention

[0006] This invention provides a heat dissipation module and its heat dissipation fins that can increase the thermal contact area. The heat dissipation fins are provided with blind holes that are connected to through holes. Solder can be placed in the blind holes and filled between the heat pipe and the inner periphery of the through holes through the blind holes, so as to avoid reducing the thermal contact area between the heat pipe and the heat dissipation fins. This makes the heat dissipation module and heat dissipation fins of this invention have excellent thermal conductivity.

[0007] In this embodiment of the present invention, a heat dissipation module that can increase the thermal contact area is provided for a solder. The heat dissipation module includes: a heat dissipation fin group comprising a plurality of heat dissipation fins spaced apart and arranged side by side, each heat dissipation fin having a sheet-like body, each sheet-like body having a through hole and at least one blind hole communicating with the through hole on its front side, each blind hole having a continuous closed bottom wall, a semi-annular peripheral wall integrally formed on the inner periphery of the continuous closed bottom wall, and a communication port formed on one side of the semi-annular peripheral wall and communicating with the through hole; and a heat pipe passing through each of the through holes; wherein the solder can be placed in each of the blind holes and filled between the heat pipe and the inner periphery of each of the through holes via each of the communication ports.

[0008] In this embodiment of the present invention, a heat dissipation fin that can increase the thermal contact area is provided for a solder. The heat dissipation fin includes: a sheet-like body with a through hole and at least one blind hole communicating with the through hole on its front side. The blind hole has a continuous closed bottom wall, a semi-annular peripheral wall integrally formed on the inner periphery of the continuous closed bottom wall, and a communicating opening formed on one side of the semi-annular peripheral wall and communicating with the through hole. The solder can be placed in the blind hole.

[0009] Based on the above, because the blind hole is closed and the high thermal conductivity medium continues to the inner periphery of the through hole, when the solder at the blind hole is lost, the inside of the blind hole will maintain a continuous surface without any gaps. At the same time, the solder fills between the heat pipe and the inner periphery of the through hole, and the outer periphery of the heat pipe is completely connected to the inner periphery of the through hole and the inside of the blind hole through the solder, so as to avoid the reduction of the thermal contact area between the heat pipe and the heat dissipation fins, so as to achieve the excellent heat conduction characteristics of the heat dissipation module and heat dissipation fins of this utility model. Attached Figure Description

[0010] Figure 1 This is a flowchart illustrating the manufacturing method of the heat dissipation module of this utility model.

[0011] Figure 2 This is a three-dimensional schematic diagram of the heat dissipation fins of this utility model to be fitted onto the heat pipe.

[0012] Figure 3 This is a three-dimensional schematic diagram showing the heat dissipation fins of this utility model already fitted onto the heat pipe and the solder placed in the blind hole.

[0013] Figure 4 This is a cross-sectional view of the present invention, showing the heat sink fins fitted onto the heat pipe and the solder placed in the blind hole.

[0014] Figure 5 This utility model Figure 4 Enlarged view of the area highlighted by the dashed line.

[0015] Figure 6This is a partially enlarged cross-sectional view of the heat dissipation module of this utility model.

[0016] Figure 7 This is a three-dimensional schematic diagram of a heat dissipation fin intended to be fitted onto a heat pipe, according to another embodiment of the present invention.

[0017] Figure 8 This is a partially enlarged cross-sectional view of another embodiment of the heat dissipation module of this utility model.

[0018] Figure 9 This is a three-dimensional schematic diagram of a heat dissipation fin intended to be fitted onto a heat pipe, according to another embodiment of the present invention.

[0019] Figure 10 This is a partially enlarged cross-sectional view of another embodiment of the heat dissipation module of this utility model.

[0020] Figure 11 This is a flowchart of another embodiment of the manufacturing method of the heat dissipation module of this utility model.

[0021] Figure 12 This is a three-dimensional schematic diagram of a heat dissipation fin intended to be fitted onto a heat pipe, according to another embodiment of the present invention.

[0022] Figure 13 This is a partially enlarged cross-sectional view of another embodiment of the heat dissipation module of this utility model.

[0023] The attached figures are labeled as follows:

[0024] 100: Solder

[0025] 10: Heat dissipation module

[0026] 1: Heat dissipation fin assembly

[0027] 11: Heat dissipation fins

[0028] 12: Flake body

[0029] 121: Through hole

[0030] 122: Ring

[0031] 13: Blind hole

[0032] 131: Continuous closed bottom wall

[0033] 132: Semi-circular peripheral wall

[0034] 133: Connector

[0035] 14: First blind hole

[0036] 15: Second blind hole

[0037] 2: Heat pipe

[0038] H1, H2: Depth

[0039] S1: Flat surface

[0040] S2: Downward-sloping surface

[0041] S3: Upward-sloping surface

[0042] A~D, A'~D': Steps Detailed Implementation

[0043] The detailed description and technical content of this utility model will be explained below with reference to the accompanying drawings. However, the drawings are for illustrative purposes only and are not intended to limit the scope of this utility model.

[0044] Please refer to Figures 1 to 6 As shown, this utility model provides a heat dissipation module that can increase the thermal contact area, its heat dissipation fins and manufacturing method, for example: a solder 100 of tin. This heat dissipation module 10 mainly includes a heat dissipation fin group 1 and a heat pipe 2. The heat dissipation fin 11 mainly includes a sheet-shaped body 12.

[0045] like Figure 1 As shown, this is an embodiment of the steps in the manufacturing method of the heat dissipation module 10 of this utility model. First, as... Figure 1 Step A and Figure 2 As shown, a plurality of heat dissipation fins 11 are provided. Each heat dissipation fin 11 has a through hole 121 and one or more blind holes 13 communicating with the through hole 121 on its front side. In this embodiment, there are two blind holes 13, which are divided into a first blind hole 14 and a second blind hole 15. Each first blind hole 14 and each second blind hole 15 are located on opposite sides of each through hole 121. The depth H1 of each first blind hole 14 is greater than or equal to the depth H2 of each second blind hole 15.

[0046] The details are as follows: Each heat dissipation fin 11 has a sheet-like body 12. Each sheet-like body 12 has a through hole 121 and a first blind hole 14 and a second blind hole 15 connected to the through hole 121 through a stamping or other processing on its front side. That is, the through hole 121, the first blind hole 14 and the second blind hole 15 are arranged adjacent to each other. Each first blind hole 14 and each second blind hole 15 have a continuous closed bottom wall 131, a semi-annular peripheral wall 132 integrally formed on the inner periphery of the continuous closed bottom wall 131, and a connecting opening 133 formed on one side of the semi-annular peripheral wall 132 and connected to the through hole 121.

[0047] Additionally, refer to Figure 5As shown, each sheet-like body 12 has an annular ring 122 extending from its back side, surrounding the inner periphery of each through hole 121. A portion of the inner periphery of each continuous closed bottom wall 131 is integrally formed with the semi-annular peripheral wall 132 and another portion is integrally formed with the annular ring 122. Each connecting port 133 is recessed from the annular ring 122 to one end of the front side of each sheet-like body 12. In this embodiment, the surface of each continuous closed bottom wall 131 has a flat surface S1 that is entirely in the same plane, but this is not a limitation.

[0048] Second, such as Figure 1 Step B and Figures 2 to 3 As shown, one or more heat pipes 2 and a solder 100 are provided. The actions of repeatedly fitting heat dissipation fins 11 onto the heat pipes 2 through through holes 121 and placing the solder 100 into the first blind hole 14 are repeated, so that the heat pipes 2 are connected to the through holes 121 of a plurality of spaced-apart heat dissipation fins 11, which together constitute a heat dissipation fin group 1. The heat pipes 2 can be tightly connected to the through holes 121 or slightly loosely connected to the through holes 121.

[0049] Third, such as Figure 1 Step C and Figures 4 to 5 As shown, multiple heat dissipation fins 11 are arranged such that each first blind hole 14 is arranged above each through hole 121, and each second blind hole 15 is arranged below each through hole 121.

[0050] Fourth, such as Figure 1 Step D and Figures 4 to 6 As shown, the solder 100 is heated to make it molten and flow sequentially from each of the first blind holes 14 to the space between the heat pipe 2 and the inner periphery of each through hole 121 and each of the second blind holes 15.

[0051] Finally, after the solder 100 cools, it will fill the space between the heat pipe 2 and the inner periphery of each through hole 121, and the overflowing solder 100 will flow into the second blind hole 15, so that the solder 100 can be placed in each first blind hole 14 and filled between the heat pipe 2 and the inner periphery of each through hole 121 through the communication port 133 of each first blind hole 14, and overflow into each second blind hole 15 through the communication port 133 of each second blind hole 15.

[0052] It is known that after the solder in the solder through-hole fills the space between the heat pipe and the inner periphery of each through-hole, the solder through-hole will form a hollow area due to solder loss, which will block the heat conduction between the heat pipe and the heat sink fins in the hollow area.

[0053] In comparison, such as Figures 3 to 6As shown, because the interior of the first blind hole 14 is closed and the high thermal conductivity medium continues to the inner periphery of the through hole 121, when the solder 100 at the first blind hole 14 is lost, the interior of the first blind hole 14 will also maintain a continuous surface without any holes. At the same time, the solder 100 is filled between the heat pipe 2 and the inner periphery of the through hole 121, and the outer periphery of the heat pipe 2 is completely connected to the inner periphery of the through hole 121 and the interior of the first blind hole 14 through the solder 100. This avoids the reduction of the thermal contact area between the heat pipe 2 and the heat dissipation fins 11, so that the heat dissipation module 10 and the heat dissipation fins 11 of this utility model have excellent thermal conductivity.

[0054] In addition, the overflowing solder 100 can be guided and concentrated into the second blind hole 15, so that the solder 100 can be more evenly filled between the heat pipe 2 and the inner periphery of each through hole 121, so as to avoid excessive solder 100 overflowing out of the periphery of the through hole 121 and forming solder balls around it after cooling. Solder balls will increase thermal flow resistance and there is a risk of solder balls falling off. If they fall onto the circuit board (not shown in the figure), they may cause a short circuit on the circuit board.

[0055] like Figures 7 to 8 The image shows another embodiment of the heat dissipation module 10 and heat dissipation fins 11 of this utility model. Figures 7 to 8 Implementation examples and Figures 1 to 6 The embodiments are largely the same. Figures 7 to 8 Implementation examples and Figures 1 to 6 The embodiment differs in that the surface of the continuous closed bottom wall 131 of each first blind hole 14 has a slightly inclined surface S2 that gradually slopes downward toward the connection port 133, but is not limited thereto.

[0056] Further explanation is as follows: the downwardly inclined surface S2 gradually slopes downwards towards the connecting port 133, which slows down the flow of the molten solder 100 towards the inner periphery of the heat pipe 2 and each through hole 121, so as to achieve the same... Figures 1 to 6 In addition to the functions and effects of the embodiments, the risk of overflow can also be improved by reducing the gravitational component to reduce the fluidity of the solder 100.

[0057] like Figures 9 to 10 The image shows another embodiment of the heat dissipation module 10 and heat dissipation fins 11 of this utility model. Figures 9 to 10 Implementation examples and Figures 1 to 6 The embodiments are largely the same. Figures 9 to 10 Implementation examples and Figures 1 to 6 The embodiment differs in that the surface of the continuous closed bottom wall 131 of each first blind hole 14 has an upwardly inclined surface S3 that gradually slopes upward toward the connection port 133, but is not limited thereto.

[0058] Further explanation is as follows: the upwardly inclined surface S3 gradually slopes upwards towards the connecting port 133, which accelerates the flow of the molten solder 100 to the area between the heat pipe 2 and the inner periphery of each through hole 121, so as to achieve the same... Figures 1 to 6 In addition to the functions and effects of the embodiments, the inner peripheral area of ​​the ring 122 in this embodiment is relatively smaller than that of the previous embodiment. Figures 1 to 6 Implementation examples and Figures 7 to 8 In this embodiment, the inner periphery of the ring 122 has a larger area, which increases the contact area between the heat dissipation fins 11 and the heat pipe 2, thereby improving the heat exchange efficiency of the heat dissipation module 10 and the heat dissipation fins 11.

[0059] like Figures 11 to 13 The diagram shows one embodiment of the manufacturing method of this utility model, and another embodiment of the heat dissipation module 10 and heat dissipation fins 11. Figures 11 to 13 Implementation examples and Figures 1 to 6 The embodiments are largely the same. Figures 11 to 13 Implementation examples and Figures 1 to 6 The difference in the embodiment is that the number of blind holes 13 is one.

[0060] like Figure 11 As shown, this is one embodiment of the steps in the manufacturing method of the heat dissipation module 10 of this utility model. First, as... Figure 1 Step A' and Figure 12 As shown, a plurality of heat dissipation fins 11 are provided, and a through hole 121 and a blind hole 13 communicating with the through hole 121 are provided on the front side of each heat dissipation fin 11.

[0061] The details are as follows: Each heat dissipation fin 11 has a sheet-like body 12. Each sheet-like body 12 has a through hole 121 and a blind hole 13 connecting the through hole 121 on its front side through stamping or other processing. That is, each through hole 121 and each blind hole 13 are arranged adjacent to each other. Each blind hole 13 has a continuous closed bottom wall 131, a semi-annular peripheral wall 132 integrally formed on the inner periphery of the continuous closed bottom wall 131, and a connecting opening 133 formed on one side of the semi-annular peripheral wall 132 and connecting the through hole 121.

[0062] Additionally, refer to Figure 13 As shown, each sheet-like body 12 has an annular ring 122 extending from its back side, surrounding the inner periphery of each through hole 121. A portion of the inner periphery of each continuous closed bottom wall 131 is integrally formed with the semi-annular peripheral wall 132 and another portion is integrally formed with the annular ring 122. Each connecting port 133 is recessed from the annular ring 122 to one end of the front side of each sheet-like body 12. In this embodiment, the surface of each continuous closed bottom wall 131 has a flat surface S1 that is entirely in the same plane, but this is not a limitation.

[0063] Second, such as Figure 11 Step B' and Figures 12 to 13As shown, one or more heat pipes 2 and a solder 100 are provided. The actions of repeatedly fitting heat dissipation fins 11 onto the heat pipes 2 through through holes 121 and placing the solder 100 into blind holes 13 are repeated, so that the heat pipes 2 are connected to the through holes 121 of a plurality of spaced-apart heat dissipation fins 11, which together constitute a heat dissipation fin group 1. The heat pipes 2 can be tightly connected to the through holes 121 or slightly loosely connected to the through holes 121.

[0064] Third, such as Figure 11 Step C' and Figure 13 As shown, multiple heat dissipation fins 11 are placed such that each blind hole 13 is arranged above each through hole 121.

[0065] Fourth, such as Figure 11 Step D' and Figure 13 As shown, the solder 100 is heated to make it melt and flow from each blind hole 13 to the inner periphery between the heat pipe 2 and each through hole 121.

[0066] Finally, after the solder 100 cools, it will fill the space between the heat pipe 2 and the inner periphery of each through hole 121, so that the solder 100 can be placed in each blind hole 13 and filled between the heat pipe 2 and the inner periphery of each through hole 121 through each communication port 133.

[0067] In this way, such as Figures 3 to 6 As shown, because the inside of the blind hole 13 is closed and the high thermal conductivity medium continues to the inner periphery of the through hole 121, when the solder 100 at the blind hole 13 is lost, the inside of the blind hole 13 will also maintain a continuous surface without any holes. At the same time, the solder 100 is filled between the heat pipe 2 and the inner periphery of the through hole 121, and the outer periphery of the heat pipe 2 is completely connected to the inner periphery of the through hole 121 and the inside of the blind hole 13 through the solder 100. This avoids the reduction of the thermal contact area between the heat pipe 2 and the heat dissipation fins 11, so that the heat dissipation module 10 and the heat dissipation fins 11 of this utility model have excellent thermal conductivity.

[0068] Furthermore, in this embodiment, the number of blind holes 13 is one. That is, compared with the previous embodiment, there are no blind holes below the heat pipe 2 in this embodiment. However, by controlling the furnace temperature, the amount of solder and the holding time, it is possible to reduce the risk of solder 100 overflowing even without blind holes below the heat pipe 2, and also avoid the loss of contact area of ​​the heat dissipation fins 11 caused by blind holes, so as to improve the heat exchange efficiency of the heat dissipation module 10 and the heat dissipation fins 11.

[0069] In conclusion, the heat dissipation module and its heat dissipation fins of this utility model, which can increase the thermal contact area, can indeed achieve the intended use purpose, solve the deficiencies of the prior art, and have industrial applicability, novelty and progress. They fully meet the requirements for patent application, and therefore, this application is filed in accordance with the Patent Law to protect the inventor's rights.

Claims

1. A heat dissipation module that increases the thermal contact area for use with solder, characterized in that, The heat dissipation module comprises: a heat dissipation fin set comprising a plurality of heat dissipation fins arranged in parallel and spaced apart, each of the heat dissipation fins having a plate-shaped body, each of the plate-shaped bodies being provided with a through hole on the front surface thereof and at least one blind hole communicating with the through hole, each of the blind holes having a continuously closed bottom wall, a semi-annular peripheral wall integrally formed on the inner periphery of the continuously closed bottom wall, and a communicating opening formed on one side of the semi-annular peripheral wall and communicating with the through hole; a heat pipe penetrating the through holes; wherein the solder can be placed in each of the blind holes and filled between the heat pipe and the inner periphery of each of the through holes through the communicating opening.

2. The heat contact area increasing heat dissipation module of claim 1, wherein, The number of blind holes of each of the heat dissipation fins is two, the two blind holes are divided into a first blind hole and a second blind hole, each of the first blind holes is arranged above each of the through holes, and each of the second blind holes is arranged below each of the through holes, the depth of each of the first blind holes is greater than or equal to the depth of each of the second blind holes, the solder can be placed in each of the first blind holes and filled between the heat pipe and the inner periphery of each of the through holes through the communicating opening of each of the first blind holes, and overflowed to each of the second blind holes through the communicating opening of each of the second blind holes.

3. The thermal contact area increaseable heat spreader module of claim 1, wherein, The surface of each of the continuously closed bottom walls has a flat surface all located in the same plane.

4. The thermal contact improvement heat sink module of claim 1, wherein, The surface of each of the continuously closed bottom walls has a downward inclined surface gradually inclined downward toward the communicating opening or an upward inclined surface gradually inclined upward toward the communicating opening.

5. The thermal contact improvement heat sink module of claim 1, wherein, Each of the plate-shaped bodies extends a ring around the inner periphery of each of the through holes on the back surface thereof, one part of the inner periphery of each of the continuously closed bottom walls is integrally formed with the semi-annular peripheral wall, and the other part is integrally formed with the ring, and each of the communicating openings is recessed from one end of the front surface of each of the plate-shaped bodies connecting the ring.

6. The thermal contact improvement heat sink module of claim 1, wherein, Each of the heat pipes is tightly penetrated in each of the through holes.

7. A heat spreading fin for increasing the thermal contact area of a solder, characterized by The heat dissipation fin comprises: a plate-shaped body provided with a through hole on the front surface thereof and at least one blind hole communicating with the through hole, the blind hole having a continuously closed bottom wall, a semi-annular peripheral wall integrally formed on the inner periphery of the continuously closed bottom wall, and a communicating opening formed on one side of the semi-annular peripheral wall and communicating with the through hole; wherein the solder can be placed in the blind hole.

8. The thermal contact area increasing heat dissipating fin of claim 7, wherein, The number of blind holes is two, the two blind holes are divided into a first blind hole and a second blind hole, the first blind hole is arranged above the second blind hole, and the depth of the first blind hole is greater than or equal to the depth of the second blind hole.

9. The heat-contact-area-increasing heat-dissipating fin according to claim 7, wherein The surface of the continuously closed bottom wall has a flat surface all located in the same plane.

10. The heat-contact-area-increasing heat-dissipating fin according to claim 7, wherein The surface of the continuously closed bottom wall has a downward inclined surface gradually inclined downward toward the communicating opening or an upward inclined surface gradually inclined upward toward the communicating opening.

11. The thermal contact area increasing heat dissipating fin of claim 7 wherein, The plate-shaped body extends a ring around the inner periphery of the through hole on the back surface thereof, one part of the inner periphery of the continuously closed bottom wall is integrally formed with the semi-annular peripheral wall, and the other part is integrally formed with the ring, and the communicating opening is recessed from one end of the front surface of the plate-shaped body connecting the ring.

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