Multi-output high-frequency switching power supply

Abstract

The utility model discloses a multi-output high-frequency switching power supply, which relates to the technical field of switching power supplies and comprises a box body provided with an air inlet and an air outlet which are oppositely arranged; the radiator is arranged in the box body, the radiator is provided with a bottom plate and a top plate, a heat dissipation channel is formed between the bottom plate and the top plate, one end of the heat dissipation channel is opposite to the air inlet, and the other end of the heat dissipation channel is opposite to the air outlet; the power supply module is arranged in the box body and is connected to the bottom plate of the radiator; the power module is arranged in the box body and is connected to the top plate of the radiator; according to the multi-output high-frequency switching power supply, through the design of the independent heat dissipation channels in the box body, heat generated when the power supply works can be effectively dissipated in time, power supply performance reduction and faults caused by heat accumulation are avoided, and the stability and the reliability of the power supply are improved.

Description

Technical Field

[0001] This utility model relates to the field of switching power supply technology, specifically to a multi-output high-frequency switching power supply. Background Technology

[0002] With the continuous development of modern electronic devices, the requirements for power supplies are increasing. Multi-output, high-precision, high-frequency switching power supplies are widely used in many fields such as communications, industrial control, and medical equipment. However, the traditional chassis design of multi-output switching power supplies has many drawbacks, such as complex assembly, which increases the difficulty and cost of production and installation; inconvenient maintenance, making it difficult to repair quickly and effectively when a fault occurs; poor heat dissipation, which may affect the performance and lifespan of the power supply; and large size, which is not conducive to the placement and application in some space-constrained specific occasions. Based on these problems, it is essential to develop a multi-output switching power supply chassis that features convenient assembly and maintenance, excellent heat dissipation performance, and a compact size. Utility Model Content

[0003] In view of this, the present invention provides a multi-output high-frequency switching power supply to solve the defect of poor heat dissipation in existing multi-output switching power supplies.

[0004] In a first aspect, this utility model provides a multi-output high-frequency switching power supply, comprising:

[0005] The enclosure has an air inlet and an air outlet that are positioned opposite each other;

[0006] A radiator is installed inside the housing. The radiator has a bottom plate and a top plate, and a heat dissipation channel is formed between the bottom plate and the top plate. One end of the heat dissipation channel is opposite to the air inlet, and the other end of the heat dissipation channel is opposite to the air outlet.

[0007] The power module is housed inside the enclosure and connected to the base plate of the radiator.

[0008] The power module is housed inside the enclosure and connected to the top plate of the radiator.

[0009] And / or, the power module is disposed on the top plate of the heat sink, and the power module is disposed on the bottom plate of the heat sink.

[0010] The multi-output high-frequency switching power supply provided by this utility model has an independent heat dissipation channel design inside the box, which can effectively dissipate the heat generated during the operation of the power supply in a timely manner, avoid the power supply performance degradation and failure caused by heat accumulation, and improve the stability and reliability of the power supply.

[0011] The power module and the power module are connected to the bottom plate and top plate of the heat sink respectively, or their positions can be swapped. This flexible layout helps to optimize heat distribution, improve heat dissipation, and also provides options for different design needs.

[0012] Optionally, it further includes a first cooling fan, disposed at the inlet and / or outlet of the heat dissipation channel. The provision of the first cooling fan further enhances the airflow speed within the heat dissipation channel, accelerates heat dissipation, and improves heat dissipation performance.

[0013] Optionally, the first cooling fan is disposed inside a fan housing, and multiple first cooling fans are spaced apart along the length of the fan housing. The spaced arrangement of multiple first cooling fans within the fan housing allows for more even airflow, preventing localized poor heat dissipation.

[0014] Optionally, the fan box is disposed within the housing. Placing the fan box within the housing makes the structure more compact and reduces space occupation.

[0015] Optionally, it also includes a controller connected to the fan housing. The controller allows for precise control of parameters such as fan speed, and real-time adjustment of the heat dissipation effect based on the power supply's operating status and temperature, achieving energy saving and performance optimization.

[0016] Optionally, it also includes a second cooling fan, disposed inside the enclosure and connected to the outside of the fan housing. The second cooling fan increases air circulation and exchange within the enclosure, further improving the overall heat dissipation capacity and effectively preventing localized overheating.

[0017] Optionally, the heat sink is made of aluminum. Aluminum has excellent thermal conductivity, enabling it to quickly conduct heat generated by the power module and power unit away, thus improving heat dissipation efficiency.

[0018] Optionally, the power modules are arranged in multiple groups in a matrix on the base plate of the heat sink, and the power modules are arranged in multiple groups in a matrix on the top plate of the heat sink, with each power module corresponding to one of the power modules. This matrix arrangement of power modules and power modules, with each group corresponding to the other, improves the power supply's output capacity and efficiency, while also facilitating modular management and maintenance.

[0019] Optionally, the side of the power module furthest from the heat sink faces the bottom of the enclosure. This layout makes more efficient use of the internal space of the enclosure, allowing for a more compact installation of the power module and thus reducing the overall size of the power supply.

[0020] Optionally, the base plate of the radiator is provided with a plurality of fins spaced parallel to each other, the fins extending toward the top plate, and the gaps between adjacent fins forming the heat dissipation channels. The parallel-spaced fins on the base plate of the radiator form heat dissipation channels, increasing the heat dissipation area and improving heat exchange efficiency.

[0021] The technical solution of this utility model has the following advantages:

[0022] By conducting the heat from the power module and power module to the heat sink and carrying the heat away through independent heat dissipation channels, effective heat dissipation is ensured, and important electrical components are isolated from the external air to prevent corrosion, thereby extending the service life of the power supply and improving its stability and reliability.

[0023] The second cooling fan circulates air through the gap between the casing and the heat dissipation channel, allowing the heat inside the power supply to be evenly conducted and dissipated. This reduces local overheating and prevents the power supply from degrading or being damaged due to excessively high local temperatures, thus helping to improve the overall performance and stability of the power supply.

[0024] The power supply module and power module adopt a specific mirrored arrangement and make reasonable use of space to supply power, which significantly reduces the size of the power supply, making it easier to install and use, and adapting to more application scenarios.

[0025] The heat dissipation channels are installed inside the enclosure, with electrical components arranged on the upper and lower sides of the channels. Each panel of the enclosure can be independently disassembled and installed, greatly facilitating power supply maintenance, reducing maintenance costs and difficulty, and improving maintenance efficiency. This modular enclosure structure design, with clearly defined functions for each component, makes the power supply assembly process more orderly and efficient, reducing assembly difficulty and error rates. The compact size design saves installation space, allowing it to adapt to a wider range of installation environments and equipment requirements.

[0026] The independent heat dissipation channel design can effectively dissipate the heat generated during power supply operation, avoiding power supply performance degradation and failure caused by heat accumulation, and improving the stability and reliability of the power supply.

[0027] The power supply module and the power module are respectively mounted on specific heat sinks, which improves heat conduction efficiency and helps to optimize heat dissipation. Attached Figure Description

[0028] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0029] Figure 1 This is a perspective view of a multi-output high-frequency switching power supply according to an embodiment of the present invention.

[0030] Figure 2 for Figure 1 The rear-view perspective of the multi-output high-frequency switching power supply is shown.

[0031] Figure 3 for Figure 1 A 3D view of the hidden top cover of the multi-output high-frequency switching power supply shown.

[0032] Figure 4 for Figure 3 A perspective view of the internal heat sink of the multi-output high-frequency switching power supply shown in the figure;

[0033] Figure 5 for Figure 4 The radiator shown is viewed from below in a three-dimensional perspective.

[0034] Figure 6 for Figure 1 The image shown is a three-dimensional view of the multi-output high-frequency switching power supply from a low angle.

[0035] Figure 7 for Figure 6 The image shows a perspective view of the hidden lower cover of the multi-output high-frequency switching power supply.

[0036] Explanation of reference numerals in the attached figures:

[0037] 1. Cabinet; 2. Air inlet; 3. Air outlet; 4. Heat sink; 5. Heat dissipation channel; 6. Power module; 7. Power module; 8. First cooling fan; 9. Fan box; 10. Controller; 11. Second cooling fan. Detailed Implementation

[0038] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0039] like Figure 1-7 As shown, this is a specific implementation of the multi-output high-frequency switching power supply provided in this embodiment, including: a housing 1, wherein a heat sink 4, a power module 6 and a power module 7 are provided inside the housing 1.

[0040] like Figure 1 , Figure 2 As shown, the enclosure 1 has an air inlet 2 and an air outlet 3 arranged opposite to each other. The air inlet 2 and the air outlet 3 arranged opposite to each other can form an effective air convection channel, promote the exchange of air inside and outside the enclosure 1, improve heat dissipation efficiency, ensure that the equipment inside the enclosure 1 operates at a suitable temperature, and extend the service life of the equipment.

[0041] like Figure 3 As shown, the heat sink 4 is disposed inside the housing 1, and the power module 7 is disposed on the top plate of the heat sink 4. Disposing of the heat sink 4 inside the housing 1 effectively utilizes the internal space of the housing 1, making the overall structure more compact. The placement of the power module 7 on the top plate of the heat sink 4 facilitates rapid heat conduction from the power module 7 to the heat sink 4, thereby improving heat dissipation efficiency, ensuring the normal operating temperature of the power module 7, and enhancing its operational stability and reliability. This layout reduces heat accumulation within the housing 1, helping to maintain a good working environment for other components within the housing 1.

[0042] like Figure 4 As shown, a heat dissipation channel 5 is formed between the bottom plate and the top plate of the radiator 4. One end of the heat dissipation channel 5 is opposite to the air inlet 2, and the other end is opposite to the air outlet 3. The heat dissipation channel 5 formed between the bottom plate and the top plate provides a clear path for airflow, allowing cool air to enter the heat dissipation channel 5 from the air inlet 2 in a targeted manner, fully absorb heat, and then be discharged from the air outlet 3, thus improving heat dissipation efficiency and effect. The heat dissipation channel 5 is positioned opposite the air inlet 2 and the air outlet 3, ensuring smooth airflow, reducing airflow resistance and turbulence, and enhancing the stability of heat dissipation. This structure helps to achieve uniform heat dissipation, avoid local overheating, and improve the reliability and stability of the entire system.

[0043] like Figure 5 As shown, the power module 6 is connected to the base plate of the heat sink 4 inside the housing 1. Connecting the power module 6 to the base plate of the heat sink 4 allows the heat generated by the power module 6 during operation to be rapidly conducted to the heat sink 4, thereby achieving efficient heat dissipation and ensuring the normal operation and stable performance of the power module 6. This connection method helps optimize the internal spatial layout of the housing 1, making the structure more compact and saving space. It also facilitates good thermal contact between the power module 6 and the heat sink 4, improving heat transfer efficiency, reducing the operating temperature of the power module 6, and extending its service life.

[0044] The multi-output high-frequency switching power supply provided by this utility model has an independent heat dissipation channel 5 inside the housing 1, which can effectively dissipate the heat generated during the operation of the power supply in a timely manner, avoid the power supply performance degradation and failure caused by heat accumulation, and improve the stability and reliability of the power supply.

[0045] Alternatively, as an alternative implementation, the positions of the power module 6 and the power module 7 can be interchanged. For example, the power module 6 can be placed on the top plate of the heat sink 4, and the power module 7 can be placed on the bottom plate of the heat sink 4. By connecting the power module 6 and the power module 7 to the bottom and top plates of the heat sink 4 respectively, or by interchangeding their positions, this flexible layout helps to optimize heat distribution, improve heat dissipation, and also provides options for different design requirements.

[0046] like Figure 6 As shown in this embodiment, the four corners of the bottom surface of the enclosure 1 are respectively provided with support legs, thereby creating a certain space between the enclosure 1 and the placement surface, which is conducive to air circulation and enhances the heat dissipation effect of the bottom of the enclosure 1. The support legs can provide stable support, making the enclosure 1 more stable and reducing the risk of malfunction or damage to the internal equipment due to unstable placement. By raising the enclosure 1, the bottom surface of the enclosure 1 can be prevented from directly contacting the damp or uneven ground, providing a certain degree of moisture protection.

[0047] like Figure 7 As shown in this embodiment, there is a gap between the radiator 4 inside the housing 1 and the inner bottom surface of the housing 1, which facilitates air circulation below the radiator 4, enhances air convection around the radiator 4, and improves the heat dissipation effect.

[0048] like Figure 5 As shown, this embodiment further includes a first cooling fan 8, which is disposed at the inlet of the heat dissipation channel 5. The first cooling fan 8 further enhances the airflow speed within the heat dissipation channel 5, accelerates heat dissipation, and improves heat dissipation performance. Of course, the above description is not limiting; in some alternative embodiments, the first cooling fan 8 may also be disposed at the outlet of the heat dissipation channel 5.

[0049] like Figure 5 As shown, the first cooling fan 8 is disposed inside the fan housing 9, and multiple first cooling fans 8 are spaced apart along the length of the fan housing 9. This layout increases the number of fans, thereby enhancing the overall ventilation volume and more effectively dissipating heat from the housing 1, ensuring the normal operation of the equipment. The multiple first cooling fans 8 spaced apart along the length of the fan housing 9 generate airflow more evenly, avoiding excessive or insufficient airflow in certain areas, and improving the uniformity and overall effectiveness of heat dissipation.

[0050] like Figure 3 , Figure 4As shown, in this embodiment, the fan box 9 is disposed inside the housing 1, making the entire cooling fan system an integrated part inside the housing 1, saving external space and making the overall structure more compact. It also facilitates connection and wiring with other components inside the housing 1, improving the system's integrity and stability.

[0051] like Figure 4 As shown, this embodiment also includes a controller 10, which is connected to the fan housing 9. The controller 10 enables precise control of parameters such as fan speed, and adjusts the heat dissipation effect in real time according to the power supply's operating status and temperature, achieving energy saving and performance optimization. Connecting the controller 10 to the fan housing 9 shortens the connection line between the controller 10 and the fan, reducing signal transmission loss and interference, and improving control accuracy and timeliness. This connection method allows the controller 10 and the fan to form a relatively centralized module, facilitating overall installation, debugging, and maintenance. It also reduces the space occupied by the controller 10 within the housing 1, making the internal layout of the housing 1 more reasonable and compact.

[0052] like Figure 4 As shown, this embodiment also includes a second cooling fan 11, which is disposed inside the housing 1 and connected to the outside of the fan box 9. The second cooling fan 11 increases air circulation and exchange within the housing 1, further improving the overall heat dissipation capacity and effectively preventing localized overheating. The second cooling fan 11, disposed inside the housing 1 and connected to the outside of the fan box 9, can work synergistically with the first cooling fan 8 inside the fan box 9 to enhance airflow and heat dissipation within the housing 1. Separate placement allows for targeted layout based on the heat dissipation needs of different locations, improving the efficiency and uniformity of heat dissipation.

[0053] It should be noted that in this embodiment, the heat sink 4 is made of aluminum. Aluminum has excellent thermal conductivity, enabling it to quickly conduct heat generated by the power module 6 and the power module 7 away, thus improving heat dissipation efficiency. Furthermore, aluminum is lightweight, reducing the overall weight of the device and facilitating installation and transportation. Aluminum also has good corrosion resistance, maintaining good performance in harsh environments and extending the lifespan of the heat sink 4. Finally, aluminum is relatively inexpensive, contributing to a reduction in the overall manufacturing cost of the device.

[0054] Of course, the above description is not limiting. In some alternative embodiments, copper can be used as the heat sink 4, as copper has better thermal conductivity than aluminum, but the cost is relatively high. Alternatively, some new thermally conductive materials, such as graphite and ceramics, can be combined with aluminum to improve heat dissipation.

[0055] like Figure 4 , Figure 5As shown, in this embodiment, the power modules 6 are arranged in a matrix on the bottom plate of the heat sink 4, and the power modules 7 are arranged in a matrix on the top plate of the heat sink 4. Each power module 7 corresponds one-to-one with a power module 6. This one-to-one correspondence ensures that each power module 7 has a matching power module 6 for stable power supply, guaranteeing the system's reliability and performance consistency. The matrix arrangement of multiple modules evenly distributes heat, preventing localized overheating and improving the uniformity and stability of heat dissipation. This corresponding arrangement facilitates troubleshooting and maintenance, allowing for quick location and replacement of faulty modules.

[0056] like Figure 6 , Figure 7 As shown, the side of the power module 6 furthest from the heat sink 4 faces the bottom of the housing 1. This layout makes more efficient use of the internal space of the housing 1, allowing for a more compact installation of the power module 6 and thus reducing the overall size of the power supply.

[0057] like Figure 5 As shown in this embodiment, the base plate of the radiator 4 is provided with a plurality of fins arranged in parallel at intervals. The fins extend toward the top plate, and the gaps between adjacent fins form the heat dissipation channel 5. That is, the plurality of parallel-spaced fins are arranged vertically. The parallel-spaced fins increase the heat dissipation area and improve the heat exchange efficiency, thereby enhancing the heat dissipation effect. The gaps between adjacent fins form the heat dissipation channel 5, providing a clear path for airflow, ensuring the stability and orderliness of airflow, and further improving the heat dissipation efficiency.

[0058] Of course, the above description is not limiting. In some alternative embodiments, the fins can be wavy, serrated, or other shapes to increase turbulence and improve heat exchange efficiency. Additionally, the fins can be made of different materials, such as copper fins or alloy fins with better thermal conductivity.

[0059] The multi-output high-frequency switching power supply provided in this embodiment conducts the heat from the power module 6 and the power module 7 to the heat sink 4, and carries the heat away from the independent heat dissipation channel 5. This not only ensures effective heat dissipation, but also isolates important electrical components from the external air, preventing them from being corroded, extending the service life of the power supply, and improving the stability and reliability of the power supply.

[0060] The second cooling fan 11 circulates air through the gap between the housing 1 and the heat dissipation channel 5, so that the heat inside the power supply is evenly conducted and dissipated, reducing local overheating and avoiding power supply performance degradation or damage caused by excessively high local temperatures, thus helping to improve the overall performance and stability of the power supply.

[0061] Power module 6 and power module 7 adopt a specific mirrored arrangement and make reasonable use of space to supply power, which significantly reduces the size of the power supply, making it easier to install and use, and adapting to more application scenarios.

[0062] The heat dissipation channel 5 is installed inside the enclosure 1, and the electrical components are arranged on the upper and lower sides of the heat dissipation channel 5. Each panel of the enclosure 1 can be independently disassembled and installed, which greatly facilitates power supply maintenance, reduces maintenance costs and difficulty, and improves maintenance efficiency. This modular enclosure 1 structure design, with clear division of labor among components, makes the power supply assembly process more orderly and efficient, reducing assembly difficulty and error rate. The compact size design saves installation space, allowing it to adapt to more installation environments and equipment requirements.

[0063] The independent heat dissipation channel 5 design can effectively dissipate the heat generated during power supply operation, avoiding power supply performance degradation and failure caused by heat accumulation, and improving the stability and reliability of the power supply.

[0064] The power supply module and power module 7 are respectively attached to a specific heat sink 4, which improves the heat conduction efficiency and helps to optimize the heat dissipation effect.

[0065] The multi-output high-frequency switching power supply provided in this embodiment mainly consists of the following key components:

[0066] 1. Enclosure 1: As the external carrier of the entire power supply, it plays an indispensable role. Enclosure 1 has an air inlet 2 and an air outlet 3 arranged opposite each other. The air inlet 2 is for introducing cool air from the outside, while the air outlet 3 is responsible for expelling the hot air generated inside. Through this air convection, a good thermal environment is created inside the power supply, ensuring the stable operation of each module.

[0067] 2. Heatsink 4: Located inside the casing 1, it is the core component of the power supply cooling system. Heatsink 4 has a bottom plate and a top plate, forming a heat dissipation channel 5 between them. Notably, one end of the heat dissipation channel 5 faces the air inlet 2, and the other end faces the air outlet 3. This ingenious layout allows cool air entering from the air inlet 2 to flow smoothly through the heat dissipation channel 5, efficiently carrying away heat, and then being exhausted from the air outlet 3, thereby effectively reducing the internal temperature of the power supply.

[0068] 3. Power Module 6: Also located inside the enclosure 1, it is mounted on the base plate of the heatsink 4. Power Module 6 is responsible for the initial conversion and processing of the input electrical energy, providing a stable input power for the subsequent power module 7. It is the energy source and fundamental guarantee for the entire power system.

[0069] 4. Power Module 7: Also located inside housing 1, it is connected to the top plate of heat sink 4. Power Module 7 is responsible for further converting the electrical energy output from power module 6 into different voltages and currents suitable for various electronic devices, directly affecting whether the power supply can meet the power requirements of different devices. Alternatively, power module 6 can be placed on the top plate of heat sink 4, and power module 7 on the bottom plate. This flexible layout design can be adjusted according to different usage scenarios and needs to achieve optimal heat dissipation and performance.

[0070] Although embodiments of the present invention have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of the present invention, and such modifications and variations all fall within the scope defined by the present invention.

Claims

1. A multi-output high-frequency switching power supply, characterized in that, include: The housing (1) has an air inlet (2) and an air outlet (3) arranged opposite to each other; A radiator (4) is installed inside the housing (1). The radiator (4) has a bottom plate and a top plate. A heat dissipation channel (5) is formed between the bottom plate and the top plate. One end of the heat dissipation channel (5) is opposite to the air inlet (2), and the other end of the heat dissipation channel (5) is opposite to the air outlet (3). The power module (6) is installed inside the housing (1) and connected to the bottom plate of the radiator (4); The power module (7) is installed inside the housing (1) and connected to the top plate of the radiator (4); And / or, the power module (6) is disposed on the top plate of the heat sink (4), and the power module (7) is disposed on the bottom plate of the heat sink (4).

2. The multi-output high-frequency switching power supply according to claim 1, characterized in that, Also includes: A first cooling fan (8) is provided at the inlet and / or outlet of the cooling channel (5).

3. A multi-output high-frequency switching power supply according to claim 2, characterized in that, The first cooling fan (8) is disposed inside the fan box (9), and multiple first cooling fans (8) are disposed at intervals along the length of the fan box (9).

4. A multi-output high-frequency switching power supply according to claim 3, characterized in that, The fan box (9) is located inside the housing (1).

5. A multi-output high-frequency switching power supply according to claim 4, characterized in that, Also includes: The controller (10) is connected to the fan box (9).

6. A multi-output high-frequency switching power supply according to claim 4, characterized in that, Also includes: The second cooling fan (11) is located inside the housing (1) and connected to the outside of the fan box (9).

7. A multi-output high-frequency switching power supply according to any one of claims 1-6, characterized in that, The heat sink (4) is made of aluminum.

8. A multi-output high-frequency switching power supply according to any one of claims 1-6, characterized in that, The power module (6) has multiple sets arranged in a matrix on the bottom plate of the heat sink (4), and the power module (7) has multiple sets arranged in a matrix on the top plate of the heat sink (4). The power module (7) is arranged in a one-to-one correspondence with the power module (6).

9. A multi-output high-frequency switching power supply according to claim 8, characterized in that, The side of the power module (6) away from the heat sink (4) faces the bottom of the housing (1).

10. A multi-output high-frequency switching power supply according to any one of claims 1-6, characterized in that, The radiator (4) has several fins arranged parallel to each other on its base plate. The fins extend toward the top plate, and the gaps between adjacent fins form the heat dissipation channel (5).

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