Heat dissipation device with heat conduction and electromagnetic shielding functions

Abstract

The utility model relates to the technical field of chips, and particularly discloses a heat dissipation device with heat conduction and electromagnetic shielding functions, which comprises a heat dissipation device provided with an upper shielding strip and used for dissipating heat of a PCB (Printed Circuit Board), a flow guide cover arranged above the heat dissipation device, and shielding bottom plates arranged at the bottom of the heat dissipation device, the shielding bottom plate is provided with a lower shielding strip which is used in cooperation with the upper shielding strip and carries out electromagnetic shielding on the PCB installed in the installation cavity. According to the utility model, electromagnetic shielding and heat dissipation of the PCB can be effectively realized; the stability and the reliability of the chip on the PCB and the whole circuit in the temperature environment are ensured; and the PCB can pass the electromagnetic compatibility test without depending on the shielding effectiveness of host machine equipment.

Description

Technical Field

[0001] This utility model relates to the field of chip technology, and more specifically, to a heat dissipation device with thermal conductivity and electromagnetic shielding functions. Background Technology

[0002] As the performance and information processing speed of specialized communication electronic equipment and weapon systems increase, the CPU performance requirements of current integrated chips are also constantly rising; however, the improvement in chip performance and computing power will result in chips generating a lot of heat. Current chip-level heat flux densities have already reached 200 W / cm². 2 The junction temperature of the chip needs to be below 100℃. Without an effective heat dissipation method, such a high heat flux density will seriously affect the reliability and lifespan of the chip and other electronic components. Therefore, heat dissipation of the chip is particularly important.

[0003] Since the circuit board is an independent module used in dedicated equipment, it needs to have anti-interference capabilities. Therefore, the electromagnetic shielding performance of the entire circuit board is also a very important evaluation indicator.

[0004] The technical problems that need to be solved are how to achieve heat dissipation for high-heat chips and physical isolation of the functional areas and connector areas of the board to achieve shielding and anti-spyware functions. Utility Model Content

[0005] The technical problem to be solved by this utility model is to provide a heat dissipation device with heat conduction and electromagnetic shielding functions, which can effectively achieve electromagnetic shielding and heat dissipation for PCB boards; ensure the stability and reliability of chips and the overall circuit on the PCB board in the temperature environment; and enable the PCB board to pass electromagnetic compatibility tests without relying on the shielding effectiveness of the host equipment.

[0006] The solution adopted by this utility model to solve the technical problem is:

[0007] A heat dissipation device with thermal conductivity and electromagnetic shielding functions includes a heat sink with an upper shielding strip for dissipating heat from a PCB board, a flow guide shroud above the heat sink, and a shielding base plate at the bottom of the heat sink, which are close to each other to form an installation cavity; the shielding base plate is provided with a lower shielding strip that works in conjunction with the upper shielding strip to provide electromagnetic shielding for the PCB board installed in the installation cavity.

[0008] In some possible implementations, the heat sink includes a heat sink plate, a fan and fins mounted on the heat sink plate, and heat pipes disposed on the chip in the PCB board and respectively attached to the chip and the heat sink plate.

[0009] In some possible implementations, the flow guide shroud is mounted on the heat sink and forms a flow guide cavity between the shroud and the heat sink; the fan and fins are located inside the flow guide cavity; and heat dissipation holes communicating with the flow guide cavity are provided on the flow guide shroud.

[0010] In some possible implementations, an upper annular groove for mounting an upper shielding strip is provided at the bottom of the heat sink, and a lower annular groove for mounting a lower shielding strip is provided on the top surface of the shielding base plate; the upper annular groove and the lower annular groove are respectively provided corresponding to the grounding shielding copper strip on the PCB board.

[0011] In some possible implementations, a conductive element for connecting the conductive PCB board and the heat sink is also included.

[0012] In some possible implementations, the conductive element includes a spring pin mounted on the upper surface of the PCB board and a pin pad mounted on the bottom of the heat sink and connected to the spring pin.

[0013] In some possible implementations, the heat pipes are in multiple sets and are arranged one-to-one with the chips, and the heat pipes are hollow tubes.

[0014] In some possible implementations, both the heat sink and the shielding base plate are aluminum plates.

[0015] In some possible implementations, connectors for securing the shroud, radiator, and shielding base plate are also included.

[0016] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0017] This invention effectively dissipates heat from the PCB board by setting up a heat sink and a flow guide.

[0018] This utility model features an upper shielding strip on the heat sink and a lower shielding strip on the shielding base plate. The upper and lower shielding strips are respectively attached to the grounding shielding copper strip on the PCB board, enabling the PCB board to pass the electromagnetic compatibility test independently without relying on the shielding effectiveness of the host equipment.

[0019] This invention, by setting spring pins and pin washers, ensures that the PCB board can start and operate normally after the heat sink and PCB board are fastened together. If there is unauthorized removal or improper installation, the PCB board will not start. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the structure of the present invention after assembly with a PCB board;

[0021] Figure 2 This is a schematic diagram of the structure of the air guide, heat sink, and shielding base plate in this utility model;

[0022] Figure 3 This is a schematic diagram of the structure of the heat sink, PCB board, and shielding base plate in this utility model;

[0023] Figure 4 This is a bottom view of the present invention;

[0024] Figure 5 This is a schematic diagram of the upper annular groove and heat sink in this utility model;

[0025] The components are: 1. Heat sink; 11. Heat sink plate; 111. Upper annular groove; 12. Fan; 13. Fins; 14. Heat pipe; 2. Radiator; 21. Heat dissipation hole; 3. Shielding base plate; 31. Lower annular groove; 4. Connector; 5. Conductor; 10. PCB board. Detailed Implementation

[0026] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. The terms "first," "second," and similar terms used in this application do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, "a" or "one," etc., do not indicate a quantity limitation, but rather indicate the existence of at least one. In the implementation of this application, "and / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. In the description of the embodiments of this application, unless otherwise stated, "multiple" means two or more. For example, multiple positioning posts refer to two or more positioning posts. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0027] The present invention will now be described in detail.

[0028] like Figures 1-5 As shown:

[0029] A heat dissipation device with thermal conductivity and electromagnetic shielding functions includes a heat sink 1 with an upper shielding strip for dissipating heat from a PCB board 10, a flow guide 2 disposed above the heat sink 1, a shielding base plate 3 disposed at the bottom of the heat sink 1 and forming a mounting cavity with the heat sink 1 and the heat sink 1 and the shielding base plate 3 close to each other on one side, and a connector 4 for fixing the flow guide 2, the heat sink 1, and the shielding base plate 3; the shielding base plate 3 is provided with a lower shielding strip 311 that works in conjunction with the upper shielding strip and provides electromagnetic shielding for the PCB board 10 mounted in the mounting cavity; the upper shielding strip and the lower shielding strip 311 are respectively connected to the upper and lower shielding strips of the PCB board 10. The grounding shield copper-clad strips are set accordingly. After assembly, the upper shielding strip and the lower shielding strip 311 will be attached to the corresponding grounding shield copper-clad strips respectively. Thus, when in use, the PCB board 10 is electromagnetically shielded by the shielding cover formed by the heat sink 1, the upper shielding strip, the shielding base plate 3, and the lower shielding strip 311. The heat sink 1 dissipates heat from the high-heat-generating chips on the PCB board 10. By quickly carrying the heat from the center of the chip away from the upper surface of the chip, the high-temperature damage caused by heat accumulation and superposition is avoided. The specific heat transfer is in three ways: radiation, convection, and conduction.

[0030] In some possible implementations, in order to effectively conduct heat dissipation for the chip, the heat sink 1 includes a heat sink 11, a fan 12 and fins 13 mounted on the heat sink 11, and heat pipes 14 disposed on the chip in the PCB board 10 and respectively attached to the chip and the heat sink 11; the heat pipes 14 are multiple sets and are arranged one-to-one with the chip, and the heat pipes 14 are hollow tubes.

[0031] Specifically, the heat pipe 14 is welded to the heat sink 11, and further, the welding method is tin soldering; the heat pipe 14 is installed on the chip and is in contact with the chip through thermal grease.

[0032] During use, heat from the top surface of the chip is transferred to the heat pipe 14. Since the heat pipe 14 is a hollow tube, when a temperature difference occurs between the two ends of the heat pipe 14, the evaporation end will quickly carry the heat to the condensation end. Since the heat pipe 14 is in contact with the heat sink 11, the heat pipe 14 quickly distributes the heat evenly to the fins 13 of the heat sink 1, avoiding heat accumulation in the center of the chip. The heat is then quickly circulated with the outside cold air by the fan 12, carrying away the heat on the fins 13, thereby achieving rapid cooling of the chip. Heat transfer is accelerated by increasing the conduction speed.

[0033] In some possible implementations, the flow guide shroud 2 is mounted on the heat sink 11 and forms a flow guide cavity between the shroud 2 and the heat sink 11; the fan 12 and the fins 13 are located inside the flow guide cavity; and the flow guide shroud 2 is provided with heat dissipation holes 21 that communicate with the flow guide cavity.

[0034] The heat sink 11 transfers heat to the fins 13, and the fan 12 circulates the heat on the fins 13 with the outside cold air through the heat dissipation holes 21, thereby removing the heat from the fins 13 and achieving rapid cooling of the chip.

[0035] In some possible implementations, in order to effectively achieve electromagnetic shielding for the PCB board 10, an upper annular groove 111 for installing an upper shielding strip is provided at the bottom of the heat sink 11, and a lower annular groove 31 for installing a lower shielding strip 311 is provided on the top surface of the shielding base plate 3; the upper annular groove 111 and the lower annular groove 31 are respectively provided corresponding to the grounding shielding copper strip on the PCB board 10.

[0036] The grounding shielding copper-clad strip physically isolates the circuit parts, external interfaces, and indicator lights on the PCB board 10 that need to be protected and prevented from interference.

[0037] The upper shielding strip is embedded in the upper annular groove 111, and the lower shielding strip 311 is embedded in the lower annular groove 31, corresponding to the grounding shielding copper strip on the PCB board 10. The shielding cover formed by the bottom of the heat sink 11, the upper shielding strip, the shielding base plate 3, and the lower shielding strip 311 provides electromagnetic shielding for the PCB board 10 and grounds the shielding cover. This ensures that the shielding cover has good conductivity and permeability. When electromagnetic waves pass through the shielding cover, the electromagnetic wave energy is absorbed or reflected due to the conductivity of the shielding cover, thereby reducing and eliminating the interference of electromagnetic waves on the PCB board 10.

[0038] In some possible implementations, a conductive element 5 is also included for connecting the conductive PCB board 10 and the heat sink 11; the conductive element 5 includes a spring pin mounted on the upper surface of the PCB board 10 and a pin pad mounted on the bottom of the heat sink 11 and connected to the spring pin.

[0039] The spring-loaded pins and corresponding spring-loaded pin washers ensure that the PCB board 10 can only start and operate normally after the heat sink 11 is snapped into place with the PCB board 10. If there is unauthorized removal or the shielding cover is not installed, the board will not start and will automatically destroy important content.

[0040] In some possible implementations, the heat sink 11 and the shielding base plate 3 are both aluminum plates. Using aluminum plates as heat sink 11 and shielding base plate 3 has good heat dissipation performance and strong resistance to oxidation and corrosion. By setting fins 13, the amount of heat radiation is increased by increasing the heat dissipation area.

[0041] This invention is not limited to the specific embodiments described above. This invention extends to any new feature or combination disclosed in this specification, as well as any new method or process step or combination disclosed herein.

Claims

1. A heat dissipation device with thermal conductivity and electromagnetic shielding functions, characterized in that, It includes a heat sink with an upper shielding strip for dissipating heat from a PCB board, a flow guide shroud above the heat sink, and a shielding base plate at the bottom of the heat sink, which are close to each other to form a mounting cavity; the shielding base plate is provided with a lower shielding strip that works in conjunction with the upper shielding strip to provide electromagnetic shielding for the PCB board mounted in the mounting cavity.

2. A heat dissipation device with thermal conductivity and electromagnetic shielding functions according to claim 1, characterized in that, The heat sink includes a heat sink plate, a fan and fins mounted on the heat sink plate, and heat pipes disposed on the chip in the PCB board and respectively attached to the chip and the heat sink plate.

3. A heat dissipation device with thermal conductivity and electromagnetic shielding functions according to claim 2, characterized in that, The flow guide shroud is mounted on the heat dissipation plate and forms a flow guide cavity between the shroud and the heat dissipation plate; the fan and fins are located inside the flow guide cavity; and heat dissipation holes communicating with the flow guide cavity are provided on the flow guide shroud.

4. A heat dissipation device with thermal conductivity and electromagnetic shielding functions according to claim 2, characterized in that, An upper annular groove for installing an upper shielding strip is provided at the bottom of the heat sink, and a lower annular groove for installing a lower shielding strip is provided on the top surface of the shielding base plate; the upper annular groove and the lower annular groove are respectively provided to correspond to the grounding shielding copper strip on the PCB board.

5. A heat dissipation device with thermal conductivity and electromagnetic shielding functions according to claim 2, characterized in that, It also includes conductive components for connecting the conductive PCB board and the heat sink.

6. A heat dissipation device with thermal conductivity and electromagnetic shielding functions according to claim 5, characterized in that, The conductive component includes a spring pin mounted on the upper surface of the PCB board and a pin pad mounted on the bottom of the heat sink and connected to the spring pin.

7. A heat dissipation device with thermal conductivity and electromagnetic shielding functions according to claim 2, characterized in that, The heat pipes are in multiple sets and are configured one-to-one with the chips, and the heat pipes are hollow tubes.

8. A heat dissipation device with thermal conductivity and electromagnetic shielding functions according to claim 2, characterized in that, Both the heat sink and the shielding base plate are made of aluminum.

9. A heat dissipation device with thermal conductivity and electromagnetic shielding functions according to any one of claims 1-8, characterized in that, It also includes connectors for fixing the air guide, heat sink, and shielding base plate.

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