Cold row heat dissipation structure and liquid cooling heat dissipation system

Abstract

The utility model discloses a cold row heat dissipation structure and a liquid cooling heat dissipation system. The cold row heat dissipation structure comprises a fin group and a cold row pipe. The fin group comprises a plurality of fins which are arranged at intervals, penetrating holes are formed in the fins, a wrapping ring is arranged between every two adjacent fins, and the front end and the rear end of each wrapping ring are in butt joint with every two adjacent penetrating holes respectively; and the cold discharge pipe is arranged in the through hole of the fin group and the wrapping ring in a penetrating manner. According to the utility model, the unique fin group design is adopted, the wrapping rings between the fins are tightly butted with the penetrating holes at the front end and the rear end, and the contact area between the fins and the cold calandria is increased through the wrapping rings, so that the heat of the cold calandria can be transferred to the fins through the wrapping rings, and therefore, the heat transfer efficiency is greatly improved, and the overall heat dissipation effect is improved.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology, and in particular to a heat dissipation structure for a radiator and a liquid cooling system. Background Technology

[0002] With technological advancements, such as the development of AI, various complex applications like deep learning and big data processing are constantly emerging, demanding faster processing speeds and stronger computing power from electronic products' chips. Similarly, computer processors need to unleash powerful performance when running complex programs like professional graphics rendering and AI training, as well as high-definition games. This performance release inevitably leads to heat generation. With the support of existing water-cooling technology, water-cooled radiators can effectively address the cooling requirements of components, ensuring that critical hardware such as processors and graphics cards maintain low temperatures even during high-performance operation, guaranteeing stable performance output and meeting the high-performance requirements of technological development for electronic products.

[0003] Currently, water cooling primarily relies on radiators to lower the liquid temperature, and the radiator's heat dissipation structure significantly impacts the overall efficiency of the water cooling system. For example... Figure 6 As shown, most existing radiators use a structure primarily consisting of corrugated fins 610 and flat tubes 620, employing a design where the corrugated fins 610 are stacked in two layers of flat tubes 620. Because the corrugated fins 610 and flat tubes 620 are only in near-line contact, the efficiency of heat transfer from the coolant inside the flat tubes 620 to the corrugated fins 610 is severely limited, thus affecting the overall cooling effect of the water cooling system and failing to meet the increasing heat dissipation demands of high-performance electronic devices. Furthermore, the flat tubes 620 are mostly arranged in parallel, easily causing uneven heat dissipation in certain areas, leading to heat accumulation that cannot be dissipated in time. This can result in the risk of performance degradation or even damage to electronic components during operation due to localized overheating, making it difficult to ensure stable operation of electronic components within a suitable temperature range. This can easily lead to equipment crashes, restarts, and other malfunctions, affecting normal equipment use and business continuity. Therefore, developing a radiator heat dissipation structure that can effectively improve heat dissipation efficiency is particularly important. Utility Model Content

[0004] The purpose of this invention is to provide a radiator heat dissipation structure and a liquid cooling system to solve the problems mentioned in the background art. To achieve the above objective, this invention provides the following technical solution:

[0005] The first aspect of this utility model provides a heat dissipation structure for a radiator, including a fin assembly and a radiator tube; the fin assembly includes a plurality of spaced fins, each fin having a through hole, and a wrapping ring is provided between two adjacent fins, with the front and rear ends of the wrapping ring respectively connecting to two adjacent through holes; the radiator tube passes through the through holes of the fin assembly and the wrapping ring.

[0006] The fin includes a planar side and a convex side, the convex side protruding outward to form a wrapping ring surrounding the through hole; the wrapping ring of the convex side of one fin is connected to the through hole of the planar side of the other fin.

[0007] The fins are formed into a wrapping ring by stamping.

[0008] Both the through hole and the cooling pipe have circular cross-sections.

[0009] A heat-absorbing layer is provided on the inner wall of the cooling pipe.

[0010] The heat-absorbing layer is configured with a groove structure.

[0011] The heat-absorbing layer is formed by sintering copper powder through the inner wall of the cooling pipe.

[0012] The second aspect of this utility model provides a liquid cooling heat dissipation system, including a fan, a cold block, water pipes, and a radiator heat dissipation structure as described in any of the preceding claims; the cold block is connected to the radiator pipes in the radiator heat dissipation structure via the water pipes to form a liquid cooling circuit, and the fan is used to drive airflow to exchange heat with the radiator heat dissipation structure.

[0013] The beneficial effects of this utility model are as follows: This utility model adopts a unique fin assembly design, which utilizes the wrapping ring between the fins to tightly connect with the through holes at the front and rear ends. The wrapping ring increases the contact area between the fins and the radiator tube, so that the heat of the radiator tube can be transferred to the fins through the wrapping ring, thereby greatly improving the heat transfer efficiency and enhancing the overall heat dissipation effect. Attached Figure Description

[0014] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0015] Figure 1 This is a schematic diagram of the heat dissipation structure of the radiator of this utility model.

[0016] Figure 2 This is a schematic diagram of the structure of the fin of this utility model.

[0017] Figure 3 This is a schematic diagram of the structure of the cooling pipe of this utility model.

[0018] Figure 4 This is a schematic diagram of the structure of the cooling pipe of this utility model in another embodiment.

[0019] Figure 5This is a schematic diagram of the liquid cooling heat dissipation system of this utility model.

[0020] Figure 6 This is a schematic diagram of the structure of a fin assembly in the prior art.

[0021] It should be noted that the accompanying drawings are not necessarily drawn to scale, but are shown only in a schematic manner without affecting the reader's understanding. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] In this invention, the terms "upper," "lower," "left," "right," "front," "rear," "top," "bottom," "inner," "outer," "middle," "vertical," "horizontal," "lateral," and "longitudinal" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing this invention and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation.

[0024] Furthermore, in addition to indicating location or positional relationship, some of the aforementioned terms may also have other meanings. For example, the term "above" may also be used in some cases to indicate a certain dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this utility model according to the specific circumstances.

[0025] Furthermore, the terms "installation," "setup," "equipped with," "connection," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of these terms in this utility model based on the specific circumstances.

[0026] Furthermore, the terms "first," "second," etc., are primarily used to distinguish different devices, components, or parts (which may be the same or different in specific type and construction), and are not intended to indicate or imply the relative importance or quantity of the indicated devices, components, or parts. Unless otherwise stated, "a plurality of" means two or more.

[0027] It should also be understood that the terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the scope of the invention. As used in this specification and the appended claims, the singular forms “a,” “an,” and “the” are intended to include the plural forms unless the context clearly indicates otherwise.

[0028] It should also be further understood that the term "and / or" as used in this specification and the appended claims refers to any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0029] like Figure 1 and Figure 2 As shown in the figure, this application provides a radiator heat dissipation structure, including a fin assembly 100 and a radiator tube 200. The fin assembly 100 is formed by stacking multiple spaced fins 110 one after the other. Each fin 110 has a through hole 111, and a wrapping ring 112 is provided between two adjacent fins 110. The front and rear ends of the wrapping ring 112 are respectively connected to the two adjacent through holes 111, thus forming a tightly connected contact heat exchange channel. Simultaneously, the radiator tube 200 passes through the contact heat exchange channel formed by the through holes 111 and the wrapping ring 112 of the fin assembly 100. The outer wall of the radiator tube 200 contacts the inner walls of the through holes 111 and the wrapping ring 112, allowing the liquid inside the radiator tube 200 to transfer heat to the fin assembly 100, thereby achieving heat dissipation.

[0030] The advantage of the radiator heat dissipation structure in this application embodiment is that it adopts a unique fin group 100 design, and uses the wrapping ring 112 between the fins 110 to be tightly connected with the through holes 111 at the front and rear ends. The wrapping ring 112 increases the contact area between the fins 110 and the radiator tube 200, so that the heat of the radiator tube 200 can be transferred to the fins 110 through the wrapping ring 112, thereby greatly improving the heat transfer efficiency and enhancing the overall heat dissipation effect.

[0031] As an example, see Figure 2The fin 110 includes a planar side 101 and a raised side 102. The raised side 102 protrudes outward to form a wrapping ring 112 surrounding the through hole 111. The wrapping ring 112 is integrally formed by stamping the fin 110. The wrapping ring 112 of the raised side 102 of one fin 110 is connected to the through hole 111 of the planar side 101 of another fin 110. In this embodiment, the fin 110 is made of metal sheet, such as aluminum alloy sheet. Through a stamping process, the fin 110 with the through hole 111 and the outwardly protruding wrapping ring 112 on one side is stamped on the sheet, so that the fin 110 is divided into a planar side 101 and a raised side 102 with the wrapping ring 112. The manufacturing process is simple and efficient, which helps to reduce costs. The stamped fins 110 are then stacked with their planar sides 101 and raised sides 102 facing each other, so that the wrapping ring 112 of the raised side 102 of one fin 110 is tightly abutted with the through hole 111 of the planar side 101 of the adjacent fin 110, thereby forming a fin assembly 100. During the stacking process, appropriate tight-fitting fixing methods, such as welding or riveting, can be used to ensure the stability of the fin assembly 100.

[0032] As an example, see Figure 1 and Figure 2 Both the through hole 111 and the radiator tube 200 have circular cross-sections. The outer diameter of the radiator tube 200 matches the diameter of the through hole 111 of the fin 110. Compared with the flat tube structure, the circular tube structure has a better water flow speed under the same power water pump drive, which can improve the flow efficiency and heat exchange effect of the coolant.

[0033] As an example, a heat-absorbing layer 210 is provided on the inner wall of the radiator pipe 200 to further improve heat dissipation efficiency and optimize heat dissipation effect. See also Figure 3 The heat-absorbing layer 210 can be configured as a grooved structure to increase the contact area between the coolant and the inner wall of the radiator pipe 200, thereby improving heat exchange efficiency. In another embodiment, see... Figure 4 The heat-absorbing layer 210 can also be formed by sintering copper powder with the inner wall of the cooling tube 200 to form a structure with fine gaps, which increases the heat-absorbing area and improves the heat absorption capacity, enabling it to absorb and transfer heat from the liquid more quickly.

[0034] Based on the same inventive concept as the aforementioned radiator heat dissipation structure, this application also provides a liquid cooling heat dissipation system, see [link to relevant documentation]. Figure 5The system includes a fan 300, a cold block 400, water pipes 500, and the radiator cooling structure described above. The cold block 400 is connected to the radiator pipes 200 in the radiator cooling structure via the water pipes 500 to form a liquid cooling circuit. The fan 300 drives airflow to exchange heat with the radiator cooling structure. The fan 300 is installed on one side of the radiator cooling structure, and its position and angle should be adjusted according to actual cooling requirements to ensure that the air blown by the fan 300 can fully exchange heat with the radiator cooling structure. The liquid cooling system of this application achieves efficient heat dissipation circulation by using the fan 300 to drive air to exchange heat with the radiator cooling structure, combined with the liquid cooling circuit, ensuring that the equipment maintains a low temperature under various operating conditions. It is suitable for high-performance computers, servers, game consoles, and other equipment requiring efficient heat dissipation.

[0035] The working principle of the liquid cooling system is as follows: When the electronic equipment generates heat, the coolant absorbs heat in the cold head 400, causing its temperature to rise. Then, the high-temperature coolant flows through the water pipe 500 into the radiator tubes 200 of the radiator cooling structure, and transfers heat to the fin assembly 100 through the radiator tubes 200. Because the fins 110 of the fin assembly 100 are in close contact with the radiator tubes 200, heat can be quickly transferred to the fins 110. Simultaneously, the fan 300 drives airflow; as the air flows past the fin assembly 100, it carries away the heat from the fins 110, achieving heat dissipation. The cooled coolant then flows back to the cold head 400 through the water pipe 500 to continue absorbing heat generated by the electronic equipment, thus completing the cycle and ensuring the stable operation of the electronic equipment.

[0036] It should also be noted that, without conflict, the embodiments of this utility model and the features therein can be combined with each other to obtain new embodiments.

[0037] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any way. The scope of protection of the present utility model should be determined by the scope of the claims. Although the present utility model has been disclosed above with reference to preferred embodiments, it is not intended to limit the present utility model. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present utility model. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of the present utility model without departing from the scope of the present utility model shall still fall within the scope of the present utility model.

Claims

1. A radiator heat dissipation structure, characterized in that, The device includes a fin assembly (100) and a cooling radiator (200); the fin assembly (100) includes a plurality of spaced fins (110), each fin (110) having a through hole (111), and a wrapping ring (112) being provided between two adjacent fins (110), with the front and rear ends of the wrapping ring (112) respectively connecting to the two adjacent through holes (111); the cooling radiator (200) passes through the through hole (111) and the wrapping ring (112) of the fin assembly (100).

2. The radiator heat dissipation structure according to claim 1, characterized in that, The fin (110) includes a planar side (101) and a raised side (102), the raised side (102) protruding outward to form a wrapping ring (112) surrounding the through hole (111); the wrapping ring (112) of the raised side (102) of one fin (110) is in contact with the through hole (111) of the planar side (101) of the other fin (110).

3. The radiator heat dissipation structure according to claim 2, characterized in that, The fins (110) are formed into a wrapping ring (112) by stamping.

4. The radiator heat dissipation structure according to claim 1, characterized in that, Both the through hole (111) and the cooling pipe (200) have circular cross-sections.

5. The radiator heat dissipation structure according to claim 4, characterized in that, A heat-absorbing layer (210) is provided on the inner wall of the cooling pipe (200).

6. The radiator heat dissipation structure according to claim 5, characterized in that, The heat-absorbing layer (210) is configured with a groove structure.

7. The radiator heat dissipation structure according to claim 5, characterized in that, The heat-absorbing layer (210) is formed by sintering copper powder through the inner wall of the cooling pipe (200).

8. A liquid cooling heat dissipation system, characterized in that, It includes a fan (300), a cold block (400), a water pipe (500), and a radiator heat dissipation structure as described in any one of claims 1 to 7; the cold block (400) is connected to the radiator pipe (200) in the radiator heat dissipation structure through the water pipe (500) to form a liquid cooling circuit, and the fan (300) is used to drive airflow to exchange heat with the radiator heat dissipation structure.

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