Heat dissipation enhanced integrated circuit board structure

Abstract

The utility model provides a heat dissipation enhanced integrated circuit board structure, which relates to the technical field of circuit board heat dissipation and comprises a circuit board main body, a main heat dissipation fan is arranged at the top of the circuit board main body, and a fixed bottom plate is fixed at the top of the main heat dissipation fan through bolts. The problem that components such as heat dissipation fans are installed to assist in cooling in the design of an integrated circuit board is solved by installing an inner rotating baffle, however, the air exhaust direction of the heat dissipation fans is often fixed, and due to the fact that the air exhaust direction of the heat dissipation fans is fixed, the components above are continuously influenced by hot air during long-time operation, and the heat dissipation efficiency of the integrated circuit board is improved. The temperature of the components above gradually rises and even exceeds the normal working temperature range, the high-temperature environment has obvious influence on the stability and the service life of the electronic component, the working state and efficiency of the whole circuit can be influenced, the aging process of the electronic component is accelerated due to long-time high temperature, and if the temperature is too high, the electronic component cannot be damaged. The problems of welding spot cracking, circuit board deformation and the like are further caused, and the stability and the reliability of equipment are further influenced.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology for circuit boards, and in particular to a heat dissipation-enhanced integrated circuit board structure. Background Technology

[0002] Integrated circuit boards (ICBs) are electronic product assemblies that integrate multiple electronic components and circuits onto a small circuit board. Using semiconductor manufacturing processes, they fabricate numerous transistors, resistors, capacitors, and other components on a single-crystal silicon wafer, and then combine these components into a complete electronic circuit using multilayer wiring or tunnel wiring methods. As an indispensable component of modern electronic devices, ICBs have a wide range of applications and a bright future. With continuous technological advancements and growing market demand, ICBs will continue to play a vital role in driving the sustained development of the electronics industry.

[0003] In existing technologies, integrated circuit board designs typically employ cooling fans and other components to aid in heat dissipation. However, the exhaust direction of these fans is often fixed. While this design addresses the heat dissipation issue to some extent, it also introduces several drawbacks. Specifically, because the exhaust direction of the fans remains constant, prolonged operation causes the components above to be continuously exposed to hot air. In this situation, the temperature of the components gradually rises, potentially exceeding their normal operating temperature range. High temperatures significantly impact the stability and lifespan of electronic components. Firstly, high temperatures degrade the performance of electronic components, causing changes in resistance and semiconductor material properties, which affects the overall circuit's operation and efficiency. Secondly, prolonged exposure to high temperatures accelerates the aging process of electronic components, shortening their lifespan. Furthermore, excessively high temperatures can lead to issues such as solder joint cracking and circuit board deformation, further affecting the stability and reliability of the equipment. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing a heat-enhancing integrated circuit board structure.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a heat dissipation enhanced integrated circuit board structure, comprising a circuit board body, a main heat dissipation fan at the top of the circuit board body, a fixed base plate fixed to the top of the main heat dissipation fan by bolts, a wind shield fixed to the top of the fixed base plate, an outer vertical ring baffle fixed to the top of the wind shield, multiple exhaust vents on the circumference of the outer vertical ring baffle, an inner vortex groove on the inner wall of the outer vertical ring baffle, an inner vortex baffle slidably connected to the inner wall of the inner vortex groove, an exhaust vent on the circumference of the inner vortex baffle, and a top plate fixed to the top of the inner vortex baffle.

[0006] Preferably, the bottom circumferential array of the inner rotating stop has an embedded arc groove, and the inner wall of the inner rotating groove is fixed with a spring insert. In the prior art, vibration is unavoidable during equipment operation. This vibration will bring a series of problems to the heat dissipation system of the integrated circuit board, especially between the inner rotating stop and the outer vertical ring stop, which are fixed only by friction. Although this design can provide sufficient stability in the early stage, over time, long-term vibration will cause the wear between the two to gradually increase. As the wear increases, the coefficient of friction between the inner rotating stop and the outer vertical ring stop will gradually decrease, resulting in a worse and worse fixing effect. In this case, after the equipment has been used for a long time, it will be difficult to fix, which not only This can affect the normal operation of the equipment and cause the direction of the hot air outlet to change due to vibration. When the direction of the hot air outlet changes, the original heat dissipation path will be broken, resulting in some components not being able to dissipate heat sufficiently, which will further affect the stability and lifespan of the equipment. To address this problem, this utility model adopts the method of installing spring inserts. When the operator rotates the top plate, the spring inserts are compressed and deformed, and when they reach the next embedded groove, they release elastic potential energy and pop out. This ensures that the operator is always subjected to the frictional force generated by the compression of the spring inserts during rotation, preventing the top plate from rotating too fast. At the same time, the pop-out of the embedded groove provides feedback to the user and can fix the position of the components, preventing the components from shifting due to vibration after long-term use, thereby improving the service life of the equipment.

[0007] Preferably, the inner wall of the outer standing ring is provided with a wing plate annular groove, and a wing plate is slidably connected to the inner wall of the wing plate annular groove. The circumferential surface of the wing plate is fixed to the circumferential surface of the top of the inner rotating ring. In the prior art, the inner rotating ring is prone to swaying up and down in the inner rotating groove of the outer standing ring due to vibration, resulting in poor shielding and sealing effect of the inner rotating ring on other exhaust ports of the outer standing ring, allowing hot air to leak out from other ports and damage other components. To address this problem, this utility model solves the problem by installing a wing plate. The cooperation between the wing plate and the wing plate annular groove prevents the inner rotating ring from swaying up and down in the inner rotating groove, thereby improving the stability of the equipment and providing better sealing for other shielded exhaust ports, thus improving the stability of the equipment.

[0008] Preferably, the top plate has anti-slip grooves arranged in a circular array on its circumferential surface, which increases the friction between the worker's palm and the top plate, making it easier for the user to operate and improving the user experience.

[0009] Preferably, the top of the top plate is fixed with an indicator arrow, which makes it easier for users to observe the direction of the exhaust air and improves the user experience.

[0010] Preferably, the bottom of the top plate is fixed with an air-guiding arc plate, which guides hot air to the opened exhaust port quickly, preventing heat accumulation and improving the service life of the equipment.

[0011] Preferably, the bottom of the fixed base plate is covered with a rubber layer, which prevents wear on the top of the main cooling fan and improves the service life of the equipment.

[0012] Beneficial effects:

[0013] 1. In existing integrated circuit board designs, cooling fans and other components are typically installed to assist in cooling and ensure effective heat dissipation. However, the exhaust direction of these fans is often fixed. While this design can solve the heat dissipation problem to some extent, it also brings some adverse effects. Specifically, because the exhaust direction of the cooling fans is fixed, the components above will be continuously affected by hot air during long-term operation. In this case, the temperature of the components above will gradually rise, even exceeding their normal operating temperature range. High-temperature environments have a significant impact on the stability and lifespan of electronic components. First, high temperatures will cause a decline in the performance of electronic components, such as changes in resistance and alterations in the properties of semiconductor materials. This will affect the operating state and efficiency of the entire circuit. Second, prolonged exposure to high temperatures... It also accelerates the aging process of electronic components, shortening their lifespan. In addition, if the temperature is too high, it can also cause problems such as solder joint cracking and circuit board deformation, further affecting the stability and reliability of the equipment. To address these issues, this utility model adopts an internal rotating baffle to solve the problem. When there are other heat-sensitive components above the circuit board, the operator can fix the base plate to the top of the main cooling fan and rotate the top plate by hand to make the internal rotating baffle rotate in the inner rotating groove of the outer ring baffle. According to actual needs, the exhaust port of the internal rotating baffle is aligned with the appropriate exhaust port of the outer ring baffle. Since the internal rotating baffle only has one exhaust port, hot air can only be discharged from this corresponding exhaust port, thereby changing the direction of the hot air and preventing hot air from blowing on heat-sensitive components for a long time, which would damage the components and improve the service life of the equipment.

[0014] 2. In existing technologies, vibration is unavoidable during equipment operation. This vibration causes a series of problems for the heat dissipation system of integrated circuit boards, especially between the inner rotating baffle and the outer vertical ring baffle, which rely solely on friction for fixation. While this design provides sufficient stability initially, prolonged vibration leads to increased wear between the two baffles over time. As wear increases, the coefficient of friction between the inner rotating baffle and the outer vertical ring baffle gradually decreases, resulting in increasingly poor fixation. In this situation, after prolonged use, the equipment may become difficult to fix, which not only affects the normal operation of the equipment but also affects the direction of the hot air outlet. When the direction of the hot air outlet changes due to vibration, the originally designed heat dissipation path is disrupted, resulting in some components not receiving sufficient heat dissipation, which further affects the stability and lifespan of the equipment. To address this problem, this utility model uses a spring insert installation method. When the operator rotates the top plate, the spring insert is compressed and deformed, and releases its elastic potential energy to pop out when it reaches the next groove. This ensures that the operator is always subjected to the frictional force generated by the spring insert during rotation, preventing the top plate from rotating too fast. At the same time, the pop-out of the groove provides feedback to the user and can fix the position of the components, preventing them from shifting due to vibration during long-term use, thereby improving the lifespan of the equipment.

[0015] 3. In the prior art, the inner rotating baffle is prone to swaying up and down in the inner rotating groove of the outer standing ring baffle due to vibration. This results in poor sealing effect of the inner rotating baffle on other exhaust vents of the outer standing ring baffle, allowing hot air to leak out from other vents and damage other components. To address this problem, this utility model adopts the method of installing a wing ring plate. By matching the wing ring plate with the wing plate ring groove, the inner rotating baffle is prevented from swaying up and down in the inner rotating groove, thereby improving the stability of the equipment and providing better sealing for other blocked exhaust vents, thus achieving the effect of improving the stability of the equipment. Attached Figure Description

[0016] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0017] Figure 2 This is an exploded view of the fixed base plate of this utility model;

[0018] Figure 3 This is a cross-sectional view of the outer standing ring of this utility model;

[0019] Figure 4 This is a cross-sectional view of the wind-induced arc plate of this utility model.

[0020] Legend:

[0021] 1. Circuit board body; 101. Main cooling fan; 2. Fixed base plate; 201. Wind shield; 202. Outer ring baffle; 203. Inner rotating baffle; 204. Top plate; 205. Inner rotating groove; 3. Embedded arc groove; 301. Spring insert; 4. Wing plate ring groove; 401. Wing ring plate; 5. Anti-slip ring groove; 6. Marking arrow; 7. Air-guiding arc plate. Detailed Implementation

[0022] To make the technical means, creative features, and achieved objectives and effects of this utility model easier to understand, the present utility model is further described below with reference to specific embodiments and accompanying drawings. However, the following embodiments are merely preferred embodiments of this utility model and not all of them. Other embodiments obtained by those skilled in the art based on the embodiments described in the implementation plan without creative effort are all within the protection scope of this utility model.

[0023] The specific embodiments of this utility model are described below with reference to the accompanying drawings. Specific implementation examples:

[0025] Reference Figure 1-4A heat-enhanced integrated circuit board structure includes a circuit board body 1. A main heat dissipation fan 101 is provided on the top of the circuit board body 1. A fixed base plate 2 is fixed to the top of the main heat dissipation fan 101 by bolts. A wind shield 201 is fixed to the top of the fixed base plate 2. An outer vertical ring baffle 202 is fixed to the top of the wind shield 201. Multiple air vents are provided on the circumference of the outer vertical ring baffle 202. An inner vortex groove 205 is provided on the inner wall of the outer vertical ring baffle 202. An inner vortex baffle 203 is slidably connected to the inner wall of the inner vortex groove 205. An air vent is provided on the circumference of the inner vortex baffle 203. A top plate 204 is fixed to the top of the inner vortex baffle 203. The bottom circumferential array of the inner rotating stop 203 has an embedded arc groove 3, and the inner wall of the inner rotating groove 205 is fixed with a spring insert 301 in a circumferential array. During equipment operation, vibration is unavoidable. This vibration can cause a series of problems for the heat dissipation system of the integrated circuit board, especially between the inner rotating stop 203 and the outer vertical ring stop 202, which rely solely on friction for fixation. Although this design provides sufficient stability initially, over time, prolonged vibration will cause wear between the two to gradually increase. As wear increases, the coefficient of friction between the inner rotating stop 203 and the outer vertical ring stop 202 will gradually decrease, leading to a worsening of their fixing effect. In this case, after prolonged use, the equipment may become difficult to fix, which is not... This not only affects the normal operation of the equipment, but also causes the direction of the hot air outlet to change due to vibration. When the direction of the hot air outlet changes, the original heat dissipation path will be broken, resulting in some components not being able to dissipate heat sufficiently, which further affects the stability and lifespan of the equipment. The solution is to install spring inserts 301. When the operator rotates the top plate 204, the spring inserts 301 are compressed and deformed, and when they reach the next recessed groove 3, they release elastic potential energy and pop out. This ensures that the operator is always subjected to the frictional force generated by the compression of the spring inserts 301 when rotating, preventing the top plate 204 from rotating too fast. At the same time, the pop-out of the recessed groove 3 provides feedback to the user and can fix the position of the components, preventing the components from shifting due to vibration after long-term use, thereby improving the service life of the equipment.

[0026] The inner wall of the outer ring baffle 202 has a wing plate annular groove 4, and a wing plate 401 is slidably connected to the inner wall of the wing plate annular groove 4. The circumferential surface of the wing plate 401 is fixed to the top circumferential surface of the inner rotating baffle 203. Under the influence of vibration, the inner rotating baffle 203 is prone to swaying up and down in the inner rotating groove 205 of the outer ring baffle 202, resulting in poor sealing effect of the inner rotating baffle 203 on other exhaust vents of the outer ring baffle 202, allowing hot air to leak out from other vents and damage other components. The installation of the wing plate 401 solves this problem. By cooperating with the wing plate annular groove 4, the inner rotating baffle 203 is prevented from swaying up and down in the inner rotating groove 205, thereby improving the stability of the equipment and providing better sealing for other blocked exhaust vents, thus improving the stability of the equipment. The top plate 204 has anti-slip annular grooves 5 arranged in a circular array on its circumferential surface, which increases the friction between the operator's palm and the top plate 204, making it easier for the user to operate and improving the user experience. The top of the top plate 204 is fixed with an arrow 6, which makes it easy for users to observe the exhaust direction and improves the user experience. The bottom of the top plate 204 is fixed with an air-guiding arc plate 7, which guides hot air quickly to the open exhaust vent, preventing heat accumulation and extending the equipment's lifespan. The bottom of the fixed base plate 2 is covered with a rubber layer, which prevents wear on the top of the main cooling fan 101 and further extends the equipment's lifespan.

[0027] The working principle of this utility model is as follows: When there are other heat-sensitive components above the circuit board, the operator can fix the base plate 2 to the top of the main cooling fan 101 and rotate the top plate 204 by hand, so that the inner rotating baffle 203 rotates in the inner rotating groove 205 of the outer standing ring baffle 202. According to actual needs, the exhaust port of the inner rotating baffle 203 is aligned with the appropriate exhaust port of the outer standing ring baffle 202. Since the inner rotating baffle 203 only has one exhaust port, hot air can only be discharged from this corresponding exhaust port, thereby changing the direction of hot air and preventing hot air from blowing on heat-sensitive components for a long time, which would damage the components. When the operator rotates the top plate 204, the spring insert 301 is compressed and deformed, and releases elastic potential energy when it reaches the next embedded arc groove 3, so that the operator is always subjected to the friction force generated by the compression of the spring insert 301 during rotation, preventing the top plate 204 from rotating too fast. At the same time, the ejection of the embedded arc groove 3 provides feedback to the user and can fix the position of the component, preventing the component from shifting due to vibration during long-term use.

[0028] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0029] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely preferred examples and are not intended to limit the utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A heat-enhanced integrated circuit board structure, comprising a circuit board body (1), wherein a main heat dissipation fan (101) is provided on the top of the circuit board body (1), characterized in that: The main cooling fan (101) is fixed to a base plate (2) by bolts. A wind shield (201) is fixed to the top of the base plate (2). An outer ring baffle (202) is fixed to the top of the wind shield (201). Multiple exhaust ports are provided on the periphery of the outer ring baffle (202). An inner vortex groove (205) is provided on the inner wall of the outer ring baffle (202). An inner vortex baffle (203) is slidably connected to the inner wall of the inner vortex groove (205). An exhaust port is provided on the periphery of the inner vortex baffle (203). A top plate (204) is fixed to the top of the inner vortex baffle (203).

2. The heat-enhanced integrated circuit board structure according to claim 1, characterized in that: The bottom circumferential array of the inner rotating stop (203) is provided with an arc groove (3), and the inner wall of the inner rotating groove (205) is fixed with a spring insert (301).

3. The heat-enhanced integrated circuit board structure according to claim 1, characterized in that: The outer standing ring (202) has a wing plate annular groove (4) on its inner wall. A wing plate (401) is slidably connected to the inner wall of the wing plate annular groove (4). The circumferential surface of the wing plate (401) is fixed to the top circumferential surface of the inner rotating ring (203).

4. The heat-enhanced integrated circuit board structure according to claim 1, characterized in that: The top plate (204) has anti-slip ring grooves (5) arranged in a circular array on its circumference.

5. The heat-enhanced integrated circuit board structure according to claim 1, characterized in that: The top of the top plate (204) is fixed with an identification arrow (6).

6. The heat-enhanced integrated circuit board structure according to claim 1, characterized in that: The bottom of the top plate (204) is fixed with an air-guiding arc plate (7).

7. The heat-enhanced integrated circuit board structure according to claim 1, characterized in that: The bottom of the fixed base plate (2) is covered with a rubber layer.

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