Anti-erosion device for front surface of Taiko wafer
By using the same set of equipment to drive the synchronous lifting and lowering design of the ejector pin and the pressure ring, the problem of misalignment between the ejector pin and the pressure ring during the dry resist removal process on the back of the wafer was solved, achieving a tight fit between the wafer and the platform and improving the wafer resist removal yield.
Patent Information
- Application Number
- CN202520205871.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-10
- Publication Date
- 2026-02-03
- Estimated Expiration
- 2035-02-10
AI Technical Summary
In existing dry resist removal equipment for the back side of wafers, misalignment of the top and bottom alignment of the ejector pins and pressure rings results in loose bonding between the wafer and the platform, creating gaps. This causes the polyimide insulating coating on the front side of the wafer to be eroded by plasma, reducing yield.
The same set of equipment is used to drive the ejector pin and the pressure ring. Through the matching design of the ejector pin and the pressure ring, the wafer and the platform are tightly fitted to avoid the formation of gaps. The lifting cylinder is used to control the lifting frame to lift the ejector pin and the pressure ring synchronously, so as to achieve precise alignment between the pressure ring and the ejector pin.
It improves the yield of dry resist removal on wafers, prevents the polyimide insulating coating on the front side of the wafer from being eroded during the resist removal process, and improves the processing quality of the wafers.
Smart Images
Figure CN223872707U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to chip processing technical field, in particular to a Taiko wafer front surface erosion prevention device technology. BACKGROUND
[0002] When the existing wafer back surface dry method peeling equipment implements the peeling operation to Taiko ultra-thin wafer, first, the thimble is operated to rise to the target position, then the wafer is placed on the thimble, then the thimble is lowered to retract into the pinhole, so that the wafer is moved and placed on the platform, then the compression ring is lowered to compress the wafer on the platform. Since the thimble and the compression ring are driven by different driving devices to rise and fall asynchronously, when the equipment is new, the thimble and the compression ring are aligned up and down, after the equipment is used for a long time, since the different driving devices are not the same in wear, the up and down alignment accuracy of the thimble and the compression ring will appear a certain deviation, so that the compression ring is easy to deviate when being pressed to the wafer, so that the wafer cannot be completely attached to the platform, resulting in that there is obvious gap between the attachment surface of the wafer and the platform, in the wafer back surface dry method peeling process, the plasma is easy to erode the polyimide insulating coating on the front surface of the wafer through the gap, finally causing the yield of the wafer to be reduced, and even being scrapped seriously. SUMMARY
[0003] In view of the defects in the prior art, the technical problem to be solved by the utility model is to provide a Taiko wafer front surface erosion prevention device capable of improving the yield of wafer dry method peeling.
[0004] In order to solve the above technical problems, the utility model provides a Taiko wafer front surface erosion prevention device, which comprises a platform support frame, a cylindrical platform fixed on the platform support frame, and a liftable compression ring installed on the platform support frame.
[0005] A plurality of pinholes penetrating up and down are formed on the platform, and a thimble capable of sliding up and down is inserted in each pinhole, a needle side limiting step is formed on the thimble, a hole inner limiting step is formed on the hole wall of the pinhole, the hole inner limiting step abuts against the needle side limiting step, the upper end of the thimble is radially expanded to form a blunt end, the upper end of the thimble is retracted into the pinhole downward, and the thimble can move upward to the position that the upper end of the thimble extends out of the pinhole.
[0006] Its characterized in that: the platform support frame is provided with a liftable lifting frame and a lifting cylinder for driving the lifting frame to lift, a plurality of thimble shaft sleeves and a plurality of compression ring shaft sleeves are fixed on the lifting frame.
[0007] The pressure ring is fixed with a plurality of vertical pressure ring support rods. The upper end of each pressure ring support rod is fixed to the pressure ring. The lower part of each pressure ring support rod is fixed with a pressure ring support block that protrudes radially outward. The lower end of each pressure ring support rod is inserted into each pressure ring bushing, and the pressure ring support block at the lower part of each pressure ring support rod abuts against the upper end of each pressure ring bushing.
[0008] Each ejector pin extends downward through a needle hole and is inserted into a ejector pin sleeve via a movable fit. Each ejector pin has a radially outward protruding ejector pin support block fixed to its lower part. The ejector pin support blocks at the lower part of each ejector pin are set at the same height, and the ejector pin support blocks at the lower part of each ejector pin are higher than the ejector pin sleeve.
[0009] The Taiko wafer front-side anti-corrosion device provided by this utility model uses the same set of equipment to drive the ejector pin and the pressure ring. The vertical alignment accuracy of the ejector pin and the pressure ring will not be offset, which can ensure that the pressure applied by the pressure ring to the wafer is balanced. This allows the wafer to be fully attached to the platform after being compacted by the pressure ring, avoiding obvious gaps between the wafer and the platform. This effectively prevents the polyimide insulating coating (photoresist) on the front side of the wafer from being eroded by plasma during the dry resist removal process on the back side of the wafer, thereby improving the yield of dry resist removal. Attached Figure Description
[0010] Figure 1 This is a schematic diagram of the structure of the Taiko wafer front anti-corrosion device in an embodiment of the present invention, in which the pressure ring and the ejector pin are both in the downward dead point state;
[0011] Figure 2 This is a schematic diagram of the Taiko wafer front anti-corrosion device according to an embodiment of the present invention, in which the pressure ring is raised to a certain height, but the upper end of the ejector pin has not yet extended out of the pin hole.
[0012] Figure 3 This is a schematic diagram of the Taiko wafer front-side anti-corrosion device according to an embodiment of the present invention, in which the pressure ring rises to a certain height while the upper end of the ejector pin extends out of the pin hole. Detailed Implementation
[0013] The embodiments of this utility model are described in further detail below with reference to the accompanying drawings. However, these embodiments are not intended to limit this utility model. Any similar structures or variations thereof that adopt this utility model should be included in the protection scope of this utility model. The commas in this utility model all indicate the relationship between and.
[0014] like Figures 1-3 As shown in the figure, the Taiko wafer front anti-corrosion device provided in this embodiment includes a platform support frame (not shown in the figure), a cylindrical platform 1 fixed on the platform support frame, and a liftable pressure ring installed on the platform support frame;
[0015] The pressure ring consists of an outer ring 31 and an inner ring 32. The outer ring and the inner ring are fixedly connected, and the outer ring is higher than the inner ring. The inner diameter of the outer ring is larger than the outer diameter of the cylindrical platform 1, and the inner diameter of the inner ring is smaller than the outer diameter of the cylindrical platform. The cylindrical platform, the outer ring, and the inner ring are arranged concentrically. An elastic buffer pad is attached to the lower surface of the inner ring 32.
[0016] The platform 1 has multiple vertically penetrating pin holes 8, and each pin hole is fitted with a pin 4 that can slide up and down. The pin 4 has a pin-side limiting step, and the pin hole 8 has an inner limiting step. The inner limiting step abuts against the pin-side limiting step, thereby limiting the downward movement of the pin. The upper end of the pin 4 is radially expanded to form a blunt end. The upper end of the pin retracts downward into the pin hole, and the pin 4 can move upward to the position where its upper end extends out of the pin hole 8.
[0017] The platform support frame is equipped with a liftable lifting frame 2 and a lifting cylinder (not shown in the figure) for driving the lifting frame 2 to lift. Multiple ejector pin bushings 7 and multiple pressure ring bushings 6 are fixed on the lifting frame 2.
[0018] The pressure ring is fixed with a plurality of vertical pressure ring support rods 5. The upper end of each pressure ring support rod 5 is fixed to the pressure ring. The lower part of each pressure ring support rod 5 is fixed with a pressure ring support block 51 that protrudes radially outward. The lower end of each pressure ring support rod 5 is inserted into each pressure ring bushing 6, and the pressure ring support block 51 at the lower part of each pressure ring support rod abuts against the upper end of each pressure ring bushing 6.
[0019] Each ejector pin 4 extends downward through a needle hole and is inserted into each ejector pin sleeve 7 in a movable manner. Each ejector pin has a radially outward protruding ejector pin support block 41 fixed to its lower part. The ejector pin support blocks 41 at the lower part of each ejector pin are set at the same height, and the ejector pin support blocks 41 at the lower part of each ejector pin are higher than the ejector pin sleeve 7.
[0020] This utility model embodiment is used for dry resist removal on the back side of a wafer, and its usage is as follows:
[0021] Initial state ( Figure 1 (As shown in the diagram) Both the pressure ring and the ejector pin are at the downward stop point, at which time the upper end of the ejector pin is retracted into the needle hole;
[0022] Then the lifting cylinder drives the lifting frame 2 to rise, and each pressure ring bushing 6 also pushes each pressure ring support rod 5 to rise synchronously through the pressure ring support block 51, thereby pushing the pressure ring to rise;
[0023] After the lifting frame 2 rises to the point where each ejector pin sleeve 7 abuts against the ejector pin support block 41 at the bottom of each ejector pin ( Figure 2As shown in the state, there is already space for wafer placement between the pressure ring and the upper end of the platform 1. Then the lifting frame 2 continues to rise, and each ejector pin sleeve 7 is also pushed to rise synchronously by the ejector pin support block 41. At this time, the pressure ring ejector pin rises synchronously, so that space for wafer placement can be maintained between the pressure ring and the upper end of the ejector pin.
[0024] After the pressure ring and ejector pin rise to the target height, the upper end of the ejector pin extends upward through the needle hole. Figure 3 (as shown in the diagram), at this time the lifting frame 2 stops rising, and the pressure ring and ejector pin also stop rising. At this time, a robotic arm can be used to transfer the Taiko wafer onto the ejector pin.
[0025] Then, the lifting cylinder drives the lifting frame 2 to descend, and the pressure ring and ejector pin also descend accordingly, thus driving the wafer to descend synchronously. When the ejector pin descends to the lower stop point, the upper end of the ejector pin retracts into the pin hole, and the wafer is also transferred to the platform. Then, the pressure ring continues to descend, pressing the wafer onto the platform. Then, plasma can be used to bombard the back of the wafer to perform the photoresist removal operation. After the photoresist on the back of the wafer is removed, the pressure ring and ejector pin rise sequentially to the platform. Figure 3 Once the wafer reaches the indicated state, the processed wafer can be removed.
Claims
1. A Taiko wafer front-side anti-corrosion device, comprising a platform support frame, a cylindrical platform fixed on the platform support frame, and a liftable pressure ring mounted on the platform support frame; The platform has multiple through-holes, and each hole has a sliding pin inserted into it. The pin has a side limiting step, and the hole wall has an inner limiting step. The inner limiting step abuts against the side limiting step. The upper end of the pin expands radially to form a blunt end. The upper end of the pin retracts downward into the hole, and the pin can move upward to the position where its upper end extends out of the hole. Its features are: The platform support frame is equipped with a liftable lifting frame and a lifting cylinder for driving the lifting frame to rise and fall. Multiple ejector pin bushings and multiple pressure ring bushings are fixed on the lifting frame. The pressure ring is fixed with a plurality of vertical pressure ring support rods. The upper end of each pressure ring support rod is fixed to the pressure ring. The lower part of each pressure ring support rod is fixed with a pressure ring support block that protrudes radially outward. The lower end of each pressure ring support rod is inserted into each pressure ring bushing, and the pressure ring support block at the lower part of each pressure ring support rod abuts against the upper end of each pressure ring bushing. Each ejector pin extends downward through a needle hole and is inserted into a ejector pin sleeve via a movable fit. Each ejector pin has a radially outward protruding ejector pin support block fixed to its lower part. The ejector pin support blocks at the lower part of each ejector pin are set at the same height, and the ejector pin support blocks at the lower part of each ejector pin are higher than the ejector pin sleeve.