MCU chip packaging structure
By introducing components such as elastic clips, connecting blocks, and telescopic springs into the MCU chip packaging structure, the problem of inconvenient disassembly and assembly in traditional packaging is solved, achieving stable installation and effective heat dissipation, and improving the ease of use and protection of the chip.
Patent Information
- Application Number
- CN202520247753.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-17
- Publication Date
- 2026-02-03
- Estimated Expiration
- 2035-02-17
AI Technical Summary
Traditional MCU chip packaging structures are inconvenient to disassemble and reassemble, and lack effective heat dissipation and protection measures.
The design incorporates components such as elastic clips, connecting blocks, mounting slots, telescopic springs, stabilizing blocks, rubber blocks, dustproof nets, and heat dissipation fins to achieve convenient disassembly and assembly, stable installation, and effective heat dissipation of the encapsulated structure.
It enables convenient installation and removal of MCU chips, increases installation stability, and has an effective heat dissipation function to protect the chip from dust and moisture.
Smart Images
Figure CN223872767U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of MCU chip packaging technology, specifically to an MCU chip packaging structure. Background Technology
[0002] An MCU chip is an integrated circuit chip with control, data processing, and communication functions. It is commonly used in industrial production, electrical equipment, and automobiles. The MCU chip packaging structure is a structure that protects the chip from damage caused by external moisture and dust.
[0003] Traditional MCU chip packaging structures, where the package is external to the MCU chip, are inconvenient to disassemble and open for maintenance, making them less user-friendly. Therefore, we propose an MCU chip packaging structure to address these issues. Utility Model Content
[0004] The purpose of this invention is to provide an MCU chip packaging structure to solve the problems mentioned in the background art.
[0005] To achieve the above objectives, this utility model provides the following technical solution: an MCU chip packaging structure, including a packaging base, with mounting brackets fixed on both sides of the top of the packaging base, and elastic buckles movably disposed inside the mounting brackets, with connecting blocks installed on the top of the elastic buckles, and one side of the connecting blocks being fixed to the outer wall of the packaging cover, and a mounting slot being provided on one side of the mounting brackets.
[0006] Preferably, the elastic buckle is provided in four sets, and the four sets of elastic buckles are symmetrically distributed about the central axis of the sealing cover.
[0007] Preferably, the cross-section of the elastic buckle is smaller than the cross-section of the mounting base, and the elastic buckle forms an engaging structure with the mounting base through the connecting block.
[0008] Preferably, a mounting groove is installed at the top of the inner part of the encapsulation cover, and a telescopic spring is installed inside the mounting groove. A stabilizing block is installed at the bottom of the telescopic spring, and a rubber block is installed at the bottom of the stabilizing block.
[0009] Preferably, a plurality of telescopic springs are provided, and the plurality of telescopic springs are symmetrically distributed about the central axis of the encapsulation cover.
[0010] Preferably, the cross-section of the stabilizing block is smaller than the cross-section of the encapsulation cover, and the stabilizing block forms a telescopic structure through a telescopic spring.
[0011] Preferably, the bottom of the encapsulation base is provided with an internal groove, and heat dissipation fins are installed inside the internal groove. Dustproof nets are installed at both the front and rear ends of the internal groove.
[0012] Preferably, the dustproof net is provided in two sets, and the two sets of dustproof nets are symmetrically distributed about the central axis of the heat dissipation fins.
[0013] Compared with the prior art, the beneficial effects of this utility model are: the MCU chip packaging structure not only facilitates disassembly and assembly and increases the stability of chip installation, but also provides a certain heat dissipation structure to help the chip dissipate heat.
[0014] (1) By setting up components such as elastic buckles, connecting blocks, mounting slots and mounting bases, the two main parts of the packaging structure, the packaging base and the packaging cover, are assembled together by snap-fit. If disassembly or assembly is required in the future, the packaging structure can be opened by opening the snap-fit structure to expose the chip protected inside. This makes the packaging structure easy to disassemble and more convenient to use.
[0015] (2) By setting up components such as mounting groove, telescopic spring, stabilizing block and rubber block, the chip is mounted on the top of the packaging base when the packaging cover is engaged with the packaging base to seal and protect the chip. The stabilizing block on the top can press the chip against the top of the chip with the elastic extension force of the telescopic spring, which greatly increases the stability of the installation between the chip and the packaging structure.
[0016] (3) By setting up components such as dustproof mesh, heat dissipation fins and internal grooves, when the chip protected inside the package generates a certain amount of heat during use, the heat can be quickly dissipated through the heat dissipation fins installed inside the internal groove at the bottom of the package base, thus realizing that the package has a heat dissipation structure. Attached Figure Description
[0017] Figure 1 This is a frontal cross-sectional view of the present invention.
[0018] Figure 2 For the present utility model Figure 1 A magnified view of the structure at point A in the middle;
[0019] Figure 3 This is a front view schematic diagram of the heat dissipation fin structure of this utility model;
[0020] Figure 4 This is a top view of the packaging cover of this utility model.
[0021] In the diagram: 1. Encapsulation base; 2. Elastic buckle; 3. Encapsulation cover; 4. Mounting slot; 5. Telescopic spring; 6. Connecting block; 7. Dustproof mesh; 8. Heat dissipation fins; 9. Internal slot; 10. Stabilizing block; 11. Rubber block; 12. Mounting slot; 13. Mounting bracket. Detailed Implementation
[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0023] Please see Figure 1-4 This utility model provides an embodiment of an MCU chip packaging structure, including a packaging base 1. Mounting brackets 13 are fixed to both sides of the top of the packaging base 1. Elastic buckles 2 are movably disposed inside each mounting bracket 13. Connecting blocks 6 are mounted on the top of each elastic buckle 2, and one side of each connecting block 6 is fixed to the outer wall of the packaging cover 3. A mounting slot 12 is provided on one side of the inside of each mounting bracket 13. Four sets of elastic buckles 2 are provided, symmetrically distributed about the central axis of the packaging cover 3, so that the packaging base 1 and the packaging cover 3 are stably assembled together. The cross-section of the elastic buckle 2 is smaller than the cross-section of the mounting bracket 13. The elastic buckles 2 form an engaging structure with the mounting bracket 13 through the connecting blocks 6, facilitating the assembly and disassembly of the packaging cover 3.
[0024] Specifically, such as Figure 1 and Figure 2 As shown, the encapsulation cover 3 is aligned with the encapsulation base 1 and snapped together, so that the elastic buckles 2 on both sides of the encapsulation cover 3 snap into the inside of the mounting bracket 13 and the mounting slot 12, thus assembling the encapsulation base 1 and the elastic buckles 2. When disassembly is required, a stick-shaped tool is taken and inserted into the inside of the mounting slot 12 to squeeze the elastic buckles 2, causing them to shrink and move out of the inside of the mounting slot 12. Then, the encapsulation cover 3 is pulled upward to move the elastic buckles 2 out of the inside of the mounting bracket 13, thus separating the encapsulation base 1 and the encapsulation cover 3 and opening the encapsulation structure.
[0025] The top of the inside of the package cover 3 is equipped with a mounting groove 4, and each mounting groove 4 is equipped with a telescopic spring 5. A stabilizing block 10 is installed at the bottom of the telescopic spring 5, and a rubber block 11 is installed at the bottom of the stabilizing block 10. The design of the rubber block 11 avoids the stabilizing block 10 from sticking to the top of the chip and causing scratches and wear to the chip. Several telescopic springs 5 are provided, and the several telescopic springs 5 are symmetrically distributed about the central axis of the package cover 3, which can stably squeeze the chip. The cross-section of the stabilizing block 10 is smaller than the cross-section of the package cover 3. The stabilizing block 10 forms a telescopic structure through the telescopic springs 5, which improves the squeezing and positioning effect of the chip.
[0026] Specifically, such as Figure 1 and Figure 4 As shown, after the chip is fixed above the packaging base 1, when the packaging cover 3 is assembled with the packaging base 1 to seal and protect the chip, the rubber block 11 at the bottom of the stabilizing block 10 will stick to the top of the chip and use the elastic force of the telescopic spring 5 to squeeze the chip, so that the chip is stably installed above the packaging base 1.
[0027] The bottom of the encapsulation base 1 is provided with an internal groove 9, and heat dissipation fins 8 are installed inside the internal groove 9. Dustproof nets 7 are installed at both the front and rear ends of the internal groove 9. There are two sets of dustproof nets 7, and the two sets of dustproof nets 7 are symmetrically distributed about the central axis of the heat dissipation fins 8, protecting the front and rear ends of the heat dissipation fins 8 and preventing external dust from entering the interior of the heat dissipation fins 8 and affecting the heat dissipation effect.
[0028] Specifically, such as Figure 1 and Figure 3 As shown, after the chip and the packaging structure are installed together, the heat generated in the chip can be conducted downwards and then quickly discharged under the action of the heat dissipation fins 8, so as to avoid the chip from generating too high a temperature and affecting its service life.
[0029] Working principle: When using this utility model, the packaging structure is taken out and assembled with the chip. After the chip is installed on top of the packaging base 1, the packaging cover 3 is aligned with the packaging base 1 and snapped together, so that the elastic buckles 2 on both sides of the packaging cover 3 snap into the inside of the mounting bracket 13 and the mounting slot 12, thereby assembling the packaging base 1 and the packaging cover 3. When the packaging base 1 and the elastic buckles 2 are snapped together, the rubber block 11 at the bottom of the stabilizing block 10 will adhere to the top of the chip, and the elastic force of the telescopic spring 5 will squeeze the chip, so that the chip is stably installed on top of the packaging base 1. When the packaging structure is used later, the heat generated in the chip can be discharged downwards and then quickly discharged under the action of the heat sink 8. Later, a rod-shaped tool can be taken and inserted into the inside of the mounting slot 12 to squeeze the elastic buckles 2, causing them to contract and move out of the inside of the mounting slot 12. Then, the packaging cover 3 is pulled upwards to move the elastic buckles 2 out of the inside of the mounting bracket 13, exposing the chip for corresponding maintenance.
[0030] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.
Claims
1. An MCU chip packaging structure, comprising a packaging base (1), characterized in that: The top of the encapsulation base (1) is fixed with mounting brackets (13) on both sides. The mounting brackets (13) are movably provided with elastic buckles (2) inside. The top of the elastic buckles (2) is provided with connecting blocks (6), and one side of the connecting blocks (6) is fixed to the outer wall of the encapsulation cover (3). The mounting brackets (13) are provided with mounting slots (12) on one side inside.
2. The MCU chip packaging structure according to claim 1, characterized in that: The elastic buckle (2) is provided in four sets, and the four sets of elastic buckles (2) are symmetrically distributed about the central axis of the sealing cover (3).
3. The MCU chip packaging structure according to claim 1, characterized in that: The cross-section of the elastic buckle (2) is smaller than the cross-section of the mounting base (13), and the elastic buckle (2) forms an engaging structure with the mounting base (13) through the connecting block (6).
4. The MCU chip packaging structure according to claim 1, characterized in that: The top of the encapsulation cover (3) is equipped with an installation groove (4), and each installation groove (4) is equipped with a telescopic spring (5). The bottom of the telescopic spring (5) is equipped with a stabilizing block (10), and the bottom of the stabilizing block (10) is equipped with a rubber block (11).
5. The MCU chip packaging structure according to claim 4, characterized in that: Several telescopic springs (5) are provided, and the several telescopic springs (5) are symmetrically distributed about the central axis of the encapsulation cover (3).
6. The MCU chip packaging structure according to claim 4, characterized in that: The cross-section of the stabilizing block (10) is smaller than the cross-section of the encapsulation cover (3), and the stabilizing block (10) forms a telescopic structure through the telescopic spring (5).
7. The MCU chip packaging structure according to claim 1, characterized in that: The bottom of the encapsulation base (1) is provided with an internal groove (9), and heat dissipation fins (8) are installed inside the internal groove (9). Dustproof nets (7) are installed at both the front and rear ends of the internal groove (9).
8. The MCU chip packaging structure according to claim 7, characterized in that: The dustproof net (7) is provided in two sets, and the two sets of dustproof net (7) are symmetrically distributed about the central axis of the heat dissipation fins (8).