Chip surface glue spraying device

Abstract

The utility model relates to the technical field of chip surface glue spraying devices, and discloses a chip surface glue spraying device. Comprising a device assembly, a glue spraying assembly and a telescopic assembly, the device assembly comprises a device frame, the telescopic assembly is arranged on the device frame, the telescopic assembly comprises a connecting protection plate, a motor is fixedly arranged on the side face of the connecting protection plate, and the output end of the motor is fixedly connected with a connecting block; the end, away from the motor, of the connecting block is rotationally connected with a first connecting rod, the end, away from the connecting block, of the first connecting rod is rotationally connected with a second connecting rod, the second connecting rod is connected with a glue spraying baffle, and the glue spraying baffle is connected with a protection box in a sliding and penetrating mode. According to the utility model, through the arrangement of the glue spraying assembly and the telescopic assembly, glue is sprayed to a plurality of chips at the same time, and the start and stop of glue spraying are controlled.

Description

TECHNICAL FIELD

[0001] The utility model relates to chip surface glue spraying technical field, concretely is a kind of chip surface glue spraying device. BACKGROUND

[0002] Traditional manual gluing method is not only inefficient, difficult to meet large-scale production demand, and there are great defects in the uniformity, thickness control of glue spreading, prone to poor chip packaging, affect product performance and reliability, at the same time, some early simple glue spraying equipment, glue spraying precision is limited, cannot adapt to the more and more fine pin structure of chip and tiny packaging area, difficult to accurately control glue amount, cause glue waste or deficiency, and then cause chip short circuit, poor heat dissipation and other problems.

[0003] After searching, prior art (application number: CN202221957607.5), the "a kind of chip surface glue spraying device" is described in the document. The utility model includes workbench, carrier, support, adjusting frame, needle cylinder and glue dispenser;The carrier, support and glue dispenser are all arranged on the workbench;The adjusting frame is slidably connected with the support, and the needle cylinder is arranged on the adjusting frame;The glue dispenser is connected with the needle cylinder, and the needle cylinder is arranged towards the carrier.

[0004] But the protection effect of chip in prior art is improved, but there are still some deficiencies: unable to spray glue on multiple chips simultaneously, and unable to control the start and stop of glue spraying. UTILITY MODEL CONTENT

[0005] The utility model aims at solving the shortcomings in prior art and provides a kind of chip surface glue spraying device.

[0006] To achieve the above object, the utility model adopts the following technical scheme: a kind of chip surface glue spraying device, including device assembly, glue spraying assembly and telescopic component, the device assembly includes device frame, the device frame is provided with telescopic component, and the telescopic component includes connecting guard plate, the side of connecting guard plate is fixedly provided with motor, the output end of motor is fixedly connected with connecting block, the end of connecting block away from motor is rotatably connected with connecting rod one, the end of connecting rod one away from connecting block is rotatably connected with connecting rod two, and connecting rod two is connected with glue spraying baffle, and glue spraying baffle slides through connecting protection box;Glue spraying assembly is arranged on the protection box, and the glue spraying assembly includes glue storage box, the glue storage box is fixedly arranged above protection box, and glue needle is fixedly arranged below protection box.

[0007] Further description of the above technical scheme:

[0008] The connecting guard plate is fixedly arranged above the device frame, and the output end of the motor is fixedly connected with the connecting guard plate.

[0009] As a further description of the above technical solutions:

[0010] The connecting guard plate is fixedly provided with a guide block, the guide block is slidably connected with a connecting rod two, the guide block plays a guiding role on the connecting rod two, and the protection box is fixedly arranged on the device frame.

[0011] As a further description of the above technical solutions:

[0012] The glue storage box and the glue injection needle are provided with a plurality of groups, and the positions of the glue storage box and the glue injection needle of each group correspond to each other.

[0013] As a further description of the above technical solutions:

[0014] The glue injection baffle penetrates the protection box, and the glue injection baffle is provided with a groove, when glue injection is performed, each group of grooves is in communication with the glue injection needle and the glue storage box, when glue injection is stopped, the outer wall of the glue injection baffle is attached to the protection box, and the grooves are away from the glue injection needle and the glue storage box.

[0015] As a further description of the above technical solutions:

[0016] The device frame is provided with a chip placing box above, the chip placing box is provided with a chip one above, and the chip one is arranged below the glue injection needle.

[0017] As a further description of the above technical solutions:

[0018] The bottom end of the glue injection needle touches the chip one, and is used for glue dropping.

[0019] The utility model has the advantages of the following beneficial effects:

[0020] 1. By setting a plurality of groups of glue storage boxes and glue injection needles, and the positions of the glue storage box and the glue injection needle of each group correspond to each other, a plurality of chips can be sprayed at the same time, the glue spraying efficiency is greatly improved, and the production time is saved.

[0021] 2. By setting grooves on the glue injection baffle, when glue injection is performed, each group of grooves is in communication with the glue injection needle and the glue storage box, when glue injection is stopped, the outer wall of the glue injection baffle is attached to the protection box, and the grooves are away from the glue injection needle and the glue storage box, so that the start and stop of glue injection are controlled. DRAWINGS

[0022] Figure 1 A schematic diagram of a chip surface glue injection device is provided.

[0023] Figure 2 A left view of the chip surface glue spraying device is provided in the utility model.

[0024] Figure 3 A glue spraying assembly schematic view of the chip surface glue spraying device is provided in the utility model.

[0025] Figure 4 A glue spraying assembly enlarged schematic view of the chip surface glue spraying device is provided in the utility model.

[0026] Legend:

[0027] 1, device assembly; 11, device frame; 12, chip placement box; 13, chip one; 2, glue spraying assembly; 21, glue spraying needle; 22, glue storage box; 23, glue connecting device; 3, telescopic assembly; 31, connecting guard plate; 32, motor; 33, connecting block; 34, connecting rod one; 35, connecting rod two; 36, guide block; 37, glue spraying baffle; 38, protection box. DETAILED DESCRIPTION

[0028] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the utility model.

[0029] With reference to Figures 1-4 The utility model provides a kind of chip surface glue spraying device, comprising: including device assembly 1, glue spraying assembly 2 and telescopic assembly 3, device assembly 1 includes device frame 11, device frame 11 is provided with telescopic assembly 3, telescopic assembly 3 includes connecting guard plate 31, connecting guard plate 31 side is fixedly provided with motor 32, the output end of motor 32 is fixedly connected connecting block 33, connecting block 33 is fixedly connected connecting rod one 34 at the end away from motor 32, connecting rod one 34 is fixedly connected connecting rod two 35 at the end away from connecting block 33, connecting rod two 35 connects glue spraying baffle 37, glue spraying baffle 37 is slidably connected protection box 38;Protection box 38 is provided with glue spraying assembly 2, glue spraying assembly 2 includes glue storage box 22, glue storage box 22 is fixedly arranged above protection box 38, glue storage box 22 is fixedly arranged below protection box 38 with glue spraying needle 21.

[0030] In the embodiment, the device assembly, the glue spraying assembly and the telescopic assembly constitute the chip surface glue spraying device involved in the application, and the chip surface glue spraying device is realized. The chip in the application can use the device as long as the chip surface glue spraying is needed. The application does not limit the specific chip category. Generally, the chip is the prior art and is a commonly used known technology in the field. Only the use is improved, and therefore the connection mode is not described in detail.

[0031] In the embodiment, the output end of the motor 32 drives the connection block 33 to rotate, and the connection block 33 drives the first connection rod 34 and the second connection rod 35 to perform telescopic movement through rotation connection.

[0032] In the embodiment, the second connection rod 35 is connected with the glue spraying baffle 37, so that the glue spraying baffle 37 is telescopic in the protection box 38 to control the glue spraying state. The glue storage box 22 stores glue, which is sprayed out through the glue spraying needle 21.

[0033] It should be noted that the glue spraying needle is made of stainless steel material. The glue spraying needle made of stainless steel material can effectively resist the corrosion of glue. It is not easy to rust and corrode for a long time, so as to ensure the structural integrity of the glue spraying needle, maintain the precise glue spraying caliber, ensure the uniformity and stability of the glue spraying, and stainless steel has good hardness and toughness. This makes the glue spraying needle not easy to deform and damage in frequent plugging, touching the chip and bearing the flow impact of the glue and the like.

[0034] Specifically, the connection guard plate 31 is fixedly arranged above the device frame 11, and the output end of the motor 32 penetrates and fixedly connects the connection guard plate 31.

[0035] In the embodiment, the connection guard plate 31 provides stable support for the motor 32, and the output end of the motor 32 penetrates the connection guard plate 31 and transmits power.

[0036] Specifically, the connection guard plate 31 is fixedly provided with a guide block 36, and the second connection rod 35 penetrates and slidably connects the guide block 36. The guide block 36 plays a guiding role on the second connection rod 35. The protection box 38 is fixedly arranged on the device frame 11. When the motor 32 is started, the output end of the motor 32 drives the connection block 33 to rotate. The connection block 33 drives the first connection rod 34 to make the second connection rod 35 telescopic left and right. The second connection rod 35 drives the glue spraying baffle 37 to perform telescopic movement in the protection box 38.

[0037] As a preferred implementation manner, the guide block 36 limits the movement direction of the second connection rod 35. The motor 32 drives the connection block 33 to rotate, drives the second connection rod 35 to telescopic left and right under the guidance of the guide block 36 through the first connection rod 34, and further drives the glue spraying baffle 37 to act, thereby improving the glue spraying control precision.

[0038] Specifically, the glue storage box 22 and the glue injection needle 21 are provided with several groups, and the positions of each group of glue storage box 22 and glue injection needle 21 correspond to each other. The glue storage box 22 is connected with the glue connecting device 23 above, which is used to connect the glue liquid. The glue connecting device 23 is arranged on the connecting guard plate 31.

[0039] It should be noted that the glue storage box 22 and the glue injection needle 21 are provided with several groups, the glue connecting device 23 connects the glue liquid, flows into the glue storage box 22, and then is sprayed out through the glue injection needle 21, which can spray glue on multiple chips at the same time.

[0040] Specifically, the glue injection baffle 37 penetrates the protection box 38, and the glue injection baffle 37 is provided with a slot hole. When the glue is sprayed, each slot hole penetrates the glue injection needle 21 and the glue storage box 22. When the glue injection is stopped, the outer wall of the glue injection baffle 37 is attached to the protection box 38, and the slot hole is away from the glue injection needle 21 and the glue storage box 22.

[0041] As a preferred embodiment, when the glue is sprayed, the glue injection baffle 37 moves to make the slot hole penetrate the glue injection needle 21 and the glue storage box 22, and the glue is smoothly sprayed out. When the glue injection is stopped, the outer wall of the glue injection baffle 37 is attached to the protection box 38, and the slot hole avoids the glue injection needle 21 and the glue storage box 22 to cut off the glue path, preventing the glue from dripping.

[0042] Specifically, the device frame 11 is provided with a chip placing box 12 above, and a chip one 13 is placed above the chip placing box 12. The chip one 13 is arranged below the glue injection needle 21.

[0043] It should be noted that the chip one 13 is placed above the chip placing box 12 and below the glue injection needle 21, which is convenient for glue injection operation.

[0044] Specifically, the bottom end of the glue injection needle 21 touches the chip one 13, which is used for glue dripping.

[0045] In this embodiment, the bottom end of the glue injection needle 21 is close to and touches the chip one 13, and the glue is evenly dripped in the form of small droplets, which ensures the accuracy of the glue injection position.

[0046] In use, the operator places the chip one 13 on the chip placing box 12 at the glue injection position of the device frame 11, starts the motor 32, drives the connecting block 33 to rotate, drives the connecting rod two 35 to stretch and contract left and right through the connecting rod one 34, and drives the glue injection baffle 37 to stretch and contract in the protection box 38 through the connecting rod two 35. The glue injection baffle 37 has a slot hole. When the slot hole of the glue injection baffle 37 corresponds to the glue injection position of the glue injection needle 21 and the glue storage box 22, the glue drips due to gravity. The glue injection baffle 37 is retracted backward to make the slot hole away from the glue dripping position of the glue injection needle 21 and the glue storage box 22, preventing the glue from dripping, and controlling the start and stop of the glue injection.

[0047] The glue spraying baffle can accurately aim the groove at the glue spraying position of the glue spraying needle and the glue storage box, so that accurate control of the glue spraying process is realized, the accuracy and consistency of glue spraying are ensured, the glue spraying baffle can prevent glue from dripping in the non-glue spraying state, glue waste is reduced, and production cost is reduced.

[0048] Finally, it should be noted that: the electrical components in this article are all connected with the main controller and 220V mains, and the main controller can be a conventional known device controlled by a computer, etc., and the detailed description of known functions and known components is omitted in the specific embodiments of the present disclosure. In order to ensure the compatibility of the device, the operation means used are consistent with the parameters of the market instruments.

[0049] The above only describes preferred embodiments of the present application and is not intended to limit the present application. Although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent replacements to some technical features, as long as they are within the spirit and principles of the present application. Any modification, equivalent replacement, improvement, etc. made within the scope of the present application shall be included in the protection scope of the present application.

Claims

1. A chip surface adhesive spraying device, characterized in that: Including device assembly (1), glue spraying assembly (2) and telescopic assembly (3), the device assembly (1) includes device frame (11), the telescopic assembly (3) is arranged on the device frame (11), the telescopic assembly (3) includes connecting guard plate (31), the connecting guard plate (31) is fixedly provided with motor (32) on the side, the output end of the motor (32) is fixedly connected with connecting block (33), the connecting block (33) is rotatably connected with connecting rod one (34) at the end away from the motor (32), the connecting rod one (34) is rotatably connected with connecting rod two (35) at the end away from the connecting block (33), the connecting rod two (35) is connected with glue spraying baffle (37), the glue spraying baffle (37) is slidably connected with connecting protection box (38).

2. The chip surface glue spraying device according to claim 1, characterized in that: The protection box (38) is provided with glue spraying assembly (2), the glue spraying assembly (2) includes glue storage box (22), the glue storage box (22) is fixedly arranged above the protection box (38), the glue spraying needle (21) is fixedly arranged below the protection box (38), the connecting guard plate (31) is fixedly arranged above the device frame (11), and the output end of the motor (32) penetrates the connecting guard plate (31).

3. The apparatus according to claim 2, wherein: The connecting guard plate (31) is fixedly provided with guide block (36), the guide block (36) is slidably connected with connecting rod two (35), the guide block (36) plays a guiding role on the connecting rod two (35), the protection box (38) is fixedly arranged on the device frame (11), when the motor (32) is started, the output end of the motor (32) drives the connecting block (33) to rotate, the connecting block (33) drives the connecting rod one (34) to make the connecting rod two (35) left-right telescopic, the connecting rod two (35) drives the glue spraying baffle (37) to do telescopic motion in the protection box (38).

4. The apparatus according to claim 3, wherein: The glue storage box (22) and the glue spraying needle (21) are provided with a plurality of groups, and the position of each group of glue storage box (22) and glue spraying needle (21) corresponds, the glue storage box (22) is connected with glue connecting device (23) above, for accessing glue liquid, the glue connecting device (23) is arranged on the connecting guard plate (31).

5. The apparatus according to claim 4, wherein: The glue spraying baffle (37) penetrates the protection box (38), and the glue spraying baffle (37) is provided with a groove, when spraying glue, each groove is penetrated with the glue spraying needle (21) and the glue storage box (22), when stopping spraying glue, the outer wall of the glue spraying baffle (37) is attached with the protection box (38), and the groove is away from the glue spraying needle (21) and the glue storage box (22).

6. The apparatus according to claim 5, wherein: The device frame (11) is provided with chip placing box (12) above, the chip placing box (12) is placed with chip one (13) above, and the chip one (13) is arranged below the glue spraying needle (21).

7. The apparatus according to claim 6, wherein: The glue spraying needle (21) bottom end touches the chip one (13), for dropping glue.

Images