Electronic component disassembling device

Abstract

The utility model belongs to the technical field of desoldering, and particularly relates to an electronic component disassembling device which comprises a heat conduction panel, a shell and a heating piece, an installation position is arranged at the upper end of the shell, the heating piece is arranged on the installation position, the heat conduction panel is arranged at the upper end of the shell and covers the heating piece, and the heating piece is arranged on the heat conduction panel. The heating piece can release heat and transfer the heat to the heat conduction panel. The circuit board is placed on the heat conducting panel, heat released by the heating piece is transmitted to the heat conducting panel, and the heat conducting panel further transmits the heat to the circuit board, so that soldering tin on the circuit board is melted, and a worker can quickly disassemble electronic elements on the circuit board by operating tools such as tweezers. The working efficiency can be effectively improved, the temperature can be accurately controlled, the energy consumption is low, the yield is high, and the cost can be effectively saved.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the dismantling and welding technical field especially relates to an electronic component disassembling device. BACKGROUND

[0002] With the social progress and the acceleration of the development of science and technology, the popularization rate of electronic and electrical products is higher and higher, and the speed of updating is faster and faster, which causes a large number of electronic and electrical products to be discarded. Since the circuit board is widely used in electronic and electrical products, the scrap amount of the circuit board is also very large, so it is necessary to recycle and utilize the circuit board.

[0003] At present, the electronic components on the circuit board are mainly treated by hot air gun or electric iron, although the electronic components can be disassembled, but there are problems of high energy consumption, low heat utilization rate and easy damage to electronic components. UTILITY MODEL CONTENTS

[0004] The utility model aims at providing an electronic component disassembling device which can solve the above problems.

[0005] To achieve the above purpose, the utility model embodiment provides an electronic component disassembling device, which comprises:

[0006] A heat-conducting panel;

[0007] A shell and a heating element, the upper end of the shell is provided with a mounting position, the heating element is arranged on the mounting position, the heat-conducting panel is arranged at the upper end of the shell and covers the heating element, the heating element can release heat and transfer the heat to the heat-conducting panel.

[0008] Optionally, the heating element is a heating disc, the mounting position is a hole penetrating from the upper end of the shell to the inside of the shell, the heating disc is arranged at the hole, and a gap is formed between the heating disc and the heat-conducting panel.

[0009] Optionally, the heat-conducting panel is a microcrystalline panel or a ceramic panel.

[0010] Optionally, the lower end of the shell is provided with four silica gel foot pads in a rectangular distribution.

[0011] Optionally, it further comprises a cooling fan, the cooling fan is arranged in the inside of the shell and below the heating element, the lower end of the shell is provided with an air inlet corresponding to the cooling fan, and the shell is further provided with an air outlet.

[0012] Optionally, it further comprises a control module, the control module is arranged in the inside of the shell, and the control module is electrically connected with the heating element and the cooling fan.

[0013] Compared with the prior art, the beneficial effects of the utility model are that: through placing the circuit board on the heat conduction panel, and transmitting the heat released by the heating piece to the heat conduction panel, the heat conduction panel further transmits the heat to the circuit board, thereby melting the solder on the circuit board, so that the staff can quickly disassemble each electronic component on the circuit board through operating the tweezers and other tools, the working efficiency can be effectively improved, the temperature can be accurately controlled, the energy consumption is small, the yield is high, and the cost can be effectively saved. BRIEF DESCRIPTION OF DRAWINGS

[0014] In order to more clearly illustrate the technical solutions in the embodiments of the utility model, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description, obviously, the drawings in the following description are only some embodiments of the utility model, and for those skilled in the art, other drawings can also be obtained according to these drawings without creative labor.

[0015] Figure 1 It is the explosion schematic diagram of the utility model.

[0016] Figure 2 It is the plan view of the utility model.

[0017] Figure 3 It is the section view along Figure 2 A-A line.

[0018] Figure 4 It is the perspective view of the utility model.

[0019] In the drawing:

[0020] 100, heat conduction panel;

[0021] 200, shell;210, mounting position;220, silica gel foot pad;230, air inlet;240, air outlet;

[0022] 300, heating piece;

[0023] 400, heat dissipation fan;

[0024] 500, control module. DETAILED DESCRIPTION

[0025] The embodiments of the utility model are described in detail below, and the examples of the embodiments are shown in the drawings, wherein the same or similar reference signs represent the same or similar elements or elements with the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary, and are intended to explain the embodiments of the utility model, and cannot be understood as the limitation of the utility model.

[0026] In the description of the embodiments of the utility model, it needs to be understood that, if the embodiments of the utility model involve directionality indication, for example, the orientation or position relationship of the indications such as up, down, left, right, front, back, inside and outside is based on the orientation or position relationship shown in the drawings, which is only for the convenience of describing the embodiments of the utility model and simplifying the description, and therefore cannot be understood as a limitation on the utility model.

[0027] In addition, the terms "first" and "second" are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" can explicitly or implicitly include one or more of the features. In the description of the embodiments of the utility model, the meaning of "multiple" is two or more, unless otherwise specifically limited.

[0028] In the embodiments of the utility model, unless otherwise specifically defined and limited, if there are terms such as "installation", "connection", "connection", "fixing" and the like, they should be understood in a broad sense, for example, they can be fixedly connected, or they can be detachably connected, or they can be integrated. It can be mechanically connected, or it can be electrically connected. It can be directly connected, or it can be indirectly connected through an intermediate medium. It can be the communication or interaction relationship between two elements. For ordinary skilled persons in the art, the specific meaning of the above terms in the embodiments of the utility model can be understood according to the specific circumstances.

[0029] As shown in Figures 1 to 4 The utility model discloses an electronic component disassembling device, including heat conduction panel 100, shell 200, heating piece 300, heat dissipation fan 400 and control module 500.

[0030] Among them, the upper end of shell 200 is provided with installation site 210, heating piece 300 is set up on installation site 210, heat conduction panel 100 is set up on the upper end of shell 200, and covers heating piece 300, heating piece 300 can release heat and transmit heat to heat conduction panel 100, specifically, heat conduction panel 100 is microcrystalline panel or ceramic panel.

[0031] When working, the worker places the circuit board on the heat conduction panel 100 and corresponds to the installation site 210, at this time, the heat released by the heating piece 300 is transmitted to the heat conduction panel 100, and the heat conduction panel 100 transmits the heat to the circuit board to melt the solder on the circuit board, so that the worker can quickly disassemble each electronic component on the circuit board by operating the tweezers and other tools, which can effectively improve the work efficiency, accurately control the temperature, save energy, improve the yield, and effectively save the cost.

[0032] In an embodiment, the heating element 300 is a heating disc, the mounting site 210 is a hole penetrating from the upper end of the shell 200 to the inside of the shell 200, the heating disc is arranged at the hole, and a gap is formed between the heating disc and the heat-conducting panel 100, that is, the spiral heating coil on the heating disc is prevented from contacting the heat-conducting panel 100 to avoid short circuit and other problems, the overall structure is simple, and the production cost is low.

[0033] In an embodiment, the lower end of the shell 200 is in a rectangular distribution and is provided with four silica gel foot pads 220, the silica gel foot pads 220 can improve the stability of the electronic component disassembling device, can prevent the electronic component disassembling device from slipping during work, and can effectively improve the safety of work.

[0034] In an embodiment, the heat dissipation fan 400 is arranged inside the shell 200 and below the heating element 300, the lower end of the shell 200 is provided with an air inlet 230 corresponding to the heat dissipation fan 400, the shell 200 is further provided with an air outlet 240, the control module 500 is arranged inside the shell 200, the control module 500 is electrically connected with the heating element 300 and the heat dissipation fan 400, the control module 500 is a prior art and is used for controlling the heating element 300 and the heat dissipation fan 400 to work, the inside of the shell 200 is heat-dissipated by the heat dissipation fan 400, and the stability of the control module 500 in work can be ensured.

[0035] The above is only a preferred embodiment of the present application, and is not used to limit the present application, and any modification, equivalent replacement and improvement within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims

1. An electronic component disassembling apparatus characterized by comprising: The utility model relates to an electronic component disassembling device, including: A heat-conducting panel; A shell and a heating element, the upper end of the shell is provided with a mounting position, the heating element is arranged on the mounting position, the heat-conducting panel is arranged on the upper end of the shell and covers the heating element, the heating element can release heat and transmit heat to the heat-conducting panel.

2. The electronic component disassembling device according to claim 1, wherein: The heating element is a heating disc, the mounting position is a hole penetrating from the upper end of the shell to the inside of the shell, the heating disc is arranged at the hole, and a gap is formed between the heating disc and the heat-conducting panel.

3. The electronic component disassembling device according to claim 1, wherein: The heat-conducting panel is a microcrystalline panel or a ceramic panel.

4. The electronic component disassembling device according to claim 1, wherein: The lower end of the shell is provided with four silica gel foot pads in a rectangular distribution.

5. The electronic component disassembly apparatus according to any one of claims 1 to 4, characterized by Further comprising: A heat dissipation fan, the heat dissipation fan is arranged in the inside of the shell and below the heating element, the lower end of the shell is provided with an air inlet corresponding to the heat dissipation fan, and the shell is further provided with an air outlet.

6. The electronic component disassembly device of claim 5, wherein Further comprising: A control module, the control module is arranged in the inside of the shell, and the control module is electrically connected with the heating element and the heat dissipation fan.

Images