Electrolytic impurity removing device for plating solution for diamond wire production
By adopting a parallel-spaced structure of mesh stainless steel cathode and anode plates in the plating solution treatment equipment, combined with the design of the circulation pipeline, the problem of insufficient contact of the plating solution caused by the small cathode area is solved, and efficient electrolytic depurification of the plating solution is achieved.
Patent Information
- Application Number
- CN202520172788.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-26
- Publication Date
- 2026-02-06
- Estimated Expiration
- 2035-01-26
AI Technical Summary
In existing plating solution treatment equipment, the cathode area is small, resulting in insufficient contact between the plating solution and the electrode plate, and low electrolytic treatment efficiency.
Multiple mesh stainless steel cathode and anode plates are used in a parallel and spaced structure. Combined with the circulation pipeline design, this ensures that the plating solution is in full contact with the electrode plates in the electrolytic tank. The uniform distribution of the plating solution and the removal of impurities are achieved through circulation pumps and filters.
This improves the electrolytic treatment efficiency of the plating solution, increases the contact area between the cathode plate and the plating solution, increases the content of impurity metal ions adsorbed per unit time, and ensures the electrolytic removal effect of the plating solution.
Smart Images
Figure CN223879883U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model belongs to electrolytic plating solution processing technical field, and specifically relates to a plating solution electrolysis impurity removal device for diamond wire production. BACKGROUND
[0002] In the production process of diamond wire saw (nickel plating step), metal impurity ions and organic impurities will continuously accumulate due to the dissolution of anode material and the electrolytic decomposition of additives, resulting in the decrease of breaking tension of finished product wire saw and plating layer quality. In the current plating solution regeneration process, the organic impurities in the plating solution are adsorbed by activated carbon, and then the impurity ions are removed by electrolytic equipment. Subsequently, the composition of the plating solution is adjusted after impurity treatment to perform diamond wire plating work again. The cathode of the electrolytic equipment is mainly made of stainless steel corrugated plate, and the cathode area is small, which leads to insufficient contact between the plating solution and the cathode plate and low electrolytic treatment efficiency. SUMMARY
[0003] The utility model discloses a plating solution electrolysis impurity removal device for diamond wire production, which can ensure sufficient contact between the plating solution and the electrode plate, increase the contact area between the electrode plate and the plating solution, and effectively improve the plating solution treatment efficiency.
[0004] To achieve the above-mentioned purpose, the technical scheme of the utility model is as follows:
[0005] A plating solution electrolysis impurity removal device for diamond wire production includes an electrolytic tank and a storage tank, a circulating pipeline is arranged between the electrolytic tank and the storage tank, a plurality of electrode plates are arranged in the electrolytic tank, a gap exists between each adjacent two electrode plates, a pair of branch pipes in the circulating pipeline are connected to both ends of each gap, and a gap exists between the electrode plate and the inner wall of the electrolytic tank.
[0006] Preferably, a plurality of connecting pieces are arranged in the electrolytic tank, the connecting pieces correspond to the electrode plates one by one, and the connecting pieces are used to install the electrode plates.
[0007] Preferably, the connecting piece comprises two limiters, which are fixedly arranged on two opposite side walls in the electrolytic tank, and each of the limiters comprises an upper clamping groove and a lower clamping groove, wherein the upper clamping groove and the lower clamping groove are both U-shaped plate structures, the upper clamping grooves of the two limiters are opposite to each other, and the lower clamping groove of each of the limiters is arranged upward.
[0008] Preferably, an emptying pipe is arranged between the bottom of the electrolytic tank and the upper end of the storage tank, and an emptying valve is arranged on the emptying pipe, so that, after the plating solution is treated, the plating solution in the electrolytic tank is completely discharged into the storage tank for subsequent treatment.
[0009] Preferably, the circulating pipeline comprises a first pipeline and a second pipeline, and the first pipeline and the second pipeline are arranged on two opposite sides of the electrolytic tank, respectively, so that the plating solution flows into the electrolytic tank through the first pipeline and flows out of the electrolytic tank through the second pipeline to realize the circulating flow of the plating solution and ensure that the plating solution is in full and uniform contact with the electrode plate.
[0010] The first pipeline comprises a first main pipe and a plurality of first branch pipes, one end of the first main pipe is communicated with the lower end of the storage tank, the other end of the first main pipe is connected with the plurality of first branch pipes, the outlet of each of the first branch pipes is communicated with a gap, and a circulating pump is arranged on the first main pipe close to the storage tank, so that the plating solution in the storage tank is delivered to the electrolytic tank through the circulating pump, and the plating solution is uniformly distributed and flows in the electrolytic tank through the plurality of first branch pipes.
[0011] The second pipeline comprises a second main pipe and a plurality of second branch pipes, one end of the second main pipe is communicated with the upper end of the storage tank, the other end of the second main pipe is connected with the plurality of second branch pipes, the inlet of each of the second branch pipes is communicated with a gap, and the plating solution in the plurality of gaps flows into the second main pipe through the corresponding second branch pipes and then flows into the storage tank.
[0012] One first branch pipe and one second branch pipe corresponding to the same gap constitute a pair of branch pipes, and the flow direction of the plating solution in the electrolytic tank is ensured through cooperation of the plurality of second branch pipes and the first branch pipes.
[0013] Preferably, a filter is arranged on the first main pipe close to the plurality of first branch pipes, and the filter is located on one side of the outlet end of the circulating pump, so that solid impurities in the plating solution during the electrolysis process are further separated through the filter.
[0014] Preferably, the cathode plate is a mesh plate body made of a stainless steel woven mesh, which effectively increases the contact area of the cathode plate and the plating solution.
[0015] Preferably, the anode plate body is a plate body structure made of nickel, the anode bag is a bag-shaped structure made of polypropylene, and the anode plate body is located in the anode bag.
[0016] Preferably, the electrolytic tank is a cuboid structure.
[0017] By the above technical scheme, the utility model discloses the beneficial effects are:
[0018] 1, the utility model discloses a plurality of electrode plate is with the way of cathode plate and anode plate parallel interval arrangement is arranged in electrolytic tank, and then make the plating solution in the circulating flow process and electrode plate fully contact, effectively guarantee the full electrolysis of plating solution, effectively improve the electrolysis treatment efficiency of plating solution.
[0019] 2, the utility model discloses the cathode plate of stainless steel braided mesh structure is arranged, and make a plurality of cathode and anode plate interval arrangement, and then effectively increase the contact area of plating solution and cathode plate, improve the impurity metal ion content of adsorption in unit time, improve the plating solution treatment efficiency, guarantee the electrolysis of plating solution and the effect of removing impurities.
[0020] 3, the utility model discloses the flowing direction of plating solution in electrolytic tank is parallel with electrode plate, guarantees the complete effective circulation of plating solution between electrolytic tank and storage tank, guarantees the full contact of plating solution and electrode plate.
[0021] 4, the utility model discloses a plurality of connecting pieces are installed to electrode plate, guaranteeing that electrode plate is parallel to each other, guaranteeing that there is the interval between electrode plate and the inner wall of electrolytic tank simultaneously, so that the cavity formed by adjacent electrode plate is interconnected, guaranteeing the full effective electrolysis of plating solution and removing impurities. DRAWINGS
[0022] Figure 1 It is the structure diagram of the utility model Figure 1 .
[0023] Figure 2 It is the structure diagram of the utility model Figure 2 .
[0024] Figure 3 It is the structure diagram of the utility model after removing electrolytic tank cover body Figure 1 .
[0025] Figure 4 It is the structure diagram of the utility model after removing electrolytic tank cover body Figure 2 .
[0026] Figure 5 It is the structure diagram of the utility model electrolytic tank.
[0027] Figure 6 It is the utility model Figure 3 Enlarged view of A.
[0028] Figure 7 It is the utility model Figure 5 Enlarged view of B.
[0029] The numbers in the attached diagram are as follows: 1 is the electrolytic tank, 2 is the storage tank, 3 is the circulating pump, 4 is the electrode plate, 5 is the upper slot, 6 is the lower slot, 7 is the drain pipe, 8 is the drain valve, 9 is the first main pipe, 10 is the first branch pipe, 11 is the filter, 12 is the second main pipe, and 13 is the second branch pipe. Detailed Implementation
[0030] The present invention will be further described below with reference to the accompanying drawings and specific embodiments:
[0031] like Figures 1-7 As shown, this embodiment provides an electrolytic depurification device for diamond wire production plating solution, including an electrolytic tank 1 and a storage tank 2. The electrolytic tank 1 has a cuboid structure. A circulation pipeline is provided between the electrolytic tank 1 and the storage tank 2. The circulation pipeline includes a first pipe and a second pipe, which are located on opposite sides of the electrolytic tank 1. A circulation pump 3 is installed on the first pipe. The circulation pump 3 transports the plating solution in the storage tank 2 through the first pipe, the electrolytic tank 1, and the second pipe, and returns it to the storage tank 2, realizing the circulation treatment of the plating solution. During this process, the electrolytic tank 1 performs electrolytic depurification on the plating solution. The storage tank 2 is equipped with a stirring device and a heat preservation device. On the one hand, the plating solution is stirred. The stirring device is driven by a motor to rotate the stirring blades in the storage tank 2 to ensure that the components of the plating solution are evenly distributed in the storage tank 2, thereby ensuring more effective electrolytic depurification of the plating solution after it is transported to the electrolytic tank 1. The heat preservation device ensures that the plating solution is kept in a temperature range of 45-50℃, ensuring the processing temperature conditions of the plating solution.
[0032] The electrolytic vessel 1 is equipped with multiple electrode plates 4, which are connected to a rectifier to ensure uniform current distribution. The current is set to 0.5 A / dm. 2 There is a gap between each pair of adjacent electrode plates 4, and the two ends of each gap are respectively connected to a pair of branch pipes in the circulation pipeline. The plating solution flows through the gaps between the electrode plates 4 in the electrolytic tank 1, making full contact with the electrode plates 4 for electrolytic purification. Multiple pairs of branch pipes ensure that the plating solution enters and exits multiple gaps between the electrode plates 4 at the same time, ensuring full contact between the plating solution and the electrode plates 4. There is a gap between the electrode plates 4 and the inner wall of the electrolytic tank 1, ensuring rapid diffusion of the plating solution in the electrolytic tank 1, so that the plating solution is evenly distributed in the electrolytic tank 1, thereby ensuring full contact between the plating solution and the electrode plates 4.
[0033] The electrode plate 4 includes an anode plate and a cathode plate, which are arranged parallel to each other at intervals, i.e., one anode plate and one cathode plate are arranged sequentially, with a gap between each adjacent anode plate and cathode plate (e.g., ...). Figure 5The cathode plate is a net plate body, the cathode plate is a net plate body made of stainless steel woven net, that is, the stainless steel woven net is woven into a plate structure as a whole, which can effectively ensure the full contact of the cathode plate with the plating solution, the net structure effectively increases the effective contact area of the plating solution and the cathode plate, improves the electrolytic impurity removal efficiency of the plating solution, the anode plate includes an anode bag and an anode plate body, the anode bag wraps the anode plate body, the anode plate body is a plate body structure made of nickel, that is, a nickel cake, which is convenient for limiting the anode plate body in the anode bag and contacting with the plating solution, the anode bag is a bag-shaped structure made of polypropylene, the anode plate body is located in the anode bag, specifically, the anode bag is provided with a support structure, the support structure is a cuboid structure made of titanium woven net, the anode plate body (that is, the nickel cake) is located in the support structure, on the one hand, the contact of the plating solution with the anode plate body is ensured, and the electrolytic impurity removal of the plating solution is smoothly performed, on the other hand, the impurities generated in the electrolysis process of the nickel cake are prevented from flowing into the plating solution, the impurities in the plating solution are increased, and at the same time, the support structure ensures the support of the anode bag and prevents it from deforming.
[0034] A plurality of connecting pieces are arranged in the electrolytic tank 1, the connecting pieces correspond to the electrode plates 4 one by one and are used to install the electrode plates 4, the connecting pieces include two limiting pieces, the two limiting pieces are fixedly arranged on two opposite side walls in the electrolytic tank 1, the limiting pieces include upper clamping grooves 5 and lower clamping grooves 6, the upper clamping grooves 5 and the lower clamping grooves 6 are both U-shaped plate structures, the upper clamping grooves 5 of the two limiting pieces are opposite, when the electrode plates 4 are installed, the electrode plates 4 pass through the upper clamping groove 5 openings from top to bottom, the electrode plates 4 are limited, and at the same time, gaps are ensured between the electrode plates 4 and the two opposite side plates of the electrolytic tank 1 in which the limiting pieces are installed, the lower clamping groove 6 openings of each limiting piece are arranged upward, on the one hand, the lower clamping groove 6 supports and limits the electrode plates 4, and at the same time, the electrode plates 4 are prevented from contacting the bottom plate of the electrolytic tank 1, the lower side of the cover plate of the electrolytic tank 1 is fixedly provided with a baffle, the lower side of the baffle abuts against a plurality of electrode plates 4, and then the baffle and the lower clamping groove 6 cooperate to limit and fix the electrode plates 4 in the up-down direction, through the gaps between the electrode plates 4 and the inner wall of the electrolytic tank 1, the full diffusion of the plating solution in the electrolytic tank 1 is ensured, and the full contact of the electrode plates 4 with the plating solution is ensured.
[0035] The bottom of the electrolytic tank 1 and the upper end of the storage tank 2 are provided with a discharge pipe 7, the discharge pipe 7 is provided with a discharge valve 8, in the process of electrolytic impurity removal of the plating solution, the content of impurity metal ions in the plating solution is continuously monitored, when the impurities reach the control requirement, the rectifier is closed, the discharge valve 8 is opened, the residual plating solution in the electrolytic tank 1 flows into the storage tank 2 through the discharge pipe 7, and then subsequent operation processing is performed.
[0036] The first pipeline comprises a first main pipe 9 and a plurality of first branch pipes 10. One end of the first main pipe 9 is communicated with the lower end of the storage tank 2, and the other end is connected with the plurality of first branch pipes 10. The outlet of each first branch pipe 10 is communicated with a gap. A circulating pump 3 is arranged on the first main pipe 9 close to the storage tank 2. The circulating pump 3 delivers the plating solution in the storage tank 2 to the plurality of first branch pipes 10 through the first main pipe 9, and simultaneously delivers the plating solution to the plurality of adjacent electrode plates 4 through the plurality of first branch pipes 10, so that the plating solution simultaneously contacts with the plurality of electrode plates 4, and the electrolysis impurity removal efficiency of the plating solution is improved.
[0037] A filter 11 is arranged on the first main pipe 9 close to the plurality of first branch pipes 10. The filter 11 is located on the outlet side of the circulating pump 3. The filter 11 filters the plating solution delivered from the storage tank 2, and separates the solid impurities in the plating solution and the solid impurities generated in the electrolysis process. The filter 11 is provided with a PP cotton filter element for filtering the plating solution.
[0038] The second pipeline comprises a second main pipe 12 and a plurality of second branch pipes 13. One end of the second main pipe 12 is communicated with the upper end of the storage tank 2, and the other end is connected with the plurality of second branch pipes 13. The inlet of each second branch pipe 13 is communicated with a gap. The plurality of second branch pipes 13 are correspondingly arranged with the plurality of first branch pipes 10. One first branch pipe 10 and one second branch pipe 13 correspondingly arranged in the same gap form a pair of branch pipes. The plating solution in the electrolysis tank 1 flows out through the plurality of second branch pipes 13, and flows into the second main pipe 12 to flow to the storage tank 2, so that the circulation of the plating solution between the storage tank 2 and the electrolysis tank 1 is realized. By one-to-one correspondence between the plurality of second branch pipes 13 and the plurality of first branch pipes 10, the uniform inflow and outflow of the plating solution in the electrolysis tank 1 are ensured.
[0039] In use, the rectifier and the circulating pump are simultaneously opened, and the current is set to 0.5A / dm 2 The plating solution in the storage tank 2 is delivered to the electrolysis tank 1 through the first main pipe 9 and the plurality of first branch pipes 10 by the circulating pump 3, and the plating solution is simultaneously ensured to enter between the plurality of cathode and anode plates through the plurality of first branch pipes 10. After being fully contacted with the electrode plates 4 and electrolyzed, the plating solution flows into the second main pipe 12 through the plurality of second branch pipes 13, and is delivered to the storage tank 2 through the second main pipe 12, so that the circulation electrolysis treatment of the plating solution is realized.
[0040] In this process, the plating solution flowing out of the storage tank 2 first separates the solid impurities in the plating solution, including the solid impurities contained in the plating solution before electrolysis and the solid impurities generated in the electrolysis process.
[0041] At the same time, the content of impurity metal ions in the plating solution is monitored during the electrolysis and impurity removal process. After the impurity content reaches the control requirement, the rectifier is closed, and the emptying valve is opened. The plating solution returns to the storage tank, and then the plating solution is adjusted to the process requirement.
[0042] The above-described embodiments are only preferred embodiments of the present application and are not intended to limit the scope of the present application. Therefore, equivalent changes or modifications made in accordance with the structure, features and principles described in the patent scope of the present application should be included in the patent scope of the present application.
Claims
1. A plating solution electrolytic impurity removal device for diamond wire production, characterized by, The electrolytic tank (1) and the storage tank (2) are provided with a circulating pipeline between them. A plurality of electrode plates (4) are arranged in the electrolytic tank (1), and a gap exists between every two adjacent electrode plates (4). The two ends of each gap are respectively connected to a pair of branch pipes in the circulating pipeline, and a spacing exists between the electrode plate (4) and the inner wall of the electrolytic tank (1). The electrode plate (4) comprises an anode plate and a cathode plate, and the anode plate and the cathode plate are arranged in parallel in sequence. The cathode plate is a mesh plate body, the anode plate comprises an anode bag and an anode plate body, and the anode bag wraps the anode plate body.
2. The impurity removing device for gold wire production plating solution electrolysis according to claim 1, characterized in that, A plurality of connecting pieces are arranged in the electrolytic tank (1), and the connecting pieces correspond to the electrode plates (4) one by one and are used for mounting the electrode plates (4).
3. The impurity removing device for gold wire production plating solution electrolysis according to claim 2, characterized in that, The connecting piece comprises two limiting pieces which are fixedly arranged on two opposite side walls in the electrolytic tank (1). The limiting piece comprises an upper clamping groove (5) and a lower clamping groove (6), and the upper clamping groove (5) and the lower clamping groove (6) are both U-shaped plate structures. The upper clamping grooves (5) of the two limiting pieces are oppositely opened, and the lower clamping groove (6) of each limiting piece is upwardly arranged.
4. The impurity removing device for gold wire production plating solution electrolysis according to claim 1, characterized in that, An emptying pipe (7) is arranged between the bottom of the electrolytic tank (1) and the upper end of the storage tank (2), and an emptying valve (8) is arranged on the emptying pipe (7).
5. The impurity removing device for gold wire production plating solution electrolysis according to claim 1, characterized in that, The circulating pipeline comprises a first pipeline and a second pipeline, and the first pipeline and the second pipeline are respectively arranged on two opposite sides of the electrolytic tank (1).
6. The impurity removing device for plating solution for diamond wire production according to claim 5, characterized in that, The first pipeline comprises a first main pipe (9) and a plurality of first branch pipes (10). One end of the first main pipe (9) is connected to the lower end of the storage tank (2), and the other end of the first main pipe (9) is connected to the plurality of first branch pipes (10). The outlet of each first branch pipe (10) is connected to a gap, and a circulating pump (3) is arranged on the first main pipe (9) close to the storage tank (2). The second pipeline comprises a second main pipe (12) and a plurality of second branch pipes (13). One end of the second main pipe (12) is connected to the upper end of the storage tank (2), and the other end of the second main pipe (12) is connected to the plurality of second branch pipes (13). The inlet of each second branch pipe (13) is connected to a gap. A first branch pipe (10) and a second branch pipe (13) corresponding to the same gap constitute a pair of branch pipes.
7. The impurity removing device for the plating solution of the diamond wire production according to claim 6, characterized in that, A filter (11) is arranged on the first main pipe (9) close to the plurality of first branch pipes (10), and the filter (11) is located on one side of the outlet end of the circulating pump (3).
8. The impurity removing device for gold wire production plating solution electrolysis according to claim 1, characterized in that, The cathode plate is a mesh plate body made of stainless steel woven mesh.
9. The impurity removing device for gold wire production plating solution electrolysis according to claim 1, characterized in that, The anode plate body is a plate body structure made of nickel, the anode bag is a bag-shaped structure made of polypropylene, and the anode plate body is located in the anode bag.
10. The impurity removing device for plating solution for diamond wire production according to claim 1, characterized in that, The electrolytic tank (1) is a cuboid structure.