High-speed cold compress fan

Abstract

The utility model discloses a high-speed cold compress fan, which is characterized in that an air passage is formed inside a fan shell, an internal support is arranged inside the air passage, a motor base and a heat dissipation piece base are arranged on the internal support, a fan blade group is mounted on the motor base, a heat dissipation piece is fixedly arranged on the heat dissipation piece base, and a fan blade group is mounted on the heat dissipation piece base. A plurality of wire grooves are formed in the circumferential direction of the heat dissipation piece, and the depth range of the wire grooves is 1-3mm. According to the utility model, the wire grooves extending in the axial direction of the heat dissipation piece are formed in the circumferential direction of the heat dissipation piece, and the wire grooves can form a negative pressure area under the action of high-speed air flow, so that the contact intimacy between the air flow and the heat dissipation piece is enhanced by the negative pressure area; compared with the prior art, heat can be taken out from the heat dissipation piece more effectively and quickly, the surface area of the heat dissipation piece is increased through the arrangement of the wire grooves, the two ways are combined, the heat dissipation effect is more efficient after the heat dissipation piece with the structure is applied, meanwhile, in the structure, the heat dissipation piece does not need to be provided with radial heat dissipation wings, and the manufacturing cost of the heat dissipation piece is greatly saved.

Description

TECHNICAL FIELD

[0001] The utility model relates to fan technical field, concretely is a high -speed cold compress fan. BACKGROUND

[0002] Cold compress fan refers to the cold compress assembly is arranged at the fan air outlet, and the cold compress assembly works and can make the conduction piece cooling refrigeration through heat conduction, so that the cooled conduction piece can be contacted with the human body, and the cold compress nursing effect is achieved.

[0003] The cold compress assembly generally adopts a semiconductor refrigeration sheet as a refrigeration source, and the semiconductor refrigeration sheet generates heat on the other side working surface while refrigerating on one side working surface when working. Therefore, when the semiconductor refrigeration sheet is used as a refrigeration source, the heat dissipation mode of the other side working surface needs to be designed. The existing heat dissipation mode is to set a heat dissipation piece on the heat generating working surface of the semiconductor refrigeration sheet through heat conduction, and then the heat is dissipated outwards along the air flow. At present, the heat dissipation piece structure applied in the fan air duct is basically a heat dissipation piece with radial fins in the circumferential direction. This shape of heat dissipation piece not only has high cost, but also needs to conduct the heat generated by the semiconductor refrigeration piece to the fin to be brought out by the air flow to achieve heat dissipation. The heat dissipation efficiency is relatively slow. Therefore, when the heat dissipation piece with this structure is used for a long time or has a large working power, the fan body will also generate heat, which seriously affects the user's experience. UTILITY MODEL CONTENTS

[0004] The utility model aims at providing a high-speed cold compress fan, which sets a linear groove extending in the axial direction of the heat dissipation piece in the circumferential direction of the heat dissipation piece. Under the action of high-speed air flow, the linear groove can form a negative pressure area, which enhances the contact intimacy between the air flow and the heat dissipation piece, and can more effectively and quickly bring out the heat from the heat dissipation piece. Moreover, the setting of the linear groove increases the surface area of the heat dissipation piece, so that the heat dissipation effect of the heat dissipation piece with this structure is more efficient. At the same time, in this structure, the heat dissipation piece does not need to be set as a radial heat dissipation fin, which greatly saves the cost of the heat dissipation piece and solves the problems raised in the above background technology.

[0005] To achieve the above object, the utility model provides the following technical scheme: a high -speed cold compress fan, including fan shell, the fan shell inside is shaped with the wind channel, the wind channel one end is connected with the air inlet and is provided, the other end is connected with the air outlet and is provided, the wind channel is provided with internal support, the internal support is provided with motor base towards the air inlet side, the motor base is installed with the fan blade group, the motor base is provided with the heat dissipation piece base towards the air outlet side, the heat dissipation piece base is fixed with the heat dissipation piece, the air outlet is provided with semiconductor support, the semiconductor support includes semiconductor mounting base and the sub -air outlet that surrounds the semiconductor mounting base circumferentially, the semiconductor mounting base is fixed with semiconductor refrigerating sheet, the semiconductor refrigerating sheet one side working surface is connected with the heat dissipation piece heat conduction connection towards the heat dissipation piece, the semiconductor refrigerating sheet one side working surface is connected with the conduction piece heat conduction connection away from the heat dissipation piece, the heat dissipation piece circumferentially is arranged with a plurality of line slot that sets up along the axial direction of heat dissipation piece, the depth range of line slot is 1~3mm.

[0006] Preferably, the heat dissipation piece outer diameter edge and semiconductor mounting base and motor base outer diameter edge are flush.

[0007] Preferably, the semiconductor mounting base is provided with semiconductor through -hole penetrating the front and back sides, and the semiconductor refrigerating sheet is installed in the semiconductor through -hole.

[0008] Preferably, the fan blade group is provided with a booster cover, the booster cover is provided with openings at opposite ends, and the inner diameter of the booster cover gradually increases from the air inlet to the air outlet.

[0009] Preferably, the fan shell is integrally connected with a fan handle, the fan handle includes a handle front shell and a handle rear shell connected with each other, a cavity is formed between the handle front shell and the handle rear shell, a circuit board assembly and a battery are arranged in the cavity, and the battery is electrically connected with the circuit board assembly.

[0010] Preferably, a display screen is electrically connected to the circuit board assembly, a through hole is formed on the handle front shell corresponding to the position of the display screen, a light-transmitting cover plate is packaged in the through hole, and the display content of the display screen is displayed outward through the light-transmitting cover plate.

[0011] Preferably, a speed regulating switch is electrically connected to the circuit board assembly, the speed regulating switch is a roller switch, and part of the body of the roller switch is arranged outside the handle front shell.

[0012] Preferably, a cold compress switch is electrically connected to the circuit board assembly, the cold compress switch is arranged in a pre-designed through hole of the handle front shell and extends outward from the through hole.

[0013] Preferably, the circuit board assembly is electrically connected with a USB interface arranged in a pre-set through hole of the handle front shell and extending outward from the through hole.

[0014] Compared with the prior art, the utility model has the beneficial effects that:

[0015] The utility model discloses, set up the linear groove of extending along the axial direction of heat dissipation spare on the circumference of heat dissipation spare, linear groove can form negative pressure area under the action of high -speed wind current, and negative pressure area strengthens the contact intimacy of wind current and heat dissipation spare, can more effective, more fastly take out heat from heat dissipation spare, and, the setting of linear groove has increased the surface area of heat dissipation spare, the two -pronged approach of making the heat dissipation effect of heat dissipation spare of application this structure more efficient, simultaneously, in this structure, heat dissipation spare does not need to set up as the radiating wing, and the cost of heat dissipation spare is greatly saved. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 For the utility model structure explosion Figure 1 ;

[0017] Figure 2 For the utility model structure explosion Figure 2 ;

[0018] Figure 3 For the utility model structure schematic diagram;

[0019] Figure 4 For the utility model shell A-A section position schematic diagram;

[0020] Figure 5 For the utility model shell A-A section view;

[0021] Figure 6 For the utility model heat dissipation spare structure schematic diagram.

[0022] In the drawing: 11 conducting part;12 semiconductor refrigeration piece;13 semiconductor support;131 semiconductor mounting pedestal;132 sub air outlet;14 heat dissipation spare;141 linear groove;15 internal support;151 motor base;152 heat dissipation spare base;16 drive fan blade group;17 booster cover;18 fan shell;181 air inlet;182 air outlet;21 handle front shell;22 handle rear shell;23 circuit board assembly;24 battery;25 display screen;26 speed regulating switch;27 cold compress switch;28 USB interface. DETAILED DESCRIPTION

[0023] Clearly, the described embodiments are merely a part of the embodiments of the present application, but not all the embodiments. Based on the embodiments of the present application, all the other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0024] Please refer to Figures 1-6 A high-speed cold compress fan, comprising a fan shell 18, a through air duct is formed inside the fan shell 18, one end of the through air duct is provided in communication with an air inlet 181, the other end is provided in communication with an air outlet 182, an internal support 15 is arranged in the through air duct, a motor base 151 is arranged on one side of the internal support 15 facing the air inlet 181, a driving fan blade group 16 is installed on the motor base 151, a heat dissipation piece base 152 is arranged on one side of the motor base 151 facing the air outlet 182, a heat dissipation piece 14 is fixedly arranged on the heat dissipation piece base 152, a semiconductor support 13 is arranged at the air outlet 182, the semiconductor support 13 comprises a semiconductor mounting base 131 and a sub-air outlet 132 arranged circumferentially around the semiconductor mounting base 131, a semiconductor refrigerating sheet 12 is fixedly arranged on the semiconductor mounting base 131, a semiconductor through hole penetrating through the front and back sides is formed in the semiconductor mounting base 131, the semiconductor refrigerating sheet 12 is installed in the semiconductor through hole, one side working surface of the semiconductor refrigerating sheet 12 facing the heat dissipation piece 14 is in thermal conduction connection with the heat dissipation piece 14, the side working surface of the semiconductor refrigerating sheet 12 away from the heat dissipation piece 14 is in thermal conduction connection with a conduction piece 11, a plurality of wire grooves 141 extending along the axial direction of the heat dissipation piece are arranged circumferentially on the heat dissipation piece 14, the depth of the wire groove 141 ranges from 1 to 3 mm, the outer diameter edges of the heat dissipation piece 14, the semiconductor mounting base 131 and the motor base 151 are arranged in flush, the air flow formed by the driving fan blade group 16 flows from one side of the motor base 151 to the sub-air outlet 132, when it passes through the area where the heat sink 14 is located, the strong air flow will form a negative pressure area in the wire groove 141, the air flow is accelerated to flow into the wire groove 141 from the starting end of the wire groove 141 when it passes through the area where the wire groove 141 is located, and then flows out from the end of the wire groove 141 close to the sub-air outlet 132, so that the contact intimacy of the air flow and the heat dissipation piece 14 is enhanced, the heat can be carried out from the heat dissipation piece 14 more effectively and quickly, and the surface area of the heat dissipation piece 141 is increased by the arrangement of the wire groove 141, so that the heat dissipation effect is higher after the heat dissipation piece with the structure is applied.

[0025] The outer periphery of the driving fan blade group 16 is provided with a booster cover 17, both ends of which are open, and the inner diameter of the booster cover 17 gradually increases from the air inlet 181 to the air outlet 182, so that the booster cover 17 can effectively compress the air flow passage and increase the internal pressure.

[0026] The fan handle is integrally connected with the fan shell 18, and the fan handle comprises a handle front shell 21 and a handle rear shell 22 which are connected with each other in a covering manner, and a cavity is formed between the handle front shell 21 and the handle rear shell 22, and a circuit board assembly 23 and a storage battery 24 are arranged in the cavity, and the storage battery 24 is electrically connected with the circuit board assembly 23. A display screen 25 is arranged on the circuit board assembly 23 in an electrically connected manner, a through hole is formed on the handle front shell 21 at a position corresponding to the display screen 25, a light-transmitting cover plate is packaged in the through hole, the display content of the display screen 25 is displayed outward through the light-transmitting cover plate, and the display screen 25 can be used to display the real-time power of the storage battery 24 and / or the working state of the driving fan blade group 16 and the semiconductor refrigeration sheet 12. A speed regulating switch 26 is arranged on the circuit board assembly 23 in an electrically connected manner, the speed regulating switch 26 is a roller switch, part of the body of the roller switch is arranged outside the handle front shell 21, and the speed regulating switch 26 is used to adjust the working speed and the working start-stop state of the driving fan blade group 16. A cold compress switch 27 is arranged on the circuit board assembly 23 in an electrically connected manner, the cold compress switch 27 is arranged in a preset through hole of the handle front shell 21 and extends outward from the through hole, and the cold compress switch 27 is used to control the working start-stop state of the semiconductor refrigeration sheet 12. A USB interface 28 is arranged on the circuit board assembly 23 in an electrically connected manner, the USB interface 28 is arranged in a preset through hole of the handle front shell 21 and extends outward from the through hole, and when the USB interface 28 is externally connected with an external power supply through a charging wire, the storage battery 24 can be charged to supplement the electric energy.

[0027] As described above, the linear groove 141 extending along the axial direction of the heat dissipation piece 14 is arranged on the circumferential direction of the heat dissipation piece 14, the linear groove 141 can form a negative pressure area under the action of high-speed air flow, the negative pressure area enhances the contact intimacy between the air flow and the heat dissipation piece 14, and the heat dissipation piece 14 can more effectively and quickly take out heat, the linear groove 141 increases the surface area of the heat dissipation piece 14, and the heat dissipation effect of the heat dissipation piece 14 is higher, and in this structure, the heat dissipation piece 14 does not need to be arranged in a radial heat dissipation wing, so that the manufacturing cost of the heat dissipation piece 14 is greatly saved.

[0028] It is to be noted that, in the present document, relational terms such as first and second and the like can be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises", "comprising", or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can include other elements not expressly listed or inherent to such process, method, article, or apparatus.

[0029] While the embodiments of the present application have been illustrated and described, it will be understood by those skilled in the art that various changes, modifications, substitutions, and alterations can be made therein without departing from the spirit and scope of the application, which is defined by the appended claims and their equivalents.

Claims

1. A high-speed cold compress fan, comprising a fan shell (18), the fan shell (18) is internally shaped with a wind channel, one end of the wind channel is in communication with an air inlet (181), the other end is in communication with an air outlet (182), an internal support (15) is arranged in the wind channel, a motor base (151) is arranged on the side of the internal support (15) facing the air inlet (181), a fan blade group (16) is installed on the motor base (151), a heat dissipation piece base (152) is arranged on the side of the motor base (151) facing the air outlet (182), a heat dissipation piece (14) is fixedly arranged on the heat dissipation piece base (152), a semiconductor support (13) is arranged at the air outlet (182), the semiconductor support (13) comprises a semiconductor mounting base (131) and a sub-air outlet (132) arranged circumferentially around the semiconductor mounting base (131), a semiconductor refrigerating sheet (12) is fixedly arranged on the semiconductor mounting base (131), a working surface on the side of the semiconductor refrigerating sheet (12) facing the heat dissipation piece (14) is in thermal conduction connection with the heat dissipation piece (14), a conduction piece (11) is in thermal conduction connection with a working surface on the side of the semiconductor refrigerating sheet (12) away from the heat dissipation piece (14), characterized in that: The heat dissipation piece (14) is circumferentially provided with a plurality of wire grooves (141) extending in the axial direction of the heat dissipation piece, and the depth of the wire grooves (141) ranges from 1 to 3 mm.

2. A high speed cold compress fan as claimed in claim 1, wherein: The outer diameter edge of the heat dissipation piece (14) is flush with the outer diameter edges of the semiconductor mounting base (131) and the motor base (151).

3. A high speed cold compress fan as claimed in claim 1, wherein: The semiconductor mounting base (131) is provided with semiconductor through holes penetrating through the front and rear sides, and the semiconductor refrigeration piece (12) is mounted in the semiconductor through holes.

4. A high speed cold compress fan as claimed in claim 1, wherein: The outer periphery of the driving fan blade group (16) is provided with a booster cover (17), the two opposite ends of the booster cover (17) are both open, and the inner diameter of the booster cover (17) gradually increases from the air inlet (181) to the air outlet (182).

5. A high speed cold compress fan as claimed in claim 1, wherein: The fan shell (18) is integrally connected with a fan handle, the fan handle includes a handle front shell (21) and a handle rear shell (22) which are connected with each other, a cavity is formed between the handle front shell (21) and the handle rear shell (22), a circuit board assembly (23) and a storage battery (24) are arranged in the cavity, and the storage battery (24) is electrically connected with the circuit board assembly (23).

6. A high speed cold compress fan as claimed in claim 5, wherein: A display screen (25) is electrically connected on the circuit board assembly (23), a through hole is formed on the handle front shell (21) corresponding to the position of the display screen (25), a light-transmitting cover plate is encapsulated in the through hole, and the display content of the display screen (25) is displayed outward through the light-transmitting cover plate.

7. A high speed cold compress fan as claimed in claim 5, wherein: A speed regulating switch (26) is electrically connected on the circuit board assembly (23), the speed regulating switch (26) is a roller switch, and part of the body of the roller switch is arranged outside the handle front shell (21).

8. A high speed cold compress fan as claimed in claim 5, wherein: A cold compress switch (27) is electrically connected on the circuit board assembly (23), the cold compress switch (27) is arranged in a preset through hole of the handle front shell (21) and extends outward from the through hole.

9. A high speed cold compress fan as claimed in claim 5, wherein: A USB interface (28) is electrically connected on the circuit board assembly (23), the USB interface (28) is arranged in a preset through hole of the handle front shell (21) and extends outward from the through hole.

Images