Annular cylinder of novel semiconductor pressure control valve
By improving the inverted structure and sealing components, the problem of high assembly precision for the annular cylinder was solved, thereby improving assembly efficiency and yield.
Patent Information
- Application Number
- CN202520774978.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-22
- Publication Date
- 2026-02-06
- Estimated Expiration
- 2035-04-22
AI Technical Summary
The existing annular cylinder requires high precision when assembling the annular piston and piston jaws, which affects assembly efficiency.
It adopts a reverse-clamp structure design of piston claw and annular piston, combined with the interference fit of steel ball sealing sleeve and sealing steel ball, equipped with multi-stage sealing groove and perfluoroether rubber sealing ring, and with disc spring and threaded fixed connection, reducing the machining tolerance requirements of parts.
By improving the inverted structure design and sealing components, the risk of interference on the assembly surfaces of parts is reduced, thereby improving assembly efficiency and yield.
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Figure CN223881830U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of semiconductor equipment vacuum pressure control valve, and particularly relates to a new type of semiconductor pressure control valve ring cylinder. BACKGROUND
[0002] In the semiconductor, solar dry etching and deposition equipment, a pendulum clock type pressure control valve is needed. The valve needs the up and down movement of the ring piston claw of the ring cylinder to adjust the vertical movement space of the valve plate, so as to realize the two states of free movement and sealing of the valve plate in the horizontal direction.
[0003] The ring piston of the existing pressure control pendulum valve ring cylinder is directly assembled and fixed with the piston claw through interference fit, sealed through interference fit with a sealing steel ball, and assembled with a sealing ring. The spring is installed between the tail of the piston claw and the spring fixing ring. The ring piston and the piston claw move upward as a whole. The air passage is connected to high pressure gas. The spring moves downward. The rising and falling of the ring piston and the piston claw are controlled by adjusting the intake and exhaust of the high pressure gas.
[0004] The ring piston of the ring cylinder in the above existing technology is directly assembled and fixed with the piston claw through interference fit, sealed through interference fit with a sealing steel ball, and assembled with a sealing ring. The machining precision of the parts is high, the cumulative machining tolerance of the parts is large, and the assembly interference is easy to occur, which affects the assembly efficiency.
[0005] That is, the existing technology has the following technical problems: the assembly precision of the ring piston and the piston claw of the ordinary ring cylinder is high, which affects the assembly efficiency. Therefore, a new type of semiconductor pressure control valve ring cylinder is provided for the above problems. SUMMARY
[0006] In this embodiment, a new type of semiconductor pressure control valve ring cylinder is provided to solve the problem of high assembly precision of the ring piston and the piston claw of the ordinary ring cylinder in the prior art, which affects the assembly efficiency.
[0007] According to one aspect of the present application, a new type of semiconductor pressure control valve ring cylinder is provided, comprising:
[0008] The piston claw, the ring piston, the reverse buckle positioning bolt, the steel ball sealing sleeve, the sealing steel ball, the sealing ring, the cylinder shell, the spring and the spring fixing ring;
[0009] The piston claw is sleeved in the ring piston through the reverse buckle structure. The reverse buckle positioning bolt penetrates the reverse buckle structure vertically and extends into the inner cavity of the steel ball sealing sleeve.
[0010] The steel ball sealing sleeve and the sealing steel ball are interference fit to form a seal.
[0011] One end of the spring is connected to the tail of the annular piston, and the other end is fixed in the cylinder shell through the spring fixing ring.
[0012] Further, the outer wall of the annular piston is provided with at least two sealing grooves, and a sealing ring is installed in the sealing groove.
[0013] Further, the reverse buckle structure comprises:
[0014] The inclined clamping groove at the bottom of the piston clamping jaw, and the corresponding protruding part of the outer wall of the annular piston.
[0015] Further, a radial movement gap is formed between the clamping groove and the protruding part.
[0016] Further, the reverse buckle positioning bolt has a shear strength of ≥500N.
[0017] Further, the inner hole of the steel ball sealing sleeve is in interference fit with the sealing steel ball.
[0018] Further, the sealing ring is made of perfluoroether rubber material, the depth of the sealing groove is 0.8 times the cross-sectional diameter of the sealing ring, and the groove bottom is provided with an anti-extrusion chamfer.
[0019] Further, the cylinder shell is an integral cast alloy part.
[0020] Further, the spring is composed of a plurality of coaxial parallel disc springs; and the pre-compression amount of the spring group is 30%-50% of the total stroke.
[0021] Further, the spring fixing ring is provided with threads, and is fixedly connected with the cylinder shell through the threads; the end surface of the spring fixing ring is provided with a locking hole, and an anti-loosening spring pin is arranged in the locking hole.
[0022] Through the above-mentioned embodiments of the present application, the reverse buckle gap between the piston clamping jaw and the annular piston is designed, thereby reducing the tolerance requirement of the components, absorbing the cumulative machining error of multiple parts, greatly reducing the interference risk of the assembly surface of multiple parts, improving the workpiece machining and assembly yield, and realizing pre-assembly integration through the cooperation of the steel ball sealing sleeve 5 and the sealing steel ball 6, thereby improving the assembly efficiency. BRIEF DESCRIPTION OF DRAWINGS
[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed in the embodiment or prior art description will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application, and those skilled in the art can also obtain other drawings according to these drawings without creative labor.
[0024] Figure 1 The overall structure schematic diagram of one embodiment of the present application;
[0025] Figure 2 A cross-sectional structure diagram of an embodiment of the present application;
[0026] Figure 3 A cross-sectional structure diagram of an embodiment of the present application Figure 2 A local enlarged structure diagram of A of the present application.
[0027] In the figure: piston claw 1, annular piston 2, reverse-docking positioning bolt 3, claw guide baffle 4, steel ball sealing sleeve 5, sealing steel ball 6, cylinder shell 7, sealing ring 8, spring 9, spring fixing ring 10, anti-loosening spring pin 11, high-pressure gas passage 12. DETAILED DESCRIPTION
[0028] In order to enable persons skilled in the art to better understand the scheme of the present application, the technical scheme in the embodiments of the present application will be described clearly and completely below in combination with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by persons skilled in the art without making creative efforts should belong to the protection scope of the present application.
[0029] It should be noted that the terms "first", "second", and the like in the specification and claims of the present application and the above-described drawings are used to distinguish similar objects, and do not necessarily have to be used to describe a specific order or sequence. It should be understood that the data thus used can be interchanged under appropriate circumstances, so that the embodiments of the present application described herein can be implemented. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion, for example, a process, method, system, product or device that includes a series of steps or units does not have to be limited to only those steps or units clearly listed, but can include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.
[0030] In the present application, the terms "upper", "lower", "left", "right", "front", "back", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "lateral", "longitudinal", and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. These terms are mainly used to better describe the present application and its embodiments, and are not used to limit the indicated devices, elements or components to have a specific orientation, or to be constructed and operated in a specific orientation.
[0031] Moreover, the above-mentioned terms can be used to represent other meanings in addition to the positional or positional relationship, for example, the term "upper" can also be used to represent a certain dependent relationship or connection relationship in some cases. For those skilled in the art, the specific meanings of these terms in this application can be understood according to the specific circumstances.
[0032] In addition, the terms "mounting", "setting", "provided with", "connected", "connected", "sleeved" should be broadly understood. For example, it can be fixedly connected, detachably connected, or integrally configured; it can be mechanically connected or electrically connected; it can be directly connected, or indirectly connected through an intermediate medium, or internal communication between two devices, elements or components. For those skilled in the art, the specific meanings of the above terms in this application can be understood according to the specific circumstances.
[0033] Please refer to Figures 1-3 As shown in the figure, a new type of semiconductor pressure control valve ring cylinder comprises:
[0034] Piston jaw 1, annular piston 2, reverse buckle positioning pin 3, steel ball sealing sleeve 5, sealing steel ball 6, sealing ring 8, cylinder shell 7, spring 9 and spring fixing ring 10;
[0035] The piston jaw 1 is sleeved in the annular piston 2 through the reverse buckle structure, and the reverse buckle positioning pin 3 vertically penetrates the reverse buckle structure and extends into the inner cavity of the steel ball sealing sleeve 5;
[0036] The steel ball sealing sleeve 5 is interference fit with the sealing steel ball 6 to form a dynamic sealing interface;
[0037] One end of the spring 9 is connected to the tail of the annular piston 2, and the other end is fixed in the cylinder shell 7 through the spring fixing ring 10.
[0038] The outer wall of the annular piston 2 is provided with at least two levels of sealing grooves, and the sealing ring 8 is installed in the sealing groove;
[0039] The reverse buckle structure comprises:
[0040] The inclined clamping groove at the bottom of the piston jaw 1, and the corresponding protruding part on the outer wall of the annular piston 2;
[0041] When assembling:
[0042] 1. Assemble the piston jaw 1 and the annular piston 2;
[0043] Axially sleeve the reverse buckle structure of the piston jaw 1 into the protruding part on the outer wall of the annular piston 2.
[0044] 2. Install the reverse buckle positioning pin 3;
[0045] The inverted positioning bolt 3 is vertically inserted into the inverted structure, and the end extends into the inner cavity of the steel ball sealing sleeve 5.
[0046] 3. Steel ball sealing assembly assembly;
[0047] The steel ball sealing sleeve 5 is pressed with the sealing steel ball 6.
[0048] 4. Seal ring 8 installation;
[0049] The seal ring 8 is installed in the two-stage sealing groove on the outer wall of the annular piston 2.
[0050] 5. Cylinder housing 7 assembly;
[0051] The assembled annular piston 2 assembly is installed into the inner cavity of the cylinder housing 7:
[0052] 6. Spring system fixation;
[0053] The spring 9 is installed to the tail of the annular piston 2, locked by the spring fixing ring 10, and pre-compressed to 50% of the total stroke.
[0054] The above only describes the preferred embodiments of the present application and is not intended to limit the present application. For those skilled in the art, the present application can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims
1. A new type of annular cylinder for a semiconductor pressure control valve, characterized by: Include: Piston jaw (1), annular piston (2), reverse buckle positioning plug (3), steel ball seal sleeve (5), sealing steel ball (6), sealing ring (8), cylinder shell (7), spring (9) and spring fixing ring (10); The piston jaw (1) is sleeved in the annular piston (2) through the reverse buckle structure, the reverse buckle positioning plug (3) vertically penetrates the reverse buckle structure and extends to the inner cavity of the steel ball seal sleeve (5); The steel ball seal sleeve (5) and the sealing steel ball (6) are interference fit, forming a sealed fixed; One end of the spring (9) is connected to the tail of the annular piston (2), and the other end is fixed in the cylinder shell (7) through the spring fixing ring (10).
2. A new type of ring cylinder of a semiconductor pressure control valve according to claim 1, characterized in that: The outer wall of the annular piston (2) is provided with at least two levels of sealing grooves, and the sealing ring (8) is installed in the sealing groove.
3. A new type of ring cylinder of semiconductor pressure control valve according to claim 1, characterized in that: The reverse buckle structure includes: The inclined clamping groove at the bottom of the piston jaw (1), and the corresponding protruding part on the outer wall of the annular piston (2).
4. A new type of ring cylinder of semiconductor pressure control valve according to claim 3, characterized in that: The radial clearance is formed between the clamping groove and the protruding part.
5. A new type of ring cylinder of a semiconductor pressure control valve according to claim 1, characterized in that: According to claim 1, the annular cylinder, wherein the shear strength of the reverse buckle positioning plug (3) is greater than or equal to 500N.
6. A new type of ring cylinder of semiconductor pressure control valve according to claim 2, characterized in that: The depth of the sealing groove is 0.8 times the diameter of the cross section of the sealing ring, and the groove bottom is provided with an anti-extrusion chamfer.
7. A new type of ring cylinder for pressure control valve with semiconductor according to claim 1, characterized in that: The spring (9) is composed of a plurality of springs coaxially connected in parallel; the pre-compression amount of the spring group is 30%-50% of the total stroke.
8. A new type of ring cylinder of a semiconductor pressure control valve according to claim 1, characterized in that: The spring fixing ring (10) is provided with threads, which are threadedly connected with the cylinder shell (7); the end face of the spring fixing ring (10) is provided with a locking hole, and an anti-loosening spring pin (11) is arranged in the locking hole.