Wafer detection equipment

Abstract

The utility model provides a wafer detection equipment, including machine table, set up the detection module and manipulator on the machine table, the detection module is set up on the machine table through the stand, the detection module includes camera mobile module, first detection subassembly and second detection subassembly, camera mobile module and first detection subassembly are set up on the stand, the second detection subassembly is set up on the stand, camera mobile module and second detection subassembly are set up on the stand. The second detection assembly is arranged on the camera moving module, the second detection assembly and the first detection assembly are the same in height and are arranged in parallel relatively, the second detection assembly is driven by the camera moving module to do translational motion close to or away from the first detection assembly, and a product bearing platform is movably arranged on the machine table corresponding to the lower portion of the detection module. The product bearing platform comprises a product moving module and a rotary adsorption platform, and the rotary adsorption platform is arranged on the product moving module. The equipment can be used for efficiently and quickly detecting wafers, is suitable for detecting wafer products of various sizes and specifications, and is high in overall flexibility and accuracy.

Description

TECHNICAL FIELD

[0001] The utility model relates to laser equipment field especially relates to a wafer detection equipment. BACKGROUND

[0002] Wafer refers to the silicon chip used for making silicon semiconductor integrated circuit, since its shape is circular, is called wafer. Wafer is the carrier used for producing integrated circuit, and generally wafer yield is single crystal silicon wafer. In the wafer processing production process, it will experience slicing, coding, cutting, detection and other operations, and the detection process is crucial, which often relates to the reliability and accuracy of wafer subsequent use. But the current equipment for detecting wafer appearance is generally poor in applicability, low in detection precision, especially cannot comprehensively and efficiently detect large-size wafer, so that the efficiency and cost of wafer detection are restricted, and the detection requirement of enterprise mass, multi-specification wafer product cannot be met. SUMMARY

[0003] In view of the above, the wafer detection equipment can efficiently and quickly detect the defects such as slight edge collapse, crack and scratch existing in wafer appearance, is suitable for wafer product detection of various sizes, and the flexibility and accuracy of the whole equipment are high.

[0004] The specific technical scheme is as follows: a wafer detection equipment, comprising a machine table, a detection module arranged on the machine table and a mechanical hand, characterized by: the detection module is arranged on the machine table through a column, the detection module comprises a camera moving module, a first detection assembly and a second detection assembly, the camera moving module and the first detection assembly are arranged on the column, the second detection assembly is arranged on the camera moving module, the second detection assembly is arranged at the same height as the first detection assembly and is arranged in parallel, the second detection assembly is driven by the camera moving module to move towards or away from the first detection assembly, a product carrying platform is movably arranged on the machine table below the detection module, the product carrying platform comprises a product moving module and a rotating adsorption platform, and the rotating adsorption platform is arranged on the product moving module.

[0005] As a further improved technical scheme of the utility model, the rotating adsorption platform comprises a product platform, a rotating drive motor and a plurality of adsorption columns arranged on the product platform in a regular manner, a plurality of adsorption holes are arranged on each adsorption column, the product platform is arranged on the rotating drive motor and is controlled to rotate or stop by the rotating drive motor.

[0006] As a further improved technical scheme of the utility model, the first detection assembly and the second detection assembly are the same in structure and each comprise a detection camera and a coaxial light source arranged below the detection camera.

[0007] As a further improved technical scheme of the utility model, the mechanical arm includes a lifting module, a rotating module, a first mechanical arm and a second mechanical arm, the first mechanical arm and the second mechanical arm are respectively arranged on the rotating module through linear moving modules, the first mechanical arm and the second mechanical arm are controlled to rotate synchronously by the rotating module, and the rotating module is arranged on the lifting module and is controlled to move up and down by the lifting module.

[0008] As a further improved technical scheme of the utility model, the end of the first mechanical arm and the second mechanical arm is provided with a suction cup.

[0009] As a further improved technical scheme of the utility model, the utility model further includes a center alignment mechanism, the center alignment mechanism includes a positioning camera, a jacking mechanism, a positioning column, a double-shaft moving platform and a positioning frame, the positioning column and the double-shaft moving platform are arranged in the positioning frame, the jacking mechanism is arranged on the opposite sides of the positioning frame, the positioning camera is arranged above the positioning frame through a support, and the positioning column is arranged on the double-shaft moving platform.

[0010] As a further improved technical scheme of the utility model, the jacking mechanism includes a first top plate, a second top plate and a jacking cylinder, the jacking cylinder is arranged on the outer walls of the opposite sides of the positioning frame, the first top plate and the second top plate are arranged on the movable end of the jacking cylinder and are driven to move up and down above the positioning frame by the jacking cylinder, one end of the second top plate is provided with a notch, the size of the notch is greater than the outer diameter of the positioning column, and the positioning column moves in the range of the notch under the drive of the double-shaft moving platform.

[0011] As a further improved technical scheme of the utility model, the positioning camera is detachably arranged on the support, a light source mechanism is further arranged on the support and is located below the positioning camera to light the positioning camera.

[0012] As a further improved technical scheme of the utility model, a plurality of regularly arranged material box bearing frames are further arranged on the machine table, and the material box bearing frames are arranged in an arc shape along the periphery of the mechanical arm.

[0013] As a further improved technical scheme of the utility model, the material box bearing frame is a multi-layer structure, and a material box is detachably arranged in each layer.

[0014] The wafer detection equipment of the present application is provided with two groups of visual detection components, and the detection efficiency is higher when detecting products, and one of the detection components can be moved, and cooperates with the movement and rotation type product bearing platform below the detection module, and can be flexibly applied to detect wafer products of various sizes, especially large size products, and the surface detection of large size products can be quickly completed through the automatic adjustment of the detection component and the product bearing platform, and the wafer detection equipment of the present application is provided with two motion mechanical arms, and the taking and placing of products are alternately performed, so that the detection efficiency is further improved. The present application is also provided with a center alignment mechanism, the mechanical hand first transports the product to the center alignment mechanism for center alignment, and then the product is taken away from the center alignment mechanism and moved to the detection station for detection, so as to further improve the detection precision and result. In addition, a plurality of box bearing frames are distributed along the arc around the mechanical hand on the machine table, so that the overall equipment structure is simple, compact and small in size, and the box bearing frame is provided with a detachable and replaceable box, so as to adapt to bearing wafer of various sizes, and a plurality of layers are designed in each box, so as to bear a batch of wafer to be coded and wafer after coding, and the adaptability of the equipment is further improved.

[0015] The additional aspects and advantages of the present application will be further given in the following description, and some will become apparent from the following description or be understood through the practice of the present application. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 Fig. 1 shows the overall schematic diagram of the wafer detection equipment of the present application.

[0017] Figure 2 Fig. 2 shows the top view of the wafer detection equipment of the present application.

[0018] Figure 3 Fig. 3 shows the structure schematic diagram of the detection module and the product bearing platform of the present application.

[0019] Figure 4 Fig. 4 shows the structure schematic diagram of the mechanical hand of the present application.

[0020] Figure 5 Fig. 5 shows the structure schematic diagram of the center alignment mechanism of the present application. DETAILED DESCRIPTION

[0021] In order to make the purpose, technical scheme and advantages of the present application more clear, the present application will be described in detail below in combination with the drawings and specific embodiments. In addition, it needs to be explained that, in order to facilitate the description, only the parts related to the present application are shown in the drawings instead of all the structures.

[0022] REFERENCE Figures 1-2The wafer detection equipment of the embodiment comprises a machine table 1, a detection module 2 and a mechanical hand 3 arranged on the machine table 1, the detection module 2 is arranged on the machine table 1 through a column 4, the detection module 2 comprises a camera moving module 21, a first detection assembly 22 and a second detection assembly 23, the camera moving module 21 and the first detection assembly 22 are fixed on the column 4, the second detection assembly 23 is arranged in parallel with the first detection assembly 22 at the same height, the camera moving module 21 selects a servo motor linear motion module, the second detection assembly 23 is arranged on a sliding table of the camera moving module 21, and the second detection assembly 23 performs translational motion close to or away from the first detection assembly 22 under the drive of the camera moving module 21, the first detection assembly 22 and the second detection assembly 23 are of the same structure and each comprises a detection camera 221 and a coaxial light source 222 arranged below a lens of the detection camera 221. A product bearing platform 5 movably arranged on the machine table 1 below the detection module 2 is provided, the product bearing platform 5 comprises a product moving module 51 and a rotating adsorption platform, is used for bearing a product 100 to be detected and driving the product 100 to rotate, and the product moving module 51 selects a servo motor linear motion module.

[0023] Specific combination Figure 3 The rotating adsorption platform comprises a product platform 52, a rotating drive motor 53 and a plurality of adsorption columns 54 arranged on the product platform 52 in a regular distribution, a plurality of adsorption holes are arranged on each adsorption column 54, the adsorption columns 54 can be distributed in a triangular shape or a ring shape, in the embodiment, three adsorption columns 54 are arranged in a triangular shape, the adsorption columns 54 are provided with air channels in the product platform 52, the air channels are communicated with the adsorption holes, the air channels are connected with pipelines, and the pipelines are connected to a vacuum pump, so that the adsorption columns 54 are provided with adsorption force to adsorb and fix the product 100. The product platform 52 is arranged on the rotating drive motor 53 and is controlled to rotate or stop by the rotating drive motor 53, the rotating drive motor 53 is arranged on a sliding table of the product moving module 51 and is driven to move horizontally in a direction perpendicular to the moving direction of the camera moving module 21 by the product moving module 51.

[0024] The detection module of the application has strong compatibility, is suitable for detecting products of various conventional sizes, and can automatically adjust and adapt to comprehensive detection of products of large sizes through the design of the second detection assembly 23 which can move and the rotating adsorption platform which rotates. The first detection assembly 22 scans and detects the inner circle of the product, the second detection assembly 23 scans and detects the outer circle of the product, and the two detection assemblies are synchronously detected, so that the detection efficiency is effectively improved.

[0025] Reference Figure 4The mechanical arm 3 comprises a lifting module 31, a rotating module 32, a first mechanical arm 33 and a second mechanical arm 34, the end of the first mechanical arm 33 and the second mechanical arm 34 is provided with a suction cup 35 for adsorbing and fixing products, and the two mechanical arms alternately take and place materials to improve efficiency. The first mechanical arm 33 and the second mechanical arm 34 are respectively arranged on the rotating module 32 through a linear movement module 36, the rotating module 32 selects a rotating motor platform, the linear movement module 36 selects a servo motor linear movement module, the first mechanical arm 33 and the second mechanical arm 34 are controlled to rotate synchronously by the rotating module 32, the rotating module 32 is arranged on the lifting module 31, and the rotating module 32 and the mechanical arms thereon are controlled to move up and down by the lifting module 31, the lifting module 31 is movably arranged in the machine table and can drive the mechanical arms to adjust the up and down positions on the machine table.

[0026] In addition, in combination with the description of the foregoing Figure 1 , Figure 5 , the wafer detection device also comprises a center alignment mechanism 6, the center alignment mechanism 6 comprises a positioning camera 61, a jacking mechanism 62, a positioning column 63, a double-shaft moving platform 64 and a positioning frame 65, the positioning column 63 and the double-shaft moving platform 64 are arranged in the positioning frame 65, the jacking mechanism 62 is arranged on the opposite sides of the positioning frame 65, the positioning camera 63 is arranged above the positioning frame 65 through a support 66, the positioning column 63 is arranged on the double-shaft moving platform 64, the double-shaft moving platform 64 is a linear movement module arranged in two perpendicular directions, and drives the positioning column 63 to move flexibly in two directions of horizontal transverse and longitudinal directions, so as to find the center position of the product 100 with the positioning column 63.

[0027] Further, the jacking mechanism 62 comprises a first top plate 621, a second top plate 622 and a jacking cylinder 623, one jacking cylinder 623 is arranged on each of the opposite outer walls of the positioning frame 65, the first top plate 621 and the second top plate 622 are arranged on the movable end of the jacking cylinder 623 and are driven by the jacking cylinder 623 to move up and down above the positioning frame 65, one end of the second top plate 622 is provided with a notch 624, the size of the notch 624 is greater than the outer diameter of the positioning column 63, and the positioning column 63 moves in the range of the notch 624 under the drive of the double-shaft moving platform 64. The positioning camera 61 is detachably arranged on the support 66, the height of the positioning camera 61 on the support 66 can be adjusted, so as to solve the problem of inaccurate focusing when the device is used to check different products for the first time. The support 66 is also provided with a light source mechanism, the light source mechanism comprises a light source fixing frame 67 and a light source 68 arranged thereon, the light source fixing frame 67 is a rectangular frame in this embodiment, strip-shaped light sources are arranged around the rectangular frame, and the light sources are located below the positioning camera 61 to light the positioning camera 61.

[0028] Further, the machine 1 is also provided with a plurality of regularly arranged box bearing frames 7, which are arranged in an arc shape along the periphery of the manipulator 3. The box bearing frame 7 is a multi-layer structure, and each layer is detachably provided with a box 8, and the products are regularly arranged in the box 8. A plurality of box bearing frames 7 can be automatically selected according to the required definition function, such as the box for storing the products to be detected, the box for the qualified products after detection, and the box for the unqualified products after detection.

[0029] In use, the size of the box 8 is selected according to the product size of the wafer to be processed, and is placed on the box bearing frame 7 for fixation, and at the same time, a batch of products is inserted into the box 8 and placed, the equipment is started, the first mechanical arm 33 and the second mechanical arm 34 of the manipulator 3 are moved to the box 8 of the feeding station under the cooperation of the lifting module 31 and the rotating module 32, and then the linear moving module 36 controls the extension into the box 8 of the feeding station to adsorb the wafer and withdraw the product, and then the rotating module 32 drives the transfer to the jacking mechanism 62, at this time, the first top plate 621 and the second top plate 622 are jacked up by the jacking cylinder 623, the product 100 is placed on the top plate, the positioning camera 61 scans the product 100 below, analyzes and determines the center position of the product 100, the double-axis moving platform 64 drives the positioning column 63 to move to the center of the product 100, the jacking cylinder 623 lowers the first top plate 621 and the second top plate 622, so that the positioning column 63 is adsorbed and fixed to the center of the product 100, and then moves to the center of the positioning frame 65 through the double-axis moving platform 64, and the jacking cylinder 623 jacks up the first top plate 621 and the second top plate 622 again, so as to ensure that the manipulator 3 adsorbs the product 100 again is just positioned to the center of the product 100, so as to improve the detection accuracy and efficiency, after positioning, the manipulator 3 transfers the product to the product bearing platform 5, the first mechanical arm 33 or the second mechanical arm 34 extends into the adsorption column 54, places the product 100 to be detected on the adsorption column 54, and then withdraws, the adsorption column 54 adsorbs and fixes the product 100, the first detection assembly 22 and the second detection assembly 23 position the product 100 below, the product moving module 51 drives the product 100 to move to the appropriate position during the positioning process, the first detection assembly 22 and the second detection assembly 23 start detection, and during the detection process, the rotating drive motor 53 drives the product platform 52 to rotate according to the size range of the product 100, so as to scan the surface of the product comprehensively, and at the same time, the second detection assembly 23 also adjusts the distance from the first detection assembly 22 according to the size of the product. The product 100 after detection is taken down by the manipulator 3 and transferred to the box 8 of the discharging station for discharging.

[0030] The first mechanical arm 33 and the second mechanical arm 34 alternately take and place materials, such as at the product bearing platform 5, one of the mechanical arms will adsorb and transfer the finished product 100 out of the adsorption column 54, and the other mechanical arm will transfer the product 100 to be detected to the empty adsorption column 54, so as to alternately work, improve the detection efficiency, take and place materials at other places such as the center alignment mechanism, the material box, and the two mechanical arms can also alternately work.

[0031] Although the specific embodiments of the present application have been described in detail with reference to the illustrative embodiments thereof, it must be understood that various other modifications and embodiments of the present application will fall within the spirit and scope of the principles of the present application. Specifically, within the scope of the foregoing disclosure, the drawings and the claims, reasonable variations and improvements can be made in the arrangement of parts and / or dependent combinations, without departing from the spirit of the present application. In addition to variations and improvements in parts and / or layout, the scope thereof is defined by the appended claims and their equivalents.

[0032] The same or similar reference numerals in the drawings of the embodiments of the present application correspond to the same or similar parts; in the description of the present application, it should be understood that if the terms "upper", "lower" and the like indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the drawings, only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, therefore the terms describing the positional relationship in the drawings are only used for exemplary description, and cannot be understood as a limitation of the present patent, for those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.

[0033] Any reference to "the present embodiment" or the like in the present application means that the specific components, structures or features described in conjunction with the embodiment are included in at least one embodiment of the present application. The above description does not necessarily refer to the same embodiment. Moreover, when a specific component, structure or feature is described in conjunction with any embodiment, it is claimed that it is within the scope of those skilled in the art to realize such components, structures or features in conjunction with other embodiments.

[0034] In addition, the above embodiments are only used to illustrate the present application and are not intended to limit the technical solutions described in the present application. The understanding of the present application should be based on the skilled in the art, although the present application has been described in detail with reference to the above embodiments, those skilled in the art should understand that the skilled in the art can still modify or equivalently replace the present application, and all technical solutions and improvements which do not deviate from the spirit and scope of the present application should be covered within the scope of the claims of the present application.

Claims

1. A wafer inspection apparatus, comprising a machine table, an inspection module disposed on the machine table, and a robot, wherein: The detection module is erected on the machine table through a column, and comprises a camera moving module, a first detection assembly and a second detection assembly. The camera moving module and the first detection assembly are arranged on the column, and the second detection assembly is arranged on the camera moving module. The second detection assembly is arranged in parallel with the first detection assembly at the same height, and performs translational movement close to or away from the first detection assembly under the drive of the camera moving module. A product carrying platform provided with a product moving module and a rotating adsorption platform is movably arranged on the machine table below the detection module.

2. The wafer inspection apparatus of claim 1, wherein The rotating adsorption platform comprises a product platform, a rotating drive motor and a plurality of adsorption columns regularly arranged on the product platform. Each adsorption column is provided with a plurality of adsorption holes. The product platform is arranged on the rotating drive motor and is controlled to rotate or stop by the rotating drive motor.

3. The wafer inspection apparatus of claim 1, wherein The first detection assembly and the second detection assembly are identical in structure and each comprises a detection camera and a coaxial light source arranged below the detection camera.

4. The wafer inspection apparatus of claim 1, wherein The mechanical hand comprises a lifting module, a rotating module, a first mechanical arm and a second mechanical arm. The first mechanical arm and the second mechanical arm are arranged on the rotating module through linear moving modules respectively, and the first mechanical arm and the second mechanical arm are controlled to rotate synchronously by the rotating module. The rotating module is arranged on the lifting module, and the rotating module is controlled to perform lifting movement by the lifting module.

5. The wafer inspection apparatus of claim 4, wherein The end of the first mechanical arm and the end of the second mechanical arm are provided with suction cups.

6. The wafer inspection apparatus of claim 1, wherein A center alignment mechanism is further provided, which comprises a positioning camera, a jacking mechanism, a positioning column, a biaxial moving platform and a positioning frame. The positioning column and the biaxial moving platform are arranged in the positioning frame, the jacking mechanism is arranged on opposite sides of the positioning frame, the positioning camera is arranged above the positioning frame through a support, and the positioning column is arranged on the biaxial moving platform.

7. The wafer inspection apparatus of claim 6, wherein The jacking mechanism comprises a first top plate, a second top plate and a jacking cylinder. The jacking cylinder is arranged on the outer walls of opposite sides of the positioning frame, the first top plate and the second top plate are arranged on the movable end of the jacking cylinder, the jacking cylinder drives the first top plate and the second top plate to perform lifting movement above the positioning frame, one end of the second top plate is provided with a notch, the size of the notch is greater than the outer diameter of the positioning column, and the positioning column moves in the range of the notch under the drive of the biaxial moving platform.

8. The wafer inspection apparatus of claim 6, wherein The positioning camera is detachably arranged on the support, and a light source mechanism is further arranged on the support below the positioning camera to provide light for the positioning camera.

9. The wafer inspection apparatus of claim 1, wherein A plurality of regularly arranged magazine carrying frames are further arranged on the machine table, and the magazine carrying frames are arranged in an arc shape along the periphery of the mechanical hand.

10. The wafer inspection apparatus according to claim 9, wherein The magazine carrying frame is a multi-layer structure, and a magazine is detachably arranged in each layer.

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