Test equipment with heat dissipation function

Abstract

The utility model discloses test equipment with a heat dissipation function. The test equipment comprises a workbench, two mounting plates arranged in a step shape, and a plurality of test mechanisms arranged at the upper parts of the mounting plates, the testing mechanism comprises a base, a first driving assembly, a second driving assembly, a mounting frame and a pressing assembly; the equipment is used for solving the problems that in the process of testing a chip in a circuit board, the chip can heat, the chip can generate a large amount of heat in the testing process, the testing effect can be influenced by temperature rise, heat dissipation cannot be conducted on the chip in time, and the risk of chip damage exists.

Description

TECHNICAL FIELD

[0001] The utility model relates to chip testing technical field, concretely relates to a test equipment with heat dissipation function. BACKGROUND

[0002] The comprehensive detection of the various performances of the 8155 chip in the electronic industry generally includes three aspects of tests of processing capacity and communication function and power consumption test; the 8155 chip processing capacity test includes data operation speed and multitasking processing efficiency; the 8155 chip communication function test aspect detects the connection stability and data transmission rate of the chip and various devices; the 8155 chip power consumption test is to ensure that it has better capacity while meeting the performance requirements.

[0003] In addition, stress test will also be carried out to simulate high load operation to test the stability and reliability of the chip, and through a series of strict tests, whether the 8155 chip meets the design requirements is verified to provide protection for its good performance in actual application.

[0004] The 8155 chip is tested, and generally related function tests are carried out on the 8155 chip installed in the corresponding circuit board. At present, in the process of testing the chip in the circuit board, the chip will heat, a large amount of heat will be generated in the chip during the test process, the temperature rise will affect the test effect, and if the chip cannot be cooled in time, there will be a risk of damaging the chip.

[0005] Therefore, a test equipment with heat dissipation function is urgently needed to solve the problem of chip heat dissipation. UTILITY MODEL CONTENTS

[0006] To solve the above technical problems, the utility model provides a test equipment with heat dissipation function for solving the problem that the chip will heat in the process of testing the chip in the circuit board, a large amount of heat will be generated in the chip during the test process, the temperature rise will affect the test effect, and if the chip cannot be cooled in time, there will be a risk of damaging the chip.

[0007] The technical scheme of the utility model is: a test equipment with heat dissipation function, the test equipment comprises:

[0008] A workbench, two installation plates arranged in a stepped manner and a plurality of test mechanisms arranged on the upper part of the installation plate;

[0009] The test mechanism comprises a base, a first driving assembly, a second driving assembly, a mounting frame and a pressing assembly, the first driving assembly is arranged on the upper part of the base, the mounting frame is arranged on the upper part of the base, the second driving assembly is arranged on the upper part of the mounting frame, and the pressing assembly is arranged on the moving end of the second driving assembly;

[0010] The down-pressing assembly comprises a down-pressing fixed plate, an air duct plate, a down-pressing plate and a heat dissipation piece, the down-pressing fixed plate is arranged at the lower part of the second driving piece, the air duct plate is arranged at the lower part of the down-pressing fixed plate, the down-pressing plate is arranged at the lower part of the air duct plate, and the heat dissipation piece is embedded at the lower part of the down-pressing plate.

[0011] Preferably, the air duct plate is provided with a first air duct and a second air duct in communication, and the first air duct and the second air duct are arranged vertically.

[0012] The lower surface of the air duct plate is provided with an air duct groove, a first mounting groove, a second mounting groove and a third mounting groove, the second mounting groove and the third mounting groove are located on both sides of the first mounting groove, the first mounting groove, the second mounting groove and the third mounting groove are all in communication with the air duct groove, and the air duct groove is in communication with the first air duct and the second air duct through a center hole.

[0013] Preferably, the down-pressing plate is provided with a first mounting hole, a second mounting hole and a third mounting hole, after the down-pressing plate is assembled with the air duct plate, the position of the first mounting hole corresponds to the first mounting groove, the position of the second mounting hole corresponds to the second mounting groove, and the position of the third mounting hole corresponds to the third mounting groove, and the first mounting hole, the second mounting hole and the third mounting hole are all arranged as stepped holes.

[0014] Preferably, the outer periphery of the upper part of the heat dissipation piece is provided with a limiting step, the heat dissipation piece comprises a first heat dissipation block, a second heat dissipation block and a third heat dissipation block, the first heat dissipation block can be mounted in the first mounting hole, the second heat dissipation block can be mounted in the second mounting hole, the third heat dissipation block can be mounted in the third mounting hole, the upper part of the first heat dissipation block is connected with the first mounting groove through a spring, the upper part of the second heat dissipation block is connected with the second mounting groove through a spring, and the upper part of the third heat dissipation block is connected with the third mounting groove through an elastic piece.

[0015] Preferably, the first heat dissipation block, the second heat dissipation block and the third heat dissipation block are all arranged as copper heat dissipation blocks.

[0016] Preferably, the lower part of the mounting frame is provided with a plurality of guide rods, and the down-pressing fixed plate is provided with guide holes matched with the guide rods.

[0017] Preferably, the upper part of the base is provided with two parallel sliding rails, and the lower part of the mounting frame is provided with sliding blocks matched with the two sliding rails.

[0018] The lower part of the base is provided with two parallel guide strips, and the lower part of the base is provided with a plurality of rolling ball heads, in addition, the lower part of the base is provided with a fixed block.

[0019] Preferably, the upper part of the workbench is provided with a plurality of guide assemblies for guiding the base.

[0020] The guiding assembly comprises a limiting plate and two groups of symmetrically arranged guiding units, each of the guiding units comprises two symmetrically arranged guiding plates, a guiding groove is formed between the two guiding plates, and the guiding groove is matched with the guiding strip.

[0021] Preferably, the two guiding plates are provided with chamfers on opposite sides of the end away from the limiting plate.

[0022] Preferably, the lower part of the air duct plate is provided with a plurality of limiting columns.

[0023] The beneficial technical effects of the utility model are as follows:

[0024] First, the heat dissipation piece is floatingly installed in the pressing plate, and the upper part of the heat dissipation piece is connected with the installation groove through a spring. After the second driving assembly drives the pressing plate to press the circuit board, the heat dissipation piece contacts the chip in the circuit board, at this time, the spring is in a compressed state, so that the heat dissipation piece is ensured to fully contact the chip in the circuit board, the compressed cold air can enter the first air duct and the second air duct, pass through the center hole to enter the air duct groove to directly blow away the heat of the heat dissipation piece, and then cool the chip in the circuit board, so as to prevent the chip in the circuit board from being damaged due to overheating during testing.

[0025] In addition, the heat dissipation piece adopts a copper heat dissipation block, has good thermal conductivity, and can quickly transfer the heat of the chip in the circuit board to the heat dissipation piece.

[0026] Meanwhile, the utility model realizes automatic testing, improves the testing efficiency, saves the detection cost, reduces the labor cost, and improves the safety of testing, so that the personnel safety accidents are avoided. BRIEF DESCRIPTION OF DRAWINGS

[0027] Figure 1 It is a whole structure schematic view of the utility model;

[0028] Figure 2 It is a testing mechanism structure schematic view of the utility model;

[0029] Figure 3 It is a pressing assembly structure schematic view of the utility model;

[0030] Figure 4 It is an air duct plate structure schematic view of the utility model;

[0031] Figure 5 It is a pressing plate structure schematic view of the utility model;

[0032] Figure 6 It is a heat dissipation piece structure schematic view of the utility model;

[0033] Figure 7 It is an air duct plate and pressing plate structure schematic view of the utility model;

[0034] Figure 8 It is base structure schematic view of the utility model.

[0035] Figure 9 It is guiding assembly structure schematic view of the utility model.

[0036] Reference signs are:

[0037] 100, workbench;

[0038] 200, mounting plate;201, guiding assembly;2011, limiting plate;2012, guiding unit;20121, guiding plate;2013, guiding groove;

[0039] 300, test mechanism;301, base;3011, slide rail;3012, guiding strip;3013, rolling ball head;3014, fixed block;302, first driving assembly;303, second driving assembly;304, mounting frame;3041, guiding rod;3042, sliding block;305, pressing-down assembly;3051, pressing-down fixed plate;30511, guiding hole;3052, air duct plate;30521, first air duct;30522, second air duct;30523, air duct groove;30524, first mounting groove;30525, second mounting groove;30526, third mounting groove;30527, center hole;30528, limiting column;3053, pressing-down plate;30531, first mounting hole;30532, second mounting hole;30533, third mounting hole;3054, heat dissipation piece;30541, limiting step;30542, first heat dissipation block;30543, second heat dissipation block;30544, third heat dissipation block. DETAILED DESCRIPTION

[0040] In order to more clearly understand the technical means of the utility model, and can be implemented according to the content of the specification, the specific embodiments of the utility model are further described in detail below, the following examples are used to illustrate the utility model, but not to limit the scope of the utility model.

[0041] As Figures 1-9 Indicated, the utility model specifically relates to a kind of test equipment with heat dissipation function, which includes:

[0042] Workbench 100, two mounting plates 200 arranged in a stepped manner and a plurality of test mechanisms 300 arranged on the upper portion of the mounting plate 200;

[0043] The test mechanism 300 comprises a base 301, a first driving assembly 302, a second driving assembly 303, a mounting frame 304 and a pressing assembly 305, the first driving assembly 302 is arranged on the upper portion of the base 301, the mounting frame 304 is arranged on the upper portion of the base 301, the second driving assembly 303 is arranged on the upper portion of the mounting frame 304, and the pressing assembly 305 is arranged on the moving end of the second driving assembly 303.

[0044] The pressing assembly 305 comprises a pressing fixed plate 3051, an air duct plate 3052, a pressing plate 3053 and a heat sink 3054, the pressing fixed plate 3051 is arranged on the lower portion of the second driving member, the air duct plate 3052 is arranged on the lower portion of the pressing fixed plate 3051, the pressing plate 3053 is arranged on the lower portion of the air duct plate 3052, and the heat sink 3054 is embedded in the lower portion of the pressing plate 3053.

[0045] The heat sink 3054 is floatingly installed in the pressing plate 3053, and the upper portion of the heat sink 3054 is connected with the mounting groove through a spring, after the second driving assembly 303 drives the pressing plate 3053 to press the circuit board, the heat sink 3054 is in contact with the chip in the circuit board, at this time, the spring is in a compressed state, so that the heat sink 3054 is in full contact with the chip in the circuit board, the compressed cold air can enter the first air duct 30521 and the second air duct 30522, pass through the center hole 30527 to enter the air duct groove 30523 to directly blow away the heat of the heat sink 3054, so as to cool the chip in the circuit board, and prevent the chip in the circuit board from being damaged due to overheating during the test.

[0046] Further, referring to Figure 2 , the air duct plate 3052 is provided with a first air duct 30521 and a second air duct 30522 which are in communication, and the first air duct 30521 and the second air duct 30522 are arranged vertically.

[0047] The lower surface of the air duct plate 3052 is provided with an air duct groove 30523, a first mounting groove 30524, a second mounting groove 30525 and a third mounting groove 30526, the second mounting groove 30525 and the third mounting groove 30526 are located on both sides of the first mounting groove 30524, the first mounting groove 30524, the second mounting groove 30525 and the third mounting groove 30526 are in communication with the air duct groove 30523, and the air duct groove 30523 is in communication with the first air duct 30521 and the second air duct 30522 through the center hole 30527.

[0048] Two ends of the first air duct 30521 extend to two ends of the air duct plate 3052, two ends of the second air duct 30522 extend to two ends of the air duct plate 3052, and during operation, the two open ends of the second air duct 30522 are sealed by plugs, one open end of the first air duct 30521 is sealed by a plug, and the other open end of the first air duct 30521 is connected to an air source through an air tube.

[0049] In addition, the lower pressing plate 3053 is provided with a first mounting hole 30531, a second mounting hole 30532, and a third mounting hole 30533, and after the lower pressing plate 3053 is assembled with the air duct plate 3052, the first mounting hole 30531 corresponds to the first mounting groove 30524 in position, the second mounting hole 30532 corresponds to the second mounting groove 30525 in position, and the third mounting hole 30533 corresponds to the third mounting groove 30526 in position, and the first mounting hole 30531, the second mounting hole 30532, and the third mounting hole 30533 are all step holes.

[0050] The outer periphery of the upper part of the heat dissipation piece 3054 is provided with a limiting step 30541, the heat dissipation piece 3054 includes a first heat dissipation block 30542, a second heat dissipation block 30543, and a third heat dissipation block 30544, the first heat dissipation block 30542 can be installed in the first mounting hole 30531, the second heat dissipation block 30543 can be installed in the second mounting hole 30532, the third heat dissipation block 30544 can be installed in the third mounting hole 30533, and the upper part of the first heat dissipation block 30542 is connected with the first mounting groove 30524 through a spring, the upper part of the second heat dissipation block 30543 is connected with the second mounting groove 30525 through a spring, and the upper part of the third heat dissipation block 30544 is connected with the third mounting groove 30526 through an elastic piece.

[0051] The second driving assembly 303 is arranged as a cylinder, and the second driving assembly 303 drives the lower pressing fixed plate 3051, the lower pressing fixed plate 3051 drives the air duct plate 3052, the air duct plate 3052 drives the lower pressing plate 3053, the lower pressing plate 3053 drives the heat dissipation piece 3054 to press the chip in the circuit board, and during the process of contacting the chip, the spring between the first heat dissipation block 30542 and the first mounting groove 30524 is gradually compressed, the spring between the second heat dissipation block 30543 and the second mounting groove 30525 is gradually compressed, and the spring between the third heat dissipation block 30544 and the third mounting groove 30526 is gradually compressed, and when the lower pressing plate 3053 contacts the circuit board, the lower pressing action is completed, at this time, the spring between the first heat dissipation block 30542 and the first mounting groove 30524, the spring between the second heat dissipation block 30543 and the second mounting groove 30525, and the spring between the third heat dissipation block 30544 and the third mounting groove 30526 are all in a compressed state, thereby ensuring that the heat dissipation piece 3054 fully contacts the chip in the circuit board.

[0052] As shown in Fig. 1, the first heat dissipation block 30542, the second heat dissipation block 30543 and the third heat dissipation block 30544 are all copper heat dissipation blocks, so as to improve the heat conductivity of the first heat dissipation block 30542, the second heat dissipation block 30543 and the third heat dissipation block 30544. Figure 3

[0053] It is to be further explained that the lower part of the mounting frame 304 is provided with a plurality of guide rods 3041, and the lower pressing plate 3051 is provided with guide holes 30511 matched with the guide rods 3041.

[0054] The stability of the movement of the lower pressing plate 3051 is improved, so as to improve the accuracy of the contact position of the heat dissipation member 3054 and the chip in the circuit board, and ensure that the chip can be in full contact with the heat dissipation member 3054.

[0055] In addition, the upper part of the base 301 is provided with two parallel sliding rails 3011, and the lower part of the mounting frame 304 is provided with sliding blocks 3042 matched with the two sliding rails 3011.

[0056] The lower part of the base 301 is provided with two parallel guide strips 3012, and the lower part of the base 301 is provided with a plurality of rolling ball heads 3013. In addition, the lower part of the base 301 is provided with a fixed block 3014.

[0057] The first driving member is a cylinder. The contraction of the first driving member drives the mounting frame 304 to contract, so as to place the circuit board to be tested on the upper part of the work station of the base 301. The elongation of the first driving member drives the mounting frame 304, and the mounting frame 304 drives the lower pressing assembly 305 to move to the upper part of the circuit board.

[0058] The upper part of the workbench 100 is provided with a plurality of guide assemblies 201 guiding the base 301.

[0059] The guide assembly 201 comprises a limiting plate 2011 and two groups of symmetrically arranged guide units 2012. The guide unit 2012 comprises two symmetrically arranged guide plates 20121, and a guide groove 2013 is formed between the two guide plates 20121. The guide groove 2013 is matched with the guide strip 3012.

[0060] The opposite side of the end of the two guide plates 20121 away from the limiting plate 2011 is provided with a chamfer.

[0061] ​The base 301 is quickly inserted into the two symmetrically arranged guide plates 20121 through the guide strips 3012 arranged at the bottom, and the position of the base 301 can be accurately fixed. During the process of inserting the base 301 into the guide plates 20121, the rolling ball heads 3013 arranged at the bottom of the base 301 slide on the upper part of the workbench 100, so that the friction between the base 301 and the workbench 100 is reduced, and the abrasion of the base 301 is reduced.

[0062] In addition, the fixed blocks 3014 are locked by bolts between the workbench 100, so that the base 301 is prevented from moving during the test.

[0063] Finally, the lower part of the air duct plate 3052 is provided with a plurality of limiting columns 30528.

[0064] The movement of the pressing plate 3053 during the pressing process is limited, and the chip in the circuit board is prevented from being damaged by the pressing plate 3053.

[0065] Working principle:

[0066] Firstly, the test mechanism 300 is quickly inserted into the two symmetrically arranged guide plates 20121 through the guide strips 3012 arranged at the lower part of the base 301, and the position of the base 301 can be accurately fixed. The fixed blocks 3014 are locked by bolts between the workbench 100, so that the base 301 is prevented from moving during the test.

[0067] Secondly, the robot places the circuit board on the upper part of the work station of the base 301. The first driving member is elongated to drive the mounting frame 304. The mounting frame 304 drives the pressing assembly 305 to move to the upper part of the circuit board. The second driving assembly 303 drives the pressing fixed plate 3051. The pressing fixed plate 3051 drives the air duct plate 3052. The air duct plate 3052 drives the pressing plate 3053. The pressing plate 3053 drives the heat dissipation member 3054 to press the chip in the circuit board. The spring is in a compressed state during the process of contacting the chip, so as to ensure that the heat dissipation member 3054 is in full contact with the chip in the circuit board.

[0068] Finally, the other open end of the first air duct 30521 is connected to the air source through the air pipe. The compressed cold air can enter the first air duct 30521 through the open end, enter the air duct groove 30523 through the center hole 30527, and directly blow away the heat of the heat dissipation member 3054. Then the air enters the air through the air duct groove 30523, and then cools the chip in the circuit board, so as to prevent the chip in the circuit board from being damaged due to overheating during the test.

[0069] The above merely is preferred implementation manner of the present application, and is not used for limiting the present application, it should be pointed out, for ordinary skilled person in the technical field, on the premise of not departing from the technical principle of the present application, can also make several improvements and variations, these improvements and variations also should be regarded as the protection scope of the present application.

Claims

1. A testing device with heat dissipation function, characterized in that: The testing equipment comprises: a workbench, two installation plates arranged in a stepped manner, and a plurality of testing mechanisms arranged on the upper portions of the installation plates; the testing mechanism comprises a base, a first driving assembly, a second driving assembly, a mounting frame, and a pressing assembly, the first driving assembly is arranged on the upper portion of the base, the mounting frame is arranged on the upper portion of the base, the second driving assembly is arranged on the upper portion of the mounting frame, and the pressing assembly is arranged on the moving end of the second driving assembly; the pressing assembly comprises a pressing fixed plate, an air duct plate, a pressing plate, and a heat dissipation piece, the pressing fixed plate is arranged on the lower portion of the second driving piece, the air duct plate is arranged on the lower portion of the pressing fixed plate, the pressing plate is arranged on the lower portion of the air duct plate, and the heat dissipation piece is embedded on the lower portion of the pressing plate.

2. The test device with heat dissipation function according to claim 1, characterized in that: The first air duct and the second air duct are arranged in the air duct plate and communicate with each other, and the first air duct and the second air duct are arranged vertically; the lower surface of the air duct plate is provided with an air duct groove, a first installation groove, a second installation groove, and a third installation groove, the second installation groove and the third installation groove are located on the two sides of the first installation groove, the first installation groove, the second installation groove, and the third installation groove all communicate with the air duct groove, and the air duct groove communicates with the first air duct and the second air duct through a center hole.

3. The test device with heat dissipation function according to claim 2, characterized in that: The pressing plate is provided with a first installation hole, a second installation hole, and a third installation hole, after the pressing plate is assembled with the air duct plate, the position of the first installation hole corresponds to the first installation groove, the position of the second installation hole corresponds to the second installation groove, the position of the third installation hole corresponds to the third installation groove, and the first installation hole, the second installation hole, and the third installation hole are all arranged as stepped holes.

4. The test device with heat dissipation function according to claim 3, characterized in that: The outer periphery of the upper portion of the heat dissipation piece is provided with a limiting step, the heat dissipation piece comprises a first heat dissipation block, a second heat dissipation block, and a third heat dissipation block, the first heat dissipation block can be installed in the first installation hole, the second heat dissipation block can be installed in the second installation hole, the third heat dissipation block can be installed in the third installation hole, the upper portion of the first heat dissipation block is connected with the first installation groove through a spring, the upper portion of the second heat dissipation block is connected with the second installation groove through a spring, and the upper portion of the third heat dissipation block is connected with the third installation groove through an elastic piece.

5. The test device with heat dissipation function according to claim 4, characterized in that: The first heat dissipation block, the second heat dissipation block, and the third heat dissipation block are all arranged as copper heat dissipation blocks.

6. The test device with heat dissipation function according to claim 5, characterized in that: The lower portion of the mounting frame is provided with a plurality of guide rods, and the pressing fixed plate is provided with guide holes matched with the guide rods.

7. The test device with heat dissipation function according to claim 1, characterized in that: The upper portion of the base is provided with two parallel sliding rails, and the lower portion of the mounting frame is provided with sliding blocks matched with the two sliding rails; the lower portion of the base is provided with two parallel guide strips, and the lower portion of the base is provided with a plurality of rolling ball heads, in addition, the lower portion of the base is provided with a fixed block.

8. The test device with heat dissipation function according to claim 7, characterized in that: The upper portion of the workbench is provided with a plurality of guide assemblies for guiding the base; the guide assembly comprises a limiting plate and two groups of symmetrically arranged guide units, the guide unit comprises two symmetrically arranged guide plates, a guide groove is formed between the two guide plates, and the guide groove is matched with the guide strip.

9. The test apparatus with heat dissipation function according to claim 8, characterized in that: The opposite side of the end of the two guide plates away from the limiting plate is provided with a chamfer.

10. The test device with heat dissipation function according to claim 9, characterized in that: The lower portion of the air duct plate is provided with a plurality of limiting columns.

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