Optical module

Abstract

The optical module comprises a shell, a heat dissipation piece and a circuit board, the shell is provided with an inner cavity, the shell comprises an outer surface and an inner surface which are opposite in the first direction, the shell is provided with an installation opening penetrating through the inner surface and the outer surface, and the installation opening is communicated with the inner cavity. The circuit board is arranged in the inner cavity, a functional device is arranged on the circuit board, the heat dissipation piece comprises a first surface, the part, provided with the first surface, of the heat dissipation piece is embedded in the mounting opening, so that the first surface seals the mounting opening and forms a part of the inner surface, and the first surface is in heat conduction connection with the circuit board; therefore, heat generated by the functional device of the circuit board is conducted to the heat dissipation piece. Wherein the first direction is the thickness direction of the shell. The embodiment of the utility model discloses an optical module which can weaken the influence of a welding agent on heat conduction and improve the heat dissipation effect of the optical module.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of optical communication technology, and in particular to an optical module. BACKGROUND

[0002] The optical module is an integrated module for optical-electrical signal conversion. When performing optical-electrical signal conversion, the optical module mainly converts electrical signals into optical signals through the sending end of the optical module, and converts optical signals into electrical signals through the receiving end of the optical module. At present, the optical module is developing towards small size and high transmission rate, and the power is also increasing, so higher requirements are put forward for the heat dissipation effect of the optical module.

[0003] In the related art, a heat dissipation module is usually arranged on the optical module by means of large-area welding, but the solder paste after welding usually has cavities, and the thermal conductivity of the solder paste is low itself, which leads to unsatisfactory heat dissipation effect of the optical module. CONTENT OF THE UTILITY MODEL

[0004] The embodiment of the present application discloses an optical module which can weaken the influence of the welding agent on heat conduction and improve the heat dissipation effect of the optical module.

[0005] In order to achieve the above-mentioned purpose, the embodiment of the present application discloses an optical module, comprising:

[0006] a shell having an inner cavity, the shell comprising an outer surface and an inner surface opposite to each other in a first direction, the shell being provided with a mounting opening penetrating through the inner surface and the outer surface, the mounting opening being communicated with the inner cavity; and

[0007] a circuit board provided in the inner cavity, the circuit board being provided with a functional device; and

[0008] a heat dissipation member comprising a first surface, the heat dissipation member having a part of the first surface embedded in the mounting opening, so that the first surface closes the mounting opening and forms a part of the inner surface, the first surface being in thermal conductive connection with the circuit board, so that the heat generated by the functional device of the circuit board is conducted to the heat dissipation member;

[0009] wherein the first direction is the thickness direction of the shell.

[0010] The light module is provided with a mounting opening on the shell, and a part of the heat dissipation member having a first surface is embedded in the mounting opening, so that the first surface closes the mounting opening and forms part of the inner surface of the shell, and the first surface is in thermal conductive connection with the circuit board, so that the heat generated by the functional device of the circuit board is conducted to the heat dissipation member. Compared with the related art in which the heat dissipation member is welded on the surface of the shell as a whole, the influence of the welding agent on heat conduction can be reduced, and the heat dissipation member can directly receive the heat of the functional device and then transmit the heat to the outside. The heat dissipation path can bypass the shell, the heat dissipation is more direct, and the heat dissipation effect is better.

[0011] As an optional implementation, the shell comprises an upper shell and a lower shell, and the upper shell is connected to the lower shell to form the inner cavity therebetween;

[0012] The upper shell comprises a main body portion, a first end portion and a second end portion, the main body portion is connected between the first end portion and the second end portion, the main body portion has the outer surface and the inner surface, the mounting opening extends along the length direction of the main body portion, and the mounting opening extends from one end of the main body portion to the other end.

[0013] By extending the mounting opening from one end of the main body portion to the other end, the mounting opening can have a relatively large proportion relative to the main body portion, so that the size of the mounting opening is maximized. When the heat dissipation member is embedded in the mounting opening, a larger size is required to match, i.e., the heat dissipation member is also a long strip-shaped heat dissipation member, and the overall length matches the length of the mounting opening, so that the heat dissipation member has a larger heat dissipation area, thereby improving the heat dissipation effect of the heat dissipation member.

[0014] As an optional implementation, the heat dissipation member comprises a first panel, a second panel and a plurality of partitions, the first panel and the second panel are spaced apart along the first direction, and a plurality of the partitions are connected between the first panel and the second panel, a heat dissipation channel is formed between adjacent two of the partitions, the first panel has the first surface, and at least part of the first panel is embedded in the mounting opening.

[0015] By adopting a plurality of partitions spaced apart between the first panel and the second panel to form a heat dissipation channel between adjacent partitions, the heat dissipation channel is an airflow channel, which can guide airflow to pass through the heat dissipation channel to carry away heat, and can increase the heat dissipation area of the heat dissipation member and the airflow speed through the heat dissipation member, so that the heat generated by the functional device is transferred to the heat dissipation member and the convection effect with the surrounding air is enhanced, thereby improving the heat dissipation effect.

[0016] As an optional implementation, edges of the outer surface are provided with two opposite edges along a third direction, the two edges extend along the second direction, and an accommodating space is formed between the two edges and is communicated with the mounting opening, an opening area of the accommodating space in the first direction is greater than an area of the mounting opening, the first panel is embedded in the mounting opening, the partition plate and the second panel are located in the accommodating space, and the second panel covers the opening of the accommodating space in the first direction.

[0017] The second direction is a length direction of the shell, and the third direction is a width direction of the shell.

[0018] By providing the edges on both sides of the upper shell to form the accommodating space communicated with the mounting opening, the heat dissipation member can be mounted in the accommodating space. Specifically, the first panel is embedded in the mounting opening, the partition plate and the second panel are located in the accommodating space, so that the heat dissipation channel can be located outside the mounting opening without being blocked, thereby not affecting the airflow passing through, and the second panel can block the opening of the accommodating space in the first direction, so that the top surface of the upper shell appears to be a complete or substantially complete plane in vision, the heat dissipation member is entirely mounted in the interior of the shell, and there is no visual effect that the heat dissipation member protrudes from the upper shell and is exposed outside, which is more conducive to presenting the integrated effect of the optical module.

[0019] As an optional implementation, the heat dissipation channel extends along the second direction.

[0020] The first end portion is configured to be connected to the optical fiber, one end of the first end portion connected to the main body portion has an inclined surface, the inclined surface is connected to the outer surface, and the inclined surface is inclined from the main body portion to the first end portion, so that an included angle between the inclined surface and the outer surface is an obtuse angle.

[0021] The second direction is a length direction of the shell.

[0022] By arranging the heat dissipation channel to extend along the second direction, that is, consistent with the direction of the first end portion towards the second end portion, and arranging the inclined surface inclined towards the first end portion on the first end portion, the airflow passing through the heat dissipation channel can flow along the inclined surface, so that the heat is more limitedly diffused to the external environment, and the heat dissipation effect of the optical module as a whole is better. In addition, since the first end portion is configured to be connected with the optical fiber, a plug-in part is usually required to be arranged between the first end portion and the lower shell. If the inclined surface design is not used, the first end portion needs to be continuously arranged along the outer surface of the main body portion. Under the condition that the size of the plug-in part is certain, this will make the plug-in part need to occupy a larger space in the inner cavity, thereby excessively increasing the thickness of the shell. However, through the inclined surface design, the top surface of the first end portion can be higher than the outer surface of the main body portion, which expands the space for the arrangement of the plug-in part and is more conducive to the lightness and thinness of the optical module.

[0023] As an optional implementation manner, the outer surface is provided with a first sunken platform, and the first sunken platform is arranged around the mounting port;

[0024] The first surface is provided with a second sunken platform matched with the first sunken platform, and the second sunken platform abuts against the first sunken platform.

[0025] By arranging the first sunken platform on the outer surface of the upper shell and arranging the second sunken platform abutting against the first sunken platform on the first surface of the heat dissipation member, the first sunken platform can provide the heat dissipation member with bearing force from the first direction, thereby providing a supporting effect for the installation of the heat dissipation member, so that the installation of the heat dissipation member has higher reliability.

[0026] As an optional implementation manner, the first sunken platform comprises a first wide edge portion, a second wide edge portion and a narrow edge portion, the first wide edge portion is located at one end of the length direction of the mounting port, and the two ends of the first wide edge portion extend to the middle part of the mounting port along the second direction, the second wide edge portion is located at the other end of the length direction of the mounting port, and the narrow edge portion is connected between the first wide edge portion and the second wide edge portion.

[0027] By adopting the segmented arrangement of the first sunken platform in different sizes, the heat dissipation member can be provided with sufficient bearing force, and at the same time, the contact area between the heat dissipation member and the upper shell cannot be too large, so that the heat dissipation member has a larger heat dissipation area not in contact with the upper shell to participate in the heat transfer process, thereby improving the heat dissipation effect.

[0028] As an optional implementation manner, the outer surface has a clamping groove, the clamping groove penetrates through the first wide edge portion along a third direction, and the clamping groove is arranged close to the connection between the first wide edge portion and the narrow edge portion, the heat dissipation member is provided with a clamping protrusion, and the clamping protrusion is clamped and connected with the clamping groove;

[0029] The first wide edge part is provided with a first connecting hole on a part corresponding to the clamping groove, the second sink is provided with a second connecting hole, and the heat dissipation piece is connected to the shell through fasteners penetrating the first connecting hole and the second connecting hole.

[0030] The third direction is the width direction of the shell.

[0031] The clamping groove penetrating the first sink and the clamping protrusion on the heat dissipation piece are matched on the outer surface, which can improve the limiting effect of the shell on the heat dissipation piece, improve the connection stability of the heat dissipation piece, and set the first connecting hole on the first sink corresponding to the clamping groove and the second connecting hole on the heat dissipation piece to correspond to the fastener penetrating, the second connecting hole can use the space on the clamping protrusion, so that the second connecting hole is not limited to the available space on the heat dissipation piece, thereby meeting the fastener penetrating the first connecting hole and the second connecting hole to realize the connection of the heat dissipation piece and the shell.

[0032] As an optional implementation, the surface of the first sink and / or the second sink is provided with an adhesive, and the heat dissipation piece is connected to the shell through the adhesive; and / or,

[0033] The surface of the first sink and / or the second sink is provided with a welding agent, and the heat dissipation piece is connected to the shell through the welding agent; and / or,

[0034] The first sink is provided with a first connecting hole, the second sink is provided with a second connecting hole, and the heat dissipation piece is connected to the shell through fasteners penetrating the first connecting hole and the second connecting hole.

[0035] The adhesive or the welding agent is distributed on the first sink, and then the second sink of the heat dissipation piece is connected thereto, and finally fastened through the fastener, which can effectively guarantee the stable connection between the heat dissipation piece and the shell, and can reduce the influence of the adhesive or the welding agent on the heat dissipation effect.

[0036] As an optional implementation, the functional device is attached to the first surface; and / or,

[0037] The first surface is provided with a plurality of protrusions, and the plurality of protrusions protrude in a direction toward the inner cavity, and each protrusion is configured to be attached to a corresponding functional device.

[0038] In this way, the protrusions can be better adapted to functional devices of different shapes and different heights, so that the heat generated by the functional devices can be better conducted to the heat dissipation piece, thereby improving the heat dissipation capacity of the optical module.

[0039] Compared with the prior art, the application has the following beneficial effects:

[0040] This application provides an optical module. The optical module has an installation port on the housing, and a portion of a heat sink with a first surface is embedded in the installation port, so that the first surface closes the installation port and forms part of the inner surface of the housing. The first surface is thermally connected to the circuit board, so that the heat generated by the functional devices of the circuit board is conducted to the heat sink. Compared with the related technology of welding the entire heat sink to the surface of the housing by welding, the influence of the welding flux on heat conduction can be reduced. Moreover, the heat sink can directly receive the heat of the functional devices and then transfer the heat to the outside. The heat dissipation path can bypass the housing, and the heat dissipation is more direct and the heat dissipation effect is better. Attached Figure Description

[0041] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0042] Figure 1 This is a schematic diagram of the structure of the optical module disclosed in an embodiment of this application;

[0043] Figure 2 for Figure 1 Sectional view at point AA;

[0044] Figure 3 This is one of the structural schematic diagrams of the connection between the heat sink and the upper shell disclosed in the embodiments of this application;

[0045] Figure 4 This is an exploded view of the optical module disclosed in an embodiment of this application;

[0046] Figure 5 This is a schematic diagram of the structure of the heat sink disclosed in the embodiments of this application;

[0047] Figure 6 This is one of the structural schematic diagrams of the upper shell disclosed in the embodiments of this application;

[0048] Figure 7 This is a second schematic diagram of the connection between the heat sink and the upper shell disclosed in an embodiment of this application;

[0049] Figure 8 This is a cross-sectional view of the connection between the heat sink and the upper shell as disclosed in the embodiments of this application;

[0050] Figure 9 This is the second schematic diagram of the upper shell structure disclosed in the embodiments of this application.

[0051] Explanation of reference numerals in the attached figures:

[0052] 100, optical module; 10, housing; 10a, optical interface; 10b, electrical interface; 101, inner cavity; 102, outer surface; 102a, mounting port; 103, inner surface; 104, retaining rim; 105, accommodation space; 11, upper shell; 111, main body portion; 111a, first connecting hole; 1111, first sink; 1111a, first wide portion; 1111b, second wide portion; 1111c, narrow portion; 1112, clamping groove; 112, first end portion; 112a, inclined surface; 113, second end portion; 12, lower shell;

[0053] 20, heat dissipation member; 201, first surface; 202, second surface; 20a, heat dissipation channel; 21, first panel; 21a, second sink; 21b, clamping protrusion; 21c, protrusion; 21d, second connecting hole; 22, second panel; 23, partition plate; 30, circuit board; 31, functional device; 40, plug-in member; 50, pull ring;

[0054] Z, first direction; Y, second direction; X, third direction. DETAILED DESCRIPTION

[0055] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative labor fall within the scope of protection of the present application.

[0056] In the present application, the terms "upper", "lower", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings. These terms are mainly used to better describe the present application and its embodiments, and are not used to limit the indicated devices, elements or components to have a specific orientation, or to be constructed and operated in a specific orientation.

[0057] In addition, in addition to indicating the orientation or positional relationship, the above-mentioned part of the terms can also be used to indicate other meanings, for example, the term "upper" can also be used to indicate a certain dependent relationship or connection relationship in some cases. Those of ordinary skill in the art can understand the specific meaning of these terms in the present application according to the specific situation.

[0058] In addition, the terms "set", "provided with", and "connected" should be interpreted broadly. For example, it can be fixed connection, detachable connection, or integral structure; it can be mechanical connection, or electrical connection; it can be direct connection, or indirect connection through an intermediate medium, or internal communication between two devices, elements or components. Those skilled in the art can understand the specific meaning of the above terms in the present application according to the specific circumstances.

[0059] In addition, the terms "first", "second", and the like are mainly used to distinguish different devices, elements or components (the specific types and structures can be the same or different), and are not intended to indicate or imply the relative importance and quantity of the indicated devices, elements or components. Unless otherwise stated, the meaning of "multiple" is two or more.

[0060] The technical solutions of the present application will be further described below in conjunction with the embodiments and the drawings.

[0061] The embodiments of the present application disclose a kind of optical module 100, refer to Figure 1 One end of optical module 100 has optical interface 10a, optical interface 10a is fiber adapter, for connecting external optical fiber, realizes optical transmission between optical module 100 and remote optical communication host end through external optical fiber. Optical interface 10a can include optical transmitting end optical interface and optical receiving end optical interface. The other end of optical module 100 has electrical interface 10b, and electrical interface 10b is electrically connected with optical communication host.

[0062] Refer to Figures 1 to 4 The optical module 100 can include a housing 10, a heat sink 20, and a circuit board 30. The housing 10 has an inner cavity 101. The housing 10 includes an outer surface 102 and an inner surface 103 facing away from each other in a first direction Z. The housing 10 is provided with a mounting opening 102a penetrating through the outer surface 102 and the inner surface 103, and the mounting opening 102a is communicated with the inner cavity 101. The circuit board 30 is arranged in the inner cavity 101, and the circuit board 30 is provided with functional devices 31.

[0063] In some embodiments, the heat sink 20 includes a first surface 201, and the heat sink 20 has a portion of the first surface 201 embedded in the mounting opening 102a, so that the first surface 201 is mounted in the mounting opening 102a, and the first surface 201 constitutes a part of the inner surface 103. The first surface 201 is in thermal conductive connection with the circuit board 30, so that the heat generated by the functional devices 31 of the circuit board 30 is conducted to the heat sink 20.

[0064] It should be noted that the optical module 100 in the embodiments of the present application is approximately in the shape of a rectangular parallelepiped, the first direction Z can be the thickness direction of the housing 10, the second direction Y can be the length direction of the housing 10, and the third direction X can be the width direction of the housing 10.

[0065] The light module 100 in the embodiment of the present application, by opening a mounting port 102a on the shell 10, embedding at least part of the heat dissipation member 20 in the mounting port 102a, so that the first surface 201 of the heat dissipation member 20 forms part of the inner surface 103 of the shell 10, the first surface 201 is in thermal conductive connection with the circuit board 30, so that the heat generated by the functional device 31 of the circuit board 30 is conducted to the heat dissipation member 20, compared with the related art, the heat dissipation member 20 is welded on the surface of the shell 10 by welding, the influence of the welding agent on heat conduction can be weakened, and the heat dissipation member 20 can directly receive the heat of the functional device 31, and then transmit the heat to the outside, the heat dissipation path can avoid the shell 10, the heat dissipation is more direct, and the heat dissipation effect is better.

[0066] It can be understood that, as shown in Figure 3 The first surface 201 of the heat dissipation member 20 constitutes part of the inner surface 103 of the shell 10, that is, the first surface 201 of the heat dissipation member 20 can be close to or directly aligned with the inner surface 103. In this way, in the case that the functional device 31 on the circuit board 30 and the heat dissipation member 20 can be directly attached, the heat dissipation member 20 is not located in the inner cavity 101 of the shell 10, does not excessively occupy the internal space of the shell 10 to affect the arrangement of other components, and does not make the heat dissipation member 20 located outside the shell 10, thereby excessively increasing the overall thickness of the light module 100, thereby facilitating the miniaturization of the light module 100.

[0067] In addition, by embedding the heat dissipation member 20 in the shell 10 through the mounting port 102a, the structure design of the first surface 201 of the heat dissipation member 20 constituting the inner surface 103 of the shell 10 can also use the shell 10 as a standard part module, which can be matched with different heat dissipation members 20, thereby corresponding to the internal design required by different modules. Specifically, the structure design in the embodiment of the present application can avoid the shell 10 and directly transmit the heat generated by the functional device 31 to the heat dissipation member 20. When the light module 100 is applied to different products with different heat dissipation requirements, for example, higher thermal conductivity is required, under the conventional design, a shell 10 with higher thermal conductivity needs to be used, and through the design of the present application, the heat dissipation member 20 can be replaced with a material that meets the thermal conductivity requirement, without the need to redesign the entire shell 10.

[0068] In some possible implementations, the shell 10 includes an upper shell 11 and a lower shell 12, the upper shell 11 is connected to the lower shell 12 to form the inner cavity 101 therebetween. Referring to Figure 3 and Figure 4The upper shell 11 can include a main body portion 111, a first end portion 112, and a second end portion 113, the main body portion 111 being connected between the first end portion 112 and the second end portion 113, the main body portion 111 having an outer surface 102 and an inner surface 103, the mounting opening 102a extending along the length direction of the main body portion 111, and the mounting opening 102a extending from one end of the main body portion 111 to the other end. It can be understood that the mounting opening 102a is a long strip-shaped opening. By arranging the mounting opening 102a to extend from one end of the main body portion 111 to the other end, the mounting opening 102a can have a relatively large proportion with respect to the main body portion 111, so that the size of the mounting opening 102a is maximized. When the heat dissipation member 20 is embedded in the mounting opening 102a, a larger size needs to be matched, i.e., the heat dissipation member 20 is also a long strip-shaped heat dissipation member, and the overall length is matched with the length of the mounting opening, so that the heat dissipation member 20 has a larger heat dissipation area, thereby improving the heat dissipation effect of the heat dissipation member 20.

[0069] Optionally, the heat dissipation member 20 can be made of a metal or alloy with good heat conductivity, such as copper, aluminum, aluminum-magnesium alloy, etc. In addition, the functional device 31 can include electronic components, chips, etc., such as a controller, a signal processor, a driver, a laser array, a photodetector array, etc.

[0070] Specifically, the first end portion 112 of the upper shell 11 and part of the lower shell 12 jointly constitute the optical interface 10a, the second end portion 113 of the upper shell 11 and the part of the lower shell 12 extending out of the circuit board 30 serve as the electrical interface 10b, and the gold fingers are arranged on the extending part of the circuit board 30.

[0071] The optical module 100 can further include an optical system, a laser (not shown), a plug-in connector 40, a pull ring 50, etc. The laser is electrically connected to the circuit board 30, and the optical system can be located between the laser and the optical interface 10a. The plug-in connector 40 can be arranged between the first end portion 112 of the upper shell 11 and the lower shell 12, and is used for connecting an optical fiber. The pull ring 50 is slidably connected to the two sides of the shell 10, and is used for unlocking the optical module 100, so that the optical module 100 can be smoothly pulled out of the mounting cage of an external device.

[0072] It should be noted that the first surface 201 of the heat dissipation member 20 is in thermal conductive connection with the circuit board 30, which can mean that the circuit board 30 is directly connected to the first surface 201 of the heat dissipation member 20, or the circuit board 30 is indirectly connected to the first surface 201 of the heat dissipation member 20, or part of the circuit board 30 is directly connected to the first surface 201, and part of the circuit board 30 is indirectly connected to the first surface 201. The above cases will be illustrated below.

[0073] In some embodiments, the circuit board 30 can be directly connected to the first surface 201 of the heat sink 20, and the functional devices 31 can be arranged on the side of the circuit board 30 facing the first surface 201, and the functional devices 31 are in direct thermal contact with the first surface 201. Alternatively, the functional devices 31 can be arranged in abutment with the first surface 201, and / or the first surface 201 can be provided with a plurality of protrusions 21c protruding in the direction of the inner cavity 101, and each of the protrusions 21c is configured to be arranged in abutment with a corresponding functional device 31.

[0074] In an example, the functional devices 31 can be arranged in abutment with the first surface 201, so that the heat generated by the functional devices 31 is directly transferred to the heat sink 20 and dissipated through the heat sink 20.

[0075] It can be understood that the functional devices 31 on the circuit board 30 can have different shapes or sizes, for example, some functional devices 31 have a small thickness, some functional devices 31 have a large thickness, and some functional devices 31 have a large length, and some functional devices 31 have a small length. In order to better conduct heat, in another example, the first surface 201 can be provided with a plurality of protrusions 21c protruding into the inner cavity 101, and each of the protrusions 21c is configured to be arranged in abutment with a corresponding functional device 31. In this way, the protrusions 21c can be better adapted to functional devices 31 of different shapes and different heights, so that the heat generated by the functional devices 31 is better conducted to the heat sink 20, thereby improving the heat dissipation capacity of the optical module 100.

[0076] In another example, the first surface 201 can be provided with a plurality of protrusions 21c protruding into the inner cavity 101, and each of the protrusions 21c is configured to be arranged in abutment with a corresponding part of the functional devices 31, and another part of the functional devices can be arranged in abutment with the first surface. In this way, by arranging the protrusions, the functional devices with height requirements can be better adapted, and at the same time, the first surface can be in direct thermal contact with another part of the functional devices, so that the heat transfer path is shorter, which is more conducive to improving the heat dissipation effect of the optical module.

[0077] Of course, in some other embodiments, the circuit board 30 can be directly connected to the first surface 201 of the heat sink 20, but at this time, the functional devices 31 can be arranged on the side of the circuit board 30 away from the first surface 201, and the first surface 201 is in thermal contact with the side of the circuit board 30 where the functional devices 31 are not arranged, and at this time, the heat generated by the functional devices 31 can be transferred to the heat sink 20 through the circuit board 30.

[0078] In some other embodiments, the circuit board 30 can also be indirectly connected with the first surface 201 of the heat dissipation member 20, for example, a heat conducting member (not shown) is arranged between the first surface 201 and the circuit board 30, that is, the heat conducting member is arranged between the first surface 201 and the circuit board 30 for conducting the heat generated by the functional device 31 on the circuit board 30 to the heat dissipation member 20, and then the heat dissipation member 20 dissipates the heat, so that a heat transfer path is formed between the functional device 31, the circuit board 30, the heat conducting member and the heat dissipation member 20, and the heat of the functional device 31 is quickly spread to the entire heat dissipation member 20 through the heat conducting member, thereby improving the heat dissipation performance of the optical module 100.

[0079] Optionally, the heat conducting member can be made of, but is not limited to, copper, silver and other materials with good heat conduction performance.

[0080] In some embodiments, the circuit board 30 can be directly connected with part of the first surface 201 and indirectly connected with another part of the first surface 201, so that the heat can be quickly transferred to the heat dissipation member 20, thereby improving the heat dissipation efficiency of the optical module 100.

[0081] In some possible embodiments, the heat dissipation member 20 includes a first panel 21, a second panel 22 and a plurality of partition plates 23, the first panel 21 and the second panel 22 are arranged in a spaced manner along a first direction Z, and the plurality of partition plates 23 are connected between the first panel 21 and the second panel 22, and a heat dissipation channel 20a is formed between adjacent two partition plates 23, the first panel 21 has a first surface 201, and at least part of the first panel 21 is embedded in the mounting port 102a. Wherein, the first panel 21, the second panel 22 and the plurality of partition plates 23 can be integrally formed. By adopting the design that the plurality of partition plates 23 are connected in a spaced manner between the first panel 21 and the second panel 22 to form the heat dissipation channel 20a between adjacent partition plates 23, the heat dissipation channel 20a is a gas flow channel, the heat dissipation channel 20a can be used to guide the gas flow to pass through to take away the heat, and the heat dissipation area of the heat dissipation member 20 and the air flow rate passing through the heat dissipation member 20 can be increased, so that the heat generated by the functional device 31 is transferred to the heat dissipation member 20, and the convection effect with the surrounding air is enhanced, thereby improving the heat dissipation effect.

[0082] Optionally, the shapes of the first panel 21 and the second panel 22 can be cuboid or square, and the shapes of the first panel 21 and the second panel 22 are matched with each other, so that the first panel 21 and the second panel 22 can be placed in parallel with each other, thereby enabling the plurality of partition plates 23 to be connected between the first panel 21 and the second panel 22. Preferably, the plurality of heat dissipation channels 20a can be uniformly distributed, so that the gas flow entering and exiting the heat dissipation channels 20a is uniformly distributed, which is more conducive to the rapid entry and exit of the gas flow into and out of the heat dissipation channels 20a, so that the heat inside the gas flow channel can be quickly discharged, thereby improving the heat dissipation efficiency of the heat dissipation member 20.

[0083] To facilitate the installation of the heat dissipation member 20, in some possible implementation manners, referring to Figures 5 to 8 The edge of the outer surface 102 is provided with two side edges 104 arranged opposite along the third direction X, the two side edges 104 are arranged along the second direction Y, and the accommodation space 105 connected to the installation opening 102a is formed between the two side edges 104, the opening area of the accommodation space 105 in the first direction Z is greater than the area of the installation opening 102a, the first panel 21 is embedded in the installation opening 102a, the partition plate 23 and the second panel 22 are located in the accommodation space 105, and the second panel 22 covers the opening of the accommodation space 105 in the first direction Z. Wherein, the two side edges 104 can be integrally formed with the upper shell 11. By arranging the side edges 104 on both sides of the upper shell 11 to form the accommodation space 105 connected to the installation opening 102a, the heat dissipation member 20 can be installed in the accommodation space 105. Specifically, by embedding the first panel 21 in the installation opening 102a, locating the partition plate 23 and the second panel 22 in the accommodation space 105, the heat dissipation channel 20a can be located outside the installation opening 102a without being blocked, so as not to affect the airflow passing through, and the opening of the accommodation space 105 in the first direction Z can be blocked by the second panel 22, so that the top surface of the upper shell 11 appears to be a complete or substantially complete plane from the visual perspective, and the heat dissipation member 20 is entirely installed in the inside of the shell 10, without the visual effect that the heat dissipation member 20 protrudes out of the upper shell 11, which is more conducive to presenting the integrated effect of the optical module 100.

[0084] In some possible implementation manners, the heat dissipation channel 20a can be arranged along the second direction Y, the first end portion 112 is configured to be connected to the optical fiber, the end of the first end portion 112 connected to the main body portion 111 has an inclined surface 112a, the inclined surface 112a is connected to the outer surface 102, and the inclined surface 112a is inclined from the main body portion 111 to the first end portion 112, so that the included angle between the inclined surface 112a and the outer surface 102 is obtuse. By arranging the heat dissipation channel 20a along the second direction Y, that is, in the same direction as the first end portion 112 towards the second end portion 113, and arranging the inclined surface 112a on the first end portion 112 which is inclined from the main body portion 111 to the first end portion 112, the airflow passing through the heat dissipation channel 20a can flow along the inclined surface 112a, so that the heat is more dispersed to the external environment, and the overall heat dissipation effect of the optical module 100 is better.

[0085] It can be understood that, since the first end portion 112 is configured to be connected with the optical fiber, a plug-in part 40 is generally required to be arranged between the first end portion 112 and the lower shell 12, and if the inclined surface 112a is not designed, the first end portion 112 needs to be continuously arranged along the outer surface 102 of the main body portion 111, which will make the plug-in part 40 occupy a larger space in the inner cavity 101, thereby excessively increasing the thickness of the shell 10, and through the design of the inclined surface 112a, the top surface of the first end portion 112 is higher than the outer surface 102 of the main body portion 111, which expands the space for arranging the plug-in part 40, and is more conducive to the lightness and thinness of the optical module 100. Specifically, the top surface of the first end portion 112 can be substantially aligned with the top surface of the retaining edge 104, so that the overall optical module 100 is more regular.

[0086] It should be noted that, since the above-mentioned accommodating space 105 is formed by the relative arrangement of the retaining edges 104 extending along the second direction Y (the length direction of the shell 10) on both sides of the upper shell 11, the accommodating space 105 not only has an opening along the first direction Z, but also has openings on both sides along the second direction Y, and the openings on both sides along the second direction Y can be the air inlet and the air outlet respectively, the opening close to the second end portion 113 side can be the air inlet, and the airflow can enter therefrom, and the opening close to the second end portion 113 side can be the air outlet, and the airflow can be discharged therefrom, and the airflow further carrying heat can flow along the inclined surface 112a to the external environment.

[0087] In the embodiment of the present application, the heat generated by the functional device 31 can be directly transmitted to the first panel 21, and since the first panel 21 is embedded in the opening, a part of the heat continues to be transmitted to the second panel 22 through the partition plate 23, and finally diffuses to the external environment, and in this process, the airflow flowing through the heat dissipation channel 20a can carry away a part of the heat, and finally flows to the external environment along the inclined surface 112a of the first end portion 112, and a part of the heat can be discharged to the external environment through the shell 10, so that the optical module 100 of the present application can realize faster heat conduction, which is conducive to improving the heat dissipation efficiency and effectively improving the heat dissipation effect.

[0088] Since the heat dissipation member 20 is installed in the opening along the first direction Z, the position of the heat dissipation member 20 limited by the upper shell 11 is located in the second direction Y and the third direction X, in order to improve the reliability of the connection of the heat dissipation member 20, in some possible embodiments, continuing to refer to Figure 6The first sunken platform 1111 is arranged on the outer surface 102 of the upper shell 11. The second sunken platform 21a is arranged on the first surface 201 of the heat dissipation member 20 and is in abutment with the first sunken platform 1111. The first sunken platform 1111 is arranged on the outer surface 102 of the upper shell 11, and the second sunken platform 21a is arranged on the first surface 201 of the heat dissipation member 20 and is in abutment with the first sunken platform 1111. The first sunken platform 1111 can provide the heat dissipation member 20 with a bearing force from the first direction Z, and the heat dissipation member 20 can be supported by the upper shell 11, thereby improving the reliability of the heat dissipation member 20.

[0089] It can be understood that, when the heat dissipation member 20 conducts heat, the part of the heat dissipation member 20 embedded in the opening is not in contact with the outer surface 102 of the shell 10. The heat generated by the functional device 31 can be directly transmitted to the entire heat dissipation member 20 through the first surface 201 for heat dissipation. Since the second sunken platform 21a is in abutment with the first sunken platform 1111 of the upper shell 11 and is adapted to the first sunken platform 1111, that is, the heat is transmitted through the upper shell 11, which affects the heat dissipation effect. The larger the size of the first sunken platform 1111, the larger the contact area between the first sunken platform 1111 and the heat dissipation member 20, and the greater the influence on the heat dissipation effect of the heat dissipation member 20.

[0090] Based on the above, in order to weaken the influence of the contact area between the upper shell 11 and the heat dissipation member 20 on heat dissipation, in some possible embodiments, referring to Figure 9 The first sunken platform 1111 can include a first wide edge portion 1111a, a second wide edge portion 1111b, and a narrow edge portion 1111c. The first wide edge portion 1111a is located at one end of the length direction of the mounting opening 102a, and the two ends of the first wide edge portion 1111a extend to the middle of the mounting opening 102a along the second direction Y. The second wide edge portion 1111b is located at the other end of the length direction of the mounting opening 102a. The narrow edge portion 1111c is connected between the first wide edge portion 1111a and the second wide edge portion 1111b. The first sunken platform 1111 is segmented and arranged in different sizes. The heat dissipation member 20 can be provided with sufficient bearing force, and the contact area between the heat dissipation member 20 and the upper shell 11 is not too large, so that the heat dissipation member 20 has a larger heat dissipation area that is not in contact with the upper shell 11 and participates in the heat transmission process, thereby improving the heat dissipation effect.

[0091] Specifically, the first wide edge portion 1111a and the second wide edge portion 1111b are formed on both sides in the length direction of the mounting opening 102a, so that the heat dissipation member 20 has more reliable bearing force in the length direction, and the first wide edge portion 1111a is extended to both sides in the opening width direction, and the narrow edge portion 1111c is connected between the first wide edge portion 1111a and the second wide edge portion 1111b, which reduces the contact area between the heat dissipation member 20 and the upper shell 11 while ensuring the bearing effect of the heat dissipation member 20, and improves the heat dissipation effect.

[0092] It can be understood that the first wide edge portion 1111a and the narrow edge portion 1111c are different in size, that is, the distance between the first wide edge portion 1111a on both sides in the width direction of the mounting opening 102a is smaller than the distance between the narrow edge portion 1111c on both sides, and a resisting surface can be formed at the connection between the first wide edge portion 1111a and the narrow edge portion 1111c, which can provide the heat dissipation member 20 with bearing force in the second direction Y (the length direction of the mounting opening 102a) and provide the heat dissipation member 20 with a certain abutting effect.

[0093] The heat dissipation member 20 can be connected to the shell 10 in various ways. In one example, the surface of the first sink 1111 and / or the second sink 21a is provided with an adhesive, and the heat dissipation member 20 is connected to the shell 10 by the adhesive. By using the adhesive, the connection between the heat dissipation member 20 and the shell 10 can be achieved, and the gap between the heat dissipation member 20 and the shell 10 can be effectively filled, ensuring smooth heat transfer and thus improving the heat dissipation effect.

[0094] Optionally, the adhesive can be an epoxy resin heat-conducting glue, a polyurethane heat-conducting glue, or an acrylic structural glue, etc., which has good adhesive properties and can also effectively conduct heat.

[0095] In another example, the surface of the first sink 1111 and / or the second sink 21a is provided with a welding agent, and the heat dissipation member 20 is connected to the shell 10 by the welding agent. By using welding, a more stable connection between the heat dissipation member 20 and the shell 10 can be achieved, and by laying the welding agent only on the sink, the influence of the welding material on heat dissipation can be reduced.

[0096] In another example, the first sink 1111 is provided with a first connecting hole 111a, and the second sink 21a is provided with a second connecting hole 21d, and the heat dissipation member 20 is connected to the shell 10 by a fastener passing through the first connecting hole 111a and the second connecting hole 21d. By using the fastener connection, the mechanical connection between the heat dissipation member 20 and the shell 10 can be effectively ensured, and the heat dissipation member 20 can be easily disassembled, improving the convenience of disassembling the heat dissipation member 20.

[0097] Optionally, the fastener can be a screw, a bolt, or the like.

[0098] It can be understood that the above different connection modes can be applied alone, can be combined in pairs, or can be applied in three connection modes. Preferably, the connection of the heat dissipation piece 20 and the shell 10 can be realized by any one of bonding or welding, in combination with the fastener connection mode. The bonding agent or the welding agent is distributed on the first sink 1111, and then the second sink 21a of the heat dissipation piece 20 is connected thereto, and finally fastening is performed by the fastener. The stable connection between the heat dissipation piece 20 and the shell 10 can be effectively guaranteed, and the influence of the bonding agent or the welding agent on the heat dissipation effect can be reduced.

[0099] In some embodiments, the outer surface 102 has a clamping groove 1112, the clamping groove 1112 penetrates the first wide edge part 1111a in the third direction X, and the clamping groove 1112 is arranged close to the connection between the first wide edge part 1111a and the narrow edge part 1111c. The heat dissipation piece 20 is provided with a clamping protrusion 21b, and the clamping protrusion 21b is clamped and connected with the clamping groove 1112. The part of the first wide edge part 1111a corresponding to the clamping groove 1112 is provided with a first connecting hole 111a, and the second sink 21a is provided with a second connecting hole 21d. The heat dissipation piece 20 is connected to the shell 10 by the fastener penetrating the first connecting hole 111a and the second connecting hole 21d.

[0100] Since the heat dissipation piece 20 has a heat dissipation channel 20a inside, and the first surface 201 of the heat dissipation piece 20 needs to be attached to the functional device 31, the layout of the functional device 31 is different according to different requirements. When a connecting hole needs to be arranged on the heat dissipation piece 20 for fastener connection, the space of the heat dissipation channel 20a, the heat dissipation piece 20, and the upper shell 11 needs to be considered. Therefore, the clamping groove 1112 penetrating the first sink 1111 is arranged on the outer surface 102 to cooperate with the clamping protrusion 21b on the heat dissipation piece 20, which can improve the limiting effect of the shell 10 on the heat dissipation piece 20, improve the connection stability of the heat dissipation piece 20, and arrange the first connecting hole 111a on the first sink 1111 corresponding to the clamping groove 1112 to correspond to the second connecting hole 21d on the heat dissipation piece 20 for the fastener to penetrate. The second connecting hole 21d can use the space on the clamping protrusion 21b, so that the second connecting hole 21d is not limited to the available space on the heat dissipation piece 20, thereby satisfying the fastener penetrating the first connecting hole 111a and the second connecting hole 21d to realize the connection of the heat dissipation piece 20 and the shell 10.

[0101] The optical module disclosed in the embodiments of the present application is described in detail above, and specific examples are applied to describe the principles and implementation modes of the present application. The above embodiment is only used to help understand the optical module and the core idea thereof; meanwhile, for those skilled in the art, the specific implementation mode and application range can be changed according to the idea of the present application. In summary, the content of the specification should not be understood as a limitation of the present application.

Claims

1. An optical module characterized by comprising: The application relates to a shell, a circuit board and a heat dissipation member. The shell has an inner cavity, and comprises an outer surface and an inner surface facing away from each other in a first direction. The shell is provided with a mounting opening penetrating through the inner surface and the outer surface, and the mounting opening is communicated with the inner cavity. The circuit board is arranged in the inner cavity and is provided with functional devices. The heat dissipation member comprises a first surface, and a part of the first surface is embedded in the mounting opening so that the first surface closes the mounting opening and forms part of the inner surface. The outer surface is provided with a first sunken platform surrounding the mounting opening. The first surface is provided with a second sunken platform matched with the first sunken platform, and the second sunken platform abuts against the first sunken platform.

2. The optical module according to claim 1, characterized by The first direction is the thickness direction of the shell. The shell comprises an upper shell and a lower shell, and the upper shell is connected to the lower shell to form the inner cavity therebetween.

3. The optical module according to claim 2, characterized by The upper shell comprises a main body, a first end portion and a second end portion.

4. The optical module according to claim 3, characterized by The main body is connected between the first end portion and the second end portion, and has the outer surface and the inner surface. The mounting opening extends along the length direction of the main body and extends from one end of the main body to the other end.

5. The optical module according to claim 3, characterized by The heat dissipation member comprises a first panel, a second panel and a plurality of partitions. The first panel and the second panel are arranged in the first direction. The plurality of partitions are connected between the first panel and the second panel. The first panel has the first surface, and at least a part of the first panel is embedded in the mounting opening. The edge of the outer surface is provided with two opposite stop edges in a third direction. The two stop edges extend in a second direction. The accommodating space is formed between the two stop edges and is communicated with the mounting opening. The opening area of the accommodating space in the first direction is larger than the area of the mounting opening. The first panel is embedded in the mounting opening. The partitions and the second panel are located in the accommodating space, and the second panel covers the opening of the accommodating space in the first direction. The second direction is the length direction of the shell, and the third direction is the width direction of the shell. The heat dissipation channels extend in the second direction. The first end portion is configured to connect an optical fiber. The end of the first end portion connected to the main body has an inclined surface connected to the outer surface. The angle between the inclined surface and the outer surface is an obtuse angle. The second direction is the length direction of the shell.

6. The optical module of claim 1, wherein, The first sink includes a first wide edge portion, a second wide edge portion, and a narrow edge portion, the first wide edge portion is located at one end of the length direction of the mounting port, and both ends of the first wide edge portion extend to the middle of the mounting port along a second direction, the second wide edge portion is located at the other end of the length direction of the mounting port, and the narrow edge portion is connected between the first wide edge portion and the second wide edge portion. The second direction is the length direction of the shell.

7. The optical module according to claim 6, characterized by The outer surface has a clamping groove, the clamping groove penetrates through the first wide edge portion along a third direction, and the clamping groove is arranged close to the connection between the first wide edge portion and the narrow edge portion, the heat dissipation piece is provided with a clamping protrusion, and the clamping protrusion is clamped and connected with the clamping groove. The first wide edge portion is provided with a first connecting hole corresponding to the part of the clamping groove, the second sink is provided with a second connecting hole, and the heat dissipation piece is connected to the shell by a fastener penetrating through the first connecting hole and the second connecting hole. The third direction is the width direction of the shell.

8. The optical module of claim 1, wherein, The surface of the first sink and / or the second sink is provided with an adhesive, and the heat dissipation piece is connected to the shell by the adhesive; and / or, The surface of the first sink and / or the second sink is provided with a welding agent, and the heat dissipation piece is connected to the shell by the welding agent; and / or, The first sink is provided with a first connecting hole, the second sink is provided with a second connecting hole, and the heat dissipation piece is connected to the shell by a fastener penetrating through the first connecting hole and the second connecting hole.

9. The optical module according to any one of claims 1 to 5, characterized by, The functional device is arranged in close contact with the first surface; and / or, The first surface is provided with a plurality of protrusions, and the plurality of protrusions protrude in the direction towards the inner cavity, and each protrusion is arranged in close contact with the corresponding functional device.

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