Notebook computer with multi-mode cooling system
By using a heat dissipation component consisting of heat pipes, fans, and graphite sheets, combined with a microcontroller and temperature sensor array, the fan speed is dynamically adjusted, solving the problems of insufficient heat dissipation and noise in traditional laptops, and achieving a highly efficient and stable heat dissipation effect.
Patent Information
- Application Number
- CN202520465132.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-17
- Publication Date
- 2026-02-06
- Estimated Expiration
- 2035-03-17
AI Technical Summary
Traditional laptop cooling designs are inefficient under high loads or prolonged use, leading to overheating, and the fixed fan speed causes power consumption and noise problems.
A heat dissipation component consisting of heat pipes, fans, and graphite sheets, combined with a microcontroller and temperature sensor array, dynamically adjusts the fan speed to form a multi-mode heat dissipation system.
It achieves efficient heat dissipation and air circulation, reduces power consumption and noise, and ensures stable operation of the laptop under high load.
Smart Images
Figure CN223883955U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model belongs to notebook computer heat dissipation technical field, especially, relate to a notebook computer with multi -mode heat dissipation system. BACKGROUND
[0002] The heat dissipation design of notebook computer is one of the key factors to ensure its stable operation and performance. The traditional notebook computer usually relies on a single fan and metal heat sink to dissipate heat, which is acceptable for low load operation, but in the case of high load or long time use, the heat dissipation effect is often insufficient, which is easy to cause overheating phenomenon, and the heat is mainly discharged through the top or side exhaust, which limits the air flow efficiency and may cause local temperature too high, especially in compact notebook computer; Most of the traditional notebook computers adopt fixed fan speed setting, which cannot be dynamically adjusted according to the actual load, resulting in either insufficient heat dissipation or excessive power consumption and unnecessary noise.
[0003] Therefore, we provide a notebook computer with multi-mode heat dissipation system to solve the above problems. INVENTION CONTENTS
[0004] To solve the above technical problems, the utility model is realized by the following technical schemes:
[0005] The utility model relates to a notebook computer with multi-mode heat dissipation system, including main body shell, the built-in processor of main body shell, the processor is equipped with heat dissipation component, the heat dissipation component includes heat pipe and fan, one end of heat pipe is attached to the processor through the heat conduction silicone grease layer, and the other end extends to the bottom of main body shell, heat pipe and fan are arranged adjacent to each other, the fan is provided with control module, the control module includes microcontroller and temperature sensor array, and the temperature sensor array is distributed in the key heating area.
[0006] The utility model is further provided with a display screen in cooperation with the main body shell, and a heat dissipation groove is arranged at the bottom of the main body shell.
[0007] The utility model is further provided with a temperature control switch connected to the microcontroller, and the temperature control switch is connected in series in the power supply circuit of the fan.
[0008] The utility model is further provided with a temperature sensor array connected to the microcontroller, and the microcontroller is connected to the processor.
[0009] The utility model is further provided with a graphite sheet arranged in contact with the heat pipe, and the graphite sheet is attached to the surface of the key heating component.
[0010] The heat dissipation groove and the fan form an air cooling heat dissipation channel.
[0011] The utility model has the following beneficial effects:
[0012] 1、The utility model discloses a heat pipe, a fan and a graphite sheet are combined, can more effectively export the heat generated by the processor rapidly, and the heat pipe utilizes the phase change mechanism to conduct heat rapidly, and the fan ensures the continuous air circulation to help heat dissipation, and the application of graphite sheet further enhances the heat diffusion capacity of the key heating area.
[0013] 2、The utility model discloses a microcontroller is set up according to the real -time temperature data of temperature sensor array and dynamically adjusts the fan rotation speed, which means that the fan only works when needed, thereby reducing unnecessary power consumption and reducing noise level.
[0014] Of course, any product implementing the utility model does not necessarily need to achieve all the advantages described above. DRAWINGS
[0015] In order to more clearly illustrate the technical scheme of the embodiments of the utility model, the following will be needed to introduce the drawings used in the embodiment briefly, and obviously, the drawings in the following description are only some embodiments of the utility model, and for those skilled in the art, other drawings can also be obtained according to these drawings without creating labor.
[0016] Figure 1 It is the whole structure schematic diagram of the utility model.
[0017] Figure 2 It is the main body shell bottom schematic diagram in the utility model.
[0018] Figure 3 It is the main body shell internal element distribution schematic diagram in the utility model.
[0019] Figure 4 It is the control module principle block diagram in the utility model.
[0020] In the drawings, the component list represented by each sign is as follows:
[0021] 100, main body shell, 101, processor, 102, heat dissipation assembly, 102a, heat pipe, 102b, fan, 102c, heat-conducting silicone grease layer, 102d, graphite sheet, 103, control module, 103a, microcontroller, 103b, temperature sensor array, 104, heat dissipation groove, 200, display screen. CONCRETE IMPLEMENTATION
[0022] With reference to the drawings of the embodiments of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described, obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.
[0023] Embodiment
[0024] Please refer to Figures 1-4 The utility model discloses a notebook computer with multi-mode heat dissipation system, including main body shell 100, built -in processor 101 in main body shell 100, its processor 101 is equipped with heat dissipation component 102, heat dissipation component 102 includes heat pipe 102a and fan 102b, heat pipe 102a one end is adhered processor 101 through heat conduction silicon grease layer 102c, and its other end extends to main body shell 100 bottom, heat pipe 102a and fan 102b are arranged adjacently, fan 102b is equipped with control module 103, control module 103 includes microcontroller 103a and temperature sensor array 103b, and temperature sensor array 103b is distributed in the key heating area.
[0025] Specifically, the microcontroller 103a is connected with a temperature control switch, the temperature control switch is connected in series in the power supply circuit of the fan 102b, the temperature sensor array 103b is connected with the microcontroller 103a, the microcontroller 103a is connected with the processor 101, the heat pipe 102a is provided with a graphite sheet 102d, and the graphite sheet 102d is attached to the surface of the key heating component.
[0026] Further, the main body shell 100 is provided with a display screen 200, and the main body shell 100 is provided with a heat dissipation groove 104 at the bottom, and the heat dissipation groove 104 and the fan 102b form an air-cooled heat dissipation channel.
[0027] The technical scheme provides a notebook computer with a multi-mode heat dissipation system, which aims to improve the heat dissipation efficiency and flexibility to ensure that the notebook computer can still maintain stable performance when working under high load, and further description of the structure is as follows:
[0028] The main body shell 100 serves as a shell to protect internal electronic components, and the built-in processor 101 is the core computing unit of the notebook computer, which is usually one of the largest heat sources.
[0029] The heat pipe 102a in the heat dissipation assembly 102 is a highly efficient heat conduction device that contains a liquid working medium inside. When heated at one end, the liquid evaporates into gas and moves along the pipe wall to the other cooling end, where it condenses back into liquid and releases heat before returning to the starting point, forming a continuous cycle. This phase change mechanism enables the heat pipe 102a to quickly and effectively transfer heat from the heat source; the thermal conductive silicone grease layer 102c is located between the heat pipe 102a and the processor 101, which provides a good thermal interface material to ensure close contact between the two and reduce thermal resistance, improving heat conduction efficiency; the fan 102b is used for forced convection to accelerate the exchange of external environment air and internal hot air. The fan 102b is located near the end of the heat pipe 102a to directly carry away the heat conducted by the heat pipe 102a; the graphite sheet 102d serves as an auxiliary heat dissipation means. The graphite sheet 102d has high thermal conductivity and light and thin characteristics, which can be attached to the surface of the key heat generating components to help evenly distribute heat and avoid local overheating.
[0030] The microcontroller 103a in the control module 103 is responsible for collecting temperature information and making decisions based on it, adjusting fan 102b speed and other parameters. The temperature sensor array 103b consists of multiple temperature sensors distributed in different key locations (such as near the CPU and GPU) to obtain comprehensive and accurate temperature distribution.
[0031] In addition, the heat dissipation grooves 104 are part of the bottom of the main body shell 100, designed to enhance the natural convection effect and form an effective air cooling channel with the fan 102b. When the fan 102b is working, cool air from the outside will enter the body through these grooves, while hot air will be expelled, maintaining a stable internal temperature.
[0032] Working principle
[0033] One end of the heat pipe 102a is tightly attached to the processor 101 through the thermal conductive silicone grease layer 102c to reduce the contact thermal resistance between the two. When the processor 101 works and generates heat, the heat is quickly transferred to the heat pipe 102a. The working liquid inside the heat pipe 102a evaporates into gas when heated and moves along the pipe wall to the other end with lower temperature, where it condenses back into liquid and releases heat, then returns to the starting point by capillary action or gravity, forming a continuous cycle.
[0034] The fan 102b is installed near the end of the heat pipe 102a. When the fan operates, it can forcibly introduce cool air from the outside into the notebook computer, while quickly carrying away the heat conducted by the heat pipe 102a, accelerating the heat exchange process and improving the heat dissipation efficiency.
[0035] The temperature sensor array 103b is distributed in the key heat generating areas (such as CPU, GPU, etc.), which monitors the temperature changes of these positions in real time and sends the data to the microcontroller 103a, which adjusts the rotating speed of the fan 102b according to the received temperature information to adapt to different heat dissipation requirements. If the temperature rises above the set threshold, the microcontroller 103a will increase the fan speed to enhance heat dissipation; on the contrary, if the temperature drops, the fan speed can be reduced to save power and reduce noise.
[0036] The graphite sheet 102d is attached to the surface of the key heat generating components, which helps to evenly disperse heat by its high thermal conductivity, preventing the occurrence of local overheating. The heat dissipation grooves 104 at the bottom of the main shell 100 enhance the effect of natural convection, and the air cooling channel formed by the fan 102b ensures the effective circulation of internal and external air, maintaining the stability of the internal environment temperature.
[0037] In summary, the multi-mode heat dissipation system combines efficient heat conduction, forced convection and intelligent control to effectively manage the heat inside the notebook computer, ensuring the performance stability and reliability of the device under various workloads.
[0038] In the description of the present specification, the description of the terms "one embodiment", "example", "specific example" and the like means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In the present specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.
[0039] The preferred embodiments of the above disclosed application are only used to help explain the application. The preferred embodiments do not describe all the details, nor limit the application to the specific embodiments described. Obviously, according to the content of the present specification, many modifications and changes can be made. The present specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the application, so that those skilled in the art can well understand and utilize the application. The application is limited by the claims and their entire scope and equivalents.
Claims
1. A notebook computer having a multi-mode heat dissipation system, comprising a main body case (100), characterized in that: The main body shell (100) is built-in processor (101), its processor (101) is equipped with heat dissipation components (102), the heat dissipation components (102) include heat pipe (102a) and fan (102b), the heat pipe (102a) one end is adhered to the processor (101) through the heat-conducting silicone grease layer (102c), the other end extends to the bottom of main body shell (100), the heat pipe (102a) and fan (102b) are adjacent arrangement, the fan (102b) is equipped with control module (103), the control module (103) includes microcontroller (103a) and temperature sensor array (103b), and the temperature sensor array (103b) is distributed in the key heating area.
2. The notebook computer having a multi-mode heat dissipation system according to claim 1, wherein, The main body shell (100) is matched with display screen (200), and the bottom of main body shell (100) is provided with heat dissipation groove (104).
3. The notebook computer having a multi-mode heat dissipation system according to claim 1, wherein, The microcontroller (103a) is connected with temperature control switch, and the temperature control switch is connected in series in the power supply circuit of fan (102b).
4. The notebook computer having a multi-mode heat dissipation system of claim 1, wherein, The temperature sensor array (103b) is connected with microcontroller (103a), and the microcontroller (103a) is connected with processor (101).
5. The notebook computer having a multi-mode heat dissipation system of claim 1, wherein, The heat pipe (102a) is in contact with graphite sheet (102d), and the graphite sheet (102d) is attached to the surface of the key heating component.
6. The notebook computer having a multi-mode heat dissipation system according to claim 2, wherein, The heat dissipation groove (104) and fan (102b) form air-cooled heat dissipation channel.