Operation server convenient for heat dissipation
By combining multi-directional heat dissipation design with a cooling system, the problems of localized overheating and dust accumulation in computing servers have been solved, achieving efficient heat dissipation and simplified maintenance, thereby improving server stability and operational efficiency.
Patent Information
- Application Number
- CN202520481757.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-19
- Publication Date
- 2026-02-06
- Estimated Expiration
- 2035-03-19
AI Technical Summary
Existing computing servers suffer from heat dissipation difficulties due to localized overheating and dust accumulation during high-load operations, and traditional filters are cumbersome to maintain.
It adopts a multi-directional heat dissipation design, including horizontally arranged cooling fans, nano dustproof heat dissipation cloth and cooling box, combined with thermal grease and heat pipes to build an efficient air convection channel, and actively cools through a cooling cycle system, while using nano dustproof heat dissipation cloth to prevent dust from entering.
This achieves a uniform reduction in the internal temperature of the server, avoids localized overheating, improves heat dissipation efficiency, simplifies maintenance, and enhances operational efficiency.
Smart Images
Figure CN223883962U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to server technical field, concretely is a kind of operation server of convenient heat dissipation. BACKGROUND
[0002] Server refers to a computer software that manages resources and provides services for users, usually divided into file server, database server and application server, computer running above software, or called network host.
[0003] The inventor found that the prior art has the following problems in the process of realizing the utility model: 1, the internal components of operation server will generate a large amount of heat when high load operation, due to the complex internal structure of server, air flow channel design is unreasonable, for example, in some high-density servers, multiple high-performance computing chips are closely arranged, if the combination of heat sink and fan cannot effectively take away heat, local overheating will occur; 2, the dust accumulated on the filter screen will be more and more, resulting in reduced air intake, affecting the heat dissipation inside the server, for example, the dust accumulation of filter screen not cleaned for a month will reduce the air intake by 30%-50%, in turn, the internal temperature of server is increased, and the cleaning and replacement of filter screen need manual operation, the filter screen is fixed by screw, and the number of servers is more, which will be a tedious work. CONTENT OF UTILITY MODEL
[0004] The utility model aims at providing a kind of operation server of convenient heat dissipation to solve the problem proposed in the above background art. To achieve the above object, the utility model provides the following technical scheme: a kind of operation server of convenient heat dissipation, including cabinet, the inside of the cabinet is installed with support plate by screw;
[0005] The inner wall of the cabinet is installed with heat dissipation fan by screw, one side of the cabinet is installed with refrigeration tank by screw, the upper portion of the refrigeration tank is installed with temperature controller by screw, the front of the cabinet is connected with magnetic attraction piece by magnetic attraction, one side of the magnetic attraction piece is glued with nanometer dustproof heat dissipation cloth, the inside of the cabinet is inserted with induction rod;
[0006] The upper portion of the support plate is installed with heat sink by screw, the front of the heat sink is inserted with heat dissipation pipe, the two sides of the heat sink are respectively pasted with second thermal grease and first thermal grease.
[0007] Further preferably, the inside of the refrigeration tank is provided with compressor, condenser, evaporator, expansion valve, and the feed inlet of refrigeration tank is connected with condenser by pipeline, and condenser and compressor are connected by pipeline, and condenser and expansion valve are connected by pipeline, and expansion valve and evaporator are connected by pipeline.
[0008] Further preferably, the upper part of the support plate is horizontally arranged with a CPU, a cooling fin, a first heat-conductive silicone grease and a second heat-conductive silicone grease.
[0009] Further preferably, the cooling fin is connected with the CPU through a heat pipe.
[0010] Further preferably, the inner wall of the case is horizontally arranged with three groups of cooling fans at the back, and is provided with a group of cooling fans at the left side.
[0011] Further preferably, the front and the right side of the case are provided with a plurality of cooling holes, and the outer wall of the cooling holes is provided with a nano dustproof cooling cloth.
[0012] Further preferably, the temperature controller is connected with the induction rod through a cable.
[0013] Compared with the prior art, the utility model has the advantages of:
[0014] In the utility model, the inner wall of the case is horizontally arranged with three groups of cooling fans at the back, is provided with a group of cooling fans at the left side, is provided with a plurality of cooling holes with nano dustproof cooling cloth at the front and the right side, and multidirectional air convection channels are constructed, so that even if a plurality of high-performance computing chips are closely arranged in the high-load operation server, the heat can be taken away in time and uniformly, the local overheating risk is greatly reduced, the optimized design makes the airflow flow through each heating position more smoothly, compared with the heat dissipation difficulty caused by the unreasonable air flow channel in the traditional server, the internal temperature of the server can be effectively maintained, the server is stably and efficiently operated, the refrigeration cycle system composed of the compressor, the condenser, the evaporator and the expansion valve is arranged in the refrigeration case, active refrigeration and cooling are realized, the ability of the server to cope with high heat under high load is further enhanced, when the cooling fin and the fan combination cannot completely meet the heat dissipation requirement, the refrigeration system is intervened, the heat is continuously absorbed from the case environment, a low-temperature operation environment is created for the high-heat load elements in the server, the deficiency of the traditional server which simply depends on air cooling is filled, and the overall heat dissipation efficiency is greatly improved.
[0015] The utility model discloses a nanometer dustproof heat dissipation cloth covers the outer wall of the heat dissipation hole, guarantees the ventilation and heat dissipation function of heat dissipation hole again can fine and densely block the dust of outside into the machine case, effectively avoid the problem that the dust accumulation on the filter screen leads to the air intake reduction, compared with the condition that the traditional filter screen does not clean for a month and makes the air intake reduction 30%-50%, and the nanometer dustproof heat dissipation cloth can maintain stable air intake for a long time, guarantees the good heat exchange environment inside the server, thereby stabilizes the heat dissipation effect of server, and the nanometer dustproof heat dissipation cloth is connected on the machine case through magnetism, and the operation is simple and convenient, greatly reduces the maintenance difficulty and workload, and in the scene that the number of servers is more, the operation and maintenance personnel do not need to spend a lot of time on filter screen maintenance, can invest more energy into the key work such as the performance optimization of server, improves the operation and maintenance efficiency, reduces the server operation risk due to the maintenance not in time. BRIEF DESCRIPTION OF DRAWINGS
[0016] Figure 1 It is the front view structural schematic diagram of the utility model;
[0017] Figure 2 It is the front view structural schematic diagram of the utility model;
[0018] Figure 3 It is the inside structure schematic diagram of the utility model machine case;
[0019] Figure 4 It is the support plate upper structure schematic diagram of the utility model.
[0020] In the drawing: 1, machine case;101, refrigeration box;102, inductive rod;103, temperature controller;104, heat dissipation fan;105, magnetic attraction piece;106, nanometer dustproof heat dissipation cloth;2, support plate;201, heat dissipation fin;202, first heat-conducting silicone grease;203, heat dissipation pipe;204, second heat-conducting silicone grease. DETAILED DESCRIPTION
[0021] The technical scheme in the embodiments of the utility model will be described clearly and completely below in combination with the drawings in the embodiments of the utility model, and obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by the ordinary skill in the art without creative labor belong to the scope of protection of the utility model.
[0022] Please refer to Figures 1 to 4 The utility model provides a kind of operation server of heat dissipation, including machine case 1, the inside of machine case 1 is equipped with support plate 2 by screw;
[0023] The inner wall of the case 1 is provided with a cooling fan 104 by screwing, one side of the case 1 is provided with a refrigeration box 101 by screwing, the upper part of the refrigeration box 101 is provided with a temperature controller 103 by screwing, the front of the case 1 is connected with a magnetic sheet 105 by magnetic attraction, one side of the magnetic sheet 105 is glued with a nano dustproof heat dissipation cloth 106, and the inside of the case 1 is inserted with an induction rod 102.
[0024] The upper part of the support plate 2 is provided with a cooling fin 201 by screwing, the front of the cooling fin 201 is inserted with a cooling pipe 203, and the two sides of the cooling fin 201 are respectively pasted with a second thermal conductive silicone grease 204 and a first thermal conductive silicone grease 202.
[0025] In this embodiment, as shown in Figure 3 , the inside of the refrigeration box 101 is provided with a compressor, a condenser, an evaporator and an expansion valve, the feed inlet of the refrigeration box 101 is connected with the condenser through a pipeline, the condenser and the compressor are connected through a pipeline, the condenser and the expansion valve are connected through a pipeline, and the expansion valve and the evaporator are connected through a pipeline; the compressor, the condenser, the evaporator and the expansion valve in the refrigeration box 101 cooperatively constitute a precise refrigeration cycle system, the feed inlet is connected with the condenser, the flow path of the refrigerant is opened, the pipeline connection between the condenser and the compressor, the expansion valve and the evaporator, and the pipeline connection between the expansion valve and the evaporator, ensure that the refrigerant can circulate in sequence according to the order of compression, condensation, throttling and evaporation, continuously absorb heat from the environment of the case 1, realize powerful refrigeration and cooling, and create a low-temperature operating environment for high-heat-load elements inside the server.
[0026] In this embodiment, as shown in Figure 1 , Figure 2 and Figure 4 , the CPU, the cooling fin 201, the first thermal conductive silicone grease 202 and the second thermal conductive silicone grease 204 are arranged horizontally on the upper part of the support plate 2; the CPU, the cooling fin 201, the first thermal conductive silicone grease 202 and the second thermal conductive silicone grease 204 are carefully arranged horizontally on the upper part of the support plate 2, which is very ingenious; the CPU as the core heat source of server operation is closely attached to the cooling fin 201 through the first thermal conductive silicone grease 202 and the second thermal conductive silicone grease 204, the silicone grease can fill the tiny gap between the CPU and the cooling fin 201, greatly enhance the heat conduction efficiency, and make the heat generated by the CPU quickly and smoothly transmitted to the cooling fin 201, laying a solid foundation for the subsequent heat dissipation process.
[0027] In this embodiment, as shown in Figure 4As shown, the heat sink 201 and the CPU are connected through the heat pipe 203; the heat sink 201 and the CPU are closely connected through the heat pipe 203, and this connection mode plays a key heat conduction expansion function. The heat pipe 203 can quickly conduct the heat generated by the CPU to the wider heat dissipation area of the heat sink 201, accelerate the heat diffusion process, and further improve the heat dissipation efficiency, so as to ensure the cool running environment of the CPU.
[0028] In this embodiment, as shown in Figure 1 , Figure 2 and Figure 3 , three groups of heat dissipation fans 104 are arranged horizontally at the back of the inner wall of the case 1, and one group of heat dissipation fans 104 is arranged at the left side of the inner wall of the case 1; the three groups of heat dissipation fans 104 arranged horizontally at the back of the inner wall of the case 1 and the group of heat dissipation fans 104 arranged at the left side of the inner wall of the case 1 together build a comprehensive forced air cooling system. These heat dissipation fans 104 rotate at high speed to generate strong air flow, accelerate the flow speed of the air in the case 1, dissipate the heat accumulated in each corner of the case 1, cooperate with other heat dissipation components such as refrigeration and heat conduction, form a multi-element heat dissipation pattern, and ensure the stable operation of the server.
[0029] In this embodiment, as shown in Figure 1 , Figure 2 and Figure 3 , a plurality of heat dissipation holes are arranged at the front and right side of the case 1, and the outer wall of the heat dissipation hole is provided with a nano dustproof heat dissipation cloth 106; the plurality of heat dissipation holes arranged at the front and right side of the case 1 provide necessary flow channels for the discharge of air in the case 1 and the entry of fresh air from the outside, and the nano dustproof heat dissipation cloth 106 arranged at the outer wall of the heat dissipation hole has double functions. On the one hand, it can finely block the dust from entering the case 1, avoid the accumulation of dust on the internal components of the server, and affect the heat dissipation efficiency and electrical performance of the components; on the other hand, it can ensure that the heat dissipation function of the heat dissipation hole is not hindered, and maintain a good heat exchange environment in the case 1.
[0030] In this embodiment, as shown in Figure 1 , Figure 2 and Figure 4As shown, the temperature controller 103 is connected with the induction rod 102 through a cable; the temperature controller 103 is connected with the induction rod 102 through a cable, and an intelligent temperature monitoring and control mechanism is constructed, the induction rod 102 is like a sharp "antenna", real-time monitoring the temperature change in the case 1, and rapidly transmitting data to the temperature controller 103 through the cable, the temperature controller 103 accurately controls the opening, closing and running intensity of the heat dissipation assembly according to the preset temperature threshold, realizes intelligent and fine heat dissipation management, and ensures that the server can maintain a suitable temperature environment under different load working conditions.
[0031] The use method and advantages of the utility model are as follows:
[0032] As shown in Figure 1 , Figure 2 , Figure 3 and Figure 4 , first, when the server runs, the CPU and other components will generate heat, the first heat-conducting silicone grease 202 and the second heat-conducting silicone grease 204 enhance the heat transfer between the CPU and the heat sink 201, the heat sink 201 absorbs heat, and further diffuses the heat through the heat dissipation pipe 203 inserted therein, at the same time, the induction rod 102 real-time monitors the temperature in the case 1, and transmits data to the temperature controller 103 through a cable, the temperature controller 103 controls the operation of the heat dissipation assembly according to the set temperature threshold, when the temperature is sensed to be increased, the temperature controller 103 starts the heat dissipation fan 104, three groups of heat dissipation fans 104 at the back of the inner wall of the case 1 and one group of heat dissipation fans 104 at the left side work simultaneously, air flow is accelerated, heat is discharged out of the case 1, at the same time, the refrigeration cycle in the refrigeration box 101 also starts to operate, the compressor compresses the gaseous refrigerant into a high-temperature and high-pressure state, and the gaseous refrigerant is delivered to the condenser through a pipeline, heat is released in the condenser, the refrigerant is liquefied, the liquid refrigerant is throttled and reduced in pressure by the expansion valve, and then enters the evaporator, absorbs surrounding heat in the evaporator, and vaporizes, the low-temperature and low-pressure gaseous refrigerant is sucked into the compressor, and the cycle is repeated, so that the temperature in the case 1 is reduced, the heat dissipation holes at the front and right side of the case 1 are used for air circulation, the nanometer dustproof heat dissipation cloth 106 can prevent dust from entering the case 1 and does not hinder heat dissipation, and the stable operation of the server is ensured.
[0033] The basic principle, main features and advantages of the utility model are shown and described above. The technical personnel in the industry should understand that the utility model is not limited by the above examples, the above examples and the description in the specification are only preferred examples of the utility model, and are not used to limit the utility model, various changes and improvements of the utility model can be made without departing from the spirit and scope of the utility model, and these changes and improvements all fall within the scope of the utility model claimed. The protection scope of the utility model is defined by the appended claims and equivalents thereof.
Claims
1. An operation server facilitating heat dissipation, comprising a case (1), characterized in that: The inside of the case (1) is provided with a support plate (2) through screwing; The inner wall of the case (1) is provided with a cooling fan (104) through screwing, one side of the case (1) is provided with a refrigeration box (101) through screwing, the upper side of the refrigeration box (101) is provided with a temperature controller (103) through screwing, the front of the case (1) is connected with a magnetic sheet (105) through magnetic attraction, one side of the magnetic sheet (105) is glued with a nano dustproof heat dissipation cloth (106), and the inside of the case (1) is inserted with an induction rod (102); The upper side of the support plate (2) is provided with a cooling fin (201) through screwing, the front of the cooling fin (201) is inserted with a cooling pipe (203), and the two sides of the cooling fin (201) are respectively attached with a second heat-conducting silicone grease (204) and a first heat-conducting silicone grease (202).
2. The operation server of claim 1, wherein: The inside of the refrigeration box (101) is provided with a compressor, a condenser, an evaporator and an expansion valve, the feed inlet of the refrigeration box (101) is connected with the condenser through a pipeline, the condenser and the compressor are connected through a pipeline, the condenser and the expansion valve are connected through a pipeline, and the expansion valve and the evaporator are connected through a pipeline.
3. The operation server of claim 1, wherein: The upper side of the support plate (2) is horizontally arranged with a CPU, a cooling fin (201), a first heat-conducting silicone grease (202) and a second heat-conducting silicone grease (204).
4. The operation server of claim 1, wherein: The cooling fin (201) and the CPU are connected through a cooling pipe (203).
5. The operation server of claim 1, wherein: The inner wall of the case (1) is horizontally arranged with three groups of cooling fans (104) at the back, and the inner wall of the case (1) is provided with a group of cooling fans (104) at the left side.
6. The operation server of claim 1, wherein: The front and the right side of the case (1) are provided with a plurality of cooling holes, and the outer wall of the cooling holes is provided with a nano dustproof heat dissipation cloth (106).
7. The operation server of claim 1, wherein: The temperature controller (103) and the induction rod (102) are connected through a cable.