Printed board assembly supporting framework

Abstract

The utility model provides a printed board assembly supporting framework. The printed board assembly supporting framework comprises an insulating substrate, a plurality of supporting salient points and two groups of grabbing pieces, the supporting salient points are arranged on the upper plate surface of the insulating substrate and are used for supporting the lower plate surface of a printed plate in the printed plate assembly; the two sets of grabbing pieces are connected to the left side edge and the right side edge of the insulating substrate respectively, extend upwards and are provided with grabbing positions. The printed board assembly supporting framework can stably support a printed board, meanwhile, a printed board assembly can be conveniently transferred, the isolation protection requirement of the welding side of the printed board is met, the printed board assembly supporting framework can be used as a transfer tool, the printed board assembly and the printed board assembly supporting framework can be jointly placed in an equipment shell, and the printed board assembly can be conveniently transferred. The printed board assembly supporting framework serves as a reliable installation base body of the printed board assembly, the structural stability and the use reliability of the printed board assembly in the shell are guaranteed, and the overall manufacturing cost of electronic power equipment can be reduced.

Description

TECHNICAL FIELD

[0001] The utility model belongs to electronic power equipment technical field, concretely relates to a printed board assembly support frame. BACKGROUND

[0002] With the rapid development of electronic power industry, the working performance requirement of electronic power equipment is higher and higher. The electronic power equipment contains a plurality of printed circuit board assemblies arranged in the equipment shell, and the printed circuit board assembly is mainly composed of a printed circuit board and a plurality of electrical devices integrated on the printed circuit board. The improvement of working performance also means that more electrical devices need to be integrated on the printed circuit board, resulting in that the volume and weight of the printed circuit board assembly are larger and larger, and it is difficult to move the printed board assembly by directly gripping the printed circuit board. In addition, in order to ensure the safety requirement, a support member needs to be arranged on the welding surface of the printed circuit board to avoid damage of each pin on the welding surface, but due to the high density of electrical devices on the printed circuit board, it is difficult to install the support member, which finally affects the support stability and use reliability of the printed circuit board assembly. SUMMARY

[0003] The utility model embodiment provides a printed board assembly support frame, which aims to solve the problems of difficult transfer and taking and placing of the existing high-density printed circuit board assembly, and poor support stability in the equipment shell.

[0004] To achieve the above-mentioned purpose, the utility model adopts the technical scheme of:

[0005] Provided is a printed board assembly support frame, comprising:

[0006] An insulating substrate;

[0007] A plurality of support protrusions arranged on the upper plate surface of the insulating substrate and used for supporting the lower plate surface of the printed board in the printed board assembly;

[0008] Two groups of grabbing pieces connected to the left and right sides of the insulating substrate, respectively, the grabbing pieces extending upward and having a grabbing position.

[0009] In a possible implementation manner, the printed board assembly support frame further comprises a protective protrusion, the protective protrusion is arranged on the upper plate surface of the front part of the insulating substrate and extends along the front edge of the insulating substrate, and the protective protrusion abuts against the front part of the lower plate surface of the printed board to seal the gap between the insulating substrate and the printed board.

[0010] In some embodiments, the protective ridge comprises a front support section extending along the front edge of the insulating substrate, and two side support sections respectively arranged at the left and right side edges of the insulating substrate and extending along the corresponding side edges of the insulating substrate, and the left and right ends of the front support section are connected with the side support sections of the corresponding sides respectively; the front support section is in contact with the front edge of the printed board, and the side support sections are in contact with the side edges of the printed board.

[0011] In a possible implementation, the front side edge of the insulating substrate is bent upward to form a first isolation flange, and the height of the upper edge of the first isolation flange is higher than the height of the lower plate surface of the printed board, so as to shield the gap between the printed board and the insulating substrate.

[0012] In some embodiments, the upper edge of the first isolation flange is bent backward to form a second isolation flange, and a gap is formed between the lower surface of the second isolation flange and the upper plate surface of the printed board to form a first isolation space.

[0013] In some embodiments, the rear edge of the second isolation flange is bent upward to form a third isolation flange, the upper edge of the third isolation flange is bent backward to form a fourth isolation flange, and the third isolation flange and the fourth isolation flange cooperate to form a second isolation space.

[0014] In some embodiments, the second isolation space corresponds to a high-heat device on the printed board, a heat sink is arranged on the high-heat device, a socket is arranged on the heat sink, and the fourth isolation flange is inserted into the socket backward.

[0015] In some embodiments, a plurality of heat sinks are arranged in the left-right direction, a plurality of fourth isolation flanges are arranged in the left-right direction, and each fourth isolation flange is inserted into the sockets of two adjacent heat sinks.

[0016] In a possible implementation, the grabbing member is a plate-shaped member arranged at an angle with the insulating substrate, and the grabbing position is a hand-holding hole formed in the grabbing member.

[0017] In some embodiments, the lower edge of the grabbing member is lower than the insulating substrate, and in the left-right direction, the grabbing member and the insulating substrate are arranged with a gap therebetween; the side edge of the insulating substrate is bent downward to form a transition support flange, and the transition support flange is connected with the lower edge of the grabbing member.

[0018] Compared with the prior art, the scheme shown in the embodiment of the application forms insulation isolation on the soldering side of the printed board by taking the insulation substrate as a carrier for bearing the printed board assembly; the support protrusions are directly arranged on the insulation substrate according to the design of the soldering surface of the printed board, so as to form stable support under the printed board and avoid directly mounting the support member on the printed board; in addition, the grabbing members arranged on the left and right sides of the insulation substrate are taken as carriers for being gripped by hands, so that the printed board assembly can be directly gripped when the printed board assembly needs to be transferred, and the printed board is avoided from being gripped. The printed board assembly support structure of the application can form stable support for the printed board, and can also conveniently transfer the printed board assembly, and meets the isolation and protection requirement of the soldering side of the printed board, so that the printed board assembly support structure can be used as a transfer tool, and can also be placed in the equipment shell together with the printed board assembly, so that the printed board assembly support structure serves as a reliable mounting matrix of the printed board assembly, guarantees the structural stability and use reliability of the printed board assembly in the shell, and is favorable for reducing the overall manufacturing cost of the electronic power equipment. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 A perspective view of the printed board assembly support structure provided by the embodiment of the application Figure 1 ;

[0020] Figure 2 A enlarged view of A of Figure 1 ;

[0021] Figure 3 A perspective view of the printed board assembly support structure provided by the embodiment of the application Figure 2 ;

[0022] Figure 4 A top view of the printed board assembly support structure provided by the embodiment of the application

[0023] Figure 5 A bottom view of the printed board assembly support structure provided by the embodiment of the application

[0024] Figure 6 An assembly perspective view of the printed board assembly support structure and the printed board assembly provided by the embodiment of the application

[0025] Figure 7 An assembly top view of the printed board assembly support structure and the printed board assembly provided by the embodiment of the application

[0026] Figure 8 A A-A sectional view of Figure 7 ;

[0027] Figure 9 A B-B sectional view of Figure 7 ;

[0028] Figure 10 The rear view of the printed board assembly support frame structure is provided for the embodiments of the present application.

[0029] Mark explanation:

[0030] 1, insulating substrate; 101, first fixed hole; 2, support bump; 3, grabbing piece; 310, buckle hand hole; 320, contact flange; 4, printed board assembly; 410, printed board; 420, electrical device; 421, high heat device; 422, heat sink; 5, protection convex strip; 510, front support section; 520, side support section; 530, avoid position support section; 6, first isolation flange; 7, second isolation flange; 710, reinforcing flange; 8, first isolation space; 9, third isolation flange; 910, buffer convex; 10, fourth isolation flange; 11, second isolation space; 12, transition support flange; 1210, first connecting edge; 1220, second connecting edge. Specific implementation

[0031] In order to make the technical problems, technical schemes and beneficial effects of the present application clearer and more apparent, the present application will be further described in detail below in combination with the drawings and examples. It should be understood that the specific examples described herein are only used to explain the present application and not to limit the present application.

[0032] In the claims, description and above drawings of the present application, unless otherwise explicitly limited, the terms such as "first", "second" or "third" are used only to distinguish different objects and are not used to describe a specific order.

[0033] In the claims, description and above drawings of the present application, unless otherwise explicitly limited, for the orientation words, such as the terms "center", "transverse", "longitudinal", "horizontal", "vertical", "top", "bottom", "inner", "outer", "upper", "lower", "front", "rear", "left", "right", "clockwise", "counterclockwise", "high", "low" and the like indicate the orientation or position relationship based on the orientation and position relationship shown in the drawings, and are only used for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements referred to must have a specific orientation or be constructed and operated in a specific orientation, so it cannot be understood as limiting the specific protection scope of the present application.

[0034] In the claims, description and above drawings of the present application, unless otherwise explicitly limited, such as the terms "fixedly connected" or "fixedly connected", should be understood broadly, that is, any connection mode without displacement relationship and relative rotation relationship between the two, that is, it includes non-detachable fixed connection, detachable fixed connection, integration and fixed connection through other devices or elements.

[0035] The terms "comprise", "have" and their conjugates, as used herein, are intended to permit the inclusion of additional elements, features, components, steps, etc.

[0036] Please refer to Figures 1 to 10 The printed board assembly support architecture provided by the utility model is described. The printed board assembly support architecture comprises an insulating substrate 1, a plurality of support protrusions 2 and two groups of grabbing members 3. The support protrusions 2 are arranged on the upper plate surface of the insulating substrate 1 and are used for supporting the lower plate surface of a printed board 410 in a printed board assembly 4. The two groups of grabbing members 3 are respectively connected to the left and right side edges of the insulating substrate 1, extend upward and have grabbing positions. The printed board assembly 4 comprises the printed board 410 and electrical devices 420 arranged on the upper side of the printed board 410. The pins of each electrical device 420 penetrate the printed board 410 and extend to the lower side of the printed board 410, and are electrically connected to other components by welding or the like. Therefore, the lower plate surface of the printed board 410 also becomes a welding surface of the printed board 410.

[0037] It should be noted that the number and distribution position of the support protrusions 2 are related to the structure of the printed board assembly 4 itself, and are not limited to the embodiment shown in the figure, which is provided with four support protrusions 2. In addition, in order to improve the support stability, the top surface of the support protrusion 2 is a plane, so as to be matched with the lower plate surface of the printed board 410.

[0038] The implementation mode of the printed board assembly 4 of the embodiment includes but is not limited to a power amplifier board assembly, and the support architecture of the present solution can be used for printed board assemblies with similar installation requirements, which are not limited to the embodiment. The material of the insulating substrate 1 of the embodiment includes but is not limited to resin, plastic and the like, which are not limited to the embodiment.

[0039] The inventor finds that in order to meet the insulation safety requirement, the prior art places an insulating plate (such as an epoxy plate) on the welding side (i.e. the lower side of the printed board) of the printed board assembly. In order to meet the support requirement of the printed board assembly, a support foot pad is installed on the welding surface of the printed board by screwing or the like, and a stud needs to be arranged in advance on the printed board to realize the connection with the support foot pad. Due to the consideration of the safety requirement, a certain space needs to be avoided around the stud to avoid affecting the working performance of the circuit and the pin on the printed board.

[0040] In order to solve the above problems, the printed board assembly support structure provided by the embodiment forms an insulation isolation on the soldering side of the printed board 410 by taking the insulation substrate 1 as a carrier for bearing the printed board assembly 4; the support protrusions 2 are arranged on the insulation substrate 1 according to the design of the soldering surface of the printed board 410 to form a stable support under the printed board 410, avoiding the direct installation of the support member on the printed board 410; in addition, the grabbing members 3 arranged on the left and right sides of the insulation substrate 1 are taken as a carrier for the hand to grip, when the printed board assembly 4 needs to be transferred, the grabbing members 3 can be directly gripped, avoiding the gripping of the printed board 410. The printed board assembly support structure can form a stable support for the printed board 410, and can also conveniently transfer the printed board assembly 4, and meet the isolation and protection requirements of the soldering side of the printed board 410, which can not only be used as a transfer tool, but also can be placed in the equipment shell together with the printed board assembly 4, so that the printed board assembly support structure serves as a reliable installation base of the printed board assembly 4, ensuring the structural stability and use reliability of the printed board assembly 4 in the shell, and being conducive to reducing the overall manufacturing cost of the electronic power equipment.

[0041] In some embodiments, the substrate is integrally formed with the support protrusions 2, and the material of the support protrusions 2 includes but is not limited to silica gel, rubber and the like, so that the support protrusions 2 have a certain elasticity, and the printed board 410 is elastically supported.

[0042] In some embodiments, the grabbing members 3 are integrally formed with the substrate or detachably connected with the substrate, and are selectively installed according to actual use requirements. More specifically, the detachable connection between the grabbing members 3 and the substrate includes but is not limited to: 1) the lower part of the grabbing member 3 is provided with a hook, and the edge of the substrate is provided with a hanging hole, and the hook is hooked with the hanging hole; 2) the lower part of the grabbing member 3 is provided with a T-shaped plug, and the edge of the substrate is provided with a T-shaped slot, and the T-shaped plug is inserted with the T-shaped slot.

[0043] The electrical device 420 in the printed board assembly 4 generates heat during work, in order to maintain the work reliability of the electrical device 420, the electrical device 420 needs to be cooled in time, and air cooling of the electrical device 420 is achieved by blowing air on the front side of the printed board assembly 4, but for some sensitive devices, dust brought by direct air supply will affect the performance of the devices. In order to solve this problem, in some embodiments, referring to Figure 1 , Figures 3 to 5The printed board assembly support structure further comprises a protective protrusion 5 arranged on the upper plate surface of the front portion of the insulating substrate 1 and extending along the front edge of the insulating substrate 1, the protective protrusion 5 abuts against the front portion of the lower plate surface of the printed board 410 to seal the gap between the insulating substrate 1 and the printed board 410. The protective protrusion 5 is integrally connected with the insulating substrate 1. The protective protrusion 5 forms an air duct isolation at the front portion of the printed board 410 to avoid cold air directly blowing into the gap, and shields the sensitive electrical devices 420 with a small height in the printed board 410, thereby effectively preventing dust.

[0044] In some embodiments, the protective protrusion 5 can adopt a structure as shown in Figure 1 、 Figures 3 to 5 The protective protrusion 5 comprises a front support section 510 and two side support sections 520. The front support section 510 extends along the front edge of the insulating substrate 1, and the two side support sections 520 are arranged on the left and right side edges of the insulating substrate 1 respectively and extend along the corresponding side edges of the insulating substrate 1. The left and right ends of the front support section 510 are connected with the corresponding side support sections 520 respectively. The front support section 510 is in contact with the front edge of the printed board 410, and the side support sections 520 are in contact with the side edges of the printed board 410. Through this segmented design, the front portion and the side portion of the printed board 410 are sealed, the sealing range is large, the sealing effect is better, and in addition, the overall length of the protective protrusion 5 is longer, which can assist the support protrusion 2 in supporting the printed board 410 to a certain extent, thereby further improving the stability of the support.

[0045] In specific implementation, in order to avoid interference with the electrical devices 420 on the printed board 410, the rear end of the side support section 520 extends to the middle portion of the substrate. The upper surface of the support protrusion is a plane to improve the reliability of the contact with the lower plate surface of the printed board 410.

[0046] Optionally, in order to adapt to the structural distribution requirements of the lower portion of the printed board 410, a zigzag distributed avoidance support section 530 is arranged at the intersection of the front support section 510 and the side support section 520, on the front support section 510, and on the rear support section to avoid circuit design in the corresponding area.

[0047] In some embodiments, referring to Figure 8 and Figure 9 The front side edge of the insulating substrate 1 is bent upward to form a first isolation flange 6, and the height of the upper edge of the first isolation flange 6 is higher than the height of the lower plate surface of the printed board 410 to shield the gap between the printed board 410 and the insulating substrate 1. The first isolation flange 6 forms an air duct isolation at the front portion of the printed board 410 to avoid cold air directly blowing into the gap between the printed board 410 and the insulating substrate 1, and shields the sensitive electrical devices 420 with a small height in the printed board 410, thereby effectively preventing dust.

[0048] On the basis of being provided with the first isolation flange 6, referring to Figure 1 、 Figures 3 to 9 , the upper edge of the first isolation flange 6 is bent backward to form a second isolation flange 7, and the lower surface of the second isolation flange 7 is spaced apart from the upper plate surface of the printed board 410 to form a first isolation space 8. The front part of the printed board 410 is placed in the first isolation space 8, and the second isolation flange 7 forms a shielding isolation above the sensitive device of the front part of the printed board 410, which can further avoid dust from falling on the sensitive device of the front part of the printed board 410 with the wind, and can also meet the regulatory requirements of the edge part of the printed board 410, realizing the integrated design of functions.

[0049] In specific implementation, in order to improve the comprehensiveness of protection, the left and right ends of the first isolation flange 6 and the left and right ends of the second isolation flange 7 are all extended to the corresponding side edges of the substrate.

[0050] On the basis of being provided with the second isolation flange 7, referring to Figure 1 、 Figures 3 to 9 , the rear edge of the second isolation flange 7 is bent upward to form a third isolation flange 9, the upper edge of the third isolation flange 9 is bent backward to form a fourth isolation flange 10, and the third isolation flange 9 cooperates with the fourth isolation flange 10 to form a second isolation space 11. The second isolation space 11 is relatively high in height, which can shield the sensitive device (such as a diode) on the printed board 410 which is relatively high in height, and further improve the comprehensiveness of dust prevention.

[0051] Referring to Figure 8 and Figure 9 , in specific implementation, the cross section of the first isolation flange 6 is in the shape of an arc protruding forward, so that the first isolation flange 6 has greater deformation capacity, which can absorb certain errors through its own deformation after the printed board assembly support structure is assembled with the printed board assembly 4. Similarly, the upper part and the lower part of the third isolation flange 9 are respectively provided with a buffer protrusion 910, the cross section of the buffer protrusion 910 is in the shape of an arc protruding forward, and the buffer protrusion 910 can also increase the deformation capacity of the upper part and the lower part of the third isolation flange 9, which can absorb certain errors through its own deformation, facilitating assembly.

[0052] Since the heat sink 422 is arranged relatively centrally and generally does not extend to the edge of the printed board 410, the two side edges of the third isolation flange 9 and the fourth isolation flange 10 are spaced apart from the corresponding side edges of the second isolation flange 7, and the front edge of the second isolation flange 7 is bent upward to form a reinforcing flange 710 in the uncovered area of the second isolation flange 7 above the third isolation flange 9, so as to improve the bending resistance of the second isolation flange 7.

[0053] On the basis of the above embodiments, referring to Figure 1 、 Figure 3 、 Figures 6 to 10, the second isolation space 11 corresponds to the high heat generating device 421 on the printed board 410, in order to realize effective heat dissipation of the device, a heat sink 422 is arranged on the upper part of the high heat generating device 421, the heat sink 422 is provided with a socket, and the fourth isolation flange 10 is inserted into the socket. Among them, the heat sink 422 has heat dissipation fins, and the cold air blowing through the heat dissipation fins can take away the heat of the heat sink 422, thereby playing a cooling role. The fourth isolation flange 10 and the heat sink 422 are inserted in the embodiment, which realizes the relative fixation of the printed board assembly support structure and the printed board assembly 4, does not affect the arrangement of the high heat generating device 421, and at the same time, avoids setting too many connecting structures between the substrate and the printed board 410, and reduces the design difficulty of the printed board 410. It should be noted that the high heat generating device 421 refers to the device with high heat generation in the printed board assembly 4, including but not limited to IGBT, diode and other power devices.

[0054] In specific implementation, the socket and the fourth isolation flange 10 are adapted by interference insertion. Since the heat sink 422 is mostly a metal component, the interference insertion does not affect the structural stability of the heat sink 422. In addition, the fins of the heat sink 422 are located above the fourth isolation flange 10 to realize effective heat exchange with the cold air.

[0055] In some specific embodiments of the distribution mode of the heat sink 422, see Figure 1 、 Figure 3 、 Figures 6 to 10 , the heat sink 422 is arranged in multiple along the left-right direction, by arranging multiple heat sinks 422, the partition heat dissipation of the lower high heat generating device 421 is realized; wherein, the multiple heat sinks 422 can correspond to the same high heat generating device 421, or the multiple heat sinks 422 correspond to different high heat generating devices 421 respectively. Based on this, the fourth isolation flange 10 is provided with multiple along the left-right direction, the same fourth isolation flange 10 is inserted into the sockets of the adjacent two heat sinks 422, by this way, the front and back length of the socket can be set longer, the combination strength of the fourth isolation flange 10 and the heat sink 422 is enhanced, the integrity of the combination of the heat sink 422 and the fourth isolation flange 10 is enhanced, which is beneficial to improve the stability of the installation of the printed board assembly 4 in the equipment.

[0056] In specific implementation, the socket is arranged on the left and right sides of the main body of the heat sink 422, the fourth isolation flange 10 at the left end is inserted into the socket at the left end, the fourth isolation flange 10 at the right end is inserted into the socket at the right end, and the fourth isolation flange 10 at the middle is inserted into two opposite sockets at the same time.

[0057] The above embodiments give the way of connecting the support structure and the printed board assembly 4 through the fourth isolation flange 10. In other embodiments, the first fixing hole 101 is opened on the base plate, and the reliable connection between the printed board assembly 4 and the printed board assembly support structure is realized by the threaded fastener penetrating through the first fixing hole 101 and the connecting terminal (such as an inner stud) arranged on the welding surface of the printed board 410.

[0058] On the basis of the reliable connection between the printed board assembly 4 and the printed board assembly support structure, the second fixing hole is opened on the third isolation flange 9, and the threaded fastener penetrating through the second fixing hole is connected with the equipment shell, so as to realize the fixation of the printed board assembly support structure in the equipment, and further realize the fixation of the printed board assembly 4 in the equipment.

[0059] In some embodiments, referring to Figures 1 to 10 , the grabbing piece 3 is a plate-shaped member arranged at an angle with the insulating base plate 1, so that the size of the grabbing piece 3 in the left-right direction can be effectively reduced, the space occupied by the printed board assembly support structure in the equipment shell is reduced, and the distribution of other components in the equipment shell is avoided. Based on this, in order to facilitate gripping, the grabbing position is a hand buckle hole 310 opened on the grabbing piece 3.

[0060] On the basis of the above embodiments, referring to Figure 1 , Figure 3 and Figure 6 , the edge of the hand buckle hole 310 is bent to form a contact flange 320, which increases the contact area of the hand buckle hole 310 with the hand, and avoids the edge of the hand buckle hole 310 from scratching or scratching the hand when gripping the hand buckle hole 310. In specific implementation, in order to further improve the gripping comfort, the contact flange 320 is folded inward, and the contact flange 320 is not only folded inward, but also curled away from the hand buckle hole 310, forming an arc-shaped gripping contact surface.

[0061] In some embodiments, referring to Figures 1 to 6, the lower edge of the grabbing piece 3 is lower than the insulating substrate 1, and in the left-right direction, the grabbing piece 3 and the insulating substrate 1 are arranged with an interval; the side edge of the insulating substrate 1 is bent downward to form a transition support flange 12, and the transition support flange 12 is connected with the lower edge of the grabbing piece 3. In the embodiment, the transition support flange 12 is arranged between the grabbing piece 3 and the insulating substrate 1, and the transition support flange 12 can buffer when the grabbing piece 3 is lifted or the printed board assembly support structure is placed downward, so that the force of the grabbing piece 3 is not directly transmitted to the insulating substrate 1, the shaking range of the printed board assembly 4 is reduced, and the electrical device 420 on the printed board 410 is prevented from being damaged; meanwhile, the downward protrusion of the transition support flange 12 from the insulating substrate 1 can form support when the printed board assembly 4 is placed, and the insulating substrate 1 is padded, so that the safety height of the printed board assembly 4 is further improved, and the safety requirement is met.

[0062] In some embodiments of the transition support flange 12, referring to Figure 2 , the transition support flange 12 comprises a first connecting edge 1210 and a second connecting edge 1220, the first connecting edge 1210 is connected to the side edge of the substrate and extends downward, the second connecting edge 1220 is connected between the lower edge of the first connecting edge 1210 and the lower edge of the grabbing piece 3, and the first connecting edge 1210 and the second connecting edge 1220 are arranged at an angle, so that the transition support flange 12 is in the shape of “L”. In use, the lower surface of the second connecting edge 1220 supports the bottom of the equipment shell, and the transition support flange 12 itself has a certain deformation ability, which can provide better buffering effect.

[0063] The printed board assembly support structure of the embodiment integrates the functions of insulation protection, support, dust isolation, connection and fixation of the printed board assembly 4 by arranging the insulating substrate 1, the grabbing piece 3, the support bump 2, the protection bump 5, the first isolation flange 6, the second isolation flange 7, the third isolation flange 9 and the fourth isolation flange 10, so that the printed board assembly support structure can be used in the process of transferring the printed board assembly 4, and the printed board assembly 4 can be installed together into the equipment shell, so that the installation is simpler and the assembly reliability is higher.

[0064] The above only describes the preferred embodiments of the present application and is not intended to limit the present application, and any modification, equivalent replacement and improvement made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A printed board assembly support architecture, characterized by, The utility model relates to a printed board assembly support frame structure, including: An insulating substrate (1); A plurality of support bumps (2) are arranged on the upper surface of the insulating substrate (1) and are used to support the lower surface of a printed board (410) in a printed board assembly (4); Two groups of grabbing pieces (3) are respectively connected to the left and right sides of the insulating substrate (1), the grabbing pieces (3) extend upward and have a grabbing position.

2. The printed board assembly support framework of claim 1, wherein, The printed board assembly support frame structure further includes a protective protrusion (5) arranged on the upper surface of the front part of the insulating substrate (1) and extending along the front edge of the insulating substrate (1), the protective protrusion (5) abuts against the front part of the lower surface of the printed board (410) to seal the gap between the insulating substrate (1) and the printed board (410).

3. The printed board assembly support framework of claim 2, wherein, The protective protrusion (5) includes a front support section (510) extending along the front edge of the insulating substrate (1) and two side support sections (520) respectively arranged on the left and right side edges of the insulating substrate (1) and extending along the corresponding side edges of the insulating substrate (1), the left and right ends of the front support section (510) are respectively connected to the side support sections (520) on the corresponding sides; the front support section (510) is in contact with the front edge of the printed board (410), and the side support sections (520) are in contact with the side edges of the printed board (410).

4. The printed board assembly support framework of claim 1, wherein, The front side of the insulating substrate (1) is bent upward to form a first isolation flange (6), the height of the upper edge of the first isolation flange (6) is higher than the height of the lower surface of the printed board (410) to block the gap between the printed board (410) and the insulating substrate (1).

5. The printed board assembly support framework of claim 4, wherein, The upper edge of the first isolation flange (6) is bent backward to form a second isolation flange (7), a first isolation space (8) is formed between the lower surface of the second isolation flange (7) and the upper surface of the printed board (410).

6. The printed board assembly support framework of claim 5, wherein, The rear edge of the second isolation flange (7) is bent upward to form a third isolation flange (9), the upper edge of the third isolation flange (9) is bent backward to form a fourth isolation flange (10), and the third isolation flange (9) cooperates with the fourth isolation flange (10) to form a second isolation space (11).

7. The printed board assembly support framework of claim 6, wherein, The second isolation space (11) corresponds to a high-heat device (421) on the printed board (410), a heat sink (422) is arranged on the high-heat device (421), a socket is arranged on the heat sink (422), and the fourth isolation flange (10) is inserted into the socket backward.

8. The printed board assembly support architecture of claim 7, wherein, A plurality of heat sinks (422) are arranged in the left-right direction, a plurality of fourth isolation flanges (10) are arranged in the left-right direction, and the same fourth isolation flange (10) is respectively inserted into the sockets of two adjacent heat sinks (422).

9. The printed board assembly support chassis of claim 1, wherein, The grabbing piece (3) is a plate-shaped member arranged at an angle with the insulating substrate (1), and the grabbing position is a hand hole (310) formed in the grabbing piece (3).

10. The printed board assembly support architecture of claim 9, wherein, The lower edge of the grabbing piece (3) is lower than the insulating substrate (1), and in the left-right direction, the grabbing piece (3) and the insulating substrate (1) are arranged with an interval; the side edge of the insulating substrate (1) is bent downward to form a transition support flange (12), and the transition support flange (12) is connected with the lower edge of the grabbing piece (3).

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