Flexible circuit board structure
By creating a mesh structure through hollowed-out areas in the inner layer of the flexible circuit board, the balance between bending performance and thickness of the flexible circuit board is solved, achieving better bending and folding performance and overall flexibility, and improving the reliability and service life of the circuit board.
Patent Information
- Application Number
- CN202520250071.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-17
- Publication Date
- 2026-02-06
- Estimated Expiration
- 2035-02-17
AI Technical Summary
Existing flexible circuit boards struggle to balance bending performance and thickness requirements. Traditional solid copper plating limits bending and folding performance, while non-copper plating makes it difficult to meet thickness requirements.
A mesh structure is formed by setting hollow areas in the inner layer of the flexible circuit board. The hollow areas are distributed in a rectangular array and are staggered to ensure that there are gaps between the copper foils to optimize bending and folding performance, while meeting the thickness requirements.
It improves the bending and folding performance and overall flexibility of flexible circuit boards, ensures that the circuit boards are subjected to uniform force in all directions, improves the reliability and service life of the circuit boards, and reduces production costs.
Smart Images
Figure CN223885374U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to circuit board technical field more specifically, it is related to a flexible circuit board structure. BACKGROUND
[0002] Printed circuit board (Printed Circuit Board, PCB board for short), as one of the core components of modern electronic equipment, plays a dual key role of physical support and signal transmission. It is not only the carrier of electronic components, but also the basis for ensuring the function realization and performance stability of electronic equipment.
[0003] With the continuous development of electronic technology, the range of flexible circuit board products in technical application is also more and more wide. Flexible printed circuit board, also known as soft board, is a kind of printed circuit board with high reliability and excellent flexibility. It has been widely used in the field of electronic products due to its high wiring density, light weight, thin thickness and excellent bending performance, including but not limited to smart phones, notebook computers, personal digital assistants (PDA), digital cameras and other portable or wearable devices. In these devices, flexible circuit board not only undertakes the task of simple circuit connection, such as the wiring connection between the screen and the mainboard of the mobile phone, but also can play a key role in complex circuit connection, such as realizing efficient and reliable signal transmission between two mainboards inside the mobile phone. Therefore, good bending performance is one of the indispensable performance indicators of flexible circuit board.
[0004] In the design and manufacturing process of flexible circuit board, the treatment method of copper skin has a crucial influence on its bending performance. At present, the common flexible circuit board copper skin treatment methods on the market mainly include two kinds: traditional solid copper treatment and no copper skin treatment.
[0005] Although the traditional solid copper treatment method can improve the conductivity and mechanical strength of the circuit board to a certain extent, its bending and folding performance is often unsatisfactory. Especially when the flexible circuit board has a certain thickness, the rigidity of the solid copper skin will significantly limit the bending and folding degree of the circuit board, making it difficult to achieve the ideal bending state. Although the no copper skin treatment method can significantly improve the bending and folding performance of the circuit board, due to the lack of support and reinforcement of the copper skin, the circuit board is often difficult to meet the required thickness requirement in the processing process. TECHNICAL SOLUTION
[0006] In order to overcome the problem that the existing flexible circuit board cannot balance the bending performance while meeting the thickness and mechanical strength requirements of the circuit board, the utility model provides a flexible circuit board structure.
[0007] The technical scheme of the utility model is as follows:
[0008] The utility model provides a flexible circuit board structure, including circuit board body, the circuit board body includes multilayer circuit board layer, the copper skin is laid on the circuit board layer in the inner layer, is equipped with a plurality of open areas on the copper skin and forms the grid -like structure, wherein a plurality of open areas are rectangular array distribution, and the open area of copper skin of adjacent circuit board layer is arranged staggered.
[0009] According to the utility model of the above scheme, the interval between the two adjacent open areas in the same row of the rectangular array is equal to the length of the open area.
[0010] According to the utility model of the above scheme, the length of the open area is equal to the width of the open area.
[0011] According to the utility model of the above scheme, the interval between the two adjacent open areas in the same row of the rectangular array is equal to the length of the open area.
[0012] According to the utility model of the above scheme, the interval between the two adjacent open areas in the same column of the rectangular array is equal to the width of the open area.
[0013] According to the utility model of the above scheme, the length of the open area is 2.5mm, and the width of the open area is 2.5mm.
[0014] According to the utility model of the above scheme, the open area is arrayed on the circuit board layer in the inner layer, and the open area forms a gap between the copper skins, so that the problem of poor bending and folding caused by the solid copper skin can be optimized, the flexible circuit board is easier to bend and fold, and the copper skin can also ensure the ideal thickness of the flexible circuit board. BRIEF DESCRIPTION OF DRAWINGS
[0015] Figure 1 It is the structural schematic diagram of the utility model;
[0016] Figure 2 It is the structural schematic diagram of a circuit board layer of the utility model;
[0017] Figure 3 It is Figure 2 The structural schematic diagram of adjacent circuit board layers.
[0018] In the drawings, various reference signs are as follows:
[0019] 100, circuit board body; 11, circuit board layer; 12, copper skin; 121, open area. DETAILED DESCRIPTION
[0020] In order to make the technical problems, technical solutions and beneficial effects of the utility model clearer, the utility model will be described in further detail below in combination with the drawings and examples.
[0021] It should be noted that the terms "comprising" and "having" and any variations thereof in the specification and claims of the utility model are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device including a series of steps or units is not limited to the listed steps or units, but optionally also includes steps or units not listed, or optionally also includes other steps or units inherent to the process, method, product or device. The term "provided" and other terms should be broadly understood, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise explicitly limited. The terms "up", "down", "left", "right", "front", "back", "bottom" and the like indicate the orientation or position based on the orientation or position shown in the drawings, and are only for convenience of description, and cannot be understood as a limitation on the technical solutions.
[0022] It should be noted that at present, there are mainly two kinds of flexible circuit board copper skin processing methods on the market: traditional solid copper processing and no copper skin processing.
[0023] Although the traditional solid copper processing method can improve the conductivity and mechanical strength of the circuit board to some extent, the bending and folding performance is often unsatisfactory. In particular, when the flexible circuit board has a certain thickness, the rigidity of the solid copper skin will significantly limit the bending and folding degree of the circuit board, making it difficult to achieve the ideal bending state. The processing method without copper skin can significantly improve the bending and folding performance of the circuit board, but due to the lack of support and reinforcement of the copper skin, the circuit board often fails to meet the required thickness requirement during processing.
[0024] As shown in Figures 1-3 The embodiment provides a flexible circuit board structure, the hollow area 121 is arranged in an array on the circuit board layer 11 located at the inner layer, and the hollow area 121 makes the copper skin 12 have gaps between them, which can optimize the problem of poor bending and folding caused by the solid copper skin 12, and the flexible circuit board is easier to bend and fold, and the setting of the copper skin 12 can also ensure that the ideal thickness of the flexible circuit board is reached.
[0025] When the flexible circuit board needs to be made into a multi-layer board, the copper skin 12 on the inner layer of the circuit board layer 11 is added in staggered positions, which can ensure that the softness of the flexible circuit board is good. After the inner layer of the flexible circuit board is laminated, it will not appear as hard to bend and fold as the solid copper skin 12. While ensuring that the board is good to bend and fold, the desired thickness of the board can also be achieved.
[0026] Specifically, the flexible circuit board structure includes a circuit board body 100, the circuit board body 100 includes a plurality of circuit board layers 11, a copper skin 12 is laid on the circuit board layer 11 at the inner layer, and a plurality of hollow areas 121 are arranged on the copper skin 12 to form a grid structure, wherein the plurality of hollow areas 121 are arranged in a rectangular array, and the hollow areas 121 arranged on the copper skin 12 of adjacent circuit board layers 11 are arranged in staggered positions.
[0027] The hollow areas 121 are uniformly distributed in the form of a rectangular array, which ensures that the flexible circuit board can be uniformly stressed in all directions, thereby maintaining good flexibility. When the flexible circuit board needs to be made into a multi-layer board, the hollow areas 121 of the copper skin 12 on adjacent circuit board layers 11 are designed to be arranged in staggered positions. This staggered arrangement further enhances the overall softness of the circuit board and avoids the problem of increased hardness caused by stacking solid copper skins 12.
[0028] In one embodiment, the distance between the two adjacent hollow areas 121 in the same row of the rectangular array is equal to the distance between the two adjacent hollow areas 121 in the same column of the rectangular array. The equal-interval layout not only makes the circuit board more neat and beautiful in appearance, but more importantly, it ensures that the circuit board can be uniformly stressed when bending and folding, avoiding deformation or damage caused by uneven stress, and greatly improving the reliability and service life of the circuit board.
[0029] In one embodiment, the length of the hollow area 121 is equal to the width of the hollow area 121, i.e., a square hollow area 121 design is adopted. This design not only simplifies the manufacturing process and reduces production costs, but more importantly, the square hollow area 121 allows the circuit board to better adapt to various deformations when bending and folding, thereby maintaining stable electrical performance and structural integrity. The square hollow area 121 design also allows the circuit board to more evenly distribute stress when subjected to external forces, further improving the strength and durability of the circuit board.
[0030] In one embodiment, the distance between the two adjacent hollow areas 121 in the same row of the rectangular array is equal to the length of the hollow area 121. This ensures that the circuit board can be uniformly stressed in the horizontal direction, avoiding bending and folding obstacles caused by uneven intervals.
[0031] The distance between two adjacent hollow areas 121 in the same column in the rectangular array is equal to the width of the hollow area 121. This ensures the uniformity of the force on the circuit board in the vertical direction, further improving the flexibility and stability of the bending and folding.
[0032] The length of the hollow area 121 is 2.5 mm, and the width of the hollow area 121 is 2.5 mm. The size of 2.5 mm not only ensures that the circuit board has enough flexibility when bending and folding, but also ensures that it can maintain enough structural strength when subjected to external force. The square hollow area 121 design not only simplifies the manufacturing process, but also enables the circuit board to more evenly disperse stress when dealing with various deformations, thereby prolonging the service life of the circuit board.
[0033] For example, a 4-layer flexible circuit board, the surface layers L1+L4 are respectively the trace layer and the power layer, and the inner layers L2+L3 are both paved with copper skin 12.
[0034] In the description of the present disclosure, it should be understood that the orientations or positional relationships indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present disclosure and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements indicated must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present disclosure.
[0035] In addition, the terms "first", "second" are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first", "second" can explicitly or implicitly include at least one of the features. In the description of the present disclosure, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise explicitly specified and limited.
[0036] In the present disclosure, unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connection", "fixing" and the like should be understood in a broad sense, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected or in communication with each other; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise explicitly limited. For those skilled in the art, the specific meaning of the above terms in the present disclosure can be understood according to the specific circumstances.
[0037] In the present disclosure, unless specifically stated and limited otherwise, a first feature "on" or "under" a second feature can be directly contacting the first and second features, or indirectly contacting the first and second features through an intermediate medium. Also, the first feature "over", "above" and "on top of" the second feature can be directly above or obliquely above the second feature, or simply means that the first feature is higher in horizontal level than the second feature. The first feature "under", "below" and "underneath" the second feature can be directly below or obliquely below the second feature, or simply means that the first feature is lower in horizontal level than the second feature.
[0038] In the present disclosure, the terms "one embodiment", "some embodiments", "an example", "a specific example", or "some examples" mean that the particular feature, structure, material, or characteristic following the term is included in at least one embodiment or example of the present disclosure. The illustrative appearances of the above terms in various places in the specification are not necessarily all referring to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics can be combined in any suitable manner in one or more embodiments or examples. Also, the terminology used has the meaning provided by the location and context in which it is used. Terms used in the present disclosure are not to be interpreted as being limited to their dictionary definitions.
[0039] Although the embodiments of the present disclosure have been shown and described above, it is to be understood that the above embodiments are merely exemplary, and are not to be interpreted as limiting the present disclosure, and the changes, modifications, substitutions and variations of the above embodiments made by those skilled in the art are within the scope of the present disclosure.
Claims
1. A flexible circuit board structure, characterized by, The circuit board body comprises a plurality of layers of circuit board, and a copper sheet is arranged on the inner layer of the circuit board, wherein a plurality of hollow areas are arranged on the copper sheet to form a grid structure, the hollow areas are arranged in a rectangular array, and the hollow areas arranged on the copper sheets of adjacent layers are staggered.
2. The flexible circuit board structure of claim 1, wherein, The distance between two adjacent hollow areas in the same row of the rectangular array is equal to the distance between two adjacent hollow areas in the same column of the rectangular array.
3. The flexible circuit board structure of claim 2, wherein, The length of the hollow area is equal to the width of the hollow area.
4. The flexible circuit board structure according to claim 1 or 3, wherein The distance between two adjacent hollow areas in the same row of the rectangular array is equal to the length of the hollow area.
5. The flexible circuit board structure of claim 4, wherein, The distance between two adjacent hollow areas in the same column of the rectangular array is equal to the width of the hollow area.
6. The flexible circuit board structure of claim 5, wherein, The length of the hollow area is 2.5 mm, and the width of the hollow area is 2.5 mm.