Heat dissipation structure for improving LDO power supply

Abstract

The utility model discloses a heat dissipation structure for improving an LDO power supply, which comprises a substrate and a silk-screen frame arranged on the substrate, a first area for placing the LDO power supply is defined by the silk-screen frame, a plurality of first heat dissipation via holes and a plurality of second heat dissipation via holes are arranged in the first area, the plurality of first heat dissipation via holes are arranged at equal intervals along the X-axis direction, and the plurality of second heat dissipation via holes are arranged at equal intervals along the X-axis direction. The second heat dissipation via holes are arranged at equal intervals in the X-axis direction, and in the Y-axis direction, each first heat dissipation via hole and each second heat dissipation via hole are arranged in a staggered mode. Specifically, a plurality of first heat dissipation via holes and a plurality of second heat dissipation via holes are formed in a substrate, and the first heat dissipation via holes and the second heat dissipation via holes are arranged at equal intervals in the X-axis direction and are staggered in the Y-axis direction, so that heat conduction paths are effectively increased, and heat can be rapidly conducted out from a heating source; and formation of local hot spots is reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of circuit board design more specifically, is related to a kind of heat dissipation structure for improving LDO power supply. BACKGROUND

[0002] In the circuit board design, the working principle of LDO power supply is to maintain the stability of output voltage through an internal feedback mechanism. Specifically, LDO contains a power adjustment element (usually MOSFET or BJT), which adjusts its conduction state according to the information provided by the feedback loop to ensure that the output voltage remains at a set value. When the output voltage tries to deviate from this set value, for example due to changes in load current or fluctuations in input voltage, the feedback loop detects this change and adjusts the operating point of the power adjustment element through an error amplifier to correct the output voltage.

[0003] Since LDO power supply adjusts the size of input voltage through the size of voltage feedback from output end to ensure that output voltage is constant, when increasing input voltage, the differential pressure becomes larger, and the transistor will be hot, which can easily lead to serious heating of LDO power supply, rising of internal junction temperature, and acceleration of aging process of semiconductor material in long-term high-temperature environment, thereby shortening the service life of LDO power supply. In addition, too high temperature may trigger the safety protection mechanism inside LDO power supply, such as overheat shutdown, which, although can prevent permanent damage, will cause the system to temporarily stop working and affect user experience.

[0004] In addition to having an impact on LDO power supply itself, its heat will also adversely affect electronic components around it. For example, passive components such as capacitors and resistors placed near LDO power supply may change their electrical characteristics due to temperature rise, or even fail. Especially in multi-layer PCB design, heat conduction may affect other components located away from LDO power supply. SUMMARY

[0005] In order to overcome the shortcomings of the prior art, the utility model provides a kind of heat dissipation structure for improving LDO power supply to solve the problem of poor heat dissipation effect of LDO power supply.

[0006] The technical solution of the utility model is as follows: a kind of heat dissipation structure for improving LDO power supply, including substrate and the silk screen frame being set on the substrate, the silk screen frame is surrounded and is formed with the first area for placing LDO power supply, the first area is provided with a plurality of first heat dissipation via holes and second heat dissipation via holes, a plurality of the first heat dissipation via holes are arranged along the X axis direction equidistantly, a plurality of the second heat dissipation via holes are arranged along the X axis direction equidistantly, and in Y axis direction, each first heat dissipation via hole and each second heat dissipation via hole are staggered.

[0007] Further, the first heat dissipation via hole has a diameter equal to that of the second heat dissipation via hole.

[0008] Further, the first heat dissipation via hole has a diameter equal to that of the second heat dissipation via hole.

[0009] Further, the substrate is provided with a copper plating area covering the first heat dissipation via holes and the second heat dissipation via holes, and the copper plating area is located in the first area.

[0010] Further, the center-to-center distance between two adjacent first heat dissipation via holes is greater than or equal to 50 mil.

[0011] Further, the center-to-center distance between two adjacent second heat dissipation via holes is greater than or equal to 50 mil.

[0012] Further, the number of first heat dissipation via holes is an odd number greater than or equal to 3, the number of second heat dissipation via holes is an even number greater than or equal to 2, and the number of first heat dissipation via holes is one more than the number of second heat dissipation via holes.

[0013] Further, the distance between the silk screen frame and the first heat dissipation via hole is greater than 10 mil, and the distance between the silk screen frame and the second heat dissipation via hole is greater than 10 mil.

[0014] Further, the silk screen frame is provided with a first GND pin pad on one side and an input pin pad, a second GND pin pad and an output pin pad on the other side.

[0015] The utility model has the advantages that:

[0016] (1) The heat dissipation structure for improving LDO power supply provided by the utility model comprises a substrate and a silk screen frame arranged on the substrate, the silk screen frame surrounds a first area for placing LDO power supply, a plurality of first heat dissipation via holes and second heat dissipation via holes are arranged in the first area, the plurality of first heat dissipation via holes are arranged at equal intervals along the X-axis direction, the plurality of second heat dissipation via holes are arranged at equal intervals along the X-axis direction, and each first heat dissipation via hole and each second heat dissipation via hole are arranged in a staggered manner in the Y-axis direction. Specifically, a plurality of first heat dissipation via holes and a plurality of second heat dissipation via holes are arranged on the substrate, and the plurality of first heat dissipation via holes and the plurality of second heat dissipation via holes are arranged at equal intervals along the X-axis direction and arranged in a staggered manner in the Y-axis direction, thereby effectively increasing the heat conduction path and ensuring that heat is rapidly conducted away from the heat source, reducing the formation of local hot spots.

[0017] (2) The heat dissipation structure for improving the LDO power supply, the plurality of first heat dissipation vias and the plurality of second heat dissipation vias are distributed in a staggered manner, thereby forming a uniform heat conduction network, which is helpful to quickly disperse heat, is helpful to heat transfer, and can promote heat dissipation and reduce temperature rise amplitude. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or prior art description will be briefly introduced as follows. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor on the basis of these drawings.

[0019] Figure 1 Figure 1 is a structural schematic diagram of the heat dissipation structure in the embodiment of the present application.

[0020] Figure 2 Figure 2 is another structural schematic diagram of the heat dissipation structure in the embodiment of the present application.

[0021] In the figure, 1 is a substrate, 2 is a silk screen frame, 3 is a first heat dissipation via, 4 is a second heat dissipation via, 5 is a copper area, 6 is a first GND pin pad, 7 is an input pin pad, 8 is a second GND pin pad, and 9 is an output pin pad. DETAILED DESCRIPTION

[0022] The embodiments of the present application will be further described in detail below in combination with the drawings and embodiments. The detailed description of the following embodiments and the drawings are used to exemplarily illustrate the principles of the present application, but cannot be used to limit the scope of the present application, that is, the present application is not limited to the described embodiments.

[0023] In order to better understand the present application, the present application will be further described below in combination with the drawings and embodiments:

[0024] The heat dissipation of the conventional LDO power supply mainly depends on the packaging material and the contact area with the PCB. However, the heat generated by the LDO power supply during operation is large, and it is difficult to effectively dissipate heat by relying on these methods alone.

[0025] Based on this, the present embodiment provides a heat dissipation structure for improving the LDO power supply, as shown in Figure 1As shown, the heat dissipation structure for improving the LDO power supply includes a substrate 1 and a silk screen frame 2 arranged on the substrate 1, the silk screen frame 2 surrounds a first area for placing the LDO power supply, a plurality of first heat dissipation vias 3 and a plurality of second heat dissipation vias 4 are arranged in the first area, the plurality of first heat dissipation vias 3 are arranged at equal intervals along the X-axis direction, the plurality of second heat dissipation vias 4 are arranged at equal intervals along the X-axis direction, and in the Y-axis direction, each first heat dissipation via 3 and each second heat dissipation via 4 are arranged staggered.

[0026] Specifically, by arranging the plurality of first heat dissipation vias 3 and the plurality of second heat dissipation vias 4, the heat conduction path of the LDO power supply can be increased, the plurality of first heat dissipation vias 3 and the plurality of second heat dissipation vias 4 are arranged at equal intervals along the X-axis direction and staggered in the Y-axis direction, thereby forming a uniform and dense heat conduction network, which helps to quickly disperse heat. This design allows heat to be transmitted not only through the heat sink in direct contact with the LDO power supply, but also through the "thermal bridge" formed by the plurality of first heat dissipation vias 3 and the plurality of second heat dissipation vias 4 to spread to a larger area, thereby improving the heat dissipation efficiency of the LDO power supply.

[0027] In some embodiments, the diameter of the first heat dissipation via 3 is equal to the diameter of the second heat dissipation via 4. Specifically, when the diameters of the first heat dissipation via 3 and the second heat dissipation via 4 are the same, the design process of the PCB can be greatly simplified. In the design stage, a uniform aperture specification is used, and there is no need to define multiple size parameters for different types of vias, reducing the design complexity and reducing the possibility of errors. In addition, in the manufacturing process, such design also reduces the difficulty of drilling process, and only one drill size is needed to complete the processing of the first heat dissipation via 3 and the second heat dissipation via 4, thereby improving production efficiency and reducing production cost.

[0028] It is worth mentioning that the diameters of the first heat dissipation via 3 and the second heat dissipation via 4 are the same. This design ensures that a consistent heat conduction path is provided throughout the first area. Since the heat conduction capacity of each heat dissipation via is basically the same, it avoids the situation that some areas are overheated while other areas are not cooled enough, which helps to maintain the working temperature stability of the LDO power supply and its surrounding components, especially in the case of high-density wiring, which helps to reduce the formation of local hot spots.

[0029] In some embodiments, the hole diameter of the first heat dissipation via hole 3 and the hole diameter of the second heat dissipation via hole 4 are both 12 mil. Specifically, it is verified through multiple experiments that the diameter of the first heat dissipation via hole 3 and the diameter of the second heat dissipation via hole 4 not only affect the heat conduction effect in the Z direction, but also, when the hole diameter of the first heat dissipation via hole 3 and the hole diameter of the second heat dissipation via hole 4 are too large, the heat conduction effect in the XY plane is destroyed, and the solder climbing problem is prone to occur in the reflow soldering process. Therefore, by designing the hole diameter of the first heat dissipation via hole 3 and the hole diameter of the second heat dissipation via hole 4 to be 12 mil, the heat conduction in the vertical direction can be maximized without affecting the planar heat conduction, thereby achieving the best heat dissipation effect.

[0030] In some embodiments, a copper plating area 5 is provided on the substrate 1, the copper plating area 5 covers the plurality of first heat dissipation via holes 3 and the plurality of second heat dissipation via holes 4, and the copper plating area 5 is located in the first area. Specifically, the design of the copper plating area 5 provides an efficient conduction path for heat. Copper is an excellent heat conducting material, and its thermal conductivity is much higher than that of most other metals. By providing a large-area copper plating area 5 on the substrate 1 and covering the plurality of first heat dissipation via holes 3 and the plurality of second heat dissipation via holes 4, a continuous heat conduction network can be formed. When the LDO power supply is working, the heat generated by the LDO power supply is first transmitted to the heat sink in direct contact with it, then transmitted to the copper plating layer, and then rapidly spread to the entire copper plating layer plane, and then conducted to the other side of the PCB board through the plurality of first heat dissipation via holes 3 and the plurality of second heat dissipation via holes 4, thereby greatly improving the heat dissipation effect.

[0031] Specifically, the center-to-center distance a between two adjacent first heat dissipation via holes 3 is greater than or equal to 50 mil; the center-to-center distance b between two adjacent second heat dissipation via holes 4 is greater than or equal to 50 mil.

[0032] In some embodiments, the number of first heat dissipation via holes 3 is an odd number greater than or equal to 3, the number of second heat dissipation via holes 4 is an even number greater than or equal to 2, and the number of first heat dissipation via holes 3 is one more than the number of second heat dissipation via holes 4.

[0033] Specifically, by setting different numbers of odd-numbered first heat dissipation via holes 3 and even-numbered second heat dissipation via holes 4, a more optimized heat conduction path can be formed on the substrate 1. The odd-numbered first heat dissipation via holes 3 can ensure that there is a center of symmetry in the X-axis direction, and the even-numbered second heat dissipation via holes 4 can provide symmetrical heat dissipation support on both sides. This layout not only improves the heat dissipation efficiency, but also avoids local heat accumulation.

[0034] It is worth mentioning that the design of odd first heat dissipation via holes 3 and even second heat dissipation via holes 4 can enhance the mechanical strength of the PCB while ensuring the heat dissipation effect. The symmetrical layout of the odd first heat dissipation via holes 3 can effectively disperse stress and prevent the substrate 1 from deforming or breaking due to local stress concentration. The odd first heat dissipation via holes 3 and the even second heat dissipation via holes 4 are distributed in a staggered manner, which can balance the stress distribution on both sides of the PCB without damaging the overall structure, and reduce the warping phenomenon caused by the difference in thermal expansion coefficient.

[0035] Referring to Figure 2 As shown, the distance c between the silk screen frame 2 and the first heat dissipation via hole 3 is greater than 10 mil, and the distance d between the silk screen frame 2 and the second heat dissipation via hole 4 is greater than 10 mil.

[0036] The improved heat dissipation structure of the LDO power supply provided in the embodiment is provided with a first GND pin pad 6 on one side of the silk screen frame 2, and an input pin pad 7, a second GND pin pad 8 and an output pin pad 9 on the other side of the silk screen frame 2.

[0037] It should be noted that the indicated orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship commonly used when the product of the application is used, or the orientation or positional relationship commonly understood by those skilled in the art, or the orientation or positional relationship commonly used when the product of the application is used, which is only for the convenience of describing the application and simplifying the description, and therefore cannot be understood as indicating or implying that the device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the application.

[0038] It should be understood that those skilled in the art can make improvements or changes based on the above description, and all such improvements and changes shall fall within the scope of the appended claims of the present application.

[0039] The above exemplary description of the present application is made in conjunction with the drawings, and it is obvious that the implementation of the present application is not limited to the above manner. Any improvement or change made by using the method concept and technical solution of the present application, or direct application of the concept and technical solution of the present application to other occasions without improvement, all fall within the scope of protection of the present application.

Claims

1. An improved heat dissipation structure for an LDO power supply, comprising: The application relates to a substrate and a silk screen frame arranged on the substrate, wherein the silk screen frame surrounds a first area for placing an LDO power supply, a plurality of first heat dissipation vias and a plurality of second heat dissipation vias are arranged in the first area, the plurality of first heat dissipation vias are arranged at equal intervals along an X-axis direction, the plurality of second heat dissipation vias are arranged at equal intervals along the X-axis direction, and each first heat dissipation via and each second heat dissipation via are arranged in a staggered manner in a Y-axis direction.

2. The heat dissipation structure for improving an LDO power supply according to claim 1, wherein: The aperture of the first heat dissipation via is equal to the aperture of the second heat dissipation via.

3. The heat dissipation structure for improving an LDO power supply of claim 1, wherein: The aperture of the first heat dissipation via and the aperture of the second heat dissipation via are both 12 mil.

4. The heat dissipation structure for improving an LDO power supply of claim 1, wherein: A copper area is arranged on the substrate, the copper area covers the plurality of first heat dissipation vias and the plurality of second heat dissipation vias, and the copper area is located in the first area.

5. The heat dissipation structure for improving an LDO power supply of claim 1, wherein: The center distance between two adjacent first heat dissipation vias is greater than or equal to 50 mil.

6. The heat dissipation structure for improving an LDO power supply according to claim 1, wherein: The center distance between two adjacent second heat dissipation vias is greater than or equal to 50 mil.

7. The heat dissipation structure for improving an LDO power supply of claim 1, wherein: The number of the first heat dissipation vias is an odd number greater than or equal to 3, the number of the second heat dissipation vias is an even number greater than or equal to 2, and the number of the first heat dissipation vias is one more than the number of the second heat dissipation vias.

8. The heat dissipation structure for improving an LDO power supply of claim 1, wherein: The distance between the silk screen frame and the first heat dissipation via is greater than 10 mil, and the distance between the silk screen frame and the second heat dissipation via is greater than 10 mil.

9. The heat dissipation structure for improving an LDO power supply of claim 1, wherein: A first GND pin pad is arranged on one side of the silk screen frame, and an input pin pad, a second GND pin pad and an output pin pad are arranged on the other side of the silk screen frame.

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