High-thermal-conductivity light-emitting diode

By introducing structures such as a heat-conducting base, heat sink, and heat-conducting rod into the light-emitting diode (LED), the problem of high-temperature damage caused by poor thermal conductivity of LEDs is solved, achieving effective heat management and improving the service life and reliability of the equipment.

CN223885593UActive Publication Date: 2026-02-06SHENZHEN YUANYANGHONG ELECTRONICS CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
CN202520238565.7
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-02-14
Publication Date
2026-02-06
Estimated Expiration
2035-02-14

AI Technical Summary

Technical Problem

Existing light-emitting diodes have poor thermal conductivity during use, and after prolonged operation, they generate a lot of heat inside, which can damage internal components.

Method used

A high thermal conductivity light-emitting diode was designed. By setting up a thermally conductive base shell, heat sink, thermally conductive rod and thermally conductive base plate, heat dissipation can be effectively achieved, and internal components can be prevented from being damaged by high temperature.

Benefits of technology

This effectively solves the high temperature problem caused by the poor thermal conductivity of light-emitting diodes, avoids damage to internal components, and improves the service life and reliability of the equipment.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN223885593U_ABST
    Figure CN223885593U_ABST
Patent Text Reader

Abstract

The utility model discloses a light-emitting diode with high thermal conductivity, which relates to the technical field of diodes and comprises a bottom plate, an epoxy resin package is arranged on the outer surface of the upper end of the bottom plate, a heat-conducting bottom shell is detachably connected to the outer surface of the lower end of the bottom plate, and a first pin and a second pin are arranged in the middle of the epoxy resin package. The first pin is located on one side of the second pin, a hollow panel is arranged on the outer wall of the heat conduction bottom shell, a positive electrode end and a negative electrode end are arranged in the epoxy resin package, and the positive electrode end is located on one side of the negative electrode end. According to the high-thermal-conductivity light-emitting diode, the arranged heat conduction bottom shell can be connected with the heat conduction rod through the cooling fin during use, the heat conduction bottom sheet connected with the other end of the heat conduction rod can help the positive electrode end and the negative electrode end conduct heat, and the situation that the positive electrode end and the negative electrode end generate high temperature when working for a long time can be avoided; and damage caused by heat influence can be avoided.
Need to check novelty before this filing date? Find Prior Art

Description

TECHNICAL FIELD

[0001] The utility model relates to diode technical field, concretely relates to a high thermal conductivity light emitting diode. BACKGROUND

[0002] Light emitting diode (LED) is a kind of solid-state semiconductor device that can convert electrical energy into light energy, it releases energy to emit light by electron and hole recombination, with high efficiency, energy saving, long service life and other characteristics.

[0003] Light emitting diode is widely used in lighting, display, communication and other fields, in the aspect of lighting, light emitting diode lamp has the characteristics of high efficiency and energy saving, gradually replaces traditional lighting equipment, in the aspect of display, light emitting diode is used for various display screens and indicator lights, in addition, light emitting diode is also applied to medical equipment, flat panel display, communication equipment and other fields, but the existing light emitting diode has certain inconvenience when using.

[0004] The existing light emitting diode has poor thermal conductivity when using, and a large amount of heat is generated inside after long time work, the existing light emitting diode has general thermal conductivity, and the heat can easily cause internal components to be damaged, so there is certain inconvenience when using.

[0005] Therefore, we propose a high thermal conductivity light emitting diode. CONTENT OF UTILITY MODEL

[0006] The main purpose of the utility model is to provide a high thermal conductivity light emitting diode, which can effectively solve the problems in the background art.

[0007] To achieve the above purpose, the technical scheme adopted by the utility model is:

[0008] A high thermal conductivity light emitting diode, including bottom plate, the upper end outer surface of the bottom plate is provided with epoxy resin package, the lower end outer surface of the bottom plate is detachably connected with heat-conducting bottom shell, the middle part of the epoxy resin package is provided with first pin and second pin, the first pin is located on one side of the second pin, the outer wall of the heat-conducting bottom shell is provided with hollow panel, the inside of the epoxy resin package is provided with positive terminal and negative terminal, the positive terminal is located on one side of the negative terminal, the outer surface of one end of the negative terminal is provided with reflecting cap, the middle part of the reflecting cap is provided with LED chip, the LED chip and the positive terminal are provided with lead wire, the lower end outer surface of the positive terminal and the negative terminal is provided with heat-conducting bottom sheet, the lower end outer surface of the heat-conducting bottom sheet is provided with heat-conducting rod, the bottom end of the heat-conducting bottom shell is provided with perforation and fin, and the perforation is located on both sides of the fin.

[0009] Preferably, the middle part of the bottom plate is provided with a butt joint groove, the middle part of the heat-conducting bottom shell is provided with a butt joint rod, the outer wall of the butt joint rod is provided with a butt joint cap, and the outer wall of the butt joint cap is provided with a limiting rod.

[0010] Preferably, the bottom plate is integrally formed with the epoxy resin package, and the LED chip is electrically connected with the positive electrode end through a lead wire.

[0011] Preferably, the heat-conducting rod penetrates to the middle part of the heat-conducting bottom shell, and one end of the heat-conducting rod is connected with the heat-dissipating fin.

[0012] Preferably, the heat-conducting bottom shell is integrally formed with the through hole, the first pin is connected with the positive electrode end, the second pin is connected with the negative electrode end, and the first pin and the second pin both penetrate the heat-conducting bottom shell through the through hole.

[0013] Preferably, the bottom plate is integrally formed with the butt joint groove, and the butt joint rod is threadedly connected with the butt joint cap.

[0014] Compared with the prior art, the heat-conducting bottom shell of the utility model has the advantages of the following beneficial effects:

[0015] The heat-conducting bottom shell is connected with the heat-dissipating fin through the heat-conducting rod, the heat-conducting bottom fin connected with the other end of the heat-conducting rod can help the positive electrode end and the negative electrode end to conduct heat, the high-temperature condition of the positive electrode end and the negative electrode end during long-time work can be avoided, and damage caused by heat can be avoided; the bottom plate can be connected with the butt joint rod through the butt joint groove during use, the butt joint rod can be fastened through the butt joint cap, and therefore the fixed installation between the bottom plate and the heat-conducting bottom shell can be completed, and the bottom plate can be conveniently disassembled and used. BRIEF DESCRIPTION OF DRAWINGS

[0016] Fig. 1 It is a whole structure schematic view of the utility model;

[0017] Fig. 2 It is an internal structure view of the epoxy resin package of the utility model;

[0018] Fig. 3 It is a structure view of the heat-conducting bottom shell of the utility model.

[0019] In the drawing: 1, bottom plate; 2, epoxy resin package; 3, heat-conducting bottom shell; 4, first pin; 5, second pin; 6, hollow panel; 7, butt joint groove; 8, positive electrode end; 9, negative electrode end; 10, reflecting cap; 11, LED chip; 12, lead wire; 13, heat-dissipating fin; 14, heat-conducting rod; 15, butt joint rod; 16, butt joint cap; 17, limiting rod; 18, through hole; 19, heat-dissipating fin. DETAILED DESCRIPTION

[0020] In order to make the technical personnel of the prior art better understand the technical scheme of the present application, the present application will be further described in detail below with reference to the drawings.

[0021] As Figs. 1-3 The utility model discloses a high thermal conductivity light emitting diode, including the bottom plate 1, the upper end outer surface of bottom plate 1 is provided with epoxy resin package 2, the lower end outer surface of bottom plate 1 is detachably connected with the heat conduction bottom shell 3, the middle part of epoxy resin package 2 is provided with first pin 4 and second pin 5, first pin 4 is located one side of second pin 5, the outer wall of heat conduction bottom shell 3 is provided with openwork panel 6, the inside of epoxy resin package 2 is provided with positive terminal 8 and negative terminal 9, positive terminal 8 is located one side of negative terminal 9, the outer surface of one end of negative terminal 9 is provided with reflection cap 10, the middle part of reflection cap 10 is provided with LED chip 11, and the wire 12 is arranged between LED chip 11 and positive terminal 8, the outer surface of the lower end of positive terminal 8 and negative terminal 9 is provided with heat conduction bottom piece 13, the outer surface of the lower end of heat conduction bottom piece 13 is provided with heat conduction rod 14, the bottom end of heat conduction bottom shell 3 is provided with perforation 18 and fin 19, and perforation 18 is located on both sides of fin 19.

[0022] Specifically, in the embodiment, including bottom plate 1, the upper end outer surface of bottom plate 1 is provided with epoxy resin package 2, the lower end outer surface of bottom plate 1 is detachably connected with the heat conduction bottom shell 3, the heat conduction bottom shell 3 can be connected with the heat conduction rod 14 through the fin 19 when in use, the heat conduction bottom piece 13 connected to the other end of the heat conduction rod 14 can help the positive terminal 8 and the negative terminal 9 to conduct heat, can avoid the high temperature of the positive terminal 8 and the negative terminal 9 when working for a long time, can avoid damage caused by heat, the middle part of the epoxy resin package 2 is provided with first pin 4 and second pin 5, first pin 4 is located one side of second pin 5, the outer wall of heat conduction bottom shell 3 is provided with openwork panel 6, the inside of epoxy resin package 2 is provided with positive terminal 8 and negative terminal 9, positive terminal 8 is located one side of negative terminal 9, the outer surface of one end of negative terminal 9 is provided with reflection cap 10, the middle part of reflection cap 10 is provided with LED chip 11, and the wire 12 is arranged between LED chip 11 and positive terminal 8, the outer surface of the lower end of positive terminal 8 and negative terminal 9 is provided with heat conduction bottom piece 13, the outer surface of the lower end of heat conduction bottom piece 13 is provided with heat conduction rod 14, the bottom end of heat conduction bottom shell 3 is provided with perforation 18 and fin 19, and perforation 18 is located on both sides of fin 19.

[0023] The utility model provides a high thermal conductivity light emitting diode, sets up the heat conduction bottom shell 3, and the heat conduction bottom shell 3 can be connected with the heat conduction rod 14 through the fin 19 when in use, the heat conduction bottom piece 13 connected to the other end of the heat conduction rod 14 can help the positive terminal 8 and the negative terminal 9 to conduct heat, can avoid the high temperature of the positive terminal 8 and the negative terminal 9 when working for a long time, can avoid damage caused by heat.

[0024] In one embodiment of the utility model, the middle part of the bottom plate 1 is provided with a butt joint groove 7, the middle part of the heat-conducting bottom shell 3 is provided with a butt joint rod 15, the outer wall of the butt joint rod 15 is provided with a butt joint cap 16, the outer wall of the butt joint cap 16 is provided with a limiting rod 17, the bottom plate 1 can be butt jointed with the butt joint rod 15 through the butt joint groove 7 during use, the butt joint rod 15 can be limited and fastened through the butt joint cap 16, so that the fixed installation between the bottom plate 1 and the heat-conducting bottom shell 3 can be completed, and the use of disassembly and assembly is facilitated.

[0025] In another embodiment of the utility model, the bottom plate 1 and the epoxy resin package 2 are integrally formed, the LED chip 11 is electrically connected with the positive electrode end 8 through the wire 12, and the wire 12 mainly plays the effect of connecting conduction.

[0026] In still another embodiment of the utility model, the heat-conducting rod 14 penetrates to the middle part of the heat-conducting bottom shell 3, one end of the heat-conducting rod 14 is connected with the heat dissipation fin 19, and the heat dissipation fin 19 can help the heat-conducting rod 14 to dissipate heat during use.

[0027] In one embodiment of the utility model, the heat-conducting bottom shell 3 and the perforation 18 are integrally formed, the first pin 4 is connected with the positive electrode end 8, the second pin 5 is connected with the negative electrode end 9, and the first pin 4 and the second pin 5 both penetrate the heat-conducting bottom shell 3 through the perforation 18, and the perforation 18 facilitates the first pin 4 and the second pin 5 to penetrate and lead out.

[0028] In another embodiment of the utility model, the bottom plate 1 and the butt joint groove 7 are integrally formed, the butt joint rod 15 is threadedly connected with the butt joint cap 16, and the butt joint cap 16 can play the effect of locking and limiting through the limiting rod 17 during use.

[0029] It should be noted that the utility model is a high-heat-conducting light-emitting diode, the bottom plate 1 can be butt jointed with the butt joint rod 15 through the butt joint groove 7 during use, the position of the butt joint cap 16 on the butt joint rod 15 can be adjusted during butt joint, the position of the butt joint cap 16 corresponds to that of the butt joint groove 7, when the butt joint cap 16 penetrates the butt joint groove 7, the butt joint cap 16 can be rotated to be fastened through the limiting rod 17, so that the fixed installation between the bottom plate 1 and the heat-conducting bottom shell 3 is completed, the heat dissipation fin 19 on the heat-conducting bottom shell 3 is connected with the heat-conducting rod 14, when the positive electrode end 8 and the negative electrode end 9 generate high temperature during use, the heat-conducting bottom sheet 13 can help the positive electrode end 8 and the negative electrode end 9 to conduct heat, heat can be conducted outward through the heat-conducting rod 14, the hollow panel 6 can ventilate and cool during the process of conduction, the heat dissipation fin 19 can help the heat-conducting rod 14 to dissipate heat, so that the high-temperature condition of the positive electrode end 8 and the negative electrode end 9 during long-time work can be avoided, damage caused by heat can be avoided, and the utility model is practical.

[0030] The basic principle, main features and advantages of the present application are shown and described above. It should be understood by those skilled in the art that the present application is not limited by the above examples, and the above examples and descriptions in the specification are only preferred examples of the present application and are not intended to limit the present application. Without departing from the spirit and scope of the present application, various changes and improvements can be made to the present application, and these changes and improvements all fall within the scope of the claimed present application. The scope of protection of the present application is defined by the appended claims and their equivalents.

Claims

1. A high heat conductive light emitting diode comprising a base plate (1), characterized in that: The upper end outer surface of the bottom plate (1) is provided with an epoxy resin package (2), the lower end outer surface of the bottom plate (1) is detachably connected with a heat-conducting bottom shell (3), the middle part of the epoxy resin package (2) is provided with a first pin (4) and a second pin (5), the first pin (4) is located on one side of the second pin (5), the outer wall of the heat-conducting bottom shell (3) is provided with a hollow panel (6), the inside of the epoxy resin package (2) is provided with a positive terminal (8) and a negative terminal (9), the positive terminal (8) is located on one side of the negative terminal (9), the outer surface of one end of the negative terminal (9) is provided with a reflecting cap (10), the middle part of the reflecting cap (10) is provided with an LED chip (11), the LED chip (11) and the positive terminal (8) are provided with a wire (12), the lower end outer surface of the positive terminal (8) and the negative terminal (9) is provided with a heat-conducting bottom sheet (13), the lower end outer surface of the heat-conducting bottom sheet (13) is provided with a heat-conducting rod (14), the bottom end of the heat-conducting bottom shell (3) is provided with a perforation (18) and a heat sink (19), the perforation (18) is located on both sides of the heat sink (19).

2. The high thermal conductivity light emitting diode of claim 1, wherein: The middle part of the bottom plate (1) is provided with a butt joint groove (7), the middle part of the heat-conducting bottom shell (3) is provided with a butt joint rod (15), the outer wall of the butt joint rod (15) is provided with a butt joint cap (16), the outer wall of the butt joint cap (16) is provided with a limiting rod (17).

3. The high thermal conductivity light emitting diode of claim 1, wherein: The bottom plate (1) and the epoxy resin package (2) are integrally formed, the LED chip (11) is electrically connected with the positive terminal (8) through the wire (12).

4. The high thermal conductivity light emitting diode of claim 1, wherein: The heat-conducting rod (14) penetrates to the middle part of the heat-conducting bottom shell (3), one end of the heat-conducting rod (14) is connected with the heat sink (19).

5. The high thermal conductivity light emitting diode of claim 1, wherein: The heat-conducting bottom shell (3) and the perforation (18) are integrally formed, the first pin (4) is connected with the positive terminal (8), the second pin (5) is connected with the negative terminal (9), the first pin (4) and the second pin (5) penetrate the heat-conducting bottom shell (3) through the perforation (18).

6. The high thermal conductivity light emitting diode of claim 2, wherein: The bottom plate (1) and the butt joint groove (7) are integrally formed, the butt joint rod (15) and the butt joint cap (16) are screw connected.