Electronic packaging module convenient for heat dissipation

Abstract

The utility model discloses an electronic packaging module convenient for heat dissipation, which relates to the technical field of electronic component packaging, and comprises a body, a top cover, a heat dissipation mechanism and a quick assembly mechanism, the top cover is fixedly arranged at the top of the body, and the two ends of the top cover are in threaded connection with fixing bolts; the inner wall of the body is fixedly provided with a heat dissipation mechanism used for conducting heat dissipation on the electronic packaging module, and the inner wall of the body is fixedly provided with a rapid installation mechanism used for rapidly installing the electronic module. According to the utility model, the driving motor drives the cooling fan to rotate at a high speed, the fan blades generate negative pressure airflow, and the heat of the electronic module is forcibly discharged to the outside of the body through the base cooling port; the heat dissipation openings and the flow channels are designed to form a directional air guide path, airflow is guided to be efficiently guided out, performance degradation or element damage caused by high temperature is effectively avoided, the long-term operation stability of the system is remarkably improved, meanwhile, the heat dissipation structure design is simplified, and the maintenance cost is reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to electronic component packaging technical field, concretely is an electronic packaging module convenient for heat dissipation. BACKGROUND

[0002] Electronic packaging module is the core interface of integrated circuit and external system, through the protection chip, realizes three big functions such as electrical connection and optimization heat dissipation, supports the stable operation of electronic equipment. In the continuous development of electronic equipment, electronic component performance is increasingly powerful, and the heat dissipation problem is increasingly serious, and the traditional electronic packaging module has many deficiencies in heat dissipation. Single heat dissipation structure, mostly using simple heat dissipation fin, and the contact area of electronic component is limited and the heat dissipation efficiency is low, which is difficult to meet the heat dissipation demand of high-power component.

[0003] Based on this, an electronic packaging module convenient for heat dissipation is provided, which can eliminate the disadvantages of the existing device. UTILITY MODEL CONTENT

[0004] The utility model aims at providing an electronic packaging module convenient for heat dissipation to solve the problem of inconvenient heat dissipation of electronic packaging module in the background art.

[0005] To achieve the above object, the utility model provides the following technical scheme:

[0006] An electronic packaging module convenient for heat dissipation, comprising: a body, a top cover, a heat dissipation mechanism and a quick mounting mechanism, the top cover is fixedly arranged on the top of the body, both ends of the top cover are threadedly connected with fixing bolts, the inner wall of the body is fixedly provided with the heat dissipation mechanism for heat dissipation of the electronic packaging module, and the inner wall of the body is fixedly provided with the quick mounting mechanism for quick mounting of the electronic module.

[0007] On the basis of the above technical scheme, the utility model further provides the following optional technical scheme:

[0008] In an optional scheme, the heat dissipation mechanism comprises a base fixedly arranged on the inner wall of the body, the inner wall of the base is fixedly provided with a heat dissipation fan, the top of the base is fixedly provided with a driving motor, the output end of the driving motor is fixedly connected with the central shaft of the heat dissipation fan, and the bottom of the body is fixedly provided with a heat dissipation port.

[0009] In an optional scheme, the quick mounting mechanism comprises a pin support fixedly arranged on the inner wall of the body, the bottom of the pin support is fixedly provided with a pin, the inner wall of the body is fixedly provided with a mounting plate, and the top of the mounting plate is fixedly provided with a substrate.

[0010] In an optional scheme, the top of the substrate is provided with a locking mechanism for locking the substrate on the mounting plate.

[0011] In an optional scheme, the locking mechanism comprises a fixing sleeve arranged on the top of the base plate, a limiting plate fixedly arranged outside the fixing sleeve, a button slidingly arranged on the inner wall of the fixing sleeve, a sliding rod slidingly connected with the fixing sleeve and fixedly arranged at the bottom end of the button, a reset spring fixedly arranged at the bottom of the button and outside the sliding rod, and a wedge-shaped block fixedly arranged at the bottom end of the sliding rod.

[0012] In an optional scheme, the top of the base plate is provided with a mounting bracket facilitating the mounting of the driving motor, and the heat dissipation opening is fixedly provided with heat dissipation fins.

[0013] In an optional scheme, the top of the top cover is provided with a mounting hole matched with the pin, and the top of the mounting plate is filled with epoxy resin.

[0014] In an optional scheme, the fixing sleeve penetrates the top of the base plate and the mounting plate in sequence and extends to the bottom of the mounting plate, and the top of the wedge-shaped block is provided with an extrusion slope matched with the locking baffle.

[0015] Compared with the prior art, the utility model has the advantages as follows:

[0016] 1. The driving motor drives the heat dissipation fan to rotate at high speed, the fan blade generates negative pressure airflow, the heat of the electronic module is forced to be discharged to the outside of the body through the base plate heat dissipation opening, the heat dissipation opening and the flow channel form a directional air guide path, the airflow is guided to be discharged efficiently, the performance decay or element damage caused by high temperature is avoided effectively, the long-term operation stability of the system is improved obviously, the heat dissipation structure design is simplified, and the maintenance cost is reduced.

[0017] 2. The fixing sleeve is inserted into the mounting hole by pressing the button, the sliding rod is pushed by the reset spring after the button is loosened, the wedge-shaped block is driven to move upwards, the extrusion slope of the wedge-shaped block forces the locking baffle to be expanded radially and clamped into the limiting groove of the mounting hole to realize locking, the fixing sleeve can be pulled out by pressing the button again when unlocking, and the installation efficiency and equipment operation reliability are improved. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 It is a structural schematic view of the utility model.

[0019] Figure 2 It is a structural schematic view of the bottom of the utility model.

[0020] Figure 3 It is a structural schematic view of the heat dissipation mechanism in the utility model.

[0021] Figure 4 It is a structural schematic view of the base plate in the utility model.

[0022] Figure 5 It is a structural schematic view of the locking baffle in the utility model.

[0023] Reference signs annotation: 1, the body; 2, top cover; 3, fixed bolt; 4, base; 5, cooling fan; 6, drive motor; 7, heat dissipation port; 8, pin support; 9, pin; 10, mounting plate; 11, base plate; 12, fixed sleeve; 13, limiting plate; 14, button; 15, sliding rod; 16, reset spring; 17, wedge block; 18, locking baffle. DETAILED DESCRIPTION

[0024] In order to make the purpose, technical scheme and advantages of the utility model more clearly, the following will be further detailed with the drawings and examples.

[0025] In one embodiment, as shown in Figures 1-5 A kind of electronic packaging module facilitating heat dissipation, including: body 1, top cover 2, heat dissipation mechanism and quick mounting mechanism, top cover 2 is fixedly arranged at the top of body 1, both ends of top cover 2 are threadedly connected with fixed bolt 3, the inner wall of body 1 is fixedly provided with heat dissipation mechanism for the heat dissipation of electronic packaging module, the inner wall of body 1 is fixedly provided with quick mounting mechanism for the quick installation of electronic module.

[0026] By sleeving top cover 2 to the top of body 1, then screwing the fixed bolt 3 of both sides to lock top cover 2 at the top of body 1.

[0027] In one embodiment, as shown in Figure 2 And Figure 3 Heat dissipation mechanism includes base 4 fixedly arranged in the inner wall of body 1, the inner wall of base 4 is fixedly provided with cooling fan 5, the top of base 4 is fixedly provided with drive motor 6, the output end of drive motor 6 is fixedly connected with the central shaft of cooling fan 5, the bottom of body 1 is fixedly provided with heat dissipation port 7.

[0028] The top of base 4 is provided with mounting bracket for the installation of drive motor 6, and heat dissipation fin is fixedly arranged on heat dissipation port 7. The output end of drive motor 6 is rotated to drive cooling fan 5 to rotate, so as to generate negative pressure, and the heat generated by electronic module is guided to the outside of body 1 through heat dissipation port 7 through the mounting bracket on base 4, so as to achieve the effect of heat dissipation of electronic module.

[0029] In one embodiment, as shown in Figure 4 And Figure 5 Quick mounting mechanism includes pin support 8 fixedly arranged in the inner wall of body 1, pin 9 is fixedly arranged at the bottom of pin support 8, mounting plate 10 is fixedly arranged in the inner wall of body 1, base plate 11 is fixedly arranged at the top of mounting plate 10, locking mechanism for locking base plate 11 on mounting plate 10 is arranged at the top of base plate 11.

[0030] The top of the top cover 2 is provided with a mounting hole matched with the pin 9, so as to avoid interference between the pin 9 and the top cover 2, and facilitate installation of the electronic module; the top of the mounting plate 10 is filled with epoxy resin to form a sealing layer, so that the epoxy resin can block the invasion of moisture, dust and the like, and avoid chip corrosion or short circuit.

[0031] The locking mechanism comprises a fixing sleeve 12 arranged at the top of the base plate 11, a limiting plate 13 fixedly arranged outside the fixing sleeve 12, a button 14 slidingly arranged on the inner wall of the fixing sleeve 12, a sliding rod 15 slidingly connected with the fixing sleeve 12 and fixedly arranged at the bottom end of the button 14, a reset spring 16 fixedly arranged at the bottom of the button 14 and outside the sliding rod 15, a wedge-shaped block 17 fixedly arranged at the bottom end of the sliding rod 15, and a locking baffle 18 rotatably arranged at the bottom end of the fixing sleeve 12 and matched with the wedge-shaped block 17.

[0032] The fixing sleeve 12 penetrates the top of the base plate 11 and the mounting plate 10 in sequence and extends to the bottom of the mounting plate 10, and the top of the wedge-shaped block 17 is provided with an extrusion slope matched with the locking baffle 18. When the wedge-shaped block 17 moves upward under the rebound of the reset spring 16, the extrusion slope on the wedge-shaped block 17 extrudes the locking baffle 18, so that the locking baffle 18 spreads around, thereby limiting the mounting hole arranged on the mounting plate 10.

[0033] By pressing the button 14 and installing the fixing sleeve 12 into the mounting hole of the mounting plate 10 and the base plate 11, after the button 14 is released, the reset spring 16 drives the sliding rod 15 to reset, so that the wedge-shaped block 17 moves upward, the extrusion slope on the wedge-shaped block 17 extrudes the locking baffle 18, so that the locking baffle 18 spreads around, thereby limiting the mounting hole arranged on the mounting plate 10, and the base plate 11 is locked and mounted on the mounting plate 10. When unlocking is needed, the button 14 is pressed and the fixing sleeve 12 is pulled out to release the locking.

[0034] The above embodiment discloses an electronic packaging module convenient for heat dissipation, wherein after the driving motor 6 is started, the output shaft directly drives the heat dissipation fan 5 to rotate at high speed, and the negative pressure airflow generated by the fan blade forcibly discharges the heat accumulated during the operation of the electronic module to the outside of the body 1 through the heat dissipation port 7 of the base 4. The heat dissipation port 7 and the flow channel of the mounting bracket form a directional air guide path, which ensures efficient heat dissipation and avoids performance degradation or damage of electronic components caused by high temperature, thereby significantly improving system stability; by pressing the button 14 and inserting the fixing sleeve 12 into the mounting hole of the mounting plate 10 and the base plate 11, after the button 14 is released, the reset spring 16 pushes the sliding rod 15 to reset, drives the wedge-shaped block 17 to move upward, and the extrusion slope forces the locking baffle 18 to radially expand and be clamped into the limiting groove of the mounting hole, thereby completing the rigid locking of the base plate 11, and the fixing sleeve 12 can be pulled out by pressing the button 14 when unlocking.

[0035] The above merely provides the specific implementation of the present application, but the protection scope of the present application is not limited to this. Any person skilled in the art can easily think of the changes or replacements within the technical range disclosed by the present application, which should be covered in the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. An electronic package module that facilitates heat dissipation, comprising: The body (1), the top cover (2), the heat dissipation mechanism and the quick mounting mechanism; the top cover (2) is fixedly arranged on the top of the body (1), both ends of the top cover (2) are threadedly connected with fixing bolts (3), the inner wall of the body (1) is fixedly provided with a heat dissipation mechanism for dissipating heat of the electronic packaging module, and the inner wall of the body (1) is fixedly provided with a quick mounting mechanism for quickly mounting the electronic module.

2. The electronic package module of claim 1, wherein, The heat dissipation mechanism comprises a base (4) fixedly arranged on the inner wall of the body (1), the inner wall of the base (4) is fixedly provided with a heat dissipation fan (5), the top of the base (4) is fixedly provided with a driving motor (6), the output end of the driving motor (6) is fixedly connected with the central shaft of the heat dissipation fan (5), and the bottom of the body (1) is fixedly provided with a heat dissipation opening (7).

3. The electronic package module of claim 2, wherein, The quick mounting mechanism comprises a pin support (8) fixedly arranged on the inner wall of the body (1), the bottom of the pin support (8) is fixedly provided with a pin (9), the inner wall of the body (1) is fixedly provided with a mounting plate (10), and the top of the mounting plate (10) is fixedly provided with a substrate (11).

4. The electronic package module of claim 3, wherein, The top of the substrate (11) is provided with a locking mechanism for locking the substrate (11) on the mounting plate (10).

5. The electronic package module of claim 4, wherein, The locking mechanism comprises a fixing sleeve (12) arranged on the top of the substrate (11), the outer portion of the fixing sleeve (12) is fixedly provided with a limiting plate (13), the inner wall of the fixing sleeve (12) is slidably provided with a button (14), the bottom end of the button (14) is fixedly provided with a sliding rod (15) in sliding connection with the fixing sleeve (12), the bottom of the button (14) and the outer surface of the sliding rod (15) are fixedly provided with a reset spring (16), the bottom end of the sliding rod (15) is fixedly provided with a wedge-shaped block (17), and the bottom end of the fixing sleeve (12) is rotatably provided with a locking baffle (18) matched with the wedge-shaped block (17).

6. The electronic package module of claim 2, wherein, The top of the base (4) is provided with a mounting bracket facilitating mounting of the driving motor (6), and the heat dissipation opening (7) is fixedly provided with heat dissipation fins.

7. The electronic package module of claim 3, wherein, The top of the top cover (2) is provided with a mounting hole matched with the pin (9), and the top of the mounting plate (10) is filled with epoxy resin.

8. The electronic package module of claim 5, wherein, The fixing sleeve (12) penetrates the top of the substrate (11) and the mounting plate (10) in sequence and extends to the bottom of the mounting plate (10), and the top of the wedge-shaped block (17) is provided with an extrusion slope matched with the locking baffle (18).

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