Polishing device for precision electronic part machining

Abstract

The utility model discloses a polishing device for precision electronic part machining, which comprises a polishing base, a middle column is fixedly mounted in the middle of the polishing base, a polishing assembly is arranged on the middle column, a top disc is mounted at the top of the polishing base through a rotary sliding assembly, and a plurality of placing grooves are formed in the top disc. According to the polishing device for precision electronic part machining, the part body needing to be polished is placed in the containing groove, a rotary sliding assembly is arranged, the top disc is driven to rotate, the part body is placed in the containing groove, the pressing plate is arranged in the containing groove, and the movable extrusion assembly is arranged between the pressing plate and the middle column. And through the arranged movable extrusion assembly, in the rotating process, an arc-shaped fixing block and an arc-shaped pushing block are in contact extrusion, so that a pressing plate is driven to move, and automatic pressing operation on the placed part body is achieved.

Description

Technical Field

[0001] This utility model relates to the field of electronic component processing technology, and in particular to a grinding device for precision electronic component processing. Background Technology

[0002] Electronic components are the various basic components used in electronic circuits, including electronic elements and electronic devices. Electronic elements refer to products whose molecular composition of raw materials is not changed during the production process, such as resistors, capacitors, and inductors. Electronic devices, on the other hand, are products whose molecular structure of raw materials is changed during the production process, such as transistors and integrated circuits. During the processing of electronic components, polishing tools are used to polish the surface of the components to remove impurities and burrs. After polishing, electronic components become more precise.

[0003] Traditionally, when polishing the surface of electronic components, workers manually place the components, clamp them with clamping tools, and then polish them using polishing equipment. Polishing a single component requires multiple steps, which is cumbersome and time-consuming. Polishing the same batch of components adds a lot of time. Therefore, a polishing device for precision electronic component processing is proposed. Utility Model Content

[0004] To address the shortcomings of existing technologies, this utility model provides a grinding device for precision electronic component processing, which solves the aforementioned problems.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A grinding device for precision electronic component processing includes a grinding base, a central column fixedly installed in the middle of the grinding base, a grinding component disposed on the central column, a top plate mounted on the top of the grinding base via a rotating sliding component, a plurality of placement slots opened on the top plate, on which component bodies are placed, a pressure plate disposed in the placement slot, and a movable pressing component disposed between the pressure plate and the central column.

[0007] Preferably, the rotary sliding assembly includes an annular groove formed on the top of the grinding base, and a rotating ring is fixedly installed on the bottom of the top plate, the rotating ring being rotatably installed in the annular groove.

[0008] Preferably, a drive motor is fixedly installed on the top of the grinding base, and a rotating gear is connected to the output end of the drive motor. A rack is fixedly installed on the inner wall of the rotating ring. The rack is arranged in a ring structure, and the rotating gear meshes with the rack.

[0009] Preferably, the polishing assembly includes a top cover fixedly installed on the top of the intermediate column, a telescopic cylinder installed on the top cover, a polishing motor connected to the output end of the telescopic cylinder, a polishing disc connected to the output end of the polishing motor, and the polishing disc located above the placement groove.

[0010] Preferably, the movable extrusion assembly includes a movable hole formed in the inner wall of the placement groove, a movable rod is movably installed in the movable hole, and one end of the movable rod is fixedly connected to the side of the pressing plate.

[0011] Preferably, an arc-shaped push block is fixedly installed at the end of the moving rod, and a return spring is fixedly installed between the arc-shaped push block and the side wall of the top plate.

[0012] Preferably, an arc-shaped fixing block is fixedly installed on one side of the intermediate column, and the arc-shaped fixing block is adapted to the arc-shaped pushing block.

[0013] Compared with the prior art, the beneficial effects of this utility model are as follows: the grinding device for precision electronic component processing places the component body to be ground in the placement slot, and the operator is configured to place and pick up the component body. The rotating sliding component drives the top plate to rotate, thereby causing the placed component body to rotate and move. The moving pressing component, during the rotation, the arc-shaped fixed block and the arc-shaped pushing block contact and press, thereby driving the pressing plate to move, and realizing automatic pressing operation on the placed component body.

[0014] The grinding component is equipped with a grinding disc that can deburr and grind the clamped parts. Through slow rotation, it can automatically clamp and grind without the need for manual clamping, reducing the clamping time. At the same time, the grinding is carried out in a rotary production line manner, making the grinding speed faster. Attached Figure Description

[0015] Figure 1 This is a three-dimensional structural diagram of the present invention viewed from the left side;

[0016] Figure 2 This is a three-dimensional structural diagram of the present invention viewed from the right side;

[0017] Figure 3 This is a cross-sectional structural diagram of the present invention;

[0018] Figure 4 This utility model Figure 3 A schematic diagram of the structure of part A.

[0019] In the diagram: 1. Grinding base; 2. Intermediate column; 3. Top cover; 4. Telescopic cylinder; 5. Grinding motor; 6. Grinding disc; 7. Annular groove; 8. Rotating ring; 9. Top plate; 10. Placement groove; 11. Component body; 12. Drive motor; 13. Rotating gear; 14. Rack; 15. Moving hole; 16. Moving rod; 17. Pressure plate; 18. Arc-shaped push block; 19. Return spring; 20. Arc-shaped fixing block. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0021] Example: Refer to Figure 1-4 A grinding device for precision electronic component processing includes a grinding base 1, a central column 2 fixedly installed in the middle of the grinding base 1, a grinding component on the central column 2, a top plate 9 mounted on the top of the grinding base 1 via a rotating sliding component, a plurality of placement slots 10 opened on the top plate 9, on which component bodies 11 are placed. The component body 11 to be ground is placed in the placement slot 10 on the top plate 9. There are multiple placement slots 10, and 1 to 2 workers are configured to place and retrieve the component body 11. A pressure plate 17 is provided in the placement slot 10, and a moving pressing component is provided between the pressure plate 17 and the central column 2.

[0022] Specifically, the rotating sliding assembly includes an annular groove 7 formed on the top of the grinding base 1, a rotating ring 8 fixedly installed on the bottom of the top plate 9, the rotating ring 8 being rotatably installed in the annular groove 7, a drive motor 12 fixedly installed on the top of the grinding base 1, a rotating gear 13 connected to the output end of the drive motor 12, and a rack 14 fixedly installed on the inner wall of the rotating ring 8, the rack 14 being arranged in an annular structure, the rotating gear 13 meshing with the rack 14. After the component body 11 is placed, the drive motor 12 on the rotating sliding assembly is started to run, driving the rotating gear 13 to rotate. Under the action of the annular rack 14, the rotating ring 8 can be driven to rotate, and the rotating ring 8 drives the top plate 9 to rotate, thereby driving the placed component body 11 to rotate and move.

[0023] Specifically, the movable extrusion assembly includes a movable hole 15 opened in the inner wall of the placement groove 10, a movable rod 16 is movably installed in the movable hole 15, one end of the movable rod 16 is fixedly connected to the side of the pressure plate 17, and an arc-shaped push block 18 is fixedly installed at the end of the movable rod 16. A return spring 19 is fixedly installed between the arc-shaped push block 18 and the side wall of the top plate 9. An arc-shaped fixing block 20 is fixedly installed on one side of the intermediate column 2. The arc-shaped fixing block 20 is adapted to the arc-shaped push block 18. During the rotation, the arc-shaped push block 18 on the movable extrusion assembly also rotates. The arc-shaped fixing block 20 is located below the top cover 3. When the part body 11 rotates to the bottom of the grinding disc 6, the arc-shaped fixing block 20 will squeeze the arc-shaped push block 18, thereby driving the movable rod 16 to move. The movement of the movable rod 16 drives the pressure plate 17 to move, thereby realizing automatic pressing operation on the placed part body 11.

[0024] Specifically, the grinding assembly includes a top cover 3 fixedly installed on the top of the intermediate column 2. A telescopic cylinder 4 is installed on the top cover 3. The output end of the telescopic cylinder 4 is connected to a grinding motor 5. The output end of the grinding motor 5 is connected to a grinding disc 6. The grinding disc 6 is located above the placement slot 10. The operation of the grinding motor 5 drives the grinding disc 6 to rotate, thereby performing deburring and grinding operations on the top of the part body 11. The grinding disc 6 is installed on the output end of the grinding motor 5 by bolts. It can be replaced when the grinding is severe. Through slow rotation, automatic clamping and grinding operations can be achieved, eliminating the need for manual clamping operations and reducing clamping time. At the same time, the grinding is carried out in a rotary assembly line manner, resulting in faster grinding speed.

[0025] In use: During the polishing of electronic components, the component body 11 to be polished is placed in the placement slot 10. Multiple placement slots 10 are provided, and one to two workers are assigned to place and retrieve the component body 11. The drive motor 12 on the rotating sliding assembly is started, which drives the placed component body 11 to rotate and move. After the arc-shaped push block 18 on the moving pressing assembly contacts the arc-shaped fixing block 20, it can drive the pressing plate 17 to move, realizing the automatic pressing operation on the placed component body 11. At this time, the polishing motor 5 runs and drives the polishing disc 6 to rotate, thereby performing deburring and polishing operations on the top of the component body 11. Through slow rotation, automatic clamping and polishing operations can be achieved, eliminating the need for manual clamping operations by workers and reducing clamping time. At the same time, the rotary assembly line method of polishing makes the polishing speed faster and more convenient to use.

[0026] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A grinding device for precision electronic component processing, comprising a grinding base (1), characterized in that, A central column (2) is fixedly installed in the middle of the grinding base (1). A grinding component is provided on the central column (2). A top plate (9) is installed on the top of the grinding base (1) through a rotating sliding component. Multiple placement slots (10) are provided on the top plate (9). Parts body (11) is placed on the placement slots (10). A pressure plate (17) is provided in the placement slots (10). A movable pressing component is provided between the pressure plate (17) and the central column (2).

2. The grinding device for precision electronic component processing according to claim 1, characterized in that, The rotating sliding assembly includes an annular groove (7) opened on the top of the grinding base (1), and a rotating ring (8) is fixedly installed on the bottom of the top plate (9), and the rotating ring (8) is rotatably installed in the annular groove (7).

3. The grinding device for precision electronic component processing according to claim 2, characterized in that, A drive motor (12) is fixedly installed on the top of the grinding base (1). A rotating gear (13) is connected to the output end of the drive motor (12). A rack (14) is fixedly installed on the inner wall of the rotating ring (8). The rack (14) is arranged in a ring structure. The rotating gear (13) meshes with the rack (14).

4. The grinding device for precision electronic component processing according to claim 1, characterized in that, The polishing assembly includes a top cover (3) fixedly installed on the top of the intermediate column (2), a telescopic cylinder (4) is installed on the top cover (3), the output end of the telescopic cylinder (4) is connected to a polishing motor (5), the output end of the polishing motor (5) is connected to a polishing disc (6), and the polishing disc (6) is located above the placement groove (10).

5. The grinding device for precision electronic component processing according to claim 1, characterized in that, The movable extrusion assembly includes a movable hole (15) opened on the inner wall of the placement groove (10), a movable rod (16) is movably installed in the movable hole (15), and one end of the movable rod (16) is fixedly connected to the side of the pressing plate (17).

6. The grinding device for precision electronic component processing according to claim 5, characterized in that, An arc-shaped push block (18) is fixedly installed at the end of the moving rod (16). A return spring (19) is fixedly installed between the arc-shaped push block (18) and the side wall of the top plate (9).

7. A grinding device for precision electronic component processing according to claim 6, characterized in that, An arc-shaped fixing block (20) is fixedly installed on one side of the intermediate column (2), and the arc-shaped fixing block (20) is adapted to the arc-shaped pushing block (18).

Images