Temperature control circuit, heat exchange device, vehicle machine system and vehicle

Abstract

The utility model relates to a temperature control circuit, a heat exchange device, a vehicle machine system and a vehicle. The temperature control circuit comprises a first temperature acquisition module, a second temperature acquisition module and a control module electrically connected with the first temperature acquisition module and the second temperature acquisition module. The first temperature acquisition module is used for detecting first temperature of the heat exchanger close to a heat source; the second temperature acquisition module is used for detecting second temperature of the heat exchanger away from the heat source; the control module is electrically connected with the heat exchanger and used for controlling the temperature of the heat exchanger according to the first temperature and the second temperature. The control module not only can obtain the first temperature of the heat exchanger close to the heat source, but also can obtain the second temperature of the heat exchanger far away from the heat source, so that the heat exchanger can be controlled according to the first temperature and the second temperature simultaneously, and the risk of temperature control failure caused by single improvement of heat exchange power is avoided.

Description

Technical Field

[0001] This application relates to the field of temperature control technology, and in particular to a temperature control circuit, a heat exchange device, an in-vehicle infotainment system, and a vehicle. Background Technology

[0002] With the rapid development of the new energy vehicle industry, the functions integrated into the intelligent cockpit host of automobiles are becoming increasingly numerous, resulting in a greater load on the electronic components inside the system and a significant amount of heat generation. To ensure system performance and meet stringent environmental requirements, a well-designed internal heat dissipation solution is essential. Using a TEC (Thermoelectric cooler) as a heat exchanger for thermal management is a typical automotive infotainment system solution.

[0003] In existing technologies, a temperature acquisition module is typically placed near the heat source on the heat exchanger to sense the temperature. This allows the control module to regulate the heat exchanger based on the temperature readings, thereby achieving temperature adjustment. Specifically, in automotive infotainment systems, taking the TEC (Dynamic Electronic Control) system as an example, a temperature acquisition module is usually placed at the bottom of the TEC near the heat source on the circuit board to sense the temperature.

[0004] Existing technologies rely solely on the temperature of the heat exchanger near the heat source for temperature control. However, in practice, since the temperature of the heat exchanger away from the heat source cannot be obtained, the control module may increase the heat exchange power of the heat exchanger, posing a risk of temperature control failure to the entire system. Utility Model Content

[0005] This application provides a temperature control circuit, a heat exchange device, a vehicle infotainment system, and a vehicle. In addition to a first temperature acquisition module for detecting the temperature of the heat exchanger near the heat source, a second temperature acquisition module for detecting the temperature of the heat exchanger away from the heat source is added. This allows the control module to acquire both the first temperature near the heat source and the second temperature away from the heat source, enabling simultaneous control of the heat exchanger based on both temperatures. This avoids the risk of temperature control failure caused by simply increasing the heat exchange power, thus at least partially solving the aforementioned technical problems.

[0006] To achieve the above objectives, according to a first aspect of this application, a temperature control circuit is provided, including a first temperature acquisition module, a second temperature acquisition module, and a control module electrically connected to the first temperature acquisition module and the second temperature acquisition module respectively.

[0007] The first temperature acquisition module is used to detect the first temperature of the heat exchanger near the heat source, and the second temperature acquisition module is used to detect the second temperature of the heat exchanger away from the heat source.

[0008] The control module is used to electrically connect to the heat exchanger and to perform temperature control on the heat exchanger based on a first temperature and a second temperature.

[0009] Optionally, the first temperature acquisition module includes a first thermistor and a first analog-to-digital converter;

[0010] The first thermistor is electrically connected to the control module through the first analog-to-digital converter unit, and is used to sense the first temperature of the heat exchanger, obtain the first temperature voltage and send it to the first analog-to-digital converter unit.

[0011] The first analog-to-digital conversion unit is used to perform analog-to-digital conversion based on the first temperature voltage to obtain the first temperature signal and send it to the control module.

[0012] Optionally, the second temperature acquisition module includes a second thermistor and a second analog-to-digital converter;

[0013] The second thermistor is electrically connected to the control module through the second analog-to-digital converter unit. It is used to sense the second temperature of the heat exchanger, obtain the second temperature voltage, and send it to the second analog-to-digital converter unit.

[0014] The second analog-to-digital conversion unit is used to perform analog-to-digital conversion based on the second temperature voltage to obtain the second temperature signal and send it to the control module.

[0015] Optionally, the temperature control circuit also includes a drive module electrically connected to the control module and for electrical connection to the heat exchanger;

[0016] The drive module is used to drive the heat exchanger under the control of the control module in order to control the temperature of the heat exchanger.

[0017] Optionally, the temperature control circuit may also include a drive power supply regulation module;

[0018] The first input terminal of the drive power adjustment module is electrically connected to the first temperature acquisition module, the second input terminal is electrically connected to the second temperature acquisition module, the first power supply terminal is used to connect to the first power supply, the second power supply terminal is used to connect to the second power supply, and the output terminal is electrically connected to the power supply terminal of the drive module.

[0019] The drive power regulation module is used to output either a first power supply or a second power supply to the drive module based on a first temperature and a second temperature.

[0020] Optionally, the drive power regulation module includes a temperature difference detection unit, a comparison unit, and a power switching unit;

[0021] The first input terminal of the temperature difference detection unit is electrically connected to the first temperature acquisition module, the second input terminal is electrically connected to the second temperature acquisition module, and the output terminal is electrically connected to the first input terminal of the comparison unit, which is used to determine the temperature difference voltage between the first temperature and the second temperature.

[0022] The second input terminal of the comparator unit is used to connect to the reference voltage, and the output terminal is electrically connected to the input terminal of the power switching unit. It is used to obtain the power selection signal based on the reference voltage and the temperature difference voltage and send it to the power switching unit.

[0023] The power switching unit has a first power supply terminal for connecting to a first power supply, a second power supply terminal for connecting to a second power supply, and an output terminal electrically connected to the power supply terminal of the drive module. It is used to output either the first power supply or the second power supply to the drive module according to the power selection signal.

[0024] Optionally, the temperature difference detection unit includes an amplifier subunit.

[0025] Optionally, the amplifier subunit includes a first follower, a second follower, and a differential amplifier;

[0026] The input terminal of the first follower is electrically connected to the first temperature acquisition module, and the output terminal is electrically connected to the first input terminal of the differential amplifier, for receiving and sending a first temperature voltage characterizing the first temperature to the differential amplifier;

[0027] The input terminal of the second follower is electrically connected to the second temperature acquisition module, and the output terminal is electrically connected to the second input terminal of the differential amplifier, for receiving and sending a second temperature voltage characterizing the second temperature to the differential amplifier;

[0028] The output terminal of the differential amplifier is electrically connected to the first input terminal of the comparator unit, and is used to obtain the temperature difference voltage based on the first temperature voltage and the second temperature voltage and send it to the comparator unit.

[0029] Optionally, the comparison unit includes a hysteresis comparator.

[0030] Optionally, the power switching unit includes a load switch;

[0031] The first access terminal of the load switch is used to connect to the first power supply, the second access terminal is used to connect to the second power supply, the third access terminal is electrically connected to the power supply terminal of the drive module, and the controlled terminal is electrically connected to the output terminal of the comparison unit. It is used to turn on the first access terminal and the third access terminal or the second access terminal and the third access terminal according to the power selection signal.

[0032] Optionally, the temperature control circuit may also include a voltage acquisition module that is electrically connected to both the control module and the drive module.

[0033] The voltage acquisition module is used to detect the drive voltage output from the drive module to the heat exchanger and send it to the control module.

[0034] Optionally, the temperature control circuit may also include a third temperature acquisition module and a humidity acquisition module, which are electrically connected to the control module respectively;

[0035] The third temperature acquisition module is used to detect a third temperature that is far from the heat source and represents the ambient temperature;

[0036] The humidity acquisition module is used to detect humidity near the heat source.

[0037] Optionally, the third temperature acquisition module includes a third thermistor and a third analog-to-digital converter;

[0038] The third thermistor is electrically connected to the control module through the third analog-to-digital converter unit. It is used to sense the third temperature, which is far away from the heat source and represents the ambient temperature, obtain the third temperature voltage, and send it to the third analog-to-digital converter unit.

[0039] The third analog-to-digital conversion unit is used to perform analog-to-digital conversion based on the input third temperature voltage, obtain the third temperature signal, and send it to the control module.

[0040] According to a second aspect of this application, a heat exchange device is provided, including a heat exchanger and a temperature control circuit in any of the above embodiments;

[0041] The heat exchanger is placed close to the heat source.

[0042] Optionally, the heat exchanger may include a thermoelectric cooler.

[0043] According to a third aspect of this application, a vehicle infotainment system is provided, including a vehicle infotainment circuit board and a heat exchange device in any of the above embodiments;

[0044] The heat exchanger is positioned close to the heat source on the vehicle's infotainment circuit board.

[0045] According to a fourth aspect of this application, a vehicle is provided, including a temperature control circuit in any of the above embodiments, or a heat exchange device in any of the embodiments, or a vehicle infotainment system in any of the embodiments.

[0046] The temperature control circuit of this application embodiment, based on the existence of a first temperature acquisition module for detecting the temperature of the heat exchanger near the heat source, adds a second temperature acquisition module for detecting the temperature of the heat exchanger far from the heat source. This allows the control module to acquire not only the first temperature of the heat exchanger near the heat source but also the second temperature of the heat exchanger far from the heat source, thereby enabling simultaneous control of the heat exchanger based on both the first and second temperatures, avoiding the risk of temperature control failure caused by simply increasing the heat exchange power.

[0047] Other features and advantages of this application will be described in detail in the following detailed description section. Attached Figure Description

[0048] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0049] To gain a more complete understanding of this application and its beneficial effects, the following description will be provided in conjunction with the accompanying drawings, wherein the same reference numerals in the following description denote the same parts.

[0050] Figure 1 This is a schematic diagram of the temperature control circuit provided in an exemplary embodiment of this application;

[0051] Figure 2 This is a schematic diagram showing the specific structure of the first temperature acquisition module and the second temperature acquisition module provided in an exemplary embodiment of this application;

[0052] Figure 3 This is a schematic diagram including a driver module provided in an exemplary embodiment of this application;

[0053] Figure 4 This is a schematic diagram of a drive power adjustment module provided in an exemplary embodiment of this application;

[0054] Figure 5 This is a schematic diagram of the specific structure of the drive power adjustment module provided in an exemplary embodiment of this application;

[0055] Figure 6 This is a schematic diagram of the specific structure of the amplifier unit, comparator unit and power switching unit provided in the exemplary embodiment of this application;

[0056] Figure 7 This is a schematic diagram of the specific structure of the amplifier unit provided in the exemplary embodiment of this application;

[0057] Figure 8 This is a schematic diagram of a voltage acquisition module provided in an exemplary embodiment of this application;

[0058] Figure 9 This is a schematic diagram of the specific structure of the humidity sensor and the third temperature acquisition module provided in an exemplary embodiment of this application;

[0059] Figure 10 This is a flowchart illustrating the control method provided in an exemplary embodiment of this application. Detailed Implementation

[0060] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the protection scope of this application.

[0061] According to the first aspect of this application, Figure 1 As shown, a temperature control circuit is provided, including a first temperature acquisition module, a second temperature acquisition module, and a control module electrically connected to the first temperature acquisition module and the second temperature acquisition module respectively.

[0062] In this embodiment, the heat exchanger is a thermoelectric cooler (hereinafter referred to as TEC for simplicity). Of course, in other embodiments, the heat exchanger can also be other specific types of devices or apparatuses.

[0063] The first temperature acquisition module is used to detect the first temperature of the TEC near the heat source, and the second temperature acquisition module is used to detect the second temperature of the TEC away from the heat source.

[0064] Taking a vehicle infotainment system as an example, the heat source typically refers to the heat-generating components on the circuit board corresponding to the system, such as the controller. In a vehicle infotainment system, the thermal interface material (TEC) can be applied to the corresponding location on the circuit board using thermal paste. At this time, the first temperature acquisition module is used to detect the first temperature of the side of the TEC closest to the circuit board (which can be understood as the bottom surface), and the second temperature acquisition module is used to detect the second temperature of the side of the TEC furthest from the circuit board (which can be understood as the surface).

[0065] exist Figure 1 In the diagram, the TEC contains a dashed frame. The portion within the dashed frame represents the bottom surface of the TEC, while the portion outside the dashed frame represents its surface. Based on the above analysis, we can obtain... Figure 1 The diagram illustrates the relationship where the first temperature acquisition module is positioned inside the dashed box and the second temperature acquisition module is positioned outside the dashed box.

[0066] The control module is used to electrically connect to the TEC and to perform temperature control on the TEC based on a first temperature and a second temperature.

[0067] The control module may include MCU (microcontroller).

[0068] The TEC can integrate a corresponding drive module, allowing the control module to be directly electrically connected to the TEC. The control module controls the drive power of the drive module inside the TEC, thereby controlling the heat exchange power of the TEC and ultimately achieving the purpose of temperature control.

[0069] Specifically, due to the special physical characteristics of the TEC, one side is a cold side (i.e., the bottom side mentioned above that is close to the circuit board) and the other side is a hot side (i.e., the surface mentioned above that is far away from the circuit board). When the hot side cannot dissipate heat properly, it will cause the cold side to heat up. If the control module cannot obtain the temperature of the cold side of the TEC, the control module will control the TEC to continue cooling, which will pose a risk of temperature control failure for the entire system.

[0070] In this embodiment, a second temperature acquisition module for detecting the second temperature of the TEC cold side is added, so that the control module can simultaneously obtain the first temperature of the TEC hot side and the second temperature of the TEC cold side when controlling the TEC. This avoids the control module controlling the TEC to continue cooling, thereby avoiding the risk of temperature control failure of the entire system.

[0071] The temperature control circuit of this application embodiment, based on the existence of a first temperature acquisition module for detecting the temperature of the heat exchanger near the heat source, adds a second temperature acquisition module for detecting the temperature of the heat exchanger far from the heat source. This allows the control module to acquire not only the first temperature of the heat exchanger near the heat source but also the second temperature of the heat exchanger far from the heat source, thereby enabling simultaneous control of the heat exchanger based on both the first and second temperatures, avoiding the risk of temperature control failure caused by simply increasing the heat exchange power.

[0072] like Figure 2 As shown, optionally, the first temperature acquisition module includes a first thermistor and a first analog-to-digital converter.

[0073] The first thermistor is electrically connected to the control module through the first analog-to-digital converter unit, and is used to sense the first temperature of the TEC, obtain the first temperature voltage, and send it to the first analog-to-digital converter unit.

[0074] The first thermistor can be bonded to the thermal paste between the TEC and the circuit board. The first thermistor is electrically connected to the first analog-to-digital converter (ADC) via a pull-up resistor, thus sending its voltage division as the first temperature voltage to the ADC. The resistance of the first thermistor changes with temperature; when the TEC's first temperature changes, the resistance of the first thermistor also changes. Since the operating power supply is constant, the first temperature voltage obtained by its voltage division also changes, ultimately achieving the acquisition of the first temperature.

[0075] The first analog-to-digital conversion unit is used to perform analog-to-digital conversion based on the first temperature voltage to obtain the first temperature signal and send it to the control module.

[0076] The control module is typically used to process digital signals, while the first temperature voltage output by the first thermistor is an analog quantity. Therefore, the first analog-to-digital converter unit is needed to convert the first temperature voltage into a digital first temperature signal. After receiving the first temperature signal, the control module can determine the corresponding first temperature.

[0077] like Figure 2 As shown, optionally, the second temperature acquisition module includes a second thermistor and a second analog-to-digital converter.

[0078] The second thermistor is electrically connected to the control module through the second analog-to-digital converter unit. It is used to sense the second temperature of the TEC, obtain the second temperature voltage, and send it to the second analog-to-digital converter unit.

[0079] The second thermistor can be placed directly on the TEC surface. The second thermistor is also electrically connected to the second analog-to-digital converter unit through a pull-up resistor, thereby sending its own voltage division as the second temperature voltage to the second analog-to-digital converter unit.

[0080] The second analog-to-digital conversion unit is used to perform analog-to-digital conversion based on the second temperature voltage to obtain the second temperature signal and send it to the control module.

[0081] The specific working details of the second thermistor and the second analog-to-digital converter can be found in the first thermistor and the first analog-to-digital converter in the above embodiments, and will not be repeated here.

[0082] like Figure 3 As shown, optionally, the temperature control circuit also includes a drive module electrically connected to the control module and for electrical connection to the heat exchanger.

[0083] The drive module is used to drive the TEC under the control of the control module in order to control the temperature of the TEC.

[0084] As mentioned in the above embodiments, the TEC can integrate a corresponding drive module, allowing the control module to be directly electrically connected to the TEC. In this embodiment, when the TEC does not integrate a drive module, an external drive module can be used to achieve the driving purpose.

[0085] The drive module may include an H-bridge power constant voltage drive circuit.

[0086] like Figure 4 As shown, optionally, the temperature control circuit also includes a drive power supply regulation module.

[0087] The first input terminal of the drive power adjustment module is electrically connected to the first thermistor in the first temperature acquisition module, the second input terminal is electrically connected to the second thermistor in the second temperature acquisition module, the first power supply terminal is used to connect to the first power supply VCC1, the second power supply terminal is used to connect to the second power supply VCC2, and the output terminal is electrically connected to the power supply terminal of the drive module.

[0088] The first power supply VCC1 can be a 3.3V power supply, and the second power supply VCC2 can be a 5V power supply.

[0089] The drive power regulation module is used to output either a first power supply or a second power supply to the drive module based on a first temperature and a second temperature.

[0090] The drive power supply adjustment module is electrically connected to the first thermistor and the second thermistor respectively, so that the drive voltage adjustment module can be connected to the first temperature voltage output by the first thermistor and the second temperature voltage output by the second thermistor respectively.

[0091] The large temperature difference between the first temperature of the TEC's bottom surface and the second temperature of its surface indicates the effectiveness of the TEC in heat exchange with the heat source on the circuit board. Specifically, it indicates whether the first temperature of the TEC's bottom surface changes significantly with the second temperature of its surface. If the first temperature of the TEC's bottom surface is high, but the second temperature of the TEC's surface is low, resulting in a large temperature difference, it means that the TEC is operating normally, but the heat source on the circuit board cannot be cooled. This indicates a high thermal resistance between the TEC and the heat source on the circuit board, usually due to an unreliable connection between the TEC and the circuit board (specifically, variations in device parameters, thermal paste, etc.), making it difficult for the TEC to effectively exchange heat with the heat source on the circuit board. Using a fixed power supply will prevent the drive module from further increasing the TEC's heat exchange power, thus failing to solve the problem of "ineffective heat exchange."

[0092] Therefore, to address the aforementioned issues, this embodiment adds a drive power supply adjustment module. This module can determine whether the temperature difference between the first temperature of the TEC bottom surface and the second temperature of the TEC surface is too large based on the input first and second temperature voltages, thereby determining the effectiveness of the TEC's heat exchange. When the temperature difference between the first and second temperatures is too large, the voltage difference between the first and second temperature voltages input to the drive power supply adjustment module is significant. This causes the drive power supply adjustment module to output a second power supply VCC2 with a larger voltage amplitude to the drive module, replacing the first power supply VCC1 with a smaller voltage amplitude. This further increases the drive voltage output to the TEC, ultimately resolving the problem of "ineffective heat exchange."

[0093] like Figure 5As shown, optionally, the drive power regulation module includes a temperature difference detection unit, a comparison unit, and a power switching unit.

[0094] The first input terminal of the temperature difference detection unit is electrically connected to the first thermistor in the first temperature acquisition module, the second input terminal is electrically connected to the second thermistor in the second temperature acquisition module, and the output terminal is electrically connected to the first input terminal of the comparison unit, which is used to determine the temperature difference voltage between the first temperature and the second temperature.

[0095] The temperature difference detection unit is used to receive the first temperature voltage output by the first thermistor and the second temperature voltage output by the second thermistor, determine the voltage difference between the two, and process the voltage difference to obtain the corresponding temperature difference voltage.

[0096] The second input terminal of the comparator unit is used to connect to the reference voltage Vref, and the output terminal is electrically connected to the input terminal of the power switching unit. It is used to obtain the power selection signal based on the reference voltage Vref and the temperature difference voltage and send it to the power switching unit.

[0097] The reference voltage Vref is preset to characterize whether the temperature difference between the first temperature and the second temperature is too large. When the temperature difference is too large, the obtained temperature difference voltage is greater than the reference voltage Vref; similarly, when the temperature difference is not too large, the obtained temperature difference voltage is not greater than the reference voltage Vref.

[0098] The comparator unit can output different power selection signals depending on whether the input temperature difference voltage is greater than the reference voltage Vref. Specifically, when the temperature difference voltage is greater than the reference voltage Vref, the comparator unit outputs a power selection signal indicating that a power supply with a larger voltage amplitude is used; when the temperature difference voltage is not greater than the reference voltage Vref, the comparator unit outputs a power selection signal indicating that a power supply with a smaller voltage amplitude is used.

[0099] The first power supply terminal of the power switching unit is used to connect to the first power supply VCC1, the second power supply terminal is used to connect to the second power supply VCC2, and the output terminal is electrically connected to the power supply terminal of the drive module. It is used to output the first power supply VCC1 or the second power supply VCC2 to the drive module according to the power selection signal.

[0100] Specifically, if the voltage amplitude of the first power supply VCC1 is less than that of the second power supply VCC2, when the power switching unit receives a power selection signal indicating the use of a power supply with a larger voltage amplitude, the power switching unit outputs the second power supply VCC2 to the drive module; when the power switching unit receives a power selection signal indicating the use of a power supply with a smaller voltage amplitude, the power switching unit outputs the first power supply VCC1 to the drive module.

[0101] like Figure 6As shown, optionally, the temperature difference detection unit includes an amplifier subunit U1, the comparison unit includes a hysteresis comparator U2, and the power switching unit includes a load switch U3.

[0102] The first input terminal of amplifier subunit U1 is used to connect to the first temperature voltage Vntc1, the second input terminal of amplifier subunit U1 is used to connect to the second temperature voltage Vntc2, and the output terminal of amplifier subunit U1 is electrically connected to the inverting input terminal of hysteresis comparator U2.

[0103] In this embodiment, the first temperature voltage Vntc1 output by the first thermistor and the second temperature voltage Vntc2 output by the second thermistor are both obtained based on voltage division. The difference between the first temperature voltage Vntc1 and the second temperature voltage Vntc2 may be small, making it difficult to directly output to the hysteresis comparator U2 for comparison. Therefore, in this embodiment, the difference between the first temperature voltage Vntc1 and the second temperature voltage Vntc2 is amplified by the amplifier subunit U1 to meet the comparison purpose of the hysteresis comparator U2.

[0104] The non-inverting input of the hysteresis comparator U2 is connected to the reference voltage Vref through a voltage divider resistor network, and the output of the hysteresis comparator U2 is electrically connected to the input C of the load switch.

[0105] The hysteresis comparator U2 incorporates positive feedback in the open-loop comparator, providing a small threshold tolerance. The reference voltage Vref can be selected based on the actual debugging conditions. When the first temperature voltage Vntc1 and the second temperature voltage Vntc2 are within the normal range, the hysteresis comparator U2 outputs a high-level power selection signal. When the difference between the first temperature voltage Vntc1 and the second temperature voltage Vntc2 is significant, the hysteresis comparator U2 outputs a low-level power selection signal. The level output by the hysteresis comparator U2 indicates the load switch U3 in the subsequent stage to select and switch the power supply of the TEC drive module.

[0106] The first access terminal S1 of the load switch U3 is used to connect to the first power supply VCC1, the second access terminal S2 is used to connect to the second power supply VCC2, the third access terminal D is electrically connected to the power supply terminal of the drive module, and the controlled terminal C is electrically connected to the output terminal of the hysteresis comparator U2. It is used to turn on the first access terminal S1 and the third access terminal D or turn on the second access terminal S2 and the third access terminal D according to the level output by the hysteresis comparator U2.

[0107] The first power supply VCC1 and the second power supply VCC2 are output by the DC power supply unit U4. If the voltage amplitude of the first power supply VCC1 is less than that of the second power supply VCC2, when the hysteresis comparator U2 outputs a high level, the load switch U3 will turn on the second access terminal S2 and the third access terminal D; when the hysteresis comparator U2 outputs a low level, the load switch U3 will turn on the first access terminal S1 and the third access terminal D.

[0108] like Figure 6 and 7 As shown, optionally, the amplifier subunit U1 includes a first follower OP1, a second follower OP2, and a differential amplifier OP3.

[0109] The input terminal of the first follower OP1 is electrically connected to the first thermistor in the first temperature acquisition module to receive the first temperature voltage Vntc1. The output terminal of the first follower OP1 is electrically connected to the first input terminal of the differential amplifier OP3 to send the received first temperature voltage Vntc1 to the differential amplifier OP3.

[0110] The input terminal of the second follower OP2 is electrically connected to the second thermistor in the second temperature acquisition module to receive the second temperature voltage Vntc2. The output terminal of the second follower OP2 is electrically connected to the second input terminal of the differential amplifier OP3 to send the received second temperature voltage Vntc2 to the differential amplifier OP3.

[0111] The output terminal of the differential amplifier OP3 is electrically connected to the first input terminal of the comparator unit, and is used to obtain the temperature difference voltage Vout based on the first temperature voltage Vntc1 and the second temperature voltage Vntc2 and send it to the comparator unit.

[0112] The first follower OP1 and the second follower OP2 function as voltage followers, providing high input impedance to the first temperature voltage Vntc1 and the second temperature voltage Vntc2, respectively, to avoid affecting the acquisition results of the preceding first and second analog-to-digital converters. Resistors R1 and R2 balance the voltage offset caused by the input bias current of the op-amp, and capacitors C1 and C2 filter out high-frequency noise interference after voltage division. Therefore, the output voltage of the first follower OP1 is equal to V1, and the output voltage of the second follower OP2 is equal to V2. Based on the virtual open / virtual short characteristics of the op-amp: V - =V + ,

[0113] Here, we take R3 = R5 and R4 = R6, and we get: in The gain of the differential amplifier OP3 can be increased based on the actual debugging results. C3 is the high-frequency feedback capacitor, which reduces noise gain, filters, and increases link stability; a small capacitor is generally chosen.

[0114] like Figure 8 As shown, optionally, the temperature control circuit also includes a voltage acquisition module electrically connected to the control module and the drive module respectively.

[0115] The voltage acquisition module is used to detect the drive voltage output from the drive module to the TEC and send it to the control module.

[0116] The control module can diagnose the drive voltage through feedback from the voltage acquisition module, thereby enabling better control of the drive module.

[0117] Optionally, the temperature control circuit may also include a third temperature acquisition module and a humidity acquisition module, which are electrically connected to the control module respectively, such as... Figure 9 As shown, the third temperature acquisition module includes a third thermistor and a third analog-to-digital converter, and the humidity acquisition module includes a humidity sensor.

[0118] The third thermistor is electrically connected to the control module through the third analog-to-digital converter unit. It is used to sense a third temperature that is far from the heat source and represents the ambient temperature, obtain the third temperature voltage, and send it to the third analog-to-digital converter unit.

[0119] The third analog-to-digital conversion unit is used to perform analog-to-digital conversion based on the input third temperature voltage, obtain the third temperature signal, and send it to the control module.

[0120] Humidity sensors are used to detect humidity near heat sources.

[0121] The third thermistor needs to be kept away from heat sources. The control module is used to determine the current dew point temperature based on the third temperature and humidity to prevent the circuit board from burning out due to excessively low temperatures causing dew to form.

[0122] Introducing a humidity acquisition solution offers the following two advantages:

[0123] The system constantly monitors the humidity level of the circuit board. Even if condensation has already formed and water droplets have begun to appear on the TEC (Condensation Circuit), the process from condensation to circuit corrosion failure is gradual and slow. If excessive humidity is detected during this process (as some condensation may have already formed), the system can immediately shut down the TEC. The heating of the circuit board can then dry the condensation, thus preventing circuit damage and failure.

[0124] If everything is normal as described above, the theoretical dew point temperature can be obtained by combining it with the ambient temperature. When the temperature approaches the dew point, the TEC can be turned off in time to avoid the risk of condensation.

[0125] like Figure 10 As shown, optionally, this application provides a control method, including:

[0126] i. After the vehicle unlocks and ACC is ON, if the SOC temperature is detected to be too high, a request is sent to the MCU to activate the TEC command. After the TEC cooling is activated, the PCB board temperature, TEC surface temperature, ambient temperature and humidity are monitored at all times.

[0127] ii. Monitor whether the target temperature has been reached. If normal, stop TEC cooling in time; if abnormal, the system will automatically determine whether the drive power supply needs to be adjusted and continue TEC cooling to reduce the temperature.

[0128] iii. After the TEC is turned on, the system monitors the humidity at all times. If the humidity is too high, condensation may have already occurred but has not yet caused failure. The TEC cooling mechanism needs to be turned off to ensure that no more condensation is produced.

[0129] iv. If step iii is normal, after the TEC is turned on, it is still necessary to monitor the ambient temperature and humidity, and the TEC surface temperature to find the current dew point temperature. Once the TEC surface temperature approaches the dew point, the TEC cooling should be turned off in time to ensure that no condensation is produced.

[0130] According to a second aspect of this application, a heat exchange device is provided, including a heat exchanger and a temperature control circuit in any of the above embodiments;

[0131] The heat exchanger is placed close to the heat source.

[0132] The heat exchange device in this embodiment includes a temperature control circuit that, in addition to a first temperature acquisition module for detecting the temperature of the heat exchanger near the heat source, adds a second temperature acquisition module for detecting the temperature of the heat exchanger away from the heat source. This allows the control module to acquire not only the first temperature of the heat exchanger near the heat source but also the second temperature of the heat exchanger away from the heat source, thereby enabling simultaneous control of the heat exchanger based on both the first and second temperatures, avoiding the risk of temperature control failure caused by simply increasing the heat exchange power.

[0133] Optionally, the heat exchanger may include a thermoelectric cooler.

[0134] According to a third aspect of this application, a vehicle infotainment system is provided, including a vehicle infotainment circuit board and a heat exchange device in any of the above embodiments;

[0135] The heat exchanger is positioned close to the heat source on the vehicle's infotainment circuit board.

[0136] The vehicle infotainment system of this application embodiment includes a temperature control circuit that, in addition to a first temperature acquisition module for detecting the temperature of the heat exchanger near the heat source, adds a second temperature acquisition module for detecting the temperature of the heat exchanger away from the heat source. This allows the control module to acquire not only the first temperature of the heat exchanger near the heat source but also the second temperature of the heat exchanger away from the heat source, thereby enabling simultaneous control of the heat exchanger based on both the first and second temperatures, avoiding the risk of temperature control failure caused by simply increasing the heat exchange power.

[0137] According to a fourth aspect of this application, a vehicle is provided, including a temperature control circuit in any of the above embodiments, or a heat exchange device in any of the embodiments, or a vehicle infotainment system in any of the embodiments.

[0138] The vehicle temperature control circuit in this application embodiment includes a second temperature acquisition module for detecting the area of ​​the heat exchanger away from the heat source, in addition to a first temperature acquisition module for detecting the area of ​​the heat exchanger away from the heat source. This allows the control module to acquire not only the first temperature of the heat exchanger near the heat source but also the second temperature of the heat exchanger away from the heat source, thereby enabling simultaneous control of the heat exchanger based on both the first and second temperatures, avoiding the risk of temperature control failure caused by simply increasing the heat exchange power.

[0139] The vehicle can be a pure gasoline vehicle, or a pure electric vehicle, a plug-in hybrid electric vehicle, or a range-extended hybrid electric vehicle, etc. This application does not make any specific restrictions on this.

[0140] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0141] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0142] The embodiments, implementation methods, and related technical features of this application can be combined and substituted for each other without conflict.

[0143] The above are merely preferred embodiments of this application and are not intended to limit this application in any way. In the embodiments of this application, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant content of other embodiments. Any brief modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of this application without departing from the content of the technical solution of this application shall still fall within the scope of the technical solution of this application.

Claims

1. A temperature control circuit, characterized in that, It includes a first temperature acquisition module, a second temperature acquisition module, and a control module that is electrically connected to the first temperature acquisition module and the second temperature acquisition module respectively; The first temperature acquisition module is used to detect the first temperature of the heat exchanger near the heat source, and the second temperature acquisition module is used to detect the second temperature of the heat exchanger away from the heat source. The control module is electrically connected to the heat exchanger and is used to control the temperature of the heat exchanger according to the first temperature and the second temperature.

2. The temperature control circuit according to claim 1, characterized in that, The first temperature acquisition module includes a first thermistor and a first analog-to-digital converter; The first thermistor is electrically connected to the control module through the first analog-to-digital converter unit, and is used to sense the first temperature of the heat exchanger, obtain the first temperature voltage and send it to the first analog-to-digital converter unit. The first analog-to-digital conversion unit is used to perform analog-to-digital conversion based on the first temperature voltage to obtain a first temperature signal and send it to the control module.

3. The temperature control circuit according to claim 1, characterized in that, The second temperature acquisition module includes a second thermistor and a second analog-to-digital converter; The second thermistor is electrically connected to the control module through the second analog-to-digital converter unit, and is used to sense the second temperature of the heat exchanger, obtain the second temperature voltage, and send it to the second analog-to-digital converter unit. The second analog-to-digital conversion unit is used to perform analog-to-digital conversion based on the second temperature voltage to obtain a second temperature signal and send it to the control module.

4. The temperature control circuit according to claim 1, characterized in that, The temperature control circuit also includes a drive module that is electrically connected to the control module and is used for electrical connection with the heat exchanger. The drive module is used to drive the heat exchanger under the control of the control module in order to control the temperature of the heat exchanger.

5. The temperature control circuit according to claim 4, characterized in that, The temperature control circuit also includes a drive power supply adjustment module. The first input terminal of the drive power adjustment module is electrically connected to the first temperature acquisition module, the second input terminal is electrically connected to the second temperature acquisition module, the first power terminal is used to connect to the first power supply, the second power terminal is used to connect to the second power supply, and the output terminal is electrically connected to the power terminal of the drive module. The drive power adjustment module is used to output the first power supply or the second power supply to the drive module according to the first temperature and the second temperature.

6. The temperature control circuit according to claim 5, characterized in that, The drive power adjustment module includes a temperature difference detection unit, a comparison unit, and a power switching unit. The first input terminal of the temperature difference detection unit is electrically connected to the first temperature acquisition module, the second input terminal is electrically connected to the second temperature acquisition module, and the output terminal is electrically connected to the first input terminal of the comparison unit, for determining the temperature difference voltage between the first temperature and the second temperature; The second input terminal of the comparison unit is used to connect to the reference voltage, and the output terminal is electrically connected to the input terminal of the power switching unit. It is used to obtain a power selection signal based on the reference voltage and the temperature difference voltage and send it to the power switching unit. The first power supply terminal of the power switching unit is used to connect to the first power supply, the second power supply terminal is used to connect to the second power supply, and the output terminal is electrically connected to the power supply terminal of the drive module. It is used to output the first power supply or the second power supply to the drive module according to the power selection signal.

7. The temperature control circuit according to claim 6, characterized in that, The temperature difference detection unit includes an amplifier subunit.

8. The temperature control circuit according to claim 7, characterized in that, The amplifier subunit includes a first follower, a second follower, and a differential amplifier; The input terminal of the first follower is electrically connected to the first temperature acquisition module, and the output terminal is electrically connected to the first input terminal of the differential amplifier, for receiving and sending a first temperature voltage characterizing the first temperature to the differential amplifier; The input terminal of the second follower is electrically connected to the second temperature acquisition module, and the output terminal is electrically connected to the second input terminal of the differential amplifier, for receiving and sending a second temperature voltage characterizing the second temperature to the differential amplifier; The output terminal of the differential amplifier is electrically connected to the first input terminal of the comparator unit, and is used to obtain the temperature difference voltage based on the first temperature voltage and the second temperature voltage and send it to the comparator unit.

9. The temperature control circuit according to claim 6, characterized in that, The comparison unit includes a hysteresis comparator.

10. The temperature control circuit according to claim 6, characterized in that, The power switching unit includes a load switch; The first access terminal of the load switch is used to connect to the first power supply, the second access terminal is used to connect to the second power supply, the third access terminal is electrically connected to the power supply terminal of the drive module, and the controlled terminal is electrically connected to the output terminal of the comparison unit. It is used to turn on the first access terminal and the third access terminal or turn on the second access terminal and the third access terminal according to the power selection signal.

11. The temperature control circuit according to claim 4, characterized in that, The temperature control circuit also includes a voltage acquisition module that is electrically connected to the control module and the drive module respectively; The voltage acquisition module is used to detect the driving voltage output by the driving module to the heat exchanger and send it to the control module.

12. The temperature control circuit according to claim 1, characterized in that, The temperature control circuit also includes a third temperature acquisition module and a humidity acquisition module, which are electrically connected to the control module respectively. The third temperature acquisition module is used to detect a third temperature that is far from the heat source and represents the ambient temperature; The humidity acquisition module is used to detect the humidity near the heat source.

13. The temperature control circuit according to claim 12, characterized in that, The third temperature acquisition module includes a third thermistor and a third analog-to-digital converter; The third thermistor is electrically connected to the control module through the third analog-to-digital converter unit, and is used to sense the third temperature, which is located away from the heat source and represents the ambient temperature, obtain the third temperature voltage, and send it to the third analog-to-digital converter unit. The third analog-to-digital conversion unit is used to perform analog-to-digital conversion based on the input third temperature voltage to obtain a third temperature signal and send it to the control module.

14. A heat exchange device, characterized in that, Includes a heat exchanger and the temperature control circuit as described in any one of claims 1 to 13; The heat exchanger is positioned close to the heat source.

15. The heat exchange device according to claim 14, characterized in that, The heat exchanger includes a thermoelectric cooler.

16. A vehicle infotainment system, characterized in that, Includes the vehicle infotainment circuit board and the heat exchange device as described in claim 14 or 15; The heat exchanger is positioned close to the heat source on the vehicle's infotainment circuit board.

17. A vehicle, characterized in that, It includes the temperature control circuit according to any one of claims 1 to 13, or the heat exchange device according to claim 14 or 15, or the vehicle infotainment system according to claim 16.

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