Mixed chemical source evaporator for high-temperature superconducting film MOCVD (Metal Organic Chemical Vapor Deposition) process

Abstract

The utility model relates to the technical field of superconducting film preparation, and aims to solve the technical problems of low evaporation rate and non-uniform temperature. In order to solve the technical problem, the utility model provides the mixed chemical source evaporator for the high-temperature superconducting film MOCVD (Metal Organic Chemical Vapor Deposition) process. According to the utility model, a sealing cavity is arranged in a cylinder body; the evaporator base is arranged at the bottom of the sealing cavity; the evaporator base comprises a base body and a plurality of stacked layers arranged on the upper surface of the base body. The plurality of stacking layers are stacked in sequence; from bottom to top, the projections of the outer walls of the plurality of superposed layers on the bottom of the sealed cavity are sequentially reduced; the outer wall of the superposed layer is arc-shaped; the heating assembly comprises a plurality of first heating pieces which are arranged in the base body; the second heating piece is arranged on the cylinder body; the temperature detection assembly is arranged in the sealed cavity and used for monitoring the temperature of the sealed cavity in real time; the control assembly is electrically connected with the temperature detection assembly and the heating assembly. The evaporation rate is greatly improved, and the temperature is more uniform.

Description

Technical Field

[0001] This utility model relates to the field of superconducting film preparation technology, and in particular to a high-temperature superconducting film MOCVD process mixed chemical source evaporator. Background Technology

[0002] In the process of fabricating superconducting MOCVD, to achieve better growth of YBCO superconducting films, a mixture of three or more chemical sources—yttrium, barium, and copper—is sprayed as a mist onto the surface of an evaporator base heated to a certain temperature. The mist then rapidly evaporates into source molecular vapor on the cylindrical platform surface of the evaporator base, forming a mixed gas flow that converges onto the surface of the high-temperature superconducting tape, thus generating the YBCO superconducting thin film. The concentration of the generated source molecular vapor is a key factor in the film deposition; therefore, the uniformity of the evaporator's mixing of the chemical sources is crucial. Current technologies suffer from relatively low evaporation rates and lack of temperature control, leading to uneven heating temperatures. Utility Model Content

[0003] Therefore, the technical problem to be solved by this utility model is to overcome the above-mentioned problems existing in the prior art.

[0004] To solve the above-mentioned technical problems, this utility model provides a high-temperature superconducting film MOCVD process hybrid chemical source evaporator, comprising:

[0005] The cylindrical body has a sealed cavity inside;

[0006] An evaporator base is located at the bottom of a sealed cavity. The evaporator base includes a base body and multiple stacked layers on the upper surface of the base body. The multiple stacked layers are stacked sequentially from bottom to top. From bottom to top, the projection of the outer walls of the multiple stacked layers on the bottom of the sealed cavity decreases sequentially. The outer walls of the stacked layers are arc-shaped.

[0007] The heating assembly includes multiple first heating elements and second heating elements; the multiple first heating elements are disposed in the base body; the second heating elements are disposed on the cylinder body;

[0008] A temperature detection component, located in the sealed cavity, is used to monitor the temperature of the sealed cavity in real time;

[0009] The control component is electrically connected to the temperature detection component and the heating component.

[0010] In one embodiment of the present invention, the temperature detection component includes a plurality of first temperature sensors, which are distributed on the uppermost stacked layer.

[0011] In one embodiment of the present invention, the temperature detection component further includes at least one second temperature sensor, which is located at the middle position of the sealed cavity.

[0012] In one embodiment of this utility model, the application further includes at least one vent pipe, which extends from the top of the cylinder into the bottom of the sealed cavity, for filling the sealed cavity with argon gas.

[0013] In one embodiment of this utility model, a second heating element is provided on the outer wall of the top and the outer wall of the bottom of the cylinder.

[0014] In one embodiment of this utility model, a plurality of first heating elements are evenly distributed on the bottom of the base body.

[0015] In one embodiment of this utility model, the application further includes a support member detachably connected to the bottom of the base body, the support member having multiple support holes, each corresponding to a first heating element; the support holes are provided with an insulating support ring, which is used to support and limit the first heating element.

[0016] In one embodiment of this invention, the support ring is made of ceramic.

[0017] In one embodiment of the present invention, the cylindrical body includes a barrel-shaped component, an upper cover, and a lower cover; the upper cover and the lower cover are respectively sealed and connected to the top and bottom ends of the barrel-shaped component.

[0018] In one embodiment of this utility model, the inner surface of the top cover is provided with an upper sealing groove, and an upper sealing ring is installed in the upper sealing groove.

[0019] In one embodiment of this utility model, the inner surface of the lower cover is provided with a lower sealing groove, and a lower sealing ring is installed in the lower sealing groove.

[0020] In one embodiment of the present invention, the inner surface of the upper cover is provided with an upper sealing groove, and an upper sealing ring is installed in the upper sealing groove; the inner surface of the lower cover is provided with a lower sealing groove, and a lower sealing ring is installed in the lower sealing groove.

[0021] The above-mentioned technical solution of this utility model has the following advantages compared with the prior art:

[0022] The high-temperature superconducting film MOCVD process hybrid chemical source evaporator described in this invention features multiple stacked layers on the upper surface of the base body, thereby increasing the contact area for chemical source atomization. This more effectively and fully expands the quantitative atomized liquid droplets per unit time, allowing them to disperse and contact more contact surfaces, reducing the concentration of droplets at specific landing points, resulting in more complete chemical source evaporation. It also reduces the problem of residual chemical source on the planar surface that cannot flow away. Simultaneously, the temperature loss and variation on the evaporator surface are smaller, making the entire atomization and evaporation process more complete, uniform, stable, and efficient, significantly improving the evaporation rate. Furthermore, this embodiment includes a temperature detection component for real-time monitoring of the sealed cavity temperature. The control component is electrically connected to the temperature detection component and the heating component, thereby ensuring more uniform temperature and guaranteeing that the evaporation base reaches the optimal evaporation temperature. Attached Figure Description

[0023] To make the content of this utility model easier to understand, the present utility model will be further described in detail below with reference to specific embodiments and accompanying drawings, wherein:

[0024] Figure 1 This is a schematic diagram of the structure of a hybrid chemical source evaporator for a high-temperature superconducting film MOCVD process in a preferred embodiment of this utility model;

[0025] Figure 2 yes Figure 1 A front view of a hybrid chemical source evaporator for high-temperature superconducting film MOCVD process;

[0026] Figure 3 yes Figure 2 AA section view;

[0027] Figure 4 yes Figure 1 A side view of a hybrid chemical source evaporator for high-temperature superconducting film MOCVD process;

[0028] Figure 5 yes Figure 4 BB cross-sectional view;

[0029] Explanation of reference numerals in the accompanying drawings: 100, cylindrical body; 110, sealed cavity; 120, barrel-shaped component; 130, upper cover; 140, lower cover; 150, first through hole; 160, second through hole; 170, third through hole;

[0030] 200. Evaporator base; 210. Base body; 211. Mounting hole; 212. Support component; 213. Support hole; 214. Support ring; 220. Stacking layer;

[0031] 300. Heating assembly; 310. First heating element; 320. Second heating element;

[0032] 400. Temperature detection component; 410. First temperature sensor;

[0033] 500. Ventilation tube;

[0034] 600, Nozzle;

[0035] 700. External conduit. Detailed Implementation

[0036] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, so that those skilled in the art can better understand and implement the present invention. However, the embodiments are not intended to limit the present invention.

[0037] In some comparative embodiments, the upper surface of the evaporator base is flat. This allows residual sources to accumulate on the upper surface, leading to weakened evaporation, a low evaporation rate, reduced evaporation source concentration, and uncontrolled film thickness and temperature. Furthermore, the evaporation of mixed chemical sources in MOCVD (Multi-Chemical Vapor Deposition) processes can be insufficient. Additionally, excessive accumulation of chemical sources on the upper surface of the evaporator base can cause a sudden drop in surface temperature, preventing the chemical sources from evaporating quickly and completely. The increasing residual surface residue further contributes to evaporation failure or degradation, resulting in uneven temperature distribution.

[0038] Reference Figures 1-5 As shown, this embodiment of the present invention provides a hybrid chemical source evaporator for high-temperature superconducting film MOCVD process, comprising:

[0039] The cylindrical body 100 has a sealed cavity 110 inside;

[0040] An evaporator base 200 is located at the bottom of a sealed cavity 110. The evaporator base 200 includes a base body 210 and multiple stacked layers 220 disposed on the upper surface of the base body 210. The multiple stacked layers 220 are stacked sequentially from bottom to top. From bottom to top, the projection of the outer wall of the multiple stacked layers 220 on the bottom of the sealed cavity 110 decreases sequentially. The outer wall of the stacked layer 220 is arc-shaped.

[0041] The heating assembly 300 includes a plurality of first heating elements 310 and a second heating element 320; the plurality of first heating elements 310 are disposed in the base body 210; the second heating elements 320 are disposed on the cylinder 100. In some embodiments, the first heating element 310 is a heating rod and the second heating element 320 is a heating ring.

[0042] Temperature detection component 400 is disposed in sealed cavity 110 for real-time monitoring of temperature of sealed cavity 110;

[0043] The control component (not shown in the figure) is electrically connected to the temperature detection component 400 and the heating component 300.

[0044] Specifically, in this embodiment, multiple stacked layers 220 on the upper surface of the base body 210 increase the contact area for chemical source atomization, more effectively and fully expanding the quantitative atomized liquid droplets per unit time, allowing them to scatter and contact more contact surfaces, reducing the concentration of droplets at the landing point, resulting in more complete chemical source evaporation, reducing the problem of planar chemical source residue that cannot flow away, and at the same time, the temperature loss and change of the evaporator surface are also smaller. The entire atomization evaporation process is more complete, uniform, stable, and efficient, greatly improving the evaporation rate. In addition, this embodiment is equipped with a temperature detection component 400 for real-time monitoring of the temperature of the sealed cavity 110. The control component is electrically connected to the temperature detection component 400 and the heating component 300, thereby making the temperature more uniform and ensuring that the evaporation base reaches the optimal evaporation temperature.

[0045] Further, the cylindrical body 100 includes a barrel-shaped component 120, an upper cover 130, and a lower cover 140; the upper cover 130 and the lower cover 140 are respectively sealed to the top and bottom ends of the barrel-shaped component 120. In some embodiments, the barrel-shaped component 120 is connected to the upper cover 130 and the lower cover 140 by bolts. The inner surface of the upper cover 130 is provided with an upper sealing groove, in which an upper sealing ring is installed. The inner surface of the lower cover 140 is provided with a lower sealing groove, in which a lower sealing ring is installed. Specifically, the structure of this embodiment is simple, and the connection method is stable and reliable.

[0046] Furthermore, the temperature detection component 400 includes multiple first temperature sensors 410, which are distributed on the uppermost stacked layer 220. Specifically, the first temperature sensors 410 can monitor the temperature of the surface of the stacked layer 220 in real time, thereby facilitating the control component to control the heating component 300 in a timely manner, thus ensuring that the evaporation base reaches the optimal evaporation temperature.

[0047] Furthermore, the temperature detection assembly 400 also includes at least one second temperature sensor (not shown in the figure), which is located at the middle position of the sealed cavity 110. In some embodiments, the top of the cylinder 100 (upper cover 130) is provided with a first through hole 150, through which the second temperature sensor is suspended at the middle position of the sealed cavity 110. Specifically, the second temperature sensor in this embodiment can monitor the temperature inside the sealed cavity 110, enabling the control assembly to acquire temperature data at multiple locations.

[0048] Furthermore, this application also includes at least one vent pipe 500, which extends from the top of the cylinder 100 into the bottom of the sealed cavity 110 for filling the sealed cavity 110 with argon gas. In some embodiments, the top of the cylinder 100 (upper cover 130) is provided with a second through hole 160, through which the vent pipe 500 passes and enters the sealed cavity 110, extending into the bottom of the sealed cavity 110. Specifically, this embodiment can fill the sealed cavity 110 with a small amount of argon gas, thereby increasing the pressure inside the sealed cavity 110, improving the fluidity of the source molecular vapor formed after evaporation, and further increasing the evaporation rate.

[0049] A third through hole 170 is provided in the center of the top cover 130, and a nozzle 600 is connected to the third through hole 170. The top of the third through hole 170 is connected to an external gas-liquid mixing pump. This allows chemical sources to be sprayed into the sealed cavity 110 from the nozzle 600.

[0050] Furthermore, a second heating element 320 is provided on the outer wall of the top and the outer wall of the bottom of the cylinder 100, respectively. In some embodiments, the second heating element 320 is fixedly connected to the top and bottom of the cylinder 100 by bolts.

[0051] Furthermore, multiple first heating elements 310 are evenly distributed on the bottom of the base body 210. In some embodiments, the bottom of the base body 210 is provided with multiple mounting holes 211, and the mounting holes 211 are corresponding one-to-one with the first heating elements 310. Specifically, the mounting holes 211 in this embodiment facilitate the installation of the first heating elements 310 on the bottom of the base body 210, resulting in a stable and reliable structure.

[0052] Furthermore, this application also includes a support member 212 detachably connected to the bottom of the base body 210. The support member 212 has multiple support holes 213, each corresponding to a first heating element 310. Each support hole 213 contains an insulating support ring 214, which supports and limits the first heating element 310. Specifically, this embodiment uses a detachable method to connect the first heating element 310 to the bottom of the base body 210, thereby facilitating the installation and removal of the first heating element 310.

[0053] Furthermore, the support ring 214 is made of ceramic. Specifically, ceramic has high insulation properties and is resistant to high temperatures.

[0054] The evaporation rate of the prior art is 60%, while the evaporation rate of this application is over 90%.

[0055] This application also includes an external conduit 700 communicating with the outside world; one end of the external conduit 700 is connected to the sealed cavity 110 and disposed near the top of the sealed cavity 110. The other end of the external conduit 700 extends through the barrel-shaped member 120 to the front of the cylinder 100 and is connected to other docking equipment.

[0056] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the protection scope of this invention.

Claims

1. A hybrid chemical source evaporator for high-temperature superconducting film MOCVD process, characterized in that: include: The cylindrical body has a sealed cavity inside; An evaporator base is located at the bottom of the sealed cavity; the evaporator base includes a base body and multiple stacked layers on the upper surface of the base body; the multiple stacked layers are stacked sequentially from bottom to top; from bottom to top, the projection of the outer wall of the multiple stacked layers at the bottom of the sealed cavity decreases sequentially; the outer wall of the stacked layer is arc-shaped. The heating assembly includes a plurality of first heating elements and a second heating element; the plurality of first heating elements are disposed in the base body; the second heating element is disposed on the cylinder body; A temperature detection component is disposed in the sealed cavity for real-time monitoring of the temperature of the sealed cavity; The control component is electrically connected to the temperature detection component and the heating component.

2. The high-temperature superconducting film MOCVD process hybrid chemical source evaporator according to claim 1, characterized in that: The temperature detection component includes a plurality of first temperature sensors, which are distributed on the uppermost stacked layer.

3. The high-temperature superconducting film MOCVD process hybrid chemical source evaporator according to claim 2, characterized in that: The temperature detection assembly further includes at least one second temperature sensor, which is located at the middle position of the sealed cavity.

4. The high-temperature superconducting film MOCVD process hybrid chemical source evaporator according to claim 1, characterized in that: It includes at least one vent pipe that extends from the top of the cylinder into the bottom of the sealed cavity for filling the sealed cavity with argon gas.

5. The high-temperature superconducting film MOCVD process hybrid chemical source evaporator according to claim 1, characterized in that: The outer walls at the top and bottom of the cylinder are respectively provided with second heating elements.

6. The high-temperature superconducting film MOCVD process hybrid chemical source evaporator according to claim 1, characterized in that: Multiple first heating elements are evenly distributed at the bottom of the base body.

7. The high-temperature superconducting film MOCVD process hybrid chemical source evaporator according to claim 1, characterized in that: It also includes a support member that is detachably connected to the bottom of the base body, the support member having multiple support holes, each of which corresponds to the first heating element; each support hole is provided with a support ring having insulating properties, the support ring being used to support and limit the first heating element.

8. The high-temperature superconducting film MOCVD process hybrid chemical source evaporator according to claim 7, characterized in that: The support ring is made of ceramic.

9. The high-temperature superconducting film MOCVD process hybrid chemical source evaporator according to claim 1, characterized in that: The cylindrical body includes a barrel-shaped component, an upper cover, and a lower cover; the upper cover and the lower cover are respectively sealed to the top and bottom of the barrel-shaped component.

10. The high-temperature superconducting film MOCVD process hybrid chemical source evaporator according to claim 9, characterized in that: The inner surface of the upper cover is provided with an upper sealing groove, and an upper sealing ring is installed in the upper sealing groove; And / or, the inner surface of the lower cover is provided with a lower sealing groove, and a lower sealing ring is installed in the lower sealing groove.

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