Efficient heating device of semiconductor temperature control equipment

Abstract

The utility model discloses an efficient heating device for semiconductor temperature control equipment, which comprises a heating box, a heating assembly is fixedly arranged on the inner wall of the top of the heating box, an auxiliary air flowing structure is arranged in the heating box, a plurality of supporting structures are arranged in the heating box, a box door is arranged on the front side of the heating box, and a plurality of heating devices are arranged on the box door. And four supporting legs which are arranged in a rectangular shape are fixedly arranged at the bottom of the heating box. By arranging the transverse plate, the air pump, the heating box, the exhaust pipe, the air distribution pipe and the air nozzles, the heating assembly, the heating wire and the air pump are started during heating, the heating wire in the heating box can heat air in the heating box, the air pump sucks in the air in the heating box, then the air is guided into the air distribution pipe through the exhaust pipe, and finally the air is exhausted through the multiple air nozzles. The air in the air nozzle is exhausted to accelerate the flowability of the air in the heating box, so that the temperature difference of different areas in the heating box can be reduced, the heating uniformity can be improved, and the heating efficiency can be improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor temperature control equipment technology, and in particular to a high-efficiency heating device for semiconductor temperature control equipment. Background Technology

[0002] In semiconductor manufacturing, extremely high temperature control is required for the processing environment. Precise and stable temperature is one of the key factors in ensuring semiconductor chip performance and yield. Semiconductor heating equipment typically heats the semiconductor by heating the air inside the heating chamber.

[0003] Since the heating equipment does not have an air-assisted flow function, the temperature inside the heating chamber will be uneven, which will not only cause uneven heating of the semiconductor, but also reduce the heating efficiency of the equipment. Therefore, a high-efficiency heating device for semiconductor temperature control equipment is proposed. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing a high-efficiency heating device for semiconductor temperature control equipment.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a high-efficiency heating device for semiconductor temperature control equipment, comprising a heating box, a heating component fixedly provided on the top inner wall of the heating box, an auxiliary air flow structure provided inside the heating box, and multiple support structures provided inside the heating box.

[0006] As a further description of the above technical solution:

[0007] The heating box has a door on the front and four support legs arranged in a rectangle are fixed at the bottom.

[0008] As a further description of the above technical solution:

[0009] The auxiliary airflow structure includes a horizontal plate fixedly connected to the heating box. An air pump and a heating box are fixedly installed on the top of the horizontal plate. A suction pipe is fixedly installed on the side of the air pump near the heating box. The other end of the suction pipe is fixedly connected to one side of the heating box. A heating wire is installed inside the heating box. An exhaust pipe is fixedly installed on one side of the air pump. One end of the exhaust pipe passes through the heating box and is fixedly connected to a distribution pipe. Multiple air nozzles are fixedly installed on the outside of the distribution pipe.

[0010] As a further description of the above technical solution:

[0011] The heating chamber is fixedly equipped with a suction pipe on the side away from the air pump, and a filter cover is movably installed on the outside of the suction pipe.

[0012] As a further description of the above technical solution:

[0013] A sleeve is fixedly provided on one side of the filter cover, and a locking block is fixedly provided on the inner wall of the sleeve. Two locking slots are provided on the outside of the suction tube, and the locking slots and locking blocks are compatible with each other.

[0014] As a further description of the above technical solution:

[0015] The support structure includes a mounting cylinder, inside which a threaded rod is movably mounted, a support plate is fixedly mounted on the top of the threaded rod, and multiple support columns are fixedly mounted on the top of the support plate.

[0016] As a further description of the above technical solution:

[0017] The inner wall of the mounting cylinder is threaded, the threaded rod is adapted to the thread on the inner wall of the mounting cylinder, and the outer fixed sleeve of the threaded rod is fitted with a rubber sleeve.

[0018] This utility model has the following beneficial effects:

[0019] 1. Compared with existing technologies, this semiconductor temperature control equipment features a high-efficiency heating device. By setting up a horizontal plate, an air pump, a heating chamber, an exhaust pipe, a distribution pipe, and jet nozzles, the heating components, heating wires, and air pump are activated during heating. The heating wires in the heating chamber heat the air inside. The air pump draws in the air from the heating chamber and then guides it through the exhaust pipe into the distribution pipe. Finally, the air is discharged through multiple jet nozzles. The discharge of gas from the jet nozzles accelerates the airflow within the heating chamber, thereby reducing the temperature difference between different areas within the heating chamber. This not only improves heating uniformity but also increases heating efficiency.

[0020] 2. Compared with existing technologies, this semiconductor temperature control equipment has a high-efficiency heating device. By setting up an installation cylinder, a threaded rod, a support plate, and a support column, the height of the support plate can be adjusted by rotating the threaded rod, thereby making the equipment suitable for placing semiconductors of different specifications and improving the practicality of the equipment. Attached Figure Description

[0021] Figure 1 This is a first-view perspective three-dimensional structural diagram of a high-efficiency heating device for semiconductor temperature control equipment proposed in this utility model;

[0022] Figure 2 This is a second-view perspective three-dimensional structural diagram of a high-efficiency heating device for semiconductor temperature control equipment proposed in this utility model.

[0023] Figure 3 This is a first-view schematic diagram of the auxiliary airflow structure in a high-efficiency heating device for a semiconductor temperature control equipment proposed in this utility model.

[0024] Figure 4This is a second-view schematic diagram of the auxiliary airflow structure in a high-efficiency heating device for a semiconductor temperature control equipment proposed in this utility model.

[0025] Figure 5 This is an exploded structural diagram of the suction pipe and filter cover in a high-efficiency heating device for a semiconductor temperature control equipment proposed in this utility model.

[0026] Figure 6 This is a three-dimensional schematic diagram of the support structure in a high-efficiency heating device for a semiconductor temperature control equipment proposed in this utility model.

[0027] Legend:

[0028] 1. Heating chamber; 2. Chamber door; 3. Heating assembly; 4. Support legs; 5. Auxiliary airflow structure; 501. Horizontal plate; 502. Air pump; 503. Heating chamber; 504. Exhaust pipe; 505. Air distribution pipe; 506. Air nozzle; 507. Intake pipe; 508. Filter cover; 509. Sleeve; 510. Locking block; 511. Locking groove; 6. Support structure; 601. Mounting cylinder; 602. Threaded rod; 603. Support plate; 604. Support column. Detailed Implementation

[0029] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0030] Reference Figures 1 to 6 The present invention provides a high-efficiency heating device for semiconductor temperature control equipment: including a heating box 1, a heating component 3 fixedly provided on the top inner wall of the heating box 1, a box door 2 provided on the front of the heating box 1, and four support legs 4 arranged in a rectangular pattern fixedly provided on the bottom of the heating box 1.

[0031] To promote airflow, the heating chamber 1 is equipped with an auxiliary airflow structure 5. The auxiliary airflow structure 5 includes a horizontal plate 501 fixedly connected to the heating chamber 1. An air pump 502 and a heating chamber 503 are fixedly mounted on the top of the horizontal plate 501. A suction pipe is fixedly mounted on the side of the air pump 502 near the heating chamber 503, and the other end of the suction pipe is fixedly connected to one side of the heating chamber 503. A heating wire is installed inside the heating chamber 503. An exhaust pipe 504 is fixedly mounted on one side of the air pump 502. One end of the exhaust pipe 504 passes through the heating chamber 1 and is fixedly mounted with a distribution pipe 505. Multiple air nozzles 506 are fixedly mounted on the outside of the distribution pipe 505. An intake pipe 507 is fixedly mounted on the side of the heating chamber 503 away from the air pump 502, and a filter cover 508 is movably mounted on the outside of the intake pipe 507. A sleeve 509 is fixedly provided on one side of the filter cover 508, and a locking block 510 is fixedly provided on the inner wall of the sleeve 509. Two slots 511 are provided on the outside of the suction pipe 507. The slots 511 and the locking block 510 are compatible. When heating, the heating component 3, heating wire and air pump 502 are activated. The heating wire in the heating box 503 can heat the air inside it. The filter cover 508 can filter the air that is sucked in. The air pump 502 sucks in the air in the heating box 503 and then introduces it into the air distribution pipe 505 through the exhaust pipe 504. Finally, it is discharged through multiple jet nozzles 506. The gas discharged from the jet nozzles 506 can accelerate the air flow in the heating box 1, thereby reducing the temperature difference between different areas in the heating box 1. This not only improves the heating uniformity, but also improves the heating efficiency.

[0032] To accommodate semiconductors of different specifications, the heating chamber 1 is equipped with multiple support structures 6. Each support structure 6 includes a mounting cylinder 601, within which a threaded rod 602 is movably mounted. The inner wall of the mounting cylinder 601 is threaded, and the threaded rod 602 is adapted to the thread on the inner wall of the mounting cylinder 601. A rubber sleeve is fixedly fitted around the threaded rod 602, and a support plate 603 is fixedly mounted on the top of the threaded rod 602. Multiple support columns 604 are fixedly mounted on the top of the support plate 603. The height of the support plate 603 can be adjusted by rotating the threaded rod 602, thereby enabling the equipment to accommodate semiconductors of different specifications and improving its practicality.

[0033] Working principle: In use, first adjust the distance between two adjacent support plates 603 according to the specifications of the conductor to be heated. Rotate the threaded rod 602 to adjust the height of the support plate 603. After adjustment, place the conductor to be heated on top of multiple support columns 604. Multiple support columns 604 can reduce the area of ​​the bottom of the conductor being blocked, thereby improving the uniformity of heating. After placement, start the heating component 3, heating wire and air pump 502. The heating wire in the heating box 503 can heat the air inside. The filter cover 508 can filter the air drawn in. The air pump 502 draws in the air in the heating box 503 and then introduces it into the air distribution pipe 505 through the exhaust pipe 504. Finally, it is discharged through multiple air nozzles 506. The gas discharged from the air nozzles 506 can accelerate the air flow in the heating box 1, thereby reducing the temperature difference between different areas in the heating box 1. This not only improves the uniformity of heating, but also improves the heating efficiency.

[0034] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A high-efficiency heating device for semiconductor temperature control equipment, comprising a heating chamber (1), characterized in that: A heating component (3) is fixedly installed on the top inner wall of the heating box (1), an auxiliary air flow structure (5) is provided inside the heating box (1), and multiple support structures (6) are provided inside the heating box (1).

2. The high-efficiency heating device for semiconductor temperature control equipment according to claim 1, characterized in that: The heating box (1) has a door (2) on the front and four support legs (4) arranged in a rectangular pattern fixed at the bottom.

3. The high-efficiency heating device for semiconductor temperature control equipment according to claim 1, characterized in that: The auxiliary airflow structure (5) includes a horizontal plate (501) fixedly connected to the heating box (1). An air pump (502) and a heating box (503) are fixedly installed on the top of the horizontal plate (501). A suction pipe is fixedly installed on the side of the air pump (502) near the heating box (503). The other end of the suction pipe is fixedly connected to one side of the heating box (503). A heating wire is installed inside the heating box (503). An exhaust pipe (504) is fixedly installed on one side of the air pump (502). One end of the exhaust pipe (504) passes through the heating box (1) and is fixedly installed with a distribution pipe (505). Multiple air nozzles (506) are fixedly installed on the outside of the distribution pipe (505).

4. The high-efficiency heating device for semiconductor temperature control equipment according to claim 3, characterized in that: The heating box (503) is fixedly provided with a suction pipe (507) on the side away from the air pump (502), and a filter cover (508) is movably provided on the outside of the suction pipe (507).

5. The high-efficiency heating device for semiconductor temperature control equipment according to claim 4, characterized in that: A sleeve (509) is fixedly provided on one side of the filter cover (508), and a locking block (510) is fixedly provided on the inner wall of the sleeve (509). Two slots (511) are provided on the outside of the suction tube (507), and the slots (511) and the locking block (510) are compatible.

6. The high-efficiency heating device for semiconductor temperature control equipment according to claim 1, characterized in that: The support structure (6) includes an installation cylinder (601), a threaded rod (602) is movably provided inside the installation cylinder (601), a support plate (603) is fixedly provided on the top of the threaded rod (602), and a plurality of support columns (604) are fixedly provided on the top of the support plate (603).

7. The high-efficiency heating device for semiconductor temperature control equipment according to claim 6, characterized in that: The inner wall of the mounting cylinder (601) is provided with threads, the threaded rod (602) is adapted to the threads on the inner wall of the mounting cylinder (601), and the outer fixed sleeve of the threaded rod (602) is provided with a rubber sleeve.

Images