Silicon-based display module and display device

Abstract

The utility model discloses a silicon-based display module and a display device. The silicon-based display module in one embodiment comprises a circuit board, a silicon-based display substrate and a cover plate, the silicon-based display substrate and the cover plate are sequentially stacked on the circuit board, and the silicon-based display substrate is attached to the circuit board through adhesive; wherein the silicon-based display substrate comprises a first surface facing the circuit board, and at least partial area of the first surface comprises a first coarse structure. According to the embodiment of the utility model, aiming at the condition that the silicon-based display substrate is separated from the circuit board in the product reliability test of the silicon-based display module, the contact area between the silicon-based display substrate and the adhesive is increased by arranging the rough structure on the smooth surface, deviating from the light-emitting side, of the silicon-based display substrate; the bonding performance of the silicon-based display substrate and a circuit board is improved, the use stability and reliability of a product are improved, and the practical application value is achieved.

Description

Technical Field

[0001] This utility model relates to the field of display technology, and in particular to a silicon-based display module and display device. Background Technology

[0002] With the rapid development of display technology, silicon-based display modules are being used more and more widely. Silicon-based display products are mainly shipped in two forms: printed circuit boards (PCBs) and flexible printed circuit boards (FPCs). PCB products are mainly used in the specialty market, while FPC products are mainly used in the consumer market.

[0003] For example, one of the main applications of silicon-based display products in PCB form is sights. In actual use, the products may become structurally unstable when subjected to huge recoil impacts. Therefore, how to ensure the structural stability of silicon-based display products has become a technical problem that urgently needs to be solved by those skilled in the art. Utility Model Content

[0004] To address at least one of the aforementioned problems, a first embodiment of this utility model provides a silicon-based display module, comprising a circuit board, a silicon-based display substrate and a cover plate sequentially stacked on the circuit board, wherein the silicon-based display substrate is bonded to the circuit board by adhesive; wherein

[0005] The silicon-based display substrate includes a first surface facing the circuit board, and at least a portion of the first surface includes a first rough structure.

[0006] For example, in some embodiments of the silicon-based display module provided in this application, the first rough structure is a first pattern disposed in at least a portion of the first surface, and the first pattern includes a plurality of protrusion structures and / or groove structures.

[0007] For example, in some embodiments of the silicon-based display module provided in this application, the reference plane relative to the first surface is:

[0008] The heights of the plurality of protrusions relative to the reference plane may be the same or different, and the height of the protrusion with the highest distance from the reference plane is less than or equal to 0.5 mm relative to the reference plane.

[0009] and / or

[0010] The multiple grooves may have the same or different depths relative to the reference plane, and the groove with the deepest depth relative to the reference plane has a height of less than or equal to 0.5 mm relative to the reference plane.

[0011] For example, in some embodiments of the silicon-based display module provided in this application, the protrusions and / or grooves on a cross section perpendicular to the circuit board are at least one of hemispherical, elliptical, rectangular, triangular, and trapezoidal shapes.

[0012] For example, in some embodiments of the silicon-based display module provided in this application, the circuit board includes a second surface facing the silicon-based display substrate, and at least a portion of the second surface includes a second rough structure.

[0013] For example, in some embodiments of the silicon-based display module provided in this application, at least a portion of the second rough structure is provided corresponding to the first rough structure;

[0014] The first rough structure of the silicon-based display substrate is bonded to the second rough structure of the circuit board using adhesive.

[0015] For example, in some embodiments of the silicon-based display module provided in this application, the first rough structure is a rough surface formed on the first surface.

[0016] For example, in some embodiments of the silicon-based display module provided in this application, the roughness of the rough surface is greater than or equal to the roughness of the surface of the circuit board facing the silicon-based display substrate.

[0017] For example, in some embodiments of the silicon-based display module provided in this application, the circuit board further includes a first limiting structure and a second limiting structure disposed on a surface facing the silicon-based display substrate;

[0018] The first limiting structure and the second limiting structure are disposed opposite to each other and are respectively located on the outside of the silicon-based display substrate.

[0019] For example, in some embodiments of the silicon-based display module provided in this application, the height of the first limiting structure is greater than the thickness of the adhesive relative to the side surface of the circuit board facing the silicon-based display substrate, and the height of the second limiting structure is greater than the thickness of the adhesive.

[0020] For example, in some embodiments of the silicon-based display module provided in this application, the silicon-based display module further includes a bonding area, and the first limiting structure is disposed on the side of the bonding area near the edge;

[0021] In a cross-section perpendicular to the circuit board, the width of the first limiting structure is greater than the width of the second limiting structure.

[0022] For example, in some embodiments of the silicon-based display module provided in this application, the first surface includes a bonding area that is bonded to the circuit board, and the orthographic projection of the bonding area on the circuit board falls into the orthographic projection of the adhesive on the circuit board.

[0023] The second embodiment of this utility model provides a display device, including a silicon-based display module as described in the first embodiment.

[0024] The beneficial effects of this utility model are as follows:

[0025] This invention addresses existing problems by providing a silicon-based display module and display device. By creating a rough structure on the smooth surface of the silicon-based display substrate away from the light-emitting side, the contact area between the silicon-based display substrate and the adhesive is increased, improving the adhesion between the substrate and the adhesive, and consequently improving the adhesion between the substrate and the circuit board. This effectively enhances the stability and reliability of the display module, preventing the separation of the substrate from the circuit board during product reliability testing. Therefore, this invention overcomes the problems existing in the prior art and has practical application value. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 A schematic diagram of the impact test is shown.

[0028] Figure 2 This diagram illustrates the structure of a silicon-based display module according to an embodiment of the present invention.

[0029] Figure 3 A flowchart illustrating the manufacturing method of one embodiment of this utility model is shown;

[0030] Figure 4 This diagram illustrates the structure of a display substrate on a wafer according to one embodiment of the present invention.

[0031] Figure 5 This diagram illustrates the structure of a silicon-based display module according to another embodiment of the present invention.

[0032] Figure 6 This diagram illustrates the structure of a silicon-based display module according to another embodiment of the present invention.

[0033] Figure 7 This diagram illustrates the structure of a silicon-based display module according to another embodiment of the present invention. Detailed Implementation

[0034] To more clearly illustrate this utility model, the preferred embodiments and accompanying drawings will be used for further description. Similar components in the drawings are indicated by the same reference numerals. Those skilled in the art should understand that the specific description below is illustrative rather than restrictive and should not be construed as limiting the scope of protection of this utility model.

[0035] It should be noted that the terms "on," "formed on," and "set on" used in this document can indicate that one layer is directly formed or set on another layer, or that one layer is indirectly formed or set on another layer, meaning that there are other layers between the two layers. In this document, unless otherwise stated, the term "located on the same layer" means that two layers, components, elements, or parts can be formed through the same patterning process, and that these two layers, components, elements, or parts are generally formed of the same material. In this document, unless otherwise stated, the description of "patterning process" generally includes steps such as photoresist coating, exposure, development, etching, and photoresist stripping. The description of "one-time patterning process" refers to a process that uses a single photomask to form patterned layers, components, elements, etc.

[0036] In related technologies, silicon-based display modules used in sights require impact testing after product manufacturing to ensure the product meets the requirements of actual application scenarios, such as simulating the actual application scenarios of gun sights. Figure 1 As shown, the specific test operation is as follows: First, the back of product 1 is fixed to test fixture 2. Then, fixture 2 is rapidly accelerated under the drive of a motor, reaches a fixed position, and then stops abruptly. It then returns to the initial falling position, rapidly accelerates again, reaches the position, and stops abruptly again. This process is repeated 20 times. After the test, the product's structural form is checked to determine if it is damaged and whether its function is normal. This test requires 500G * 20 times, i.e., a sudden stop at a speed of 670m / s. The impact force of the sudden stop is used to evaluate the product's reliability. Under the above test conditions, products using related technologies exhibit a certain proportion of structural damage and functional failure, manifested as separation of the silicon-based display substrate and circuit board, severe damage to the module structure of the silicon-based display module, breakage of the conductive gold wires connecting the silicon-based display substrate and circuit board, and display function failure. In the failure analysis, the inventor pointed out that because the silicon-based display substrate has a smooth surface facing the circuit board, although it is bonded to the surface of the circuit board with adhesive, the adhesion between the adhesive and the silicon-based display substrate is weaker than the adhesion between the adhesive and the circuit board. In the impact test, it cannot withstand the impact force and therefore fails to separate.

[0037] Based on the above problems and the causes of these problems, such as Figure 2As shown, one embodiment of this utility model provides a silicon-based display module, including a circuit board 10, a silicon-based display substrate 11 and a cover plate 12 sequentially stacked on the circuit board 10, wherein the silicon-based display substrate 11 is attached to the circuit board 10 by adhesive 13; wherein

[0038] The silicon-based display substrate 11 includes a first surface facing the circuit board 10, and at least a portion of the first surface includes a first rough structure 111.

[0039] In this embodiment, by providing a rough structure on the smooth surface of the silicon-based display substrate away from the light-emitting side of the silicon-based display module, the roughness of the first surface of the silicon-based display substrate is effectively increased, increasing the contact area with the adhesive. This improves the adhesion performance between the silicon-based display substrate and the adhesive, thereby improving the adhesion performance between the silicon-based display substrate and the circuit board. Consequently, the stability and reliability of the display module are significantly improved, avoiding the problem of separation between the silicon-based display substrate and the circuit board during product reliability testing. This has practical application value.

[0040] To further illustrate the specific implementation of this embodiment, such as Figure 3 As shown, the following steps are included in the description of manufacturing a silicon-based display module as an example:

[0041] The first step is to form multiple display substrates on the wafer and attach a cover plate to the display substrates.

[0042] In this embodiment, as Figure 4 As shown, multiple display substrates 101 are formed on a whole wafer 100, including, for example, driving circuits formed within the wafer, display functional layers formed on the driving circuits, and encapsulation layers, wherein the minimum distance between the display substrate 101 and the edge of the wafer is L. After the display substrates are formed, a cover plate is attached to the display substrates, such as... Figure 2 As shown, the display substrate 11 and the cover plate 12 are bonded together by an optical adhesive layer 14.

[0043] The second step is to form a rough structure on the surface of the wafer facing away from the cover plate.

[0044] In this embodiment, the surface of the wafer away from the cover plate is a smooth silicon wafer surface, such as a mirror surface. In order to improve the adhesion performance between the display substrate and the adhesive, the smooth surface is roughened, for example, a rough structure is formed on the smooth surface.

[0045] In an optional embodiment, a first pattern is formed on the surface using laser marking or physical etching. The first pattern includes multiple raised structures, multiple groove structures, or multiple raised structures and multiple groove structures.

[0046] In this embodiment, laser marking is used. For example, a high-energy-density laser beam is used to irradiate the silicon-based mirror surface, causing the silicon material to melt and vaporize instantaneously, thereby forming pits or protrusions on the surface to achieve roughening. Laser marking has advantages such as being non-contact, highly precise, and flexibly controllable. In this embodiment, physical etching can also be used. For example, a specific pattern is first defined on the silicon-based mirror surface using photolithography, and then the silicon material in the patterned area is removed through an etching process to form a rough surface. Photolithography has advantages such as precisely controlling the shape and size of the pattern.

[0047] In this embodiment, a first pattern is formed on at least a portion of the first surface using laser marking. The first pattern may be a pattern including multiple raised structures, a structure including multiple grooves, or a structure including both multiple raised structures and multiple grooves.

[0048] Specifically, such as Figure 5 The diagram shows a cross-section perpendicular to the circuit board, revealing that multiple protrusions and grooves are formed on the first surface of the display substrate 11, including multiple protrusions 112 and multiple grooves 113 relative to a reference plane R. Specifically, as shown... Figure 5 As shown, the height of each protrusion relative to the reference plane R can be the same or different, and the spacing between the protrusions can be the same or different. For example, protrusions are formed only in a part of the surface, and the height of the protrusion 1121 with the highest distance from the reference plane is less than or equal to 0.5 mm relative to the reference plane R. Similarly, the depth of each groove relative to the reference plane R can be the same or different. For example, grooves are formed only in a part of the surface. Considering the driving circuit structure of the display substrate, the depth of the groove 1131 with the deepest distance from the reference plane is less than or equal to 0.5 mm relative to the reference plane R.

[0049] like Figure 5 As shown, the protrusions and grooves are rectangular. Those skilled in the art should understand that the protrusions and grooves can also be hemispherical, elliptical, triangular, or trapezoidal, or a combination of the above shapes, in order to achieve the basic design principle of increasing the surface roughness of the display substrate and increasing the contact area, all of which are within the protection scope of this application.

[0050] In another alternative embodiment, a rough surface is formed on the surface using chemical solvents or mechanical abrasion.

[0051] In this embodiment, for example, a chemical solution is used to react with the silicon surface, selectively dissolving the silicon material to form a rough surface. Specifically, etching is performed using an etchant containing a mixed solution of hydrofluoric acid (HF), nitric acid (HNO3), and acetic acid (CH3COOH). Alternatively, an abrasive material (such as sandpaper, polishing paste, etc.) is used to polish the silicon-based mirror surface, removing some of the silicon material through mechanical friction to roughen the surface. For example, forming a surface like... Figure 2 The rough structure 111 shown increases the surface roughness of the display substrate, thereby increasing the contact area with the adhesive. Furthermore, the roughness of the rough surface formed in this embodiment is greater than or equal to the roughness of the surface of the circuit board facing the silicon-based display substrate. Specifically, when the surface roughness of the display substrate and the surface roughness of the circuit board are equal, the overall stability and reliability of the silicon-based display module are further increased.

[0052] The third step is to cut the wafer into multiple silicon-based display substrates, and at least a portion of the first surface of each silicon-based display substrate on the side away from the cover plate includes a first rough structure.

[0053] In this embodiment, based on the rough structure formed on the surface of the wafer away from the cover plate, the wafer is cut to form multiple silicon-based display substrates. The rough structure is manifested as a first rough structure on the first surface of the silicon-based display substrate away from the cover plate.

[0054] The fourth step is to use adhesive to attach the silicon-based display substrate to the circuit board.

[0055] In this embodiment, adhesive is applied to the side of the circuit board facing the silicon-based display substrate, and then the silicon-based display substrate is attached to the circuit board. The adhesive fully fills the space between the two. The rough structure of the first surface of the silicon-based display substrate effectively increases the adhesion between the silicon-based display substrate and the adhesive, thereby increasing the adhesion between the silicon-based display substrate and the circuit board, thus improving the overall stability and reliability of the silicon-based display module.

[0056] To further improve the adhesion performance between the silicon-based display substrate and the adhesive, in an optional embodiment, the first surface includes an adhesion area that is bonded to the circuit board, wherein the orthographic projection of the adhesion area on the circuit board falls into the orthographic projection of the adhesive on the circuit board.

[0057] In this embodiment, as Figure 2 , Figure 5 and Figure 6As shown in the figure, this embodiment increases the amount of adhesive to ensure that the effective contact area between the silicon-based display substrate and the circuit board is filled with adhesive. As shown in the figure, the adhesive partially wraps around the edge of the silicon-based display substrate, thereby further increasing the contact area between the silicon-based display substrate and the adhesive, increasing the adhesion between the two, and thus increasing the adhesion between the silicon-based display substrate and the circuit board, thereby improving the overall stability and reliability of the silicon-based display module.

[0058] This completes the fabrication of the silicon-based display module. In this embodiment, by creating a rough structure on the smooth surface of the silicon-based display substrate away from the light-emitting side, the contact area between the silicon-based display substrate and the adhesive is increased. This improves the adhesion performance between the silicon-based display substrate and the adhesive, thereby improving the adhesion performance between the silicon-based display substrate and the circuit board. This effectively enhances the stability and reliability of the display module and avoids the problem of separation between the silicon-based display substrate and the circuit board during product reliability testing, thus having practical application value.

[0059] To further improve the adhesion of the display module, in an optional embodiment, such as Figure 6 As shown, the circuit board 10 includes a second surface facing the silicon-based display substrate 11, and at least a portion of the second surface includes a second rough structure 1011.

[0060] In this embodiment, by providing a second roughening structure 1011, such as a protrusion, in at least a portion of the second surface, the contact area between the circuit board and the adhesive is further increased, thereby increasing the overall stability of the display module. Specifically, in this embodiment, at least a portion of the second roughening structure 1011 corresponds to the first roughening structure. For example, the protrusion on the second surface of the circuit board corresponds to the groove on the first surface of the silicon-based display substrate. The first roughening structure of the silicon-based display substrate is bonded to the second roughening structure of the circuit board using adhesive.

[0061] To further improve the relative stability of the silicon-based display substrate and the circuit board, in an optional embodiment, such as Figure 7 As shown, the circuit board 10 also includes a first limiting structure 15 and a second limiting structure 16 disposed on the surface facing the silicon-based display substrate 11.

[0062] The first limiting structure 15 and the second limiting structure 16 are disposed opposite to each other and are located on the outside of the silicon-based display substrate 11, respectively.

[0063] In this embodiment, the first limiting structure 15 is disposed on one side of the silicon-based display substrate 11, and the second limiting structure 16 is disposed on the other side of the silicon-based display substrate 11. The first and second limiting structures are limiting structures with a certain width and thickness. That is, by setting the first and second limiting structures on the circuit board, the silicon-based display substrate is restricted to the middle position, thereby further preventing the first surface of the silicon-based display substrate 11 from separating and sliding from the second surface of the circuit board during product reliability testing, thereby improving the stability and reliability of the silicon-based display module.

[0064] In one specific example, relative to the side surface of the circuit board facing the silicon-based display substrate, the height of the first limiting structure is greater than the thickness of the adhesive, and the height of the second limiting structure is greater than the thickness of the adhesive.

[0065] In this embodiment, by setting the height of the first limiting structure and the height of the second limiting structure to be greater than the thickness of the adhesive, the limiting function of the limiting structure is further improved. That is, the silicon-based display module is bonded by adhesive, and then the limiting structure further limits the silicon-based display substrate. In this embodiment, for example... Figure 7 As shown, the heights of the first limiting structure and the second limiting structure can be the same; the heights of the first limiting structure and the second limiting structure can also be different, and this application does not specifically limit this.

[0066] In an optional embodiment, such as Figure 7 As shown, the silicon-based display module further includes a bonding area, and the first limiting structure is disposed on the side of the bonding area near the edge; in a cross section perpendicular to the circuit board, the width of the first limiting structure is greater than the width of the second limiting structure.

[0067] In this embodiment, considering the bonding area on the silicon-based display module, such as the first bonding area disposed on the silicon-based display substrate and the second bonding area disposed on the circuit board on the same side as the first bonding area, both the first and second bonding areas include pads and connecting lines connecting the two bonding areas. In product reliability testing, the bonding area bears greater stress. A first limiting structure is set near the bonding area, and the width of the first limiting structure is set to be wider and the thickness to be thicker than the width of the second limiting structure. For example, the first limiting structure partially surrounds the bonding area, thereby further stabilizing the silicon-based display substrate, thereby stabilizing the connecting lines, and further ensuring the normal display function of the silicon-based display substrate.

[0068] Based on the silicon-based display module of the above embodiments, one embodiment of the present invention also provides a display device including the above-described silicon-based display module.

[0069] The silicon-based display device in this embodiment is, for example, a sight used in firearms. By providing a rough structure on the smooth surface of the silicon-based display substrate away from the light-emitting side of the silicon-based display module, the contact area between the silicon-based display substrate and the adhesive is increased, which improves the adhesion performance between the silicon-based display substrate and the adhesive, thereby improving the adhesion performance between the silicon-based display substrate and the circuit board. This effectively improves the stability and reliability of the display module, for example, it can still maintain stable and reliable application even under the impact of the huge recoil after the firearm is fired.

[0070] This invention addresses existing problems by providing a silicon-based display module and display device. By creating a rough structure on the smooth surface of the silicon-based display substrate away from the light-emitting side, the contact area between the silicon-based display substrate and the adhesive is increased, improving the adhesion between the substrate and the adhesive, and consequently improving the adhesion between the substrate and the circuit board. This effectively enhances the stability and reliability of the display module, preventing the separation of the substrate from the circuit board during product reliability testing. Therefore, this invention overcomes the problems existing in the prior art and has practical application value.

[0071] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating this utility model, and are not intended to limit the implementation of this utility model. For those skilled in the art, other variations or modifications can be made based on the above description. It is impossible to exhaustively list all the implementation methods here. All obvious variations or modifications derived from the technical solutions of this utility model are still within the protection scope of this utility model.

Claims

1. A silicon-based display module, characterized in that, The system includes a circuit board, a silicon-based display substrate and a cover plate stacked sequentially on the circuit board, wherein the silicon-based display substrate is bonded to the circuit board with adhesive; wherein The silicon-based display substrate includes a first surface facing the circuit board, and at least a portion of the first surface includes a first rough structure.

2. The silicon-based display module according to claim 1, characterized in that, The first rough structure is a first pattern disposed in at least a portion of the first surface, the first pattern including a plurality of protrusions and / or grooves.

3. The silicon-based display module according to claim 2, characterized in that, Relative to the reference plane of the first surface: The heights of the plurality of protrusions relative to the reference plane may be the same or different, and the height of the protrusion with the highest distance from the reference plane is less than or equal to 0.5 mm relative to the reference plane. and / or The multiple grooves may have the same or different depths relative to the reference plane, and the groove with the deepest depth relative to the reference plane has a height of less than or equal to 0.5 mm relative to the reference plane.

4. The silicon-based display module according to claim 2, characterized in that, The circuit board includes a second surface facing the silicon-based display substrate, and at least a portion of the second surface includes a second rough structure.

5. The silicon-based display module according to claim 4, characterized in that, At least a portion of the second roughening structure is configured correspondingly to the first roughening structure; The first rough structure of the silicon-based display substrate is bonded to the second rough structure of the circuit board using adhesive.

6. The silicon-based display module according to claim 1, characterized in that, The first rough structure is a rough surface formed on the first surface; The roughness of the rough surface is greater than or equal to the roughness of the surface of the circuit board facing the silicon-based display substrate.

7. The silicon-based display module according to any one of claims 1-6, characterized in that, The circuit board also includes a first limiting structure and a second limiting structure disposed on the surface facing the silicon-based display substrate; The first limiting structure and the second limiting structure are disposed opposite to each other and are respectively located on the outside of the silicon-based display substrate.

8. The silicon-based display module according to claim 7, characterized in that, Relative to the side surface of the circuit board facing the silicon-based display substrate, the height of the first limiting structure is greater than the thickness of the adhesive, and the height of the second limiting structure is greater than the thickness of the adhesive.

9. The silicon-based display module according to claim 8, characterized in that, The silicon-based display module also includes a bonding area, and the first limiting structure is disposed on the side of the bonding area near the edge; In a cross-section perpendicular to the circuit board, the width of the first limiting structure is greater than the width of the second limiting structure.

10. The silicon-based display module according to claim 1, characterized in that, The first surface includes an adhesion area that is bonded to the circuit board, wherein the orthographic projection of the adhesion area on the circuit board falls into the orthographic projection of the adhesive on the circuit board.

11. A display device, characterized in that, Includes the silicon-based display module as described in any one of claims 1-10.

Images