Switching power supply with temperature control mechanism

Abstract

The utility model discloses a switching power supply with a temperature control mechanism, and particularly relates to the technical field of switching power supplies, the switching power supply comprises a main body mechanism, the top of the main body mechanism is fixedly provided with a temperature sensor, one side of the main body mechanism is fixedly provided with a protection mechanism, and the protection mechanism is internally and fixedly provided with a temperature control mechanism. Water jackets are arranged outside core electronic elements in the main body mechanism, the temperature control mechanism comprises a water tank, one side of the water tank is fixedly connected with a circulating pipe, and the water tank is connected with the water jackets in the main body mechanism through the circulating pipe. According to the switching power supply with the temperature control mechanism, one side, close to the first heat conduction assembly, of the semiconductor refrigeration sheet can be switched into a refrigeration surface when the internal temperature of the main body mechanism is high, so that the internal core part of the main body mechanism is cooled; when the internal temperature of the main body mechanism is low, the side, close to the first heat conduction assembly, of the semiconductor chilling plate can be switched into a heating surface to heat the internal core part of the main body mechanism.

Description

Technical Field

[0001] This utility model relates to the field of switching power supply technology, specifically to a switching power supply with a temperature control mechanism. Background Technology

[0002] Switching power supply technology utilizes modern power electronics to control the on / off time ratio of switching transistors, converting input electrical energy into a stable output voltage. It is characterized by high efficiency, small size, and light weight, and is widely used in industrial automation, communication equipment, electronic instruments, and home appliances. With technological advancements, switching power supplies are continuously progressing towards higher frequencies, smaller sizes, and higher efficiency, while also demonstrating significant value in energy conservation and environmental protection. Despite issues such as circuit complexity and maintenance difficulties, its position in modern electronics and electrical technology remains irreplaceable, and it continues to drive the development of related technologies.

[0003] Current switching power supplies employ various heat dissipation methods, primarily including natural cooling, fan cooling, and combinations thereof. Natural cooling increases heat dissipation capacity by increasing the surface area of ​​the heat sink, but this results in a larger heat sink; while fan cooling rapidly cools the power supply through forced airflow, although this may increase the risk of malfunction. Combining both methods allows for rapid adaptation to temperature changes while reducing the size and cost of individual coolers. In addition, there are methods using metal heat sinks and some advanced intelligent cooling technologies. The appropriate method must be selected based on the specific requirements of the power supply and its environmental adaptability during the design phase.

[0004] While existing switching power supplies meet certain usage requirements to some extent, they only provide cooling but not heating. In extremely cold regions or low-temperature environments, the internal components of the switching power supply may malfunction due to excessively low temperatures. For example, electrolytic capacitors may fail at low temperatures, preventing the power supply from starting. Utility Model Content

[0005] The purpose of this invention is to provide a switching power supply with a temperature control mechanism to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a switching power supply with a temperature control mechanism, comprising a main body, a temperature sensor fixedly mounted on the top of the main body, a protective mechanism fixedly mounted on one side of the main body, a temperature control mechanism fixedly mounted inside the protective mechanism, water jackets provided on the exterior of the core electronic components inside the main body, the temperature control mechanism including a water tank, a circulation pipe fixedly connected to one side of the water tank, the water tank being connected to the water jacket inside the main body via the circulation pipe, a circulation pump being provided in the middle section of the circulation pipe, a semiconductor refrigeration chip fixedly mounted on one side of the water tank, a first heat-conducting component fixedly mounted on one side of the semiconductor refrigeration chip, and the first heat-conducting component being fixedly mounted inside the water tank.

[0007] Preferably, a second heat-conducting component is fixedly installed on one side of the semiconductor cooling chip, and a cooling fan is fixedly installed on one side of the second heat-conducting component.

[0008] Preferably, a circuit protection module is fixedly installed on one side of the main body.

[0009] Preferably, a second control panel is fixedly installed on one side of the main body.

[0010] Preferably, the protective mechanism includes a protective shell, the outer wall of which has a plurality of air inlets, and one side of which has an air outlet. An air outlet is fixedly installed on one side of both the air inlets and the air outlet.

[0011] Preferably, a first control panel is fixedly installed on one side of the protective shell.

[0012] Preferably, a wireless communication module is fixedly installed on one side of the main body.

[0013] Compared with the prior art, the beneficial effects of this utility model are: the switching power supply with a temperature control mechanism;

[0014] 1. The temperature inside the main body is detected by a temperature sensor. A circulating pump drives the heat exchange medium to circulate in the water tank, circulating pipe, and water jacket. The temperature of the heat exchange medium inside the water tank is changed by the cooperation of the semiconductor cooling chip and the first heat conduction component. The position between the cooling surface and the heating surface of the semiconductor cooling chip is changed by changing the current input direction of the semiconductor cooling chip. In summary, when the temperature inside the main body is high, the side of the semiconductor cooling chip close to the first heat conduction component can be switched to the cooling surface to cool the core components inside the main body. When the temperature inside the main body is low, the side of the semiconductor cooling chip close to the first heat conduction component can be switched to the heating surface to heat the core components inside the main body.

[0015] 2. The protective casing provides comprehensive protection for the temperature control mechanism, effectively preventing damage to internal components and leakage of cooling media, thus ensuring stable system operation. Simultaneously, the design of the air inlet and outlet ensures good airflow for the temperature control mechanism during operation, improving heat dissipation efficiency and preventing overheating. Furthermore, the addition of a dust filter further optimizes the system, reducing the impact of dust accumulation on heat dissipation by filtering dust and other impurities from the incoming air, extending the equipment's lifespan, and lowering maintenance costs. This comprehensive design not only improves the system's reliability and efficiency but also enhances its adaptability to various environmental conditions. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of this utility model;

[0017] Figure 2 This is a schematic diagram of the temperature control mechanism of this utility model;

[0018] Figure 3 This is a partial structural diagram of the temperature control mechanism of this utility model;

[0019] Figure 4 This is a schematic diagram of the protective mechanism of this utility model.

[0020] In the diagram: 1. Main body; 2. Temperature sensor; 3. Protective mechanism; 301. Protective shell; 302. First control panel; 303. Air inlet; 304. Air outlet; 305. Dust filter; 4. Temperature control mechanism; 401. Water tank; 402. Circulation pipe; 403. Circulation pump; 404. Semiconductor cooling chip; 405. First heat conduction component; 406. Second heat conduction component; 407. Cooling fan; 5. Circuit protection module; 6. Second control panel; 7. Wireless communication module. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] Please see Figure 1-3This utility model provides a technical solution: a switching power supply with a temperature control mechanism, including a main body 1, a temperature sensor 2 fixedly installed on the top of the main body 1, a protective mechanism 3 fixedly installed on one side of the main body 1, a temperature control mechanism 4 fixedly installed inside the protective mechanism 3, water jackets provided on the exterior of the core electronic components inside the main body 1, the temperature control mechanism 4 including a water tank 401, a circulation pipe 402 fixedly connected to one side of the water tank 401, the water tank 401 being connected to the water jacket inside the main body 1 through the circulation pipe 402, a circulation pump 403 provided in the middle section of the circulation pipe 402, a semiconductor cooling chip 404 fixedly installed on one side of the water tank 401, a first heat-conducting component 405 fixedly installed on one side of the semiconductor cooling chip 404, the first heat-conducting component 405 being fixedly installed inside the water tank 401, and a first heat-conducting component 405 being fixedly installed inside the water tank 401. A second heat-conducting component 406 is fixedly installed, and a cooling fan 407 is fixedly installed on one side of the second heat-conducting component 406. The cooperation between the second heat-conducting component 406 and the cooling fan 407 dissipates heat from the side of the thermoelectric cooler 404 away from the first heat-conducting component 405, reducing mutual interference between the two sides of the thermoelectric cooler 404. A circuit protection module 5 is fixedly installed on one side of the main body 1. The circuit protection module 5 provides multiple protection functions such as overload, short circuit, and overvoltage, which helps prevent the power supply and its power supply equipment from being damaged due to abnormal current or voltage, thereby improving the safety of the overall system. A second control panel 6 is fixedly installed on one side of the main body 1. Through the second control panel 6, users can monitor the status of the power supply in real time, including parameters such as input voltage, output voltage, and temperature, and make necessary adjustments, which simplifies the management and maintenance of the power supply system.

[0023] The specific implementation method is as follows: the temperature sensor 2 detects the temperature inside the main body 1, the circulating pump 403 drives the heat exchange medium to circulate inside the water tank 401, the circulating pipe 402, and the water jacket, and the temperature of the heat exchange medium inside the water tank 401 is changed by the cooperation of the semiconductor cooling chip 404 and the first heat conduction component 405. The position between the cooling surface and the heating surface of the semiconductor cooling chip 404 is changed by changing the current input direction of the semiconductor cooling chip 404. In summary, when the temperature inside the main body 1 is high, the side of the semiconductor cooling chip 404 close to the first heat conduction component 405 can be switched to the cooling surface to cool the core components inside the main body 1. When the temperature inside the main body 1 is low, the side of the semiconductor cooling chip 404 close to the first heat conduction component 405 can be switched to the heating surface to heat the core components inside the main body 1.

[0024] Please see Figure 1-4This utility model provides a technical solution: a switching power supply with a temperature control mechanism. The protective mechanism 3 includes a protective shell 301. The outer wall of the protective shell 301 has several air inlets 303, and one side of the protective shell 301 has an air outlet 304. An air outlet 304 is fixedly installed on one side of both the air inlets 303 and the air outlet 304. A first control panel 302 is fixedly installed on one side of the protective shell 301. Through the first control panel 302, the user can easily and directly observe temperature changes and set the temperature, improving the intuitiveness and convenience of operation. A wireless communication module 7 is fixedly installed on one side of the main body 1. The wireless communication module 7 has several advantages. First, this layout ensures tight integration between the wireless communication module 7 and the power supply, thereby improving the stability and efficiency of signal transmission. Second, this design helps simplify internal wiring, reduce space occupation and potential electromagnetic interference problems. In addition, the side-mounted wireless communication module 7 facilitates inspection and maintenance by users or maintenance personnel. At the same time, this design also helps improve the flexibility and scalability of the equipment, as the wireless communication module 7 can easily connect and communicate with other devices or systems. In summary, placing the wireless communication module 7 on one side of the main structure 1 is an efficient, safe and user-friendly design strategy.

[0025] The implementation method is as follows: The protective shell 301 provides comprehensive protection for the temperature control mechanism 4, effectively preventing damage to internal components and leakage of cooling medium, ensuring stable system operation. Simultaneously, the design of the air inlet 303 and air outlet 304 ensures good airflow for the temperature control mechanism 4 during operation, improving heat dissipation efficiency and preventing overheating. Furthermore, the addition of a dust filter 305 further optimizes the system, reducing the impact of dust accumulation on heat dissipation by filtering dust and other impurities from the incoming air, extending the equipment's lifespan, and lowering maintenance costs. This comprehensive design not only improves the system's reliability and efficiency but also enhances its adaptability to various environmental conditions.

[0026] Working principle: When using a switching power supply with a temperature control mechanism, the temperature sensor 2 detects the temperature inside the main body 1. The circulating pump 403 drives the heat exchange medium to circulate inside the water tank 401, the circulating pipe 402, and the water jacket. The temperature of the heat exchange medium inside the water tank 401 is changed by the cooperation of the semiconductor cooling chip 404 and the first heat conduction component 405. The position between the cooling surface and the heating surface of the semiconductor cooling chip 404 is changed by changing the current input direction of the semiconductor cooling chip 404. In summary, when the temperature inside the main body 1 is high, the side of the semiconductor cooling chip 404 closest to the first heat conduction component 405 can be switched to the cooling surface to cool the core components inside the main body 1. When the temperature inside the main body 1 is low, the side of the semiconductor cooling chip 404 closest to the first heat conduction component 405 can be switched to the heating surface to heat the core components inside the main body 1.

[0027] The cooperation between the second heat-conducting component 406 and the cooling fan 407 dissipates heat on the side of the thermoelectric cooler 404 away from the first heat-conducting component 405, reducing mutual interference between the two sides of the thermoelectric cooler 404. The circuit protection module 5 provides multiple protection functions such as overload, short circuit, and overvoltage, which helps prevent damage to the power supply and its powered equipment due to abnormal current or voltage, thereby improving the safety of the overall system. Through the second control panel 6, users can monitor the status of the power supply in real time, including parameters such as input voltage, output voltage, and temperature, and make necessary adjustments, which simplifies the management and maintenance of the power supply system.

[0028] The temperature control mechanism 4 is fully protected by the protective casing 301, effectively preventing damage to internal components and leakage of cooling medium, ensuring stable system operation. Meanwhile, the design of the air inlet 303 and air outlet 304 ensures good airflow for the temperature control mechanism 4 during operation, improving heat dissipation efficiency and preventing overheating. Furthermore, the addition of a dust filter 305 further optimizes the system, filtering dust and other debris from the incoming air, reducing the impact of dust accumulation on heat dissipation, extending the equipment's lifespan, and lowering maintenance costs. This comprehensive design not only improves the system's reliability and efficiency but also enhances its adaptability to various environmental conditions.

[0029] The first control panel 302 allows users to easily observe temperature changes and set temperatures, improving the intuitiveness and convenience of operation. Placing the wireless communication module 7 on one side of the main body 1 offers several advantages. First, this layout ensures tight integration of the wireless communication module 7 with the power supply, thereby improving the stability and efficiency of signal transmission. Second, this design helps simplify internal wiring, reducing space occupation and potential electromagnetic interference issues. Furthermore, the side-mounted wireless communication module 7 facilitates inspection and maintenance by users or maintenance personnel. Simultaneously, this design also enhances the flexibility and scalability of the equipment, as the wireless communication module 7 can easily connect and communicate with other devices or systems. In summary, placing the wireless communication module 7 on one side of the main body 1 is an efficient, safe, and user-friendly design strategy.

[0030] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A switching power supply with a temperature control mechanism, comprising a main body (1), wherein a temperature sensor (2) is fixedly mounted on the top of the main body (1), a protective mechanism (3) is fixedly mounted on one side of the main body (1), a temperature control mechanism (4) is fixedly mounted inside the protective mechanism (3), and water jackets are provided on the exterior of the core electronic components inside the main body (1), characterized in that: The temperature control mechanism (4) includes a water tank (401), a circulation pipe (402) is fixedly connected to one side of the water tank (401), the water tank (401) is connected to the water jacket inside the main body mechanism (1) through the circulation pipe (402), a circulation pump (403) is provided in the middle section of the circulation pipe (402), a semiconductor cooling chip (404) is fixedly installed on one side of the water tank (401), a first heat conduction component (405) is fixedly installed on one side of the semiconductor cooling chip (404), and the first heat conduction component (405) is fixedly installed inside the water tank (401).

2. A switching power supply with a temperature control mechanism according to claim 1, characterized in that, A second heat-conducting component (406) is fixedly installed on one side of the semiconductor cooling chip (404), and a cooling fan (407) is fixedly installed on one side of the second heat-conducting component (406).

3. A switching power supply with a temperature control mechanism according to claim 1, characterized in that, A circuit protection module (5) is fixedly installed on one side of the main body (1).

4. A switching power supply with a temperature control mechanism according to claim 1, characterized in that, A second control panel (6) is fixedly installed on one side of the main body (1).

5. A switching power supply with a temperature control mechanism according to claim 4, characterized in that, The protective mechanism (3) includes a protective shell (301), the outer wall of the protective shell (301) is provided with a plurality of air inlets (303), and an air outlet (304) is provided on one side of the protective shell (301). An air outlet (304) is fixedly installed on one side of both the air inlets (303) and the air outlet (304).

6. A switching power supply with a temperature control mechanism according to claim 5, characterized in that, A first control panel (302) is fixedly installed on one side of the protective shell (301).

7. A switching power supply with a temperature control mechanism according to claim 1, characterized in that, A wireless communication module (7) is fixedly installed on one side of the main body (1).

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