Piece arranging device prepared based on quartz crystal resonator

Abstract

The utility model relates to the technical field of quartz crystal resonators, in particular to a quartz crystal resonator preparation-based sheet arranging device, which comprises a negative pressure box; the negative pressure air connecting pipe is arranged on the negative pressure box; the adsorption plate is arranged on the negative pressure box, and a plurality of adsorption holes are formed in the adsorption plate in a penetrating manner; the sheet arranging main body is arranged on the adsorption plate, and a plurality of sheet placing grooves with a guiding function are formed in the sheet arranging main body; firstly, the wafers are placed on the wafer arrangement body through the suction nozzle, the wafers slide in the direction from the groove walls to the groove bottoms under the action of the gravity of the wafers so as to slide into the groove walls of the wafer arrangement grooves, the wafers do not need to be repeatedly scratched in the process, therefore, scratches are prevented from being generated on the surfaces of the wafers, and the rate of finished products is increased; when the wafer slides into the groove wall of the wafer placing groove, negative pressure adsorption force is generated in the wafer placing groove under the action of the vacuum source, and the wafer is accurately inserted into the wafer placing groove on the wafer arranging main body under the action of negative pressure adsorption, so that the insertion rate of the wafer is improved, and the production efficiency is further improved.

Description

Technical Field

[0001] This utility model relates to the field of quartz crystal resonator technology, and in particular to a chip arrangement device based on quartz crystal resonators. Background Technology

[0002] Quartz crystal resonators are piezoelectric devices made of piezoelectric quartz (i.e., crystal). The quality of the resonator is directly related to the cleanliness of the wafer surface and the quality of the coating. In the production process of quartz crystal resonators, the wafers need to be loaded into a carrier plate in order to transport them to the coating station for processing in an orderly manner.

[0003] The current wafer loading method is as follows: the picker picks up the wafer, then the camera captures the information of the wafer's position on the carrier plate, the motor drives the wafer pick-up nozzle to move, and the pick-up axis and the receiving axis perform rubbing and docking actions in the X and Y directions, thereby inserting the wafer into the wafer slot of the carrier plate.

[0004] However, due to the lack of a reliable positioning structure, the wafer surface is not only scratched during the wiping process, resulting in an increased scrap rate, but also the wafer cannot be accurately inserted into the wafer slot of the carrier board. This requires manual correction of wafers that are not accurately inserted into the wafer slot of the carrier board, further leading to low production efficiency. Utility Model Content

[0005] The purpose of this invention is to provide a chip arrangement device based on quartz crystal resonators to solve the problems mentioned in the background art.

[0006] The technical solution adopted in this utility model is:

[0007] A chip stacking device based on a quartz crystal resonator includes:

[0008] A negative pressure chamber, which has an internal cavity;

[0009] A negative pressure inlet pipe is installed on the negative pressure box and is connected to a vacuum source.

[0010] An adsorption plate is disposed on the negative pressure box, and multiple adsorption holes are opened through it, the adsorption holes being connected to the cavity;

[0011] The sheet placement body is set on the adsorption plate, and has multiple sheet placement slots with guiding functions. Multiple slot holes are opened through the sheet placement slots, and the slot holes are aligned with the adsorption holes.

[0012] The vacuum source creates a negative pressure inside the placement slot and the negative pressure box, generating a downward adsorption force.

[0013] Optionally, rubber sealing rings are provided between the negative pressure box and the adsorption plate, and between the adsorption plate and the sheet assembly.

[0014] Optionally, the sheet-laying body is detachably mounted on the adsorption plate.

[0015] Optionally, a positioning pin is provided on the adsorption plate, and a pin hole matching the positioning pin is opened on the plate body, with the positioning pin placed in the pin hole.

[0016] Optionally, the tray body is made of an anti-static, low-friction coefficient material.

[0017] Optionally, the material of the sheet body is ceramic.

[0018] Optionally, the slot includes:

[0019] The bottom of the groove has multiple slots arranged in a linear array.

[0020] The tank wall is inclined relative to the tank bottom and disposed on the periphery of the tank bottom.

[0021] Optionally, the inclination angle of the tank wall relative to the tank bottom is controlled between 30° and 45°.

[0022] Optionally, a positive pressure gas inlet pipe connected to an external gas source is also provided on the outer wall of the negative pressure box, and a second ball valve is provided on the positive pressure gas inlet pipe.

[0023] Optionally, a negative pressure gauge is also provided on the outer wall of the negative pressure box.

[0024] Compared with the prior art, the beneficial effects of this utility model are:

[0025] In this invention, the wafer is first placed on the wafer mounting body through a suction nozzle. Under its own gravity, the wafer slides along the groove wall towards the bottom of the groove, thus sliding into the wafer placement groove wall. This process does not require repeated wiping of the wafer, thus avoiding scratches on the wafer surface and improving the yield. When the wafer slides into the wafer placement groove wall, a negative pressure adsorption force is generated inside the wafer placement groove under the action of a vacuum source. Under the negative pressure adsorption, the wafer is accurately inserted into the wafer placement groove on the wafer mounting body, improving the wafer insertion rate and thus improving production efficiency. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 This is a schematic diagram of the overall structure of this application;

[0028] Figure 2 This is another schematic diagram of the state structure of this application;

[0029] Figure 3 This is a schematic diagram of the structure of the main body for arranging films in this application.

[0030] Figure label:

[0031] 1. Negative pressure box; 11. Cavity;

[0032] 2. Adsorption plate; 21. Adsorption hole; 22. Positioning pin;

[0033] 3. Main body for tray placement; 31. Tray placement slot; 311. Slot bottom; 3111. Slot hole; 312. Slot wall;

[0034] 4. Negative pressure air inlet pipe; 41. First ball valve;

[0035] 5. Rubber sealing ring;

[0036] 6. Positive pressure air inlet pipe; 61. Second ball valve;

[0037] 7. Negative pressure gauge. Detailed Implementation

[0038] In the following description, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments can be modified in various ways without departing from the spirit or scope of this invention. Therefore, the drawings and description are considered to be exemplary in nature and not restrictive.

[0039] In this invention, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0040] Given that the current technology lacks a reliable positioning structure, the wafer surface is not only scratched during the wiping process, increasing the scrap rate, but also the wafer cannot be accurately inserted into the wafer slot of the carrier board. This requires manual correction of wafers that are not accurately inserted into the wafer slot of the carrier board, further leading to low production efficiency.

[0041] like Figure 1-3 As shown, this utility model embodiment provides a sheet arrangement device based on a quartz crystal resonator, including: a negative pressure box 1, an adsorption plate 2 disposed on the negative pressure box 1, and a sheet arrangement body 3 disposed on the adsorption plate 2.

[0042] The negative pressure box 1 has an internal cavity 11. A negative pressure inlet pipe 4 is provided on one outer wall of the negative pressure box 1. The negative pressure inlet pipe 4 is connected to a vacuum source (not shown in the figure) and is used to evacuate air to form a negative pressure. The negative pressure inlet pipes 4 are arranged symmetrically, and each negative pressure inlet pipe 4 is provided with a first ball valve 41.

[0043] The adsorption plate 2 has multiple adsorption holes 21 arranged in a linear array, which are configured as channels for airflow. The shape and size of the adsorption plate 2 are adapted to the negative pressure box 1. That is, when the adsorption plate 2 is placed on the negative pressure box 1, a closed cavity 11 is formed inside the negative pressure box 1, and the adsorption holes 21 are connected to the cavity 11.

[0044] The tray placement body 3 has multiple tray placement slots 31 arranged in a linear array. Each tray placement slot 31 consists of a slot bottom 311 and a slot wall 312 forming an enclosing structure. Multiple slot holes 3111 arranged in a linear array are formed through the slot bottom 311, and these slot holes 3111 are also configured as channels for airflow. When the tray placement body 3 is placed on the adsorption plate 2, the slot holes 3111 on the slot bottom 311 are aligned with the adsorption holes 21. The slot wall 312 is inclined relative to the slot bottom 311 and positioned on the outer periphery of the slot bottom 311, forming a guide groove with a guiding function. Preferably, the inclination angle of the slot wall 312 relative to the slot bottom 311 is controlled between 30° and 45°.

[0045] In use, connect the negative pressure air inlet pipe 4 to the vacuum source and start the vacuum source. Adjust the first ball valve 41 to the appropriate opening. At this time, a negative pressure environment is formed in the wafer placement slot 31 on the wafer placement body 3. The airflow passes through the slot hole 3111, the adsorption hole 21 and the negative pressure box 1, generating an adsorption force from top to bottom. The wafer is placed on the wafer placement body 3 through the suction nozzle. Under its own gravity, the wafer slides along the slot wall 312 towards the slot bottom 311. When the wafer slides into the slot wall 312 of the wafer placement slot 31, it is accurately inserted into the wafer placement slot 31 on the wafer placement body 3 under the negative pressure adsorption, thereby improving the wafer insertion rate.

[0046] When the wafer is inserted into the wafer slot 31, the wafer covers the slot hole 3111, thereby forming a sealed space together with the slot hole 3111, the adsorption hole 21, and the cavity 11 of the negative pressure box 1. When the vacuum source continues to work, the air in the sealed space is evacuated, and the air pressure inside the slot hole 3111, the adsorption hole 21, and the cavity 11 of the negative pressure box 1 is lower than the outside air pressure, thus achieving the purpose of fixing the wafer and facilitating the next processing of the wafer, such as coating operation.

[0047] Furthermore, to prevent air leakage at the connection between the negative pressure box 1 and the adsorption plate 2, which could lead to insufficient suction, a rubber sealing ring 5 is provided between the negative pressure box 1 and the adsorption plate 2 in this embodiment. Specifically, the structure of the rubber sealing ring 5 can be as follows: Figure 2 As shown, the shape and size of the rubber sealing ring 5 are adapted to the negative pressure box 1, but it can also be other shapes.

[0048] Similarly, to prevent air leakage at the connection between the adsorption plate 2 and the sheet-laying body 3, which could lead to insufficient suction, in another embodiment, a rubber sealing ring (not shown in the figure) is also provided between the adsorption plate 2 and the sheet-laying body 3. Its shape is not limited, as long as it ensures a sealed connection between the adsorption plate 2 and the sheet-laying body 3.

[0049] Furthermore, to enable the wafer arrangement device to adapt to different application scenarios and be compatible with wafers of various specifications, in this embodiment, the wafer arrangement body 3 is detachably mounted on the adsorption plate 2.

[0050] Furthermore, to ensure precise alignment between the slot 3111 and the adsorption hole 21, in this embodiment, a positioning pin 22 is also provided on the adsorption plate 2, and a pin hole (not shown in the figure) matching the positioning pin 22 is opened on the plate arrangement body 3. During the installation of the plate arrangement body 3, the positioning pin 22 is inserted into the pin hole, thereby achieving precise alignment between the slot 3111 and the adsorption hole 21.

[0051] Furthermore, to prevent the wafers from accumulating static electricity and to reduce the sliding resistance during the sliding process, the wafer mounting body 3 in this embodiment is made of an antistatic, low-friction coefficient material, such as ceramic.

[0052] Furthermore, to ensure that the negative pressure value inside the negative pressure chamber 1 can be maintained within a certain range, the sheet arrangement device also includes a positive pressure air inlet pipe 6 installed on the outer wall of the negative pressure chamber 1 and a negative pressure gauge 7 installed on the outer wall of the negative pressure chamber 1.

[0053] The positive pressure air inlet pipes 6 are arranged symmetrically, and each positive pressure air inlet pipe 6 is equipped with a second ball valve 61. The positive pressure air inlet pipe 6 is connected to an external air source (such as the atmosphere) to introduce gas into the negative pressure box 1. The second ball valve 61 is used to adjust the air intake to balance the air extraction volume of the vacuum source, thereby stabilizing the negative pressure. For example, if the vacuum source extracts air too quickly, resulting in a low negative pressure (i.e., the vacuum is too high), the second ball valve 61 on the positive pressure air inlet pipe 6 is opened to allow a small amount of air to enter, slowing down the pressure drop and maintaining stability.

[0054] The negative pressure gauge 7 is used to monitor the negative pressure value in real time. The operator or automatic control system can adjust the opening of the second ball valve 61 according to the reading of the negative pressure gauge 7 to control the air intake. For example, when the negative pressure gauge 7 shows that the negative pressure is too high (vacuum is too high), the second ball valve 61 is opened to increase the air intake and reduce the vacuum; conversely, the second ball valve 61 is closed to reduce the air intake and increase the vacuum.

[0055] Finally, it should be noted that the above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A chip arrangement device based on a quartz crystal resonator, characterized in that, include: A negative pressure chamber has an internal cavity; a negative pressure inlet pipe is installed on the negative pressure chamber and connected to a vacuum source; an adsorption plate is installed on the negative pressure chamber and has multiple adsorption holes that communicate with the cavity; a tablet placement body is installed on the adsorption plate and has multiple tablet placement slots with guiding functions, each tablet placement slot having multiple through holes that are aligned with the adsorption holes; wherein, the vacuum source creates a negative pressure in the tablet placement slots and inside the negative pressure chamber, generating a downward adsorption force.

2. The tray arrangement device according to claim 1, characterized in that, Rubber sealing rings are provided between the negative pressure box and the adsorption plate, and between the adsorption plate and the sheet assembly body.

3. The tray arrangement device according to claim 1, characterized in that, The tray assembly is detachably mounted on the adsorption plate.

4. The tray arrangement device according to claim 1, characterized in that, A positioning pin is provided on the adsorption plate, and a pin hole matching the positioning pin is opened on the tray body, and the positioning pin is placed in the pin hole.

5. The tray arrangement device according to claim 1, characterized in that, The main body of the tray is made of anti-static, low-friction coefficient material.

6. The tray arrangement device according to claim 5, characterized in that, The material of the main body of the tray is ceramic.

7. The tray arrangement device according to claim 1, characterized in that, The placement slot includes: a slot bottom with a plurality of slots arranged in a linear array therethrough; and a slot wall that is inclined relative to the slot bottom and disposed on the periphery of the slot bottom.

8. The tray arrangement device according to claim 7, characterized in that, The inclination angle of the tank wall relative to the tank bottom is controlled between 30° and 45°.

9. The tray arrangement device according to claim 1, characterized in that, The outer wall of the negative pressure box is also provided with a positive pressure air inlet pipe that connects to an external air source, and a second ball valve is provided on the positive pressure air inlet pipe.

10. The tray arrangement device according to claim 9, characterized in that, A negative pressure gauge is also installed on the outer wall of the negative pressure box.

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