Multilayer composite circuit board of microwave high-frequency circuit

Abstract

The utility model discloses a multilayer composite circuit board of a microwave high-frequency circuit. The multilayer composite circuit board of the microwave high-frequency circuit comprises a substrate, a cover plate is arranged above the substrate, two high-frequency plates are arranged between the substrate and the cover plate, and a composite component is arranged between the two high-frequency plates; the composite component comprises a static electricity removing heat dissipation plate, heat dissipation silica gel is installed between the static electricity removing heat dissipation plate and the high-frequency plate, and a plurality of heat dissipation holes are formed in the static electricity removing heat dissipation plate. According to the multilayer composite circuit board of the microwave high-frequency circuit provided by the utility model, the substrate, the cover plate and the two high-frequency boards are arranged, and the static electricity removing heat dissipation plate is arranged between the two high-frequency boards, so that the heat dissipation and static electricity removing requirements of the high-frequency boards are realized by utilizing the static electricity removing heat dissipation plate, and the circuit board is simpler in overall structure and more convenient to use. And the difficulty and the cost of batch production are reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to composite circuit board technical field especially relates to a kind of multilayer composite circuit board of microwave high-frequency circuit. BACKGROUND

[0002] High-frequency circuit board is a kind of special circuit board with high electromagnetic frequency, generally, high frequency can be defined as frequency above 1GHz, and its physical performance, precision and technical parameters are better, and it is commonly used in automobile anti-collision system, satellite system and radio system.

[0003] The file with the existing announcement number CN217217006U discloses a kind of multilayer composite circuit board for microwave high-frequency circuit, it includes substrate, both sides of substrate upper end are fixed with positioning rod, substrate upper side is equipped with cover plate, two high-frequency boards are equipped between substrate and cover plate, heat dissipation component is equipped between the upper end and the lower end of the two high-frequency boards, and static electricity removing component is equipped in the middle of the two high-frequency boards;The heat generated when the high-frequency board works is adsorbed by the heat dissipation silica gel, and then the heat in the heat dissipation silica gel is diffused into the heat dissipation cavity through the mesh of the grid plate, and the heat is adsorbed by the heat dissipation fin to accelerate the speed of heat diffusion, thereby accelerating the heat dissipation efficiency, and finally the heat is diffused into the air through the opening of the heat dissipation cavity, so as to prevent the heat from circulating around the high-frequency board, and ensure the heat dissipation efficiency of the high-frequency board.

[0004] The circuit board dissipates heat through heat dissipation component, and removes static electricity through static electricity removing component, so that the structure of the circuit board is relatively complex, and it is not conducive to batch production of the circuit board.

[0005] Therefore, it is necessary to provide a kind of multilayer composite circuit board for microwave high-frequency circuit to solve the above technical problems. UTILITY MODEL CONTENT

[0006] In view of the above situation, to overcome the defects of the prior art, the utility model provides a kind of multilayer composite circuit board for microwave high-frequency circuit, which can be simple in structure and reduce the difficulty of batch production.

[0007] To achieve the above purpose, the utility model adopts the following technical scheme:

[0008] The multilayer composite circuit board for microwave high-frequency circuit comprises: a substrate, a cover plate is arranged above the substrate, two high-frequency boards are arranged between the substrate and the cover plate, a composite component is arranged between the two high-frequency boards, the composite component comprises a static electricity removing and heat dissipation plate arranged between the two high-frequency boards, heat dissipation silica gel is installed between the static electricity removing and heat dissipation plate and the high-frequency boards, the static electricity removing and heat dissipation plate is made of metal material, and a plurality of heat dissipation holes are formed in the static electricity removing and heat dissipation plate.

[0009] Preferably, a grounding wire is installed on one side of the static electricity removing and heat dissipation plate.

[0010] Preferably, the heat dissipation holes are triangular.

[0011] Preferably, the top and bottom of the anti-static heat sink are provided with mounting grooves.

[0012] Preferably, mounting holes are provided on the anti-static heat sink, the cover plate, and the high-frequency board.

[0013] Preferably, bolts are mounted on the substrate.

[0014] Compared with the prior art, the present invention has the following beneficial effects:

[0015] (1) This utility model sets up a substrate, a cover plate and two high-frequency boards, and sets an anti-static heat dissipation plate between the two high-frequency boards. The anti-static heat dissipation plate is used to realize the heat dissipation and anti-static needs of the high-frequency boards. The overall structure of the circuit board is simpler, and the difficulty and cost of mass production are reduced.

[0016] (2) By setting triangular heat dissipation holes, this utility model can help improve the structural stability of the antistatic heat dissipation plate;

[0017] (3) By opening an installation groove on the antistatic heat dissipation plate, this utility model can facilitate the installation and positioning of heat dissipation silicone.

[0018] (4) By setting mounting holes and bolts, this utility model can facilitate the assembly of circuit boards. Attached Figure Description

[0019] Figure 1 A schematic diagram of the structure of the multilayer composite circuit board for the microwave high-frequency circuit provided by this utility model;

[0020] Figure 2 for Figure 1 The diagram shows the structure of the anti-static heat sink in the multilayer composite circuit board of the microwave high-frequency circuit.

[0021] Figure 3 for Figure 2 An enlarged schematic diagram of part A in the middle.

[0022] The corresponding names of the attached figures are: 1-substrate, 2-antistatic heat sink, 3-cover plate, 4-thermal silicone, 5-high frequency board, 6-grounding wire, 7-heat dissipation hole, 8-support edge, 9-mounting groove, 10-mounting hole, 11-bolt. Detailed Implementation

[0023] The present invention will be further described below with reference to the accompanying drawings and embodiments. The embodiments of the present invention include, but are not limited to, the following embodiments.

[0024] Example 1:

[0025] likeFigures 1-3 As shown, the multilayer composite circuit board for microwave high-frequency circuits provided by this utility model includes: a substrate 1, a cover plate 3 on top of the substrate 1, two high-frequency boards 5 between the substrate 1 and the cover plate 3, and a composite component between the two high-frequency boards 5. The composite component includes an anti-static heat sink 2 disposed between the two high-frequency boards 5, heat-dissipating silicone 4 installed between the anti-static heat sink 2 and the high-frequency boards 5, the anti-static heat sink 2 being made of metal, a grounding wire 6 installed on one side of the anti-static heat sink 2, and multiple heat dissipation holes 7 extending along the entire length of the anti-static heat sink 2. In use, according to... Figure 1 As shown, the circuit board is assembled. The heat generated by the two high-frequency boards 5 during operation is transferred to the anti-static heat sink 2 via the thermal silicone 4. The heat is then exchanged with the external air through the heat dissipation holes 7 on the anti-static heat sink 2, achieving heat dissipation for the circuit board. Furthermore, the static electricity generated by the high-frequency boards 4 during operation is adsorbed by the anti-static heat sink 2 and then released to ground through the grounding wire 6, thus eliminating static electricity and preventing interference from additional static electricity, ensuring the normal operation of the high-frequency boards 5. This structural design, through the anti-static heat sink 2, achieves both static electricity removal and auxiliary heat dissipation for the circuit board. The overall structural design is simpler, and the overall thickness of the circuit board can be effectively controlled, thereby reducing the difficulty and cost of mass production of the circuit board.

[0026] By setting up a substrate 1, a cover plate 3, and two high-frequency boards 5, and setting an anti-static heat sink 2 between the two high-frequency boards 5, the heat dissipation and anti-static requirements of the high-frequency boards 5 are met by using the anti-static heat sink 2. The overall structure of the circuit board is simpler, reducing the difficulty and cost of mass production.

[0027] Example 2:

[0028] like Figure 3 As shown, the heat dissipation hole 7 is triangular, which forms an inclined support side 8 on the side of the heat dissipation hole 7. By utilizing the stability principle of triangle, the heat dissipation hole 7 is not easily deformed, thereby improving the structural stability of the anti-static heat dissipation plate 2.

[0029] By setting triangular heat dissipation holes 7, the structural stability of the antistatic heat dissipation plate 2 can be improved.

[0030] Example 3:

[0031] like Figures 1-2 As shown, mounting grooves 9 are provided at the top and bottom of the anti-static heat sink 2. One side of the heat dissipation silicone 4 is embedded in the mounting groove 9, and the other side is tightly attached to the high-frequency board 5.

[0032] By opening an installation groove 9 on the anti-static heat sink 2, the thermal silicone 4 can be easily installed and positioned.

[0033] Example 4:

[0034] like Figure 2 As shown, mounting holes 10 are provided on the antistatic heat sink 2, cover plate 3 and high frequency plate 4. Correspondingly, bolts 11 are installed on the substrate 1. During installation, as shown in the installation diagram, the bolts 11 on the base plate 1 are passed through the mounting holes 10 on the antistatic heat sink 2, cover plate 3 and high frequency plate 4, and the nuts are tightened, so that the entire circuit board can be assembled and fixed.

[0035] The installation of the circuit board is facilitated by the mounting holes 10 and the bolts 11.

[0036] Working Principle: During use, the circuit board is assembled as shown in the diagram. The heat generated by the two high-frequency boards 5 during operation is transferred to the anti-static heat sink 2 via the thermal silicone 4. The heat is then exchanged with the external air through the heat dissipation holes 7 on the anti-static heat sink 2, achieving heat dissipation for the circuit board. Additionally, the static electricity generated by the high-frequency boards 4 during operation is adsorbed by the anti-static heat sink 2 and then released to ground through the grounding wire 6, thus eliminating static electricity and preventing interference from additional static electricity, ensuring the normal operation of the high-frequency boards 5. This structural design, through the anti-static heat sink 2, achieves both static electricity removal and auxiliary heat dissipation for the circuit board. The overall structural design is simpler, and the overall thickness of the circuit board can be effectively controlled, thereby reducing the difficulty and cost of mass production of the circuit board.

Claims

1. A multilayer composite circuit board for microwave high-frequency circuits, characterized in that, include: A substrate (1) is provided with a cover plate (3) on top of the substrate (1), and two high-frequency plates (5) are provided between the substrate (1) and the cover plate (3), and a composite component is provided between the two high-frequency plates (5); The composite component includes an antistatic heat sink (2), a heat dissipation silicone (4) is installed between the antistatic heat sink (2) and the high-frequency plate (5), and a plurality of heat dissipation holes (7) are opened on the antistatic heat sink (2).

2. The multilayer composite circuit board for microwave high-frequency circuits according to claim 1, characterized in that, A grounding wire (6) is installed on one side of the anti-static heat sink (2).

3. The multilayer composite circuit board for microwave high-frequency circuits according to claim 1, characterized in that, The heat dissipation hole (7) is triangular.

4. The multilayer composite circuit board for microwave high-frequency circuits according to claim 1, characterized in that, The top and bottom of the antistatic heat sink (2) are provided with mounting grooves (9).

5. The multilayer composite circuit board for microwave high-frequency circuits according to claim 1, characterized in that, Mounting holes (10) are provided on the antistatic heat sink (2), the cover plate (3) and the high frequency plate (5).

6. The multilayer composite circuit board for microwave high-frequency circuits according to claim 1, characterized in that, Bolts (11) are mounted on the substrate (1).

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