Control device
By employing a dual-circuit board and heat sink design in the automotive control unit, the problem of large domain controller size is solved, realizing the integration and miniaturization of intelligent driving, infotainment, and vehicle control functions, meeting the heat dissipation requirements of multiple functions, and simplifying assembly processes and wiring harness layout.
Patent Information
- Application Number
- CN202422856205.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-21
- Publication Date
- 2026-02-10
- Estimated Expiration
- 2034-11-21
AI Technical Summary
In traditional electronic and electrical architectures, domain controllers for intelligent driving, infotainment, and vehicle control functions are large in size, making integration and miniaturization difficult.
The design employs a dual-circuit board structure and heat sink. By placing a first circuit board and a second circuit board inside the housing, located on opposite sides of the heat sink, the heat sink is used to dissipate heat from the chip. Combined with a floating connector, electrical connections between the circuit boards are achieved, simplifying the assembly process.
It achieves a high degree of integration, miniaturization, and lightweighting of the control device, meets the heat dissipation requirements of multi-functional needs, reduces vehicle assembly space and assembly processes, and simplifies wiring harness layout.
Smart Images
Figure CN223899427U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of automobile manufacturing technology, and in particular to a control device. Background Technology
[0002] Intelligent driving, infotainment, and vehicle control are the three essential functions of modern new energy vehicles. In traditional electronic and electrical architectures, these three functions belong to three different domain controllers, resulting in a large overall size for these three domain controllers. Utility Model Content
[0003] One embodiment of this application provides a control device for an automobile, comprising a housing, a heat sink, a first circuit board, and a second circuit board. The heat sink, the first circuit board, and the second circuit board are all disposed within the housing. The first circuit board and the second circuit board are located on opposite sides of the heat sink and each has a chip that abuts against the heat sink. The housing includes a base, a middle frame, and a cover. The base and the cover are respectively disposed on opposite sides of the middle frame. The middle frame surrounds the heat sink and is connected to the heat sink. The first circuit board is located on the side of the heat sink facing the base, and the second circuit board is located on the side of the heat sink facing the cover. The heat sink has an access channel communicating with the outside of the housing.
[0004] A further embodiment is provided with a vent hole and a vent valve located in the vent hole, the vent hole connecting the inside and outside of the housing.
[0005] A further embodiment is provided in which a sealed space is formed between the first circuit board and the second circuit board, the connecting hole connects the sealed space to the outside of the housing, and the heat sink is located inside the sealed space.
[0006] A further embodiment is that the base has a clearance groove on the side near the first circuit board, and the first circuit board has a first electrical connection port on the side facing the base, and the first electrical connection port is located in the clearance groove.
[0007] A further embodiment is that the side of the first circuit board facing the base is sealed to the base to form a sealed space, and the first electrical connection port is located outside the sealed space.
[0008] A further embodiment is provided with a mounting hole on the cover, and a second electrical connection port is provided on the second circuit board, the second electrical connection port being located inside the mounting hole.
[0009] A further embodiment is that the cover includes a main body and an antenna cover, the main body is provided with a clearance opening, the antenna cover is disposed on the clearance opening and connected to the main body and / or the middle frame, and the second circuit board is provided with an antenna structure corresponding to the clearance opening.
[0010] A further embodiment is that the chip on the first circuit board that abuts against the heat sink includes any two of the following four chips: a smart cockpit chip, a smart driving chip, a power amplifier chip, and a vehicle control chip; and the chip on the second circuit board that abuts against the heat sink includes the other two of the following four chips: the smart cockpit chip, the smart driving chip, the power amplifier chip, and the vehicle control chip.
[0011] A further embodiment is provided with heat dissipation protrusions on the outer surface of the heat sink to abut against the chips on the first circuit board and / or the chips on the second circuit board.
[0012] A further embodiment is provided with a plurality of heat sink pillars on the inner surface of the heat sink corresponding to the position of the chip that abuts against the heat sink.
[0013] A further embodiment includes a floating connector disposed between the first circuit board and the second circuit board, the floating connector electrically connecting the first circuit board and the second circuit board.
[0014] This application adopts the above-mentioned technical solution. By setting a first circuit board and a second circuit board, multiple chips with different functions can be set in the control device, thereby enabling one control device to realize multiple functions. Compared with the overall volume of multiple control devices that realize one function, the overall volume of the control device in this application is smaller. In addition, the control device dissipates heat from the chip through a heat sink to meet the heat dissipation requirements of the chip. Attached Figure Description
[0015] Figure 1 This is a schematic diagram of the control device in some embodiments of this application;
[0016] Figure 2 for Figure 1 The diagram shows a schematic representation of the circuit board assembly in some embodiments.
[0017] Figure 3 for Figure 1 A partial structural schematic diagram of the control device in the illustrated embodiment. Detailed Implementation
[0018] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are merely some examples or embodiments of this application. For those skilled in the art, these drawings can be applied to other similar scenarios without creative effort. Unless obvious from the context or otherwise specified, the same reference numerals in the drawings represent the same structures or operations.
[0019] This application describes a control device that can be used in automobiles and can serve as a vehicle control unit (VCU). Of course, in other embodiments, the control device can also be used in other non-automotive electronic devices, which will not be elaborated here. Here, the control device is used in an automobile as an example.
[0020] The control device may have intelligent driving functions, infotainment (smart cockpit) functions, or even vehicle control functions. In some embodiments, the control device may have intelligent driving functions, infotainment functions, or vehicle control functions. In some embodiments, the control device may have any two of the three functions: intelligent driving functions, infotainment functions, and vehicle control functions. In some embodiments, the control device may not have intelligent driving functions, infotainment functions, and vehicle control functions, but may have other functions.
[0021] Please see Figure 1 , Figure 1 This is a schematic diagram of the structure of the control device in some embodiments of this application. The control device 100 may include a housing 10, a circuit board assembly 20, and a heat sink 30. The housing 10 can be used to support and mount the circuit board assembly 20 and the heat sink 30. The circuit board assembly 20 and the heat sink 30 may both be disposed within the housing 10. The circuit board assembly 20 may be provided with a chip that implements the control functions of the control device 100, such as intelligent driving functions, infotainment functions, and / or vehicle control functions. The chip that implements the control functions of the control device 100, such as intelligent driving functions, infotainment functions, and / or vehicle control functions, may generate excessive heat due to its high computing power, which may further affect the chip performance and / or the stability of the control device 100, and may even lead to chip damage. The heat sink 30 can dissipate heat from the chip that implements the control functions of the control device 100, such as intelligent driving functions, infotainment functions, and / or vehicle control functions, to meet the chip's heat dissipation requirements.
[0022] The shell 10 can be a shell structure, supported by rigid materials, or it can be other structures or made of other materials, which will not be elaborated further.
[0023] Please see Figure 1The housing 10 may include a base 11, a middle frame 12, and a cover 13. The base 11 and the cover 13 may be respectively installed on opposite sides of the middle frame 12 to form a space within the housing 10 for accommodating the circuit board assembly 20 and the heat sink 30.
[0024] The base 11 may include a body portion 111 and a fixing portion 112. The body portion 111 and the fixing portion 112 may be connected.
[0025] A reinforcing grille 1111 may be provided on the side of the main body 111 facing the middle frame 12 to enhance the structural strength of the main body 111. In some embodiments, a groove (not shown) may be provided on the side of the main body 111 facing the middle frame 12, and the reinforcing grille 1111 is disposed in the groove.
[0026] A sealing ring (not shown) may be provided on the surface of the body portion 111 facing the middle frame 12 to allow for a sealing fit with the circuit board assembly 20. In some embodiments, a sealing groove may be provided on the surface of the body portion 111 facing the middle frame 12 to accommodate the sealing ring. In some embodiments, the sealing ring may surround the reinforcing grille 1111. In some embodiments, the sealing ring may be disposed on the groove wall of the recess accommodating the reinforcing grille 1111.
[0027] A recess 1112 may be provided on the side of the main body 111 facing the middle frame 12 to mate with the circuit board assembly 20. In some embodiments, the recess 1112 may communicate between the inside and outside of the housing 10. In some embodiments, a sealing ring may be provided around the recess 1112. In some embodiments, the sealing ring may surround the recess 1112.
[0028] In some embodiments, the clearance groove 1112 may be spaced apart from the recess that accommodates the reinforcing grille 1111. In some embodiments, the clearance groove 1112 may extend to the edge of the body portion 111 to form a mounting opening 1102 at the edge of the body portion 111.
[0029] In some embodiments, the clearance groove 1112 may penetrate the body portion 111 and extend to the surface of the body portion 111 opposite to the middle frame 12, so as to form a mounting opening 1102 on the surface of the body portion 111 opposite to the middle frame 12.
[0030] In some embodiments, the clearance groove 1112 may be provided on the bottom of the groove that accommodates the reinforcing grille 1111 to penetrate the body portion 111.
[0031] The fixing part 112 can be connected to other structures, such as those on a car, by means of welding, screwing, snap-fitting, bonding or plugging, as is well known in the art, to enable the control device 100, such as the base 11, to be mounted on other structures, such as a car.
[0032] The fixing part 112 can be disposed around the periphery of the body part 111, or on the side of the body part 111 opposite to the middle frame 12, or on the side of the body part 111 facing the middle frame 12. The fixing part 112 can be connected to the body part 111 by methods well known in the art, such as welding, screwing, snap-fitting, bonding, or plugging. In some embodiments, the fixing part 112 can be integrally formed with the body part 111.
[0033] In some embodiments, the fixing portion 112 may enclose a spacer region 1101. In some embodiments, the spacer region 1101 may be located on the side of the body portion 111 opposite to the middle frame 12 to reduce contact between the body portion 111 and other structures, such as a vehicle. In some embodiments, the spacer region 1101 may be formed on the body portion 111, for example, a groove may be provided on the side of the body portion 111 opposite to the middle frame 12 to form the spacer region 1101.
[0034] The middle frame 12 can be a frame structure, which can surround the heat sink 30 and can be connected to the heat sink 30 by means well known in the art, such as welding, screwing, snap-fitting, bonding, or plugging. In some embodiments, the middle frame 12 can be integrally formed with the heat sink 30. In some embodiments, the middle frame 12 can be connected and fixed to the base 11, such as the body portion 111, for example, by means of welding, screwing, snap-fitting, bonding, or plugging.
[0035] A sealing ring (not shown) may be provided on the surface of the middle frame 12 facing the base 11, such as the body portion 111, to allow for a sealing fit with the circuit board assembly 20. In some embodiments, a sealing groove (not shown) may be provided on the surface of the middle frame 12 facing the base 11 to accommodate the sealing ring.
[0036] A sealing ring (not shown) may be provided on the surface of the middle frame 12 facing the cover 13 to allow for a sealing fit with the circuit board assembly 20. In some embodiments, a sealing groove (not shown) may be provided on the surface of the middle frame 12 facing the cover 13 to accommodate the sealing ring.
[0037] A vent 121 is provided on the middle frame 12 to connect the inside and outside of the housing 10. A vent valve 122 is also provided on the middle frame 12 at the vent 121 to allow air to pass through and to prevent moisture from entering the housing 10 as much as possible. In some embodiments, the vent 121 and the vent valve 122 may also be installed on other structures of the housing 10.
[0038] The cover 13 can be connected and fixed to the middle frame 12, for example, by welding, screwing, snap-fitting, gluing or plugging, or other methods well known in the art. The cover 13 may include a main body 131 and an antenna cover 132. The main body 131 and the antenna cover 132 can be connected and fixed, for example, by welding, screwing, snap-fitting, gluing or plugging, or other methods well known in the art.
[0039] The main body 131 can be connected and fixed to the middle frame 12, for example, by means of welding, screwing, snap-fitting, gluing or plugging, or other methods well known in the art.
[0040] The main body 131 is provided with a mounting hole 1301 for engaging with the circuit board assembly 20. In some embodiments, the mounting hole 1301 can communicate between the inside and outside of the housing 10. In some embodiments, a sealing ring (not shown) may be provided on the surface of the main body 131 facing the middle frame 12 for sealing engagement with the circuit board assembly 20. In some embodiments, the sealing ring surrounds the mounting hole 1301. In some embodiments, a sealing groove (not shown) may be provided on the surface of the main body 131 facing the middle frame 12 to accommodate the sealing ring.
[0041] The main body 131 may have a relief opening 1302 for mating with the circuit board assembly 20. In some embodiments, the relief opening 1302 is formed at the edge of the main body 131. In some embodiments, the relief opening 1302 is formed at the corner of the main body 131.
[0042] The antenna cover 132 may be made of a material that allows electromagnetic signals to pass through, such as a non-metallic material, so that the antenna function on the circuit board assembly 20 can be fully utilized.
[0043] The antenna cover 132 can be disposed over the clearance opening 1302 to reduce the exposure of the clearance opening 1302. In some embodiments, the antenna cover 132 can be connected and fixed to the main body 131, for example, by means well known in the art such as welding, screwing, snap-fitting, bonding, or plugging. In some embodiments, the antenna cover 132 can be connected and fixed to the middle frame 12, for example, by means well known in the art such as welding, screwing, snap-fitting, bonding, or plugging.
[0044] The circuit board assembly 20 can be connected to the housing 10 by means well known in the art, such as soldering, screwing, snapping, bonding or plugging.
[0045] Please see Figure 1 and Figure 2 , Figure 2 for Figure 1 The diagram shows a schematic representation of the circuit board assembly 20 in some embodiments. The circuit board assembly 20 may include a first circuit board 21 and a second circuit board 22. The first circuit board 21 and the second circuit board 22 may be located on opposite sides of the heat sink 30, and both have chips that abut against the heat sink 30. Therefore, the heat sink 30 can dissipate heat from the chips that abut against the heat sink 30. Of course, chips that are not abutting against the heat sink 30 can also be dissipated by the heat sink 30, although the heat dissipation effect may be somewhat worse.
[0046] The first circuit board 21 may be located between the base 11 and the heat sink 30, and may be fixed to the base 11 and / or the middle frame 12, for example, by means of welding, screwing, snap-fitting, gluing or plugging, or other methods well known in the art. The first circuit board 21 may include a first board body 211, a first control chip 212, a first connector 213 and a first electrical connection port 214. The first control chip 212, the first connector 213 and the first electrical connection port 214 may all be disposed on the first board body 211.
[0047] The first plate 211 can be fixed to the base 11 and / or the middle frame 12, for example, by means of welding, screwing, snap-fitting, bonding, or plugging, or other methods well known in the art. In some embodiments, the first plate 211 can abut against a sealing ring on the base 11, for example, the body portion 111, to achieve a sealing fit, and a sealed space can be formed between the first circuit board 21, for example, the first plate 211, and the base 11, for example, the body portion 111. In some embodiments, the sealed space between the first circuit board 21, for example, the first plate 211, and the base 11, for example, the body portion 111, can communicate with the vent 121. In some embodiments, a chip can be disposed within the sealed space between the first circuit board 21, for example, the first plate 211, and the base 11, for example, the body portion 111.
[0048] In some embodiments, the first plate 211 may abut against a sealing ring on the middle frame 12 to achieve a sealing fit, and may form a sealed space between the first circuit board 21 (e.g., the first plate 211) and the second circuit board 22. In some embodiments, the sealed space between the first circuit board 21 (e.g., the first plate 211) and the second circuit board 22 may communicate with the vent 121. In some embodiments, the sealed space between the first circuit board 21 (e.g., the first plate 211) and the second circuit board 22 may be formed by the first circuit board 21 (e.g., the first plate 211), the second circuit board 22, and the middle frame 12. In some embodiments, the sealed space between the first circuit board 21 (e.g., the first plate 211) and the second circuit board 22 may be formed by the first circuit board 21 (e.g., the first plate 211), the middle frame 12, and the cover 13 (e.g., the main body 131).
[0049] The first control chip 212 may include a first chip 2121 and a second chip 2122. In some embodiments, the first chip 2121 and / or the second chip 2122 may be disposed on the side of the first plate 211 facing the middle frame 12. In some embodiments, the first chip 2121 and / or the second chip 2122 may be disposed on the side of the first plate 211 facing the base 11, such as the body portion 111. In some embodiments, the first chip 2121 may be one of multiple chips that can abut against the heat sink 30, such as a smart cockpit chip, a smart driving chip, a power amplifier chip, and a vehicle control chip. The smart driving chip enables the intelligent driving function of the vehicle, the smart cockpit chip enables the infotainment function of the vehicle, and the vehicle control chip enables the vehicle control function of the vehicle. The power amplifier chip enables power amplification. Since the smart cockpit chip, smart driving chip, power amplifier chip, and vehicle control chip are high-power devices, they require heat dissipation. That is, the high-power devices in the control device 100 can be cooled by the heat sink 30. In some embodiments, the second chip 2122 may be one of multiple chips that can abut against the heat sink 30, such as a smart cockpit chip, a smart driving chip, a power amplifier chip, and a vehicle control chip. In some embodiments, the first chip 2121 and the second chip 2122 may be different. In some embodiments, the first chip 2121 and / or the second chip 2122 may abut against the heat sink 30 so that the chip abutting against the heat sink 30 can be cooled by the heat sink 30.
[0050] The first connector 213 may be disposed on the side of the first plate 211 facing the second circuit board 22 for electrical connection with the second circuit board 22. Of course, the first connector 213 may also be disposed on other structures and / or parts on the first plate 211. In some embodiments, the first connector 213 may be a wire, a conductive post, or an interface such as a USB interface or a Type-C interface, or even an electrical connector or digital interface well known in the art, which will not be elaborated further.
[0051] In some embodiments, the first connector 213 may be disposed within a sealed space located between the first circuit board 21, for example, the first plate body 211 and the second circuit board 22.
[0052] The first electrical connection port 214 can be a wire, a conductive post, or an interface such as a USB interface, a Type-C interface, or even a digital interface well-known in the art, which will not be elaborated further.
[0053] The first electrical connection port 214 enables electrical connection between the first circuit board 21, such as the first board body 211, and an external device. The first electrical connection port 214 can be located on the side of the first board body 211 facing away from the second circuit board 22, and can be correspondingly provided in the recessed groove 1112 so that it can be installed within the recessed groove 1112. Furthermore, the external device can extend into the recessed groove 1112 from the mounting port 1102 and make electrical connection with the first electrical connection port 214. In some embodiments, the first electrical connection port 214 can be isolated from the sealed space between the first board body 211 and the base 11, such as the body part 111, by a sealing ring on the base 11, such as the main body part 111, thereby preventing water from entering the sealed space between the first board body 211 and the base 11, such as the main body part 111, through the sealing ring. In some embodiments, the first electrical connection port 214 may be isolated from the sealed space between the first plate 211 and the second circuit board 22 by the sealing engagement of the sealing ring on the base 11, such as the body portion 111, thereby preventing water at the first electrical connection port 214 from entering the sealed space between the first plate 211 and the second circuit board 22.
[0054] The second circuit board 22 may be located between the cover 13 (e.g., the main body 131) and the heat sink 30, and may be fixed to the middle frame 12 and / or the cover 13 (e.g., the main body 131), for example, by means well-known in the art such as welding, screwing, snap-fitting, gluing, or plugging. The second circuit board 22 may include a second board 221, an antenna structure 222, a second connector 223, a second control chip 224, and a second electrical connection port 225. The antenna structure 222, the second connector 223, the second control chip 224, and the second electrical connection port 225 may all be disposed on the second board 221.
[0055] The second plate 221 can be fixed to the middle frame 12 and / or the cover 13, such as the main body 131, for example, by means well-known in the art such as welding, screwing, snap-fitting, bonding, or plugging. In some embodiments, the second plate 221 can abut against a sealing ring on the cover 13, such as the main body 131, to achieve a sealing fit, and a sealed space can be formed between the second plate 221 and the cover 13, such as the main body 131. In some embodiments, the sealed space between the second plate 221 and the cover 13, such as the main body 131, can communicate with the vent 121. In some embodiments, a chip can be disposed within the sealed space between the second plate 221 and the cover 13, such as the main body 131.
[0056] In some embodiments, the second plate 221 may abut against a sealing ring on the middle frame 12 to achieve a sealing fit, and a sealed space may be formed between the second plate 221 and the first circuit board 21, such as the first plate 211. In some embodiments, the sealed space between the second plate 221 and the first circuit board 21, such as the first plate 211, may communicate with the vent 121. In some embodiments, the sealed space between the second plate 221 and the first circuit board 21, such as the first plate 211, may be formed by the first circuit board 21, such as the first plate 211, the second circuit board 22, such as the second plate 221, and the middle frame 12. In some embodiments, the sealed space between the second plate 221 and the first circuit board 21, such as the first plate 211, may be formed by the second circuit board 22, such as the second plate 221, the middle frame 12, and the base 11, such as the body portion 111.
[0057] Antenna structure 222 enables communication between the second circuit board 22 (e.g., the second board body 221) and an external device. Antenna structure 222 can be disposed on the side of the second board body 221 facing away from the first circuit board 21, and can be disposed corresponding to antenna cover 132, to realize the antenna function of antenna structure 222 and reduce the impact of the main body 131 on the antenna performance of antenna structure 222. In some embodiments, antenna structure 222 can be disposed on the side of the second board body 221 facing the first circuit board 21 (e.g., the first board body 211). In some embodiments, antenna structure 222 can be isolated from the sealed space between the second board body 221 and the cover 13 (e.g., the main body 131) by a sealing ring on the cover 13 (e.g., the main body 131), preventing water from entering the sealed space between the second board body 221 and the cover 13 (e.g., the main body 131) through the sealing ring. In some embodiments, the antenna structure 222 can be isolated from the sealed space between the second plate 221 and the cover 13 (e.g., the main body 131) by a sealing ring on the cover 13 (e.g., the main body 131), preventing water from entering the sealed space between the second plate 221 and the first circuit board 21 (e.g., the first plate 211) through the sealing ring. In some embodiments, the antenna structure 222 can be isolated from the sealed space between the second plate 221 and the cover 13 (e.g., the main body 131) by a sealing ring on the middle frame 12, preventing water from entering the sealed space between the second plate 221 and the cover 13 (e.g., the main body 131) through the sealing ring. In some embodiments, the antenna structure 222 can be isolated from the sealed space between the second plate 221 and the cover 13 (e.g., the main body 131) by a sealing ring on the middle frame 12, preventing water from entering the sealed space between the second plate 221 and the first circuit board 21 (e.g., the first plate 211) through the sealing ring.
[0058] In some embodiments, the antenna structure 222 may be an onboard antenna, which may be fully integrated on the second circuit board 22, such as the second board 221, to avoid protruding structures as much as possible, so as to ensure that the shape of the control device 100, such as the second circuit board 22, is regular and conducive to the overall vehicle layout.
[0059] The second connector 223 can be disposed on the side of the second plate 221 facing the first circuit board 21, such as the first plate 211, so as to be opposite to the first circuit board 21, such as the first connector 213, to achieve electrical connection. Of course, the second connector 223 can also be disposed on other structures and / or parts on the second plate 221. In some embodiments, the second connector 223 can be a wire, a conductive post, or an interface that matches the first connector 213, such as a USB interface or a Type-C interface, or even an electrical connector or digital interface that matches the first connector 213 well known in the art, which will not be described in detail.
[0060] In some embodiments, the second connector 223 and the first connector 213 can form a floating connector to achieve a floating connection between the first circuit board 21 and the second circuit board 22, which can simplify the assembly process.
[0061] In some embodiments, the second connector 223 may be disposed in a sealed space between the first circuit board 21, for example, the first plate body 211, and the second circuit board 22, for example, the second plate body 221.
[0062] The second control chip 224 may include a third chip 2241 and a fourth chip 2242. In some embodiments, the third chip 2241 and / or the fourth chip 2242 may be disposed on the side of the second plate 221 facing the middle frame 12. In some embodiments, the third chip 2241 and / or the fourth chip 2242 may be disposed on the side of the second plate 221 facing the cover 13, such as the main body 131. In some embodiments, the third chip 2241 may be one of multiple chips that can abut against the heat sink 30, such as a smart cockpit chip, a smart driving chip, a power amplifier chip, and a vehicle control chip. In some embodiments, the fourth chip 2242 may be one of multiple chips that can abut against the heat sink 30, such as a smart cockpit chip, a smart driving chip, a power amplifier chip, and a vehicle control chip. In some embodiments, the third chip 2241 and the fourth chip 2242 may be different. In some embodiments, the third chip 2241 is different from both the first chip 2121 and the second chip 2122. In some embodiments, the fourth chip 2242 is different from the first chip 2121 and also different from the second chip 2122. In some embodiments, the third chip 2241 and / or the fourth chip 2242 may abut against the heat sink 30, and the heat sink 30 can dissipate heat from the chip abutting against the heat sink 30.
[0063] The second electrical connection port 225 can be a wire, a conductive post, or an interface such as a USB interface, a Type-C interface, or even a digital interface well-known in the art, which will not be elaborated further.
[0064] The second electrical connection port 225 enables electrical connection between the second circuit board 22, such as the second board body 221, and an external device. The second electrical connection port 225 can be located on the side of the second board body 221 facing away from the first circuit board 21, and can be corresponding to the mounting hole 1301 for installation within the mounting hole 1301. Furthermore, the external device can extend into the mounting hole 1301 and make electrical connection with the second electrical connection port 225. In some embodiments, the second electrical connection port 225 can be isolated from the sealed space between the second board body 221 and the cover body 13, such as the main body 131, through a sealing ring on the cover 13, such as the main body 131, thereby preventing water from entering the sealed space between the second board body 221 and the cover 13, such as the main body 131. In some embodiments, the second electrical connection port 225 may be isolated from the sealed space between the second plate 221 and the first circuit board 21, such as the first plate 211, by the sealing fit of the sealing ring on the cover 13, such as the main body 131, thereby preventing water at the second electrical connection port 225 from entering the sealed space between the second plate 221 and the first circuit board 21, such as the first plate 211.
[0065] Please see Figure 1 and Figure 3 , Figure 3 for Figure 1 The illustrated embodiment shows a partial structural diagram of the control device 100. The heat sink 30 can be fixed to the housing 10, for example, the middle frame 12, and can be located within the sealed space between the second circuit board 22, for example, the second plate 221, and the first circuit board 21, for example, the first plate 211. In some embodiments, the space between the heat sink 30 and the housing 10, for example, the middle frame 12, can accommodate the first connector 213 and the second connector 223, so that the first connector 213 and the second connector 223 can be electrically connected.
[0066] The heat sink 30 may include a heat sink body 31 and an inlet / outlet channel 32. The heat sink body 31 may be fixed to the housing 10, such as the middle frame 12, for example, by means well known in the art, such as welding, screwing, snap-fitting, bonding, or plugging. The inlet / outlet channel 32 may communicate with the interior of the heat sink body 31 and may extend outside the housing 10, connecting to a cooling source that provides cooling medium, so that the cooling medium can enter and exit the heat sink body 31 through the inlet / outlet channel 32 under the control of the cooling source. The inlet / outlet channel 32 may penetrate the housing 10, such as the middle frame 12, to extend outside the housing 10. In some embodiments, the input channel 321 in the inlet / outlet channel 32 is used to allow cooling medium to flow into the heat sink 30, such as the heat sink body 31, and to allow cooling medium to be input from the cooling source into the heat sink 30, such as the heat sink body 31. In some embodiments, the output channel 322 in the inlet / outlet channel 32 is used to allow cooling medium to flow out of the heat sink 30, such as the heat sink body 31, and into the cooling source.
[0067] The heat dissipation body 31 may include a heat dissipation shell 311 and a heat dissipation cover 312. The heat dissipation shell 311 and the heat dissipation cover 312 may be connected and fixed by means well known in the art, such as welding, screwing, snap-fitting, bonding or plugging, to form a space for accommodating the cooling medium and to allow the cooling medium to flow in an orderly manner within the heat dissipation body 31, thereby achieving heat dissipation for the control device 100. In some embodiments, the heat dissipation shell 311 and the heat dissipation cover 312 are integrally formed.
[0068] The heat sink 311 can be fixed to the housing 10, such as the middle frame 12, for example, by means of welding, screwing, snap-fitting, gluing, or plugging, or other methods well known in the art. In some embodiments, the heat sink cover 312 can be fastened to the side of the heat sink 311 facing the first circuit board 21, such as the first plate 211. In some embodiments, the heat sink cover 312 can be fastened to the side of the heat sink body 31 facing the second circuit board 22, such as the second plate 221.
[0069] The heat sink 311 may have multiple heat dissipation pillars within the heat dissipation body 31 to increase the contact area with the cooling medium. This allows the heat dissipation pillars 3111 to accelerate heat dissipation from the heat sink 311, and further accelerates heat dissipation from the chips such as the first chip 2121, second chip 2122, third chip 2241, and / or fourth chip 2242 that abut against the heat dissipation body 31, such as the heat sink 311. In some embodiments, the heat dissipation pillars 3111 may correspond to the positions of the chips such as the first chip 2121, second chip 2122, third chip 2241, and / or fourth chip 2242 that abut against the heat dissipation body 31, such as the heat sink 311. In some embodiments, multiple heat dissipation pillars 3111 may correspond to the first chip 2121. In some embodiments, multiple heat dissipation pillars 3112 may correspond to the second chip 2122.
[0070] The outer surface of the heat sink 311 may be provided with heat dissipation protrusions (not shown) to abut against the first chip 2121, second chip 2122, third chip 2241, and / or fourth chip 2242, etc., which abut against the heat dissipation body 31, such as the heat sink 311, thereby accelerating heat dissipation of the chips abutting against the heat dissipation body 31, such as the heat sink 311. In some embodiments, the heat dissipation protrusions are provided with grooves to accommodate the first chip 2121, second chip 2122, third chip 2241, and / or fourth chip 2242, etc., which abut against the heat dissipation body 31, such as the heat sink 311, thereby increasing the contact area and accelerating heat dissipation. In some embodiments, the heat dissipation protrusions are provided in a one-to-one correspondence with the chips, that is, the number of heat dissipation protrusions may be the same as the number of chips.
[0071] The heat dissipation cover 312 may have multiple heat dissipation pillars within the heat dissipation body 31 to increase the contact area with the cooling medium. This allows the heat dissipation pillars 3111 to accelerate heat dissipation from the heat dissipation cover 312, and further accelerates heat dissipation from the first chip 2121, second chip 2122, third chip 2241, and / or fourth chip 2242, which abut against the heat dissipation body 31, such as the heat dissipation cover 312. In some embodiments, the heat dissipation pillars 3111 may correspond to the positions of the first chip 2121, second chip 2122, third chip 2241, and / or fourth chip 2242, which abut against the heat dissipation body 31, such as the heat dissipation cover 312. In some embodiments, multiple heat dissipation pillars 3121 may correspond to the third chip 2241. In some embodiments, multiple heat dissipation pillars 3122 may correspond to the fourth chip 2242.
[0072] In some embodiments, the plurality of heat dissipation pillars on the heat dissipation cover 312 may be the same as the plurality of heat dissipation pillars on the heat dissipation shell 311.
[0073] The outer surface of the heat dissipation cover 312 may be provided with heat dissipation protrusions to abut against the first chip 2121, second chip 2122, third chip 2241, and / or fourth chip 2242, etc., which abut against the heat dissipation body 31, such as the heat dissipation cover 312, thereby accelerating heat dissipation of the chips abutting against the heat dissipation body 31, such as the heat dissipation cover 312. In some embodiments, the heat dissipation protrusions are provided with grooves to accommodate the first chip 2121, second chip 2122, third chip 2241, and / or fourth chip 2242, etc., which abut against the heat dissipation body 31, such as the heat dissipation shell 311, thereby increasing the contact area and accelerating heat dissipation. In some embodiments, the heat dissipation protrusion 3123 may be correspondingly provided with the third chip 2241 and abut against each other. In some embodiments, the heat dissipation protrusion 3124 may be correspondingly provided with the fourth chip 2242 and abut against each other.
[0074] This application can integrate intelligent driving functions, infotainment functions and / or vehicle control functions, thereby enabling the control device 100 to have the characteristics of high integration, miniaturization and lightweight, which can reduce the vehicle assembly space and assembly process, and reduce the difficulty of wiring harness layout.
[0075] In addition, the arrangement of the heat sink 30 simplifies the cooling circuit, reduces the space occupied by the vehicle assembly, and can also meet the heat dissipation requirements of intelligent driving functions, infotainment functions and / or vehicle control functions.
[0076] The basic concepts have been described above. Obviously, for those skilled in the art, the detailed disclosure above is merely illustrative and does not constitute a limitation of this application. Although not explicitly stated herein, those skilled in the art may make various modifications, improvements, and corrections to this application. Such modifications, improvements, and corrections are suggested in this application, and therefore remain within the spirit and scope of the exemplary embodiments of this application.
[0077] Meanwhile, this application uses specific terms to describe embodiments of the application. For example, "an embodiment," "one embodiment," and / or "some embodiments" refer to a particular feature, structure, or characteristic related to at least one embodiment of the application. Therefore, it should be emphasized and noted that "an embodiment," "one embodiment," or "an alternative embodiment" mentioned twice or more in different locations in this application do not necessarily refer to the same embodiment. Furthermore, certain features, structures, or characteristics in one or more embodiments of the application can be appropriately combined.
[0078] Furthermore, unless expressly stated in the claims, the order of elements and sequences processed in this application, the use of numbers and letters, or the use of other names are not intended to limit the order of the processes and methods of this application. Although some embodiments that are currently considered useful have been discussed through various examples in the foregoing disclosure, it should be understood that such details are for illustrative purposes only, and the appended claims are not limited to the disclosed embodiments; rather, the claims are intended to cover all modifications and equivalent combinations that conform to the substance and scope of the embodiments of this application. For example, while the system components described above can be implemented by hardware devices, they can also be implemented solely by software solutions, such as installing the described system on existing servers or mobile devices.
[0079] Similarly, it should be noted that, in order to simplify the description of the present application and thus aid in the understanding of one or more embodiments, the foregoing description of the embodiments of the present application sometimes combines multiple features into a single embodiment, drawing, or description thereof. However, this disclosure method does not imply that the subject matter of the present application requires more features than those mentioned in the claims. In fact, the embodiments contain fewer features than all the features of the single embodiments disclosed above.
[0080] In some embodiments, numbers describing the quantity of components and attributes are used. It should be understood that such numbers used in the description of embodiments are modified in some examples with the terms "approximately," "approximately," or "generally." Unless otherwise stated, "approximately," "approximately," or "generally" indicates that the numbers are allowed to vary by ±20%. Accordingly, in some embodiments, the numerical parameters used in this application are approximate values, which may be changed according to the characteristics required by individual embodiments. In some embodiments, numerical parameters should take into account specified significant digits and employ a general method of digit preservation. Although the numerical ranges and parameters used to confirm their breadth of range in some embodiments of this application are approximate values, in specific embodiments, such numerical values are set as precisely as feasible.
[0081] For each patent, patent application, patent application publication, and other material such as articles, books, applications, publications, and documents referenced in this application, the entire contents of that patent application are incorporated herein by reference. This excludes historical application documents that are inconsistent with or conflict with the content of this application, as well as documents that limit the broadest scope of the claims in this application (currently or subsequently appended to this application). It should be noted that if there are any inconsistencies or conflicts between the descriptions, definitions, and / or terminology used in the supplementary materials of this application and the content of this application, the descriptions, definitions, and / or terminology used in this application shall prevail.
[0082] Finally, it should be understood that the embodiments in this application are merely illustrative of the principles of the embodiments of this application. Other modifications may also fall within the scope of this application. Therefore, alternative configurations of the embodiments of this application are considered as examples and not limitations, and are regarded as consistent with the teachings of this application. Accordingly, the embodiments of this application are not limited to the embodiments explicitly described and illustrated in this application.
Claims
1. A control device, characterized in that, The control device is used in an automobile and includes a housing, a heat sink, a first circuit board, and a second circuit board. The heat sink, the first circuit board, and the second circuit board are all disposed within the housing. The first circuit board and the second circuit board are located on opposite sides of the heat sink and each has a chip that abuts against the heat sink. The housing includes a base, a middle frame, and a cover. The base and the cover are respectively disposed on opposite sides of the middle frame. The middle frame surrounds the heat sink and is connected to the heat sink. The first circuit board is located on the side of the heat sink facing the base, and the second circuit board is located on the side of the heat sink facing the cover. The heat sink has an access channel communicating with the outside of the housing.
2. The control device according to claim 1, characterized in that, The housing is provided with a vent hole and a vent valve located in the vent hole, and the vent hole connects the inside and outside of the housing.
3. The control device according to claim 2, characterized in that, A sealed space is formed between the first circuit board and the second circuit board, the vent hole connects the sealed space to the outside of the housing, and the heat sink is located inside the sealed space.
4. The control device according to claim 1, characterized in that, The base has a recessed groove on its edge near the first circuit board, and the first circuit board has a first electrical connection port on its side facing the base, which is located in the recessed groove.
5. The control device according to claim 4, characterized in that, The first circuit board is sealed to the base on the side facing the base to form a sealed space, and the first electrical connection port is located outside the sealed space.
6. The control device according to claim 1, characterized in that, The cover includes a main body and an antenna cover. The main body is provided with a clearance opening. The antenna cover is placed on the clearance opening and connected to the main body and / or the middle frame. The second circuit board is provided with an antenna structure corresponding to the clearance opening.
7. The control device according to claim 1, characterized in that, The chips on the first circuit board that abut against the heat sink include any two of the following: a smart cockpit chip, a smart driving chip, a power amplifier chip, and a vehicle control chip. The chips on the second circuit board that abut against the heat sink include the other two of the following: a smart cockpit chip, a smart driving chip, a power amplifier chip, and a vehicle control chip.
8. The control device according to claim 1, characterized in that, The outer surface of the heat sink is provided with heat dissipation protrusions to abut against the chips on the first circuit board and / or the chips on the second circuit board.
9. The control device according to claim 1, characterized in that, Multiple heat dissipation pillars are provided on the inner surface of the heat sink corresponding to the positions of the chips that abut against the heat sink.
10. The control device according to claim 1, characterized in that, The control device further includes a floating connector disposed between the first circuit board and the second circuit board, the floating connector being electrically connected to the first circuit board and the second circuit board.