Fixing structure and electronic device

Abstract

The utility model discloses a fixing structure and an electronic device, the fixing structure is used for fixing an electronic assembly, the fixing structure comprises a cooling assembly and a pressing assembly, the cooling assembly comprises a cooling main body, and after a refrigerant is injected into a refrigerant cavity of the cooling main body, a cooling surface is formed on the peripheral side of the cooling main body; the pressing assembly comprises a baffle and a pressing structure, the baffle is connected with the cooling main body, the baffle is provided with an installation surface facing the cooling main body, the installation surface and the cooling surface are oppositely arranged, a containing gap is formed between the installation surface and the cooling surface and used for containing the electronic assembly, and the pressing structure is connected to the installation surface; the pressing structure is used for pressing the electronic component on the cooling surface, so that the electronic component is attached to the cooling surface, the contact area between the electronic component and the cooling main body is increased, and the cooling effect of the cooling main body on the electronic component is improved.

Description

Technical Field

[0001] This utility model relates to the field of electronic device technology, and in particular to a fixed structure and an electronic device. Background Technology

[0002] In existing electronic products, MOSFETs are indispensable in modern electronic technology due to their high-speed switching capability and good control characteristics, and their applications range from simple household appliances to complex computer and communication systems.

[0003] However, MOSFETs generate heat during operation in electronic products, necessitating effective heat dissipation to ensure normal operation and extend their lifespan. In current electronic devices, the market demand for miniaturization has reduced the installation space for MOSFETs, placing more stringent demands on heat dissipation. Furthermore, traditional MOSFET mounting methods are no longer suitable. Therefore, a new method is needed to meet the installation requirements of MOSFETs within the reduced available space. Utility Model Content

[0004] In view of this, this application provides a fixing structure and an electronic device. In the electronic device, the fixing structure is used to fix the electronic components in the electronic device to improve the cooling effect of the cooling body on the electronic components, thereby solving the above-mentioned technical problems.

[0005] The first aspect of this application provides a fixing structure, which includes a cooling component and a pressing component. The cooling component includes a cooling body. After refrigerant is injected into the refrigerant cavity of the cooling body, a cooling surface is formed on the outer periphery of the cooling body. The pressing component includes a baffle and a pressing structure. The baffle is connected to the cooling body and has a mounting surface facing the cooling body. The mounting surface and the cooling surface are disposed opposite to each other, and a receiving gap is formed between the mounting surface and the cooling surface. The receiving gap is used to receive electronic components. The pressing structure is connected to the mounting surface.

[0006] When the electronic component is placed in the receiving gap, the baffle is connected to the cooling body. The baffle and the cooling body can jointly constrain the electronic component located in the receiving gap. The pressing structure connected to the mounting surface of the baffle presses the electronic component onto the cooling surface of the cooling body to apply pressure to the electronic component, so that the electronic component can fit against the cooling surface. This increases the contact area between the electronic component and the cooling body, thereby improving the cooling effect of the cooling body on the electronic component. This allows the cooling body to remove excess heat generated by the electronic component in a timely manner, reducing the possibility of the electronic component burning out due to excessive heat accumulation.

[0007] Optionally, the pressing structure includes a pressing main board and a spring tongue. The pressing main board is connected to the mounting surface. The fixed end of the spring tongue is connected to the pressing main board. The tongue of the spring tongue protrudes from the pressing main board side toward the cooling surface side, and the spring tongue is used to press the electronic components against the cooling surface.

[0008] Optionally, the main board or baffle is pressed together with the spring tongue and forms an integral structure;

[0009] Optionally, multiple springs are spaced apart on the surface of the motherboard, and the multiple springs are used to jointly press against the electronic components on the cooling surface.

[0010] Optionally, the main board and the baffle are interconnected and form an integral structure.

[0011] Optionally, the pressing assembly further includes a connecting buckle, which is connected to the mounting surface; the cooling body further includes a connecting rib, which protrudes from the cooling surface, and the connecting buckle engages with the connecting rib.

[0012] Optionally, the connecting buckle includes a connecting seat and two fastening members, which are connected to the two sides of the connecting seat respectively. The connecting seat is connected to a baffle. The fastening members extend from the side where the baffle is located toward the side where the cooling body is located, and the side of one fastening member facing away from the other fastening member is set at an obtuse angle with the mounting surface.

[0013] Optionally, the fastener includes a connecting arm and a fastening part, with one end of the connecting arm connected to the connecting seat and the other end connected to the fastening part;

[0014] The connecting arm extends from the side where the baffle is located toward the side where the cooling body is located. One fastening part faces away from the other fastening part. The connecting arm is set at an obtuse angle with the mounting surface. The two fastening parts of the two fastening parts extend toward the side where the other is located, and the fastening parts are set at an acute angle with the connecting arm.

[0015] The connecting ribs have connecting recesses on opposite sides, and a fastening part fastens to a connecting recess.

[0016] Optionally, the connecting seat and the baffle are interconnected and form an integral structure.

[0017] Optionally, the cooling assembly also includes a base, which includes a mounting member and a limiting member connected to each other, the limiting member being exposed on the outer periphery of the mounting member; the cooling body is connected to the mounting member, and the baffle limits the connection to the limiting member.

[0018] Optionally, the mounting component has a first connecting portion and a second connecting portion connected to each other, the first connecting portion being connected to the cooling body, and the second connecting portion being located on the periphery of the first connecting portion and exposed on the periphery of the cooling body;

[0019] The limiting member includes a first limiting part and a second limiting part connected to each other. The first limiting part protrudes from the surface of the second connecting part and extends along the extending direction of the second connecting part. The first limiting part is connected to the end of the second limiting part away from the cooling body and is perpendicular to the surface of the second connecting part.

[0020] A positioning groove is provided on the side of the baffle near the base. The second limiting part is connected to the positioning groove. A first limiting space is formed between the first limiting part and the cooling body. Along the direction near the cooling body, the baffle and the pressing structure are arranged in the first limiting space to form a receiving gap for accommodating electronic components. The first limiting part abuts against the surface of the baffle away from the mounting surface.

[0021] A second aspect of this application provides an electronic device, which includes an electronic component and a fixing structure as described in the first aspect of this application, wherein the electronic component is pressed between a cooling surface and the pressing structure.

[0022] Since the main beneficial effects of the second aspect are derived from the beneficial effects of the first aspect, please refer to the beneficial effects of the first aspect for details of the beneficial effects of the second aspect, and will not be repeated here. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 This is a schematic diagram of the electronic device in this application;

[0025] Figure 2 This is a schematic diagram of the structure of the fixed structure connecting the electronic components in this application;

[0026] Figure 3 for Figure 2 A structural diagram from a first-person perspective;

[0027] Figure 4 for Figure 2 A structural diagram from a second-person perspective;

[0028] Figure 5 for Figure 2 A structural diagram and a magnified view of the fixed structure from a top-down perspective;

[0029] Figure 6 for Figure 2 Cross-sectional view at point AA;

[0030] Figure 7 for Figure 6 Enlarged view of point B in the middle;

[0031] Figure 8 for Figure 7 Independent illustrations of the connecting buckle and related structures in the middle;

[0032] Figure 9 A structural diagram of the first embodiment of the pressing assembly;

[0033] Figure 10 A structural diagram of the second embodiment of the pressing assembly;

[0034] Figure 11 for Figure 10 Exploded view of the structure shown;

[0035] Figure 12 A structural diagram of the third embodiment of the pressing assembly;

[0036] Figure 13 This is a structural diagram of the fourth embodiment of the pressing component.

[0037] Explanation of reference numerals in the attached figures:

[0038] 1000 - Electronic device; 1 - Electronic component; 2 - Fixing structure; 20 - Cooling component; 200 - Cooling body; 2000 - Cooling surface; 2001 - Connecting rib; 2002 - Connecting recess; 2003 - First limiting space; 2004 - Refrigerant cavity; 201 - Base; 2010 - Mounting component; 2011 - First connecting part; 2012 - Second connecting part; 2013 - Limiting component; 2014 - First limiting part, 2015- Second limiting part, 21- Pressing assembly, 210- Baffle, 2100- Mounting surface, 2101- Receiving gap, 2102- Positioning groove, 2103- Restraining arm, 211- Pressing structure, 2110- Pressing main board, 2111- Spring tongue, 212- Connecting buckle, 2120- Connecting seat, 2121- Fastening part, 2122- Connecting arm, 2123- Fastening part;

[0039] X - length direction, Y - width direction. Detailed Implementation

[0040] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are merely some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of this application.

[0041] Unless otherwise defined, the technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this application pertains. The terms “an,” “a,” or “the,” as used herein, do not indicate a limitation of quantity, but are merely used to indicate the presence of at least one. Terms such as “comprising” or “including” mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. Terms such as “connected” or “linked” are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect.

[0042] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0043] The following will refer to the appendices in the embodiments of this application. Figures 1-13 The technical solutions in the embodiments of this application are clearly and completely described. It should be noted that the length direction X marked in each drawing is marked with reference to the length direction of the fixed structure 2, and the width direction Y marked in each drawing is marked with reference to the width direction of the fixed structure 2. The directions marked in each drawing are kept consistent for reference and understanding.

[0044] You can refer to this first. Figure 1 This application provides an electronic device 1000, which includes an electronic component 1 and a fixing structure 2, which can be further referenced. Figures 2 to 4 The fixing structure 2 is used to fix the electronic component 1, so as to press the electronic component 1 between the cooling surface 2000 and the pressing structure 211 in the fixing structure 2, thereby enabling the electronic component 1 to fit against the cooling surface 2000, increasing the contact area between the electronic component 1 and the cooling surface 2000, and enabling the cooling body 200 to better remove the excess heat generated by the operation of the electronic component 1.

[0045] It should be noted that electronic component 1 can be a combination of multiple types of electronic components such as MOSFETs, resistors, and PCB boards. When electronic component 1 is working, it will generate excess heat. Cooling surface 2000 can transfer this heat and improve the heat dissipation effect of electronic component 1.

[0046] Additionally, please refer to Figures 2 to 13This application also provides a fixing structure 2, which includes a cooling component 20 and a pressing component 21. The cooling component 20 is used to cool the electronic component 1 and transfer the excess heat generated by the electronic component 1 during operation. The pressing component 21 is used to press the electronic component 1 onto the surface of the cooling component 20.

[0047] For reference Figure 3 and Figure 4 The cooling assembly 20 includes a cooling body 200. After refrigerant is injected into the refrigerant cavity 2004 of the cooling body 200, a cooling surface 2000 is formed on the outer periphery of the cooling body 200. When the electronic component 1 comes into contact with the cooling surface 2000, the heat generated by the operation of the electronic component 1 can be transferred to the cooling body 200 through the cooling surface 2000, so that the electronic component 1 will not operate abnormally due to excessive heat accumulation.

[0048] The pressing assembly 21 includes a baffle 210 and a pressing structure 211. The baffle 210 is connected to the cooling body 200 to form a connection relationship with the cooling body 200.

[0049] In addition, in conjunction with reference Figure 5 The baffle 210 has a mounting surface 2100 facing the cooling body 200. The mounting surface 2100 is disposed opposite to the cooling surface 2000. A receiving gap 2101 is formed between the mounting surface 2100 and the cooling surface 2000. The receiving gap 2101 is used to receive the electronic component 1. The press-fit structure 211 is connected to the mounting surface 2100.

[0050] Thus, when the electronic component 1 is placed in the receiving gap 2101, since the baffle 210 is connected to the cooling body 200, the baffle 210 and the cooling body 200 can jointly constrain the electronic component 1 located in the receiving gap 2101. The pressing structure 211 connected to the mounting surface 2100 of the baffle 210 presses the electronic component 1 onto the cooling surface 2000 of the cooling body 200, thereby applying pressure to the electronic component 1 so that the electronic component 1 can adhere to the cooling surface 2000, increasing the contact area between the electronic component 1 and the cooling body 200. This improves the cooling effect of the cooling body 200 on the electronic component 1, allowing the cooling body 200 to remove excess heat generated by the electronic component 1 in a timely manner, reducing the risk of the electronic component 1 burning out due to excessive heat accumulation.

[0051] For reference Figures 9 to 13In some feasible implementations, the pressing structure 211 includes a pressing main board 2110 and a spring tongue 2111. The pressing main board 2110 is connected to the mounting surface 2100 to form a connection with the baffle 210. The fixed end of the spring tongue 2111 is connected to the pressing main board 2110 to form a connection with the pressing main board 2110. The tongue of the spring tongue 2111 protrudes from the pressing main board 2110 side toward the cooling surface 2000 side, and the spring tongue 2111 is used to press the electronic component 1 against the cooling surface 2000, so that the electronic component 1 can be attached to the cooling surface 2000.

[0052] The tongue of the spring 2111 protrudes from the surface of the motherboard 2110 and can move close to the mounting surface 2100. Therefore, during the pressing process of the pressing component 21 pressing the electronic component 1, after the tongue of the spring 2111 abuts against the electronic component 1, the tongue of the spring 2111 will also move close to the mounting surface 2100 due to the reverse action of the electronic component 1. In this way, the spring 2111 provides the pressure to press the electronic component 1, so that the electronic component 1 can be stably attached to the cooling surface 2000. The spring 2111 also has a certain degree of flexibility and can move to avoid obstacles so that the electronic component 1 can be put into the receiving gap 2101, so that the electronic device 1000 can adaptably accommodate electronic components 1 of various sizes.

[0053] like Figure 9 and Figure 10 As shown, the press-fit main board 2110 or baffle 210 is interconnected with the spring tongue 2111 and forms an integral structure. Thus, when processing the spring tongue 2111 and the press-fit main board 2110, the press-fit main board 2110 and the spring tongue 2111 can be cast in one go through injection molding process, or the spring tongue 2111 structure connected to it can be directly formed by drilling, cutting or other processing methods on the press-fit main board 2110. This simplifies the processing and forming method of the press-fit main board 2110 and the spring tongue 2111, and omits the connection processing steps between the two when the press-fit main board 2110 and the spring tongue 2111 are set separately.

[0054] like Figures 9 to 13 As shown, in some feasible methods, multiple springs 2111 are spaced apart on the surface of the motherboard 2110. The multiple springs 2111 are used to jointly abut the electronic component 1 against the cooling surface 2000. Thus, when the electronic component 1 is placed into the receiving gap 2101, the multiple springs 2111 abut against multiple parts of the electronic component 1, that is, multiple parts of the electronic component 1 are abutted. As a result, the electronic component 1 and the cooling surface 2000 have a higher degree of fit, further increasing the connection area between the electronic component 1 and the cooling surface 2000.

[0055] From another perspective, the arrangement of multiple springs 2111 allows the pressing structure 211 to apply pressure to the electronic component 1 from multiple directions. The pressing structure 211 can further consolidate the relative position of the electronic component 1 in the receiving gap 2101. When the electronic device using the fixing structure 2 is subjected to external force and vibrates, the springs 2111 can to a certain extent push against the electronic component 1 in a fixed position. Moreover, the springs 2111 themselves have a certain buffering force, which can reduce the external force on the electronic component 1 and maintain the performance of the electronic component 1 in the electronic device.

[0056] For reference Figure 13 In some feasible ways, the pressing main board 2110 and the baffle 210 are interconnected and form an integral structure. In this way, when processing the pressing structure 211, it is not necessary to process the pressing main board 2110 and the baffle 210 separately. Only one plate structure needs to be processed, which saves processing steps and also saves the amount of material consumed in the pressing structure 211, improves the production efficiency of the pressing structure 211, and reduces the material cost of the pressing structure 211.

[0057] Optionally, the pressing structure 211 may include multiple pressing motherboards 2110, and the electronic component 1 includes multiple electronic components, with one pressing motherboard 2110 corresponding to pressing one electronic component.

[0058] Please refer back. Figures 5 to 8 In some feasible embodiments, the pressing assembly 21 further includes a connecting buckle 212, which is connected to the mounting surface 2100. The cooling body 200 also includes a connecting rib 2001, which protrudes from the cooling surface 2000. The connecting buckle 212 engages with the connecting rib 2001. Thus, the engagement between the connecting buckle 212 and the connecting rib 2001 further strengthens the connection between the pressing structure 211 and the cooling body 200 in the pressing assembly 21, thereby improving the overall structural stability of the fixing structure 2.

[0059] Please refer to this carefully. Figure 7 and Figure 8 Furthermore, the connecting buckle 212 includes a connecting seat 2120 and two fastening members 2121. The two fastening members 2121 are connected to the two sides of the connecting seat 2120 respectively. The connecting seat 2120 is connected to the baffle 210 to form a connection relationship between the connecting buckle 212 and the baffle 210.

[0060] The fastener 2121 extends from the side where the baffle 210 is located toward the side where the cooling body 200 is located (refer to the width direction Y in the figure). The side of one fastener 2121 facing away from the other fastener 2121 is set at an obtuse angle with the mounting surface 2100 (refer to the first angle α1 in the figure).

[0061] Specifically, in any connecting buckle 212, on the opposite sides of its two fastening parts 2121, the fastening parts 2121 and the mounting surface 2100 form an obtuse angle. Thus, during the process of any connecting buckle 212 fastening the connecting rib 2001, the two fastening parts 2121 on the connecting buckle 212 can first adapt to the size of the connecting rib 2001 and move relatively away, and then move relatively closer. When any connecting buckle 212 is fully connected to the connecting rib 2001, its corresponding two fastening parts 2121 can adapt to the local size of the connecting rib 2001 and tilt to their opposite sides. At this time, the connecting buckle 212 can better fasten the connecting rib 2001 and strengthen the connection strength of the fixing structure 2.

[0062] In other respects, the side of one fastener 2121 facing away from the other fastener 2121 is set at an obtuse angle with the mounting surface 2100. When the fixing structure 2 is subjected to external force and vibrates, due to the constraint between the two fasteners 2121 and the connecting rib 2001, the connecting buckle 212 can maintain a stable connection with the connecting rib 2001 to ensure the connection strength of the fixing structure 2. In electronic devices using this fixing structure 2, the electronic component 1 can always maintain a supported state, thereby enabling the electronic component 1 to stably contact the cooling surface 2000 of the cooling body 200, thus maintaining the fixing effect and cooling effect of the fixing structure 2 on the electronic component 1.

[0063] In some specific embodiments, reference may be made to Figure 8 The first angle α1 is on the side of one fastener 2121 facing away from the other fastener 2121. The included angle between the fastener 2121 and the mounting surface 2100 is between 91° and 95°, that is, it can be 91°, or 92°, or 93°, or 94°, or 95°, or other angles within this angle range.

[0064] Furthermore, the fastening member 2121 includes a connecting arm 2122 and a fastening part 2123. One end of the connecting arm 2122 is connected to the connecting seat 2120, and the other end is connected to the fastening part 2123. The connecting arm 2122 has a certain deformation capability, so that the two fastening parts 2123 arranged opposite to each other on the connecting buckle 212 can move closer or further apart.

[0065] The connecting arm 2122 extends from the side where the baffle 210 is located toward the side where the cooling body 200 is located. One fastening member 2121 faces the other fastening member 2121. The connecting arm 2122 is set at an acute angle with the mounting surface 2100 (refer to the first angle α1 in the figure). The two fastening portions 2123 of the two fastening members 2121 extend toward the side where the other is located, and the fastening portions 2123 are set at an acute angle with the connecting arm 2122 (refer to the second angle α2 in the figure). Connecting recesses 2002 are provided on opposite sides of the connecting rib 2001, and one fastening portion 2123 fastens to one connecting recess 2002.

[0066] When the fastening part 2123 is located in the connecting recess 2002, interference occurs between the fastening part 2123 and the connecting recess 2002 along the length direction X of the connecting arm 2122 (refer to the width direction Y in the figure) to prevent the connecting buckle 212 from disengaging from the connecting rib 2001 along the width direction Y of the fixing structure 2. Furthermore, when the connecting structure vibrates under external force, the two fastening parts 2123 on the connecting buckle 212 will not disengage from the connecting recess 2002 simultaneously; at least one fastening part 2123 will remain in the connecting recess 2002. Therefore, the connecting buckle 212 can maintain its connection with the connecting rib 2001, and the pressing structure 211 can maintain its connection with the cooling body 200, thus maintaining the connection strength of the fixing structure 2. This allows the electronic component 1 placed in the accommodating gap of the fixing structure 2 to stably contact the cooling surface 2000, improving the heat dissipation performance of the cooling body 200 for the electronic component 1.

[0067] Furthermore, in the space on the side of one fastening member 2121 facing away from the other fastening member 2121, that is, on the opposite side of the two fastening portions 2123, one can refer to Figure 8 The first angle α1 in the figure, the angle between the connecting arm 2122 and the mounting surface 2100 is between 91° and 95°, that is, it can be 91°, or 92°, or 93°, or 94°, or 95°, or other angles within this angle range.

[0068] Optionally, in the space between the two fastening parts 2123, on the side where one fastening member 2121 faces the other fastening member 2121, a reference can be made to... Figure 8 The second angle α2, the included angle between the fastening part 2123 and the connecting arm 2122 is between 85° and 88°, that is, it can be 85°, or 86°, or 87°, or 88°, or other angles within this angle range.

[0069] For reference Figures 2 to 4In some feasible embodiments, the cooling assembly 20 further includes a base 201, which includes a connected mounting member 2010 and a limiting member 2013, with the limiting member 2013 protruding from the outer periphery of the mounting member 2010. The cooling body 200 is connected to the mounting member 2010, and the baffle 210 is limited by the limiting member 2013. Thus, the baffle 210 can be constrained by the limiting member 2013 to a fixed position on the mounting member 2010, giving the fixing structure 2 better connection stability and stronger structural stability during use. This improves the constraint effect and cooling effect of the fixing structure 2 on the electronic component 1 placed therein.

[0070] Furthermore, the mounting component 2010 and the limiting component 2013 are interconnected and form an integral structure. In other words, the base 201 is divided into a part for the mounting component 2010 and a part for the limiting component 2013 to provide mounting positions for different components.

[0071] See also Figure 3 and Figure 4 In some possible implementations, the mounting component 2010 has a first connecting portion 2011 and a second connecting portion 2012 connected to each other. The first connecting portion 2011 is connected to the cooling body 200, and the second connecting portion 2012 is located on the periphery of the first connecting portion 2011 and exposed on the periphery of the cooling body 200. The second connecting portion 2012 is used to provide the mounting position required for other components.

[0072] The limiting member 2013 includes a first limiting part 2014 and a second limiting part 2015 connected to each other. The first limiting part 2014 protrudes from the surface of the second connecting part 2012 and extends along the extension direction of the second connecting part 2012 (refer to the length direction X of the fixing structure 2). The first limiting part 2014 is connected to the end of the second limiting part 2015 away from the cooling body 200 and is perpendicular to the surface of the second connecting part 2012.

[0073] A positioning groove 2102 is provided on the side of the baffle 210 near the base 201. The second limiting part 2015 is positioned and connected to the positioning groove 2102. A first limiting space 2003 is formed between the first limiting part 2014 and the cooling body 200. Along the direction near the cooling body 200, the baffle 210 and the pressing structure 211 are sequentially arranged in the first limiting space 2003 to form a receiving gap 2101 for accommodating the electronic component 1 (e.g., Figure 5 (As shown); the first limiting part 2014 abuts against the surface of the baffle 210 away from the mounting surface 2100.

[0074] Specifically, you can refer to the following: Figure 7 The baffle 210 has a positioning groove 2102 on the side near the base 201 (see reference). Figure 3The second limiting part 2015 of the limiting member 2013 is positioned and connected to the positioning groove 2102 to form a limiting constraint on the baffle 210 in the length direction X of the fixed structure 2, so that the baffle 210 can be positioned and constrained in the length direction X of the fixed structure 2, reducing the movement of the baffle 210 in the length direction X of the fixed structure 2; the first limiting part 2014 of the limiting member 2013 extends along the length direction X of the fixed structure 2 shown in the figure. When the baffle 210 is connected to the base 201, the first limiting part 2014 forms a constraint on the baffle 210 perpendicularly to the surface of the baffle 210 in the width direction Y of the fixed structure 2, reducing the movement of the baffle 210 in the width direction Y of the fixed structure 2.

[0075] Thus, in summary, the setting of the limiting member 2013 and its structural features strengthens the connection stability between the baffle 210 and the base 201, making the baffle 210 more stable relative to the base 201 after being connected to the base 201. In turn, it improves the overall stability of the fixing structure 2. The electronic device 1000 using the fixing structure 2 can better position and constrain the electronic component 1 to ensure the connection stability between the electronic component 1 and the fixing structure 2 in the electronic device.

[0076] Please refer to this as well. Figures 2 to 5 , Figures 9 to 11 The baffle is also provided with a constraint arm 2103, which is vertically mounted on the mounting surface 2100 of the baffle 210. The constraint arm 2103 can be connected to the connecting rib 2001 by fasteners (such as screws, pins, etc.) so that a constraint effect is formed between the baffle 210 and the cooling body 200, thereby improving the connection strength between the baffle 210 and the cooling body 200. In this way, the connection between the pressing assembly 21 and the cooling assembly 20 is more stable.

[0077] Furthermore, the constraint arm 2103 and the connecting buckle 212 are set in a one-to-one correspondence.

[0078] It should be noted that, for the sake of simplicity, the foregoing method embodiments are all described as a series of actions. However, those skilled in the art should understand that this application is not limited to the described order of actions, as some steps may be performed in other orders or simultaneously according to this application. Furthermore, those skilled in the art should also understand that the embodiments described in the specification are preferred embodiments, and the actions and modules involved are not necessarily essential to this application.

[0079] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0080] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit it. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A fixing structure for fixing electronic components, characterized in that, include: A cooling assembly includes a cooling body, into which refrigerant is injected, and a cooling surface is formed on the outer periphery of the cooling body. as well as A pressing assembly includes a baffle and a pressing structure. The baffle is connected to the cooling body and has a mounting surface facing the cooling body. The mounting surface is disposed opposite to the cooling surface, and a receiving gap is formed between the mounting surface and the cooling surface. The receiving gap is used to receive electronic components. The pressing structure is connected to the mounting surface and is used to press the electronic components onto the cooling surface.

2. The fixing structure as described in claim 1, characterized in that, The pressing structure includes a pressing main board and a spring tongue. The pressing main board is connected to the mounting surface. The fixed end of the spring tongue is connected to the pressing main board. The tongue of the spring tongue protrudes from the pressing main board side toward the cooling surface side, and the spring tongue is used to press the electronic component against the cooling surface.

3. The fixing structure as described in claim 2, characterized in that, The pressing main board or the baffle is interconnected with the spring tongue and forms an integral structure; And / or, the surface of the pressing motherboard is provided with a plurality of said springs spaced apart, the plurality of said springs being used to jointly press the electronic components against the cooling surface.

4. The fixing structure as described in claim 3, characterized in that, The main board and the baffle are interconnected and form an integral structure.

5. The fixing structure as described in claim 1, characterized in that, The pressing assembly further includes a connecting buckle, which is connected to the mounting surface; The cooling body also includes a connecting rib, which protrudes from the cooling surface and is fastened to the connecting rib by a connecting buckle.

6. The fixing structure as described in claim 5, characterized in that, The connecting buckle includes a connecting seat and two fastening parts, the two fastening parts being connected to opposite sides of the connecting seat, and the connecting seat being connected to the baffle. The fastening member extends from the side where the baffle is located toward the side where the cooling body is located, and the side of one fastening member facing away from the other fastening member is set at an obtuse angle with the mounting surface.

7. The fixing structure as described in claim 6, characterized in that, The fastening component includes a connecting arm and a fastening part, one end of the connecting arm is connected to the connecting seat, and the other end is connected to the fastening part; The connecting arm extends from the side where the baffle is located toward the side where the cooling body is located. One of the fastening members faces away from the other fastening member. The connecting arm is set at an obtuse angle with the mounting surface. Both fastening parts of the two fastening members extend toward the side where the other is located, and the fastening parts are set at an acute angle with the connecting arm. The connecting rib has connecting recesses on both sides, and one of the fastening parts is fastened to one of the connecting recesses. And / or, the connecting seat is interconnected with the baffle and forms an integral structure.

8. The fixing structure as described in any one of claims 1-7, characterized in that, The cooling assembly also includes a base, the base including a connected mounting member and a limiting member, the limiting member being exposed on the outer periphery of the mounting member; The cooling body is connected to the mounting component, and the baffle is connected to the limiting component.

9. The fixing structure as described in claim 8, characterized in that, The mounting component has a first connecting portion and a second connecting portion connected to each other. The first connecting portion is connected to the cooling body, and the second connecting portion is located on the periphery of the first connecting portion and exposed on the periphery of the cooling body. The limiting member includes a first limiting part and a second limiting part connected to each other. The first limiting part protrudes from the surface of the second connecting part and extends along the extending direction of the second connecting part. The first limiting part is connected to the end of the second limiting part away from the cooling body and is perpendicular to the surface of the second connecting part. The baffle has a positioning groove on the side near the base, the second limiting part is connected to the positioning groove, the first limiting part and the cooling body form a first limiting space, the baffle and the pressing structure are arranged sequentially in the first limiting space along the direction near the cooling body to form the receiving gap for accommodating the electronic components; the first limiting part abuts against the surface of the baffle away from the mounting surface.

10. An electronic device, characterized in that, It includes electronic components and a fixing structure as described in any one of claims 1-9, wherein the electronic components are pressed between the cooling surface and the pressing structure.

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