Display module and display device

Abstract

The utility model relates to the field of display, particularly provides a display module and a display device, and aims to improve the electrostatic discharge bearing capacity of the display module. The display module provided by the utility model comprises a display panel, a flexible circuit board and a first conductive film layer, wherein the display panel comprises a substrate and a display driving chip; the flexible circuit board is electrically connected with the display driving chip, the flexible circuit board comprises a bending area, the flexible circuit board is bent from the display side of the display panel to the non-display side of the display panel in the bending area, and the side, away from the display panel, of the flexible circuit board is provided with a first grounding bonding pad; the first conductive film layer covers at least part of the flexible circuit board and is electrically connected with the first grounding bonding pad. Static charges gathered on the cover plate and the display driving chip can be released to the first conducting film and then are grounded through the first conducting film layer via the first grounding bonding pad, the flexible circuit board and the driving board, and therefore the static electricity bearing capacity of the display module is improved.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the field of display, and specifically provides a display module and a display device. BACKGROUND

[0002] In the structure design of the display module, the ability of the display module to withstand electrostatic discharge determines the reliability and service life of the display module. Once the ability of the display module to withstand electrostatic discharge is exceeded, it is easy to cause black screen or other types of display defects, affecting the service life of the display module.

[0003] Therefore, how to improve the ability of the display module to withstand electrostatic discharge is an important research and development direction. CONTENT OF THE INVENTION

[0004] The present disclosure aims to improve the ability of the display module to withstand electrostatic discharge, and provides a display module and a display device.

[0005] In a first aspect, the present disclosure provides a display module, comprising: a display panel comprising a substrate, the substrate comprising a display area and a non-display area, a display driving chip being arranged in the non-display area; a flexible circuit board electrically connected with the display driving chip, the flexible circuit board comprising a bending area, the flexible circuit board being bent from a display side of the display panel to a non-display side of the display panel at the bending area, a side of the flexible circuit board away from the display panel having a first ground pad; and a first conductive film layer covering at least part of the flexible circuit board and electrically connected with the first ground pad.

[0006] In some possible examples, the first conductive film layer covers the display driving chip.

[0007] In some possible examples, a cover plate is arranged on the substrate, the cover plate covering the display area, and an end of the first conductive film layer close to the cover plate extending to between the cover plate and the display driving chip.

[0008] In some possible examples, a second conductive film layer is arranged on the non-display side of the substrate, the second conductive film covering at least the display area and the display driving chip.

[0009] In some possible examples, a side of the flexible circuit board close to the display panel has a second ground pad, and the second conductive film is electrically connected with the second ground pad.

[0010] In some possible examples, a conductive reinforcing plate is arranged between the second conductive film layer and the flexible circuit board, and the reinforcing plate is connected with the second conductive film layer and the flexible circuit board through conductive adhesive.

[0011] In some possible examples, the flexible circuit board is provided with a shielding cover, the shielding cover covering components on the flexible circuit board.

[0012] In some possible examples, the shielding cover is arranged on a side of the flexible circuit board away from the display panel, and / or the shielding cover is arranged on a side of the flexible circuit board facing the display panel.

[0013] In some possible examples, the display panel is any one of a silicon-based OLED panel, a glass-based OLED panel, a micro-LED panel, and a liquid crystal panel.

[0014] In some possible examples, the substrate is a silicon-based substrate, and the display panel further includes: a plurality of sub-pixels, the sub-pixels including a pixel driving circuit and a light-emitting element, the pixel driving circuit being configured to drive the light-emitting element to emit light; and a color film layer including color resistance blocks of three colors, the color resistance blocks of each color corresponding to different sub-pixels respectively.

[0015] In a second aspect, the present disclosure provides a display device including the display module.

[0016] Compared with the prior art, the present disclosure has the following beneficial effects:

[0017] The present disclosure provides a display module including a display panel, a flexible circuit board, and a first conductive film layer. The display panel includes a substrate, the substrate including a display area and a non-display area, and a display driving chip arranged in the non-display area. The flexible circuit board is electrically connected to the display driving chip. The flexible circuit board includes a bending area, and the flexible circuit board is bent from a display side of the display panel to a non-display side of the display panel at the bending area. A side of the flexible circuit board away from the display panel has a first ground pad. The first conductive film layer covers at least part of the flexible circuit board and is electrically connected to the first ground pad. Electrostatic charges accumulated on the cover plate and the display driving chip can be released to the first conductive film, and then grounded through the first conductive film layer, the first ground pad, the flexible circuit board, and the driving board, thereby improving the ability of the display module to withstand static electricity. BRIEF DESCRIPTION OF DRAWINGS

[0018] The preferred embodiments of the present disclosure will be described below with reference to the accompanying drawings, in which:

[0019] Figure 1 is a cross-sectional structure diagram of a display panel provided by the present disclosure;

[0020] Figure 2 is a plan view of a display panel film layer structure provided by the present disclosure;

[0021] Figure 3A is a cross-sectional structure diagram of a display module provided by the present disclosure;

[0022] Figure 3B This is a cross-sectional structural diagram of another display module provided in this disclosure;

[0023] Figure 3C This is a cross-sectional structural diagram of another display module provided in this disclosure;

[0024] Figure 3D This is a cross-sectional structural diagram of another display module provided in this disclosure;

[0025] Figure 3E yes Figure 3D Cross-sectional view along the AA direction;

[0026] Figure 4 This is a schematic diagram showing the distribution of test points for the withstand voltage test of the display module;

[0027] Figure 5A This is a schematic diagram of the cross-sectional structure of a display panel;

[0028] Figure 5B This is a schematic diagram of the cross-sectional structure of another type of display panel;

[0029] Figure 5C This is a cross-sectional structural diagram of another type of display panel.

[0030] Explanation of reference numerals in the attached figures:

[0031] 10. Display panel; 1. Substrate; 2. Light-emitting device layer; 21. Anode; 22. Electroluminescent layer; 23. Cathode; 3. First encapsulation layer; 4. Color filter layer; 41. Color resist block; 42. Black matrix; 5. Second encapsulation layer; 6. Cover plate; 7. Display driver chip; 20. Flexible circuit board; 201. Shielding cover; 202. First grounding pad; 203. Second grounding pad; 30. First conductive film layer; 40. Second conductive film layer; 50. Reinforcing plate; 501. Conductive adhesive. Detailed Implementation

[0032] Preferred embodiments of the present disclosure will now be described with reference to the accompanying drawings. Those skilled in the art should understand that these embodiments are merely illustrative of the technical principles of the present disclosure and are not intended to limit the scope of protection of the present disclosure.

[0033] It should be noted that in the description of this disclosure, the terms "upper," "lower," "left," "right," "inner," and "outer," which indicate directional or positional relationships, are based on the directional or positional relationships shown in the accompanying drawings. These are used merely for ease of description and do not indicate or imply that the device or element must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this disclosure. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0034] Furthermore, it should be noted that, in the description of this disclosure, unless otherwise expressly specified and limited, the terms "installation," "setup," and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection, an indirect connection through an intermediate medium, or a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this disclosure according to the specific circumstances.

[0035] This disclosure provides a display module, comprising: a display panel including a substrate, the substrate including a display area and a non-display area, wherein a display driver chip is disposed in the non-display area; a flexible circuit board electrically connected to the display driver chip, the flexible circuit board including a bending area, the flexible circuit board bending from the display side of the display panel to the non-display side of the display panel at the bending area, the flexible circuit board having a first ground pad on the side away from the display panel; and a first conductive film layer at least covering the flexible circuit board and electrically connected to the first ground pad.

[0036] The following describes some specific embodiments of the display module of this disclosure.

[0037] Figure 1 This is a schematic diagram of the cross-sectional structure of a display panel provided in this disclosure.

[0038] The display module includes a display panel, such as Figure 1 As shown, the display panel 10 includes a substrate 1, which includes a display area and a non-display area surrounding the display area. For example, when the display panel 10 is a flexible display panel 10, the substrate 1 can be a flexible substrate such as polyimide (PI), and when the display panel 10 is a rigid display panel 10, the substrate 1 can be a rigid substrate such as glass or quartz. Alternatively, the substrate 1 can also be a silicon substrate.

[0039] A driving device layer (not shown in the figure) and a light-emitting device layer 2 are disposed on the display area of ​​substrate 1. A pixel driving circuit is disposed in the driving circuit layer, and light-emitting elements are disposed in the light-emitting device layer 2. The pixel driving circuit is used to drive the corresponding light-emitting element to emit light. The pixel driving circuit and the corresponding light-emitting element are called sub-pixels. For example, the light-emitting elements in different sub-pixels can emit red, green, and blue light, or the light-emitting elements in the sub-pixels can all emit monochromatic light (such as white light).

[0040] Taking the silicon substrate 1 as an example, the driving device layer is fabricated on the silicon substrate 1 using a 180nm or 110nm semiconductor process. The light-emitting device layer 2 includes an anode 21, an electroluminescent layer 22, and a cathode 23. The anode 21 is electrically connected to the pixel driving circuit in the driving device layer. For example, the anode 21 is made of ITO (Indium Tin Oxide) to obtain high transmittance and high work function. For example, the electroluminescent layer 22 uses an electroluminescent organic material. Under the action of voltage or current, holes and electrons in the electroluminescent layer 22 are excited to form excitons, thereby achieving light emission. For example, the cathode 23 is made of one or more alloys of magnesium or silver, which have high transmittance.

[0041] Of course, in addition to silicon-based OLED panels, display panel 10 can also be glass-based OLED panels, micro-LED panels, and LCD panels, etc.

[0042] For example, a first encapsulation layer 3 is disposed on the side of the light-emitting device layer 2 away from the substrate 1 to effectively encapsulate the driving device layer and the light-emitting device layer 2, blocking moisture and oxygen, thereby protecting the light-emitting device layer 2 and the driving device layer and extending the service life of the display panel 10. The material of the first encapsulation layer 3 is an organic or inorganic material with good sealing properties, and it can be one or more layers, with different materials for different layers. For example, the material of the first encapsulation layer 3 can be silicon oxide, silicon nitride, etc.

[0043] For example, a color filter layer 4 is disposed on the side of the first encapsulation layer 3 away from the substrate 1. The color filter layer 4 is particularly necessary when the light-emitting element emits monochromatic light. For example, the color filter layer 4 includes color resist blocks 41 and a black matrix 42. The color resist blocks 41 are divided into different colors, each corresponding to a different light-emitting element. For example, if the light-emitting element emits white light, the color resist blocks 41 may contain red, green, and blue. White light passing through the color blocks of different colors can display the corresponding colors.

[0044] For example, a second encapsulation layer 5 is provided on the side of the color filter layer 4 away from the substrate 1 to further improve the reliability of the encapsulation and also to protect the color filter layer 4.

[0045] The display panel 10 also includes a cover plate 6, which is located on the display side of the display panel 10 at the position furthest from the substrate 1 to protect the display panel 10. The cover plate 6 covers the display area and part of the non-display area. The cover plate 6 is smaller than the substrate 1 and has a certain distance from the substrate 1 around its perimeter to facilitate the positioning and fixing of the display module. For example, the material of the cover plate 6 is glass, specifically plain glass.

[0046] Figure 2 This is a plan view of a display panel film layer structure provided in this disclosure.

[0047] For example, such as Figure 2 As shown, the orthogonal projection of the color filter layer 4 on the substrate 1 covers the orthogonal projection of the electroluminescent layer 22 or the anode 21 on the substrate 1, and the orthogonal projection of the cover plate 6 on the substrate 1 covers the orthogonal projection of the color filter layer 4 on the substrate 1.

[0048] Figure 3A This is a cross-sectional structural diagram of a display module provided in this disclosure.

[0049] like Figure 3A As shown, a display driver chip 7 (Display Driver Integrated Circuit, DDIC) is disposed in the non-display area of ​​the display panel 10. The display module also includes a flexible circuit board 20, which includes a bending area where it bends from the display side of the display panel 10 to the non-display side. One end of the flexible circuit board 20 on the display side is connected to the non-display area of ​​the display panel 10, and the other end on the non-display side is connected to a driver board. The driver board supplies power to the display driver chip 7 through the flexible circuit board 20, thereby driving the display panel 10 to display.

[0050] When the display module is subjected to a large external current or static electricity, electrostatic charges will be generated and accumulated on the cover plate 6 and the display driver chip 7, and released to the non-display side of the display module through the air. For example, the electrostatic charges accumulated on the surface of the cover plate 6 will be released to the non-display side of the substrate 1 through the air. For example, the electrostatic charges accumulated on the surface of the display driver chip 7 will be released downward through the air to the non-display side of the substrate 1, or to the components (such as capacitors, resistors, etc.) on the flexible circuit board 20.

[0051] For example, the flexible circuit board 20 is provided with multiple metal shields 201, which cover the components on the flexible circuit board 20. Static charges generated on the cover plate 6 and the display driver chip 7 are released to the shields 201 and blocked, reducing the possibility of damage to the components on the flexible circuit board 20. In addition, the shields 201 can also weaken the static charges generated on the components by external high currents or static electricity, reducing the possibility of component damage. For example, the flexible circuit board 20 has shields 201 on both the side away from the display panel 10 and the side closer to the display panel 10. The side of the flexible circuit board 20 away from the display panel 10 has a first grounding pad 202, which is connected to the grounding wire in the flexible circuit board 20.

[0052] The display panel 10 also includes a first conductive film layer 30, which is located on the flexible circuit board 20, covers at least a portion of the flexible circuit board 20, and bends with the flexible circuit board 20 from the display side of the display panel 10 to the non-display side of the display panel 10. Furthermore, the first conductive film layer 30 is in contact with the first grounding pad 202, grounding the first conductive film layer 30. If a large current or static electricity is present externally, the static charge accumulated on the cover plate 6 and the display driver chip 7 can be released onto the first conductive film layer 30, and then grounded through the first conductive film layer 30, the first grounding pad 202, the flexible circuit board 20, and the driver board. When the display module generates the same static voltage, the possibility of static discharge to the first conductive film layer 30 damaging the display module is lower; therefore, the static voltage required to damage the display module is stronger, meaning the display module has a stronger ability to withstand static discharge.

[0053] For example, the material of the first conductive film layer 30 is graphite.

[0054] Figure 3B This is a cross-sectional structural diagram of another display module provided in this disclosure.

[0055] In some examples, such as Figure 3B As shown, the first conductive film layer 30 simultaneously covers the display driver chip 7, protecting it and reducing the electrostatic voltage generated at the chip. Given the same voltage required for the display driver chip 7 to release static electricity, the first conductive film layer 30 increases the external current or static charge required to achieve this voltage, thus enhancing the display module's ability to withstand electrostatic discharge. Furthermore, the static electricity accumulated on the display driver chip 7 can be released to the first conductive film layer 30 and grounded via the first grounding pad 202, the flexible circuit board 20, and the driver board, reducing the likelihood of damage to components on the flexible circuit board 20 caused by the release of static charge from the display driver chip 7.

[0056] Figure 3C This is a cross-sectional structural diagram of another display module provided in this disclosure.

[0057] In other examples, such as Figure 3C As shown, the first conductive film layer 30 extends from one end near the cover plate 6 to the space between the cover plate 6 and the display driver chip 7, covering most of the gap between the cover plate 6 and the display driver chip 7. This increases the coverage area of ​​the first conductive film layer 30, enhances the protection range of the first conductive film layer 30 for the display module, and helps to improve the display module's ability to withstand electrostatic discharge.

[0058] Figure 3D This is a cross-sectional structural diagram of another display module provided in this disclosure.

[0059] In some examples, such as Figure 3D As shown, a second conductive film layer 40 is disposed on the non-display side of the substrate 1. The second conductive film layer 40 at least covers the display area and can extend to the display driver chip 7. On the non-display side of the display module, the second conductive film layer 40 is closer to the substrate 1 than the flexible circuit board 20 and the first conductive film layer 30. The electrostatic charge accumulated on the cover plate 6 and the display driver chip 7 is more easily released to the second conductive film layer 40, reducing the possibility of damaging the driving circuit and other components in the display panel 10.

[0060] For example, the second conductive film layer 40 can also serve as a heat dissipation layer to improve the heat dissipation effect of the display panel 10 and help extend the service life of the display panel 10.

[0061] In some examples, the flexible circuit board 20 has a second grounding pad 203 on the side near the display panel 10. The second grounding pad 203 is electrically connected to the ground wire on the flexible circuit board 20, and the second conductive film layer 40 is electrically connected to the second grounding pad 203. Static electricity released from the cover plate 6 or the display driver chip 7 to the second conductive film layer 40 can be grounded through the second grounding pad 203, the flexible circuit board 20, and the driver board, further improving the display module's ability to withstand electrostatic discharge.

[0062] For example, a conductive reinforcing plate 50 is disposed between the second conductive film layer 40 and the flexible circuit board 20. The reinforcing plate 50 is connected to the flexible circuit board 20 and the second conductive film layer 40 by conductive adhesive 501, and the reinforcing plate 50 covers the second grounding pad 203. The reinforcing plate 50 is mainly used to support the flexible circuit board 20 and to electrically connect the second grounding pad 203 and the second conductive film layer 40 on the flexible circuit board 20, thereby reducing the potential of the second conductive film layer 40 and increasing the probability of static electricity being released to the second conductive film layer 40, thereby improving the display module's ability to withstand static electricity.

[0063] To facilitate understanding of this disclosure, some examples are provided below. Twelve test points are selected in the display modules of the following examples. Contact discharge at different voltage levels is applied to the selected test points, and the display module is observed to see if any malfunction occurs. If any test point malfunctions at the same voltage level, the display module is determined to be unable to withstand the discharge voltage of that level. Four test points are located at the corners of the cover plate 6, four test points are located in the middle of the side of the cover plate 6, one test point is located in the middle of the cover plate 6, and three test points are located on the display driver chip 7. The test points are numbered as 1 to 9 on the cover plate 6, and A, B, and C on the display driver chip 7.

[0064] It should be noted that, Figure 4 This is a schematic diagram of the unfolded flexible circuit board 20 in the display module, showing that the flexible circuit board 20 and other structures are in a bent state when the module is being tested.

[0065] Example 1

[0066] like Figure 5A As shown, the display module includes a display panel 10 and a flexible circuit board 20. The display panel 10 is divided into a display area and a non-display area. The display panel 10 includes a cover plate 6 and a display driver chip 7. The cover plate 6 covers the display area and a portion of the non-display area. The display driver chip 7 is located in the non-display area and outside the area where the cover plate 6 is located. The flexible circuit board 20 is connected to the non-display area and is electrically connected to the display driver chip 7. The flexible circuit board 20 includes a bending area where it bends from the display side of the display module toward the non-display side.

[0067] Contact voltages of +1KV, -1KV, +2KV, -2KV, +2.2KV, -2.2KV, +2.5KV, -2.5KV, +2.8KV, -2.8KV, +3KV, -3KV, +4KV, and -4KV were applied to the test points of the display module to test whether the display module malfunctioned.

[0068] According to the test results, the module did not malfunction at any test point under contact voltage levels of +2KV and -2KV and below. At a contact voltage of +2.2KV, test points 7 and 9 malfunctioned. At a contact voltage of -2.2KV, all test points except for test points 5 and B malfunctioned.

[0069] Therefore, it can be concluded that the display module has an electrostatic discharge capability of 2KV.

[0070] Example 2

[0071] like Figure 3AAs shown, the display module provided in this disclosure example has a structure that is basically the same as the display module provided in Example 1. The difference is that a first conductive film layer 30 is provided on the side of the flexible circuit board 20 away from the display panel 10. The first conductive film layer 30 covers the flexible circuit board 20 and exposes the display driver chip 7.

[0072] Contact voltages of +1KV, -1KV, +2KV, -2KV, +2.5KV, -2.5KV, +2.8KV, -2.8KV, +3KV, -3KV, +4KV, and -4KV were applied to the test points of the display module to test whether the display module malfunctioned.

[0073] According to the test results, no defects occurred at any test point under contact voltage levels of +2.5KV and -2.5KV and below. However, defects occurred at test points A and C under contact voltage levels of +2.8KV and -2.8KV.

[0074] Therefore, it can be concluded that the display module has an electrostatic discharge capability of 2.5KV.

[0075] Example 3

[0076] like Figure 3B As shown, the display module provided in this disclosure example has a basically the same structure as the display module provided in Example 2. The difference is that the first conductive film layer 30 covers the flexible circuit board 20 and the display driver chip 7, and the edge of the first conductive film layer 30 is flush with the edge of the display driver chip 7.

[0077] Contact voltages of +1KV, -1KV, +2KV, -2KV, +2.5KV, -2.5KV, +2.8KV, -2.8KV, +3KV, -3KV, +4KV, and -4KV were applied to the test points of the display module to test whether the display module malfunctioned.

[0078] According to the test results, the module did not malfunction at any test point under contact voltage levels of +2.8KV and -2.8KV and below. At a contact voltage of +3KV, test points 7 and 9 malfunctioned. At a contact voltage of -3KV, all test points except for 5 and B malfunctioned.

[0079] Therefore, it can be concluded that the display module has an electrostatic discharge capability of 2.8KV.

[0080] Example 4

[0081] like Figure 3CAs shown, the display module provided in this disclosure example has a basically the same structure as the display module provided in Example 2. The difference is that the first conductive film layer 30 covers the flexible circuit board 20 and the display driver chip 7, and the edge of the first conductive film layer 30 extends to the space between the cover plate 6 and the display driver chip 7.

[0082] Contact voltages of +1KV, -1KV, +2KV, -2KV, +2.5KV, -2.5KV, +2.8KV, -2.8KV, +3KV, -3KV, +4KV, and -4KV were applied to the test points of the display module to test whether the display module malfunctioned.

[0083] According to the test results, the module did not malfunction at any test point under contact voltage levels of +3KV and -3KV and below. At a contact voltage of +4KV, malfunctions occurred at all test points except for test points 5 and B. At a contact voltage of -4KV, malfunctions occurred at all test points.

[0084] Therefore, it can be concluded that the display module has an electrostatic discharge capability of 3KV.

[0085] Example 5

[0086] like Figure 5B As shown, the display module provided in this disclosure example has a structure that is basically the same as the display module provided in Example 1. The difference is that a second conductive film layer 40 is provided on the non-display side of the display module. The second conductive film layer 40 is located between the flexible circuit board 20 and the display panel 10, and the second conductive film layer 40 covers the display area and the display driver chip 7.

[0087] Contact voltages of +1KV, -1KV, +2KV, -2KV, +3KV, -3KV, +4KV, and -4KV were applied to the test points of the display module to test whether the display module malfunctioned.

[0088] According to the test results, no defects occurred at any test point under contact voltage levels of +4KV and below 3KV. However, defects occurred at test points 1, 3, and 4 under a contact voltage of -4KV.

[0089] Therefore, it can be concluded that the display module has an electrostatic discharge capability of +4KV.

[0090] Example 6

[0091] like Figure 5CAs shown, the display module provided in this disclosure example has a basically the same structure as the display module provided in Example 5. The difference is that a reinforcing plate 50 is provided between the second conductive film layer 40 and the flexible circuit board 20. The reinforcing plate 50 is electrically connected to the second conductive film layer 40 and the flexible circuit board 20 through conductive adhesive 501, so that the second conductive film layer 40 is grounded through the grounding wire on the flexible circuit board 20.

[0092] Contact voltages of +1KV, -1KV, +2KV, -2KV, +3KV, -3KV, +4KV, -4KV, +5KV, -5KV, +6KV, and -6KV were applied to the test points of the display module to test whether the display module malfunctioned.

[0093] According to the test results, the module did not malfunction at any test point under contact voltage levels of +5KV and -5KV and below. At a contact voltage of +6KV, test points 1, 6 and 7 malfunctioned. At a contact voltage of -6KV, all test points except test points 5 and B malfunctioned.

[0094] Therefore, it can be concluded that the display module has an electrostatic discharge capability of 5KV.

[0095] Example 7

[0096] like Figure 3D As shown, the display module provided in this disclosure example has a structure that is basically the same as the display module provided in Example 4. The difference is that a second conductive film layer 40 is provided on the non-display side of the display module. The second conductive film layer 40 is located between the flexible circuit board 20 and the display panel 10, and the second conductive film layer 40 covers the display area and the display driver chip 7. A reinforcing plate 50 is provided between the second conductive film layer 40 and the flexible circuit board 20. The reinforcing plate 50 is electrically connected to the second conductive film layer 40 and the flexible circuit board 20 through conductive adhesive 501, so that the second conductive film layer 40 is grounded through the grounding wire on the flexible circuit board 20.

[0097] Contact voltages of +2KV, -2KV, +4KV, -4KV, +6KV, -6KV, +8KV, and -8KV were applied to the test points of the display module to test whether the display module malfunctioned.

[0098] According to the test results, the module did not malfunction at any test point under contact voltages of +6KV and -6KV. At a contact voltage of +8KV, test points 1 and 3 malfunctioned. At a contact voltage of -8KV, test points 1, 3, A, and C all malfunctioned.

[0099] Therefore, it can be concluded that the display module has an electrostatic discharge capability of 6KV.

[0100] As can be seen from Examples 1 and 2, after adding the first conductive film layer 30 to the flexible circuit board 20, the static electricity resistance of the display module is increased from 2KV to 2.5KV. The reason is that the static charge accumulated on the cover plate 6 and the display driver chip 7 can be released to the first conductive film, and then grounded through the first conductive film layer 30, the first grounding pad 202, the flexible circuit board 20 and the driver board, thereby improving the static electricity resistance of the display module.

[0101] As can be seen from Examples 2, 3 and 4, both covering the display driver chip 7 with the first conductive film layer 30 and extending the first conductive film layer 30 between the display driver chip 7 and the cover plate 6 can increase the display module's ability to withstand static electricity. This is because the first conductive film layer 30 has a larger coverage area, providing a wider range of static electricity protection for the display module, thereby increasing the display module's ability to withstand static electricity.

[0102] As can be seen from Examples 1 and 5, after a second conductive film layer 40 is provided between the display panel 10 and the flexible circuit board 20 on the non-display side of the display module, the static electricity resistance of the display module is increased from 2KV to +4KV. The reason is that the second conductive film layer 40 is closer to the substrate 1, and the static charge accumulated on the cover plate 6 and the display driver chip 7 is more easily released to the second conductive film layer 40, reducing the possibility of damaging the driving circuit in the display panel 10.

[0103] As can be seen from Examples 5 and 6, after the second conductive film layer 40 is grounded through the flexible circuit board 20, the display module's ability to withstand static electricity is increased from +4KV to 5KV. The reason is that the potential of the second conductive film layer 40 decreases after grounding, which increases the probability of static electricity being released onto the second conductive film layer 40, thereby improving the display module's ability to withstand static electricity.

[0104] As can be seen from Examples 4, 6 and 7, when the first conductive film layer 30 and the second conductive film layer 40 are set simultaneously, they can work together to improve the display module's ability to withstand static electricity.

[0105] At least one embodiment of this disclosure also provides a display device, including the display module described above. The display device can be any product or component with display functionality, such as a mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, navigator, or vehicle display screen; the embodiments of this disclosure do not limit this.

[0106] The following points also need to be explained:

[0107] (1) The accompanying drawings of the embodiments of this disclosure only involve the structures involved in the embodiments of this disclosure. Other structures can be referred to the general design.

[0108] (2) For clarity, the thickness of layers or regions is enlarged or reduced in the drawings used to describe embodiments of the present disclosure, i.e., these drawings are not drawn to actual scale. It will be understood that when an element such as a layer, film, region or substrate is referred to as being “above” or “below” another element, the element may be “directly” located “above” or “below” the other element or there may be intermediate elements.

[0109] (3) Where there is no conflict, the embodiments of this disclosure and the features in the embodiments can be combined with each other to obtain new embodiments.

[0110] The above description is merely a specific embodiment of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. A display module, characterized in that, include: The display panel (10) includes a substrate (1), the substrate (1) includes a display area and a non-display area, and a display driver chip (7) is disposed in the non-display area; A flexible circuit board (20) is electrically connected to the display driver chip (7). The flexible circuit board (20) includes a bending area. The flexible circuit board (20) bends from the display side of the display panel (10) to the non-display side of the display panel (10) at the bending area. The flexible circuit board (20) has a first ground pad (202) on the side away from the display panel (10). A first conductive film layer (30) covers at least a portion of the flexible circuit board (20) and is electrically connected to the first ground pad (202).

2. The display module according to claim 1, characterized in that, The first conductive film layer (30) also covers the display driver chip (7).

3. The display module according to claim 2, characterized in that, A cover plate (6) is disposed on the substrate (1), the cover plate (6) covers the display area, and the first conductive film layer (30) extends from one end near the cover plate (6) to between the cover plate (6) and the display driver chip (7).

4. The display module according to claim 1, characterized in that, A second conductive film layer (40) is provided on the non-display side of the substrate (1), and the second conductive film at least covers the display area.

5. The display module according to claim 4, characterized in that, The flexible circuit board (20) has a second grounding pad (203) on the side near the display panel (10), and the second conductive film is electrically connected to the second grounding pad (203).

6. The display module according to claim 5, characterized in that, A conductive reinforcing plate (50) is provided between the second conductive film layer (40) and the flexible circuit board (20). The reinforcing plate (50) is connected to the second conductive film layer (40) and the flexible circuit board (20) through conductive adhesive (501).

7. The display module according to claim 1, characterized in that, A shielding cover (201) is provided on the flexible circuit board (20), and the shielding cover (201) covers the components on the flexible circuit board (20).

8. The display module according to claim 7, characterized in that, The shield (201) is disposed on the side of the flexible circuit board (20) away from the display panel (10), and / or the shield (201) is disposed on the side of the flexible circuit board (20) facing the display panel (10).

9. The display module according to claim 1, characterized in that, The display panel (10) is any one of a silicon-based OLED panel, a glass-based OLED panel, a micro-LED panel, and a liquid crystal panel.

10. The display module according to claim 1, characterized in that, The substrate (1) is a silicon-based substrate, and the display panel (10) further includes: Multiple sub-pixels, each sub-pixel including a pixel driving circuit and a light-emitting element, wherein the pixel driving circuit is configured to drive the light-emitting element to emit light; The color filter layer (4) includes three color resist blocks (41) of different colors, each color resist block (41) corresponding to a different sub-pixel.

11. A display device, characterized in that, Includes the display module as described in any one of claims 1 to 10.

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