Bubble removing equipment

Abstract

The utility model relates to the technical field of semiconductors, and particularly discloses defoaming equipment which comprises a defoaming chamber, a first vacuum system, a second vacuum system and a first switching unit. The first vacuum system is used for providing negative pressure for the defoaming chamber; the second vacuum system is used for providing negative pressure for the defoaming chamber; the first switching unit is arranged in a connecting pipeline of the first vacuum system, the second vacuum system and the defoaming chamber, when the first switching unit is in a first switching state, the first vacuum system is connected to the defoaming chamber, the second vacuum system is disconnected from the defoaming chamber, and when the first switching unit is in a second switching state, the second vacuum system is connected to the defoaming chamber. The second vacuum system is connected to the defoaming chamber, and the first vacuum system is disconnected from the defoaming chamber. Through cooperation of the first vacuum system, the second vacuum system and the first switching unit, when one vacuum system breaks down, the other vacuum system can be seamlessly switched and used, defoaming equipment does not need to be interrupted, and it is ensured that wafers cannot be scrapped.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor, in particular to a defoaming device. BACKGROUND

[0002] In the field of semiconductor, if the semiconductor equipment fails, it may cause the wafer to be scrapped, even in batches, and the wafer is very valuable, and the loss caused by the batch scrapping of the wafer is large. At present, when the semiconductor equipment fails, it is generally stopped for maintenance, which helps to troubleshoot the fault, but it will cause the semiconductor equipment to be interrupted, and for some semiconductor equipment, such as a defoaming device, if the interruption occurs during the chip defoaming process, it is easy to cause the wafer to be scrapped. SUMMARY

[0003] Therefore, it is necessary to provide a defoaming device aiming at the above problems, comprising:

[0004] a defoaming chamber;

[0005] a first vacuum system connected to the defoaming chamber for providing negative pressure for the defoaming chamber;

[0006] a second vacuum system connected to the defoaming chamber for providing negative pressure for the defoaming chamber;

[0007] a first switching unit arranged in a connecting pipeline of the first vacuum system, the second vacuum system and the defoaming chamber, when the first switching unit is in a first switching state, the first vacuum system is connected to the defoaming chamber, and the connection between the second vacuum system and the defoaming chamber is disconnected, when the first switching unit is in a second switching state, the second vacuum system is connected to the defoaming chamber, and the connection between the first vacuum system and the defoaming chamber is disconnected.

[0008] In one of the embodiments, the first vacuum system comprises a first vacuum pump and a first vacuum electromagnetic valve, the first vacuum pump is connected to the defoaming chamber through the first vacuum electromagnetic valve and the first switching unit;

[0009] the second vacuum system comprises a second vacuum pump and a second vacuum electromagnetic valve, the second vacuum pump is connected to the defoaming chamber through the second vacuum electromagnetic valve and the first switching unit.

[0010] In one of the embodiments, the first switching unit comprises a vacuum electromagnetic valve.

[0011] In one of the embodiments, the defoaming device further comprises:

[0012] a first pressure increasing system connected to the defoaming chamber for increasing the pressure of the defoaming chamber;

[0013] a second pressurization system connected to the bubble removal chamber for pressurizing the bubble removal chamber;

[0014] a second switching unit connected to the intake end and connected in series to the pipeline between the first pressurization system and the second pressurization system, when the second switching unit is in a first switching state, the first pressurization system is connected to the pipeline where the bubble removal chamber is located, and the second pressurization system is disconnected from the pipeline where the bubble removal chamber is located, when the second switching unit is in a second switching state, the second vacuum system is connected to the pipeline where the bubble removal chamber is located, and the first vacuum system is disconnected from the pipeline where the bubble removal chamber is located.

[0015] In one of the embodiments, the first pressurization system comprises a first pressurization pump and a first electromagnetic valve, the second switching unit is connected to the bubble removal chamber through the first electromagnetic valve and the first pressurization pump.

[0016] The second pressurization system comprises a second pressurization pump and a second electromagnetic valve, the second switching unit is connected to the bubble removal chamber through the second electromagnetic valve and the second pressurization pump.

[0017] In one of the embodiments, the second switching unit comprises an electromagnetic valve.

[0018] In one of the embodiments, the bubble removal device further comprises a pressure detection unit and a control unit, the pressure detection unit is connected to the bubble removal chamber for detecting the pressure in the bubble removal chamber, and the control unit is connected to the pressure detection unit, the first switching unit and the second switching unit respectively.

[0019] In one of the embodiments, the pressure detection unit comprises a pressure sensor.

[0020] In one of the embodiments, the control unit comprises a programmable logic controller.

[0021] In one of the embodiments, the bubble removal device further comprises a UPS power supply unit, the UPS power supply unit is electrically connected to the first vacuum system, the second vacuum system, the first switching unit, the first pressurization system, the second pressurization system and the second switching unit respectively.

[0022] The bubble removing device provided by the embodiment of the application is provided with a first vacuum system and a second vacuum system, both of which can be connected to the bubble removing chamber to provide negative pressure for the bubble removing chamber. A first switching unit is arranged in the connecting pipeline between the first vacuum system, the second vacuum system and the bubble removing chamber. The first switching unit can switch the use of the first vacuum system or the second vacuum system. Specifically, when the first switching unit is in a first switching state, the first vacuum system is connected to the bubble removing chamber to provide negative pressure for the bubble removing chamber, and at this time, the second vacuum system is disconnected from the bubble removing chamber. When the first switching unit is in a second switching state, the second vacuum system is connected to the bubble removing chamber to provide negative pressure for the bubble removing chamber, and at this time, the first vacuum system is disconnected from the bubble removing chamber. Through the cooperation of the first vacuum system, the second vacuum system and the first switching unit, when one of the vacuum systems fails, the other vacuum system can be seamlessly switched without interrupting the bubble removing process of the bubble removing device, so that the wafer is not scrapped due to process interruption or vacuum system failure. BRIEF DESCRIPTION OF DRAWINGS

[0023] Figure 1 A structural schematic diagram of a bubble removing device provided by an embodiment of the application is shown in the figure.

[0024] Figure 2 A structural schematic diagram of a bubble removing device provided by another embodiment of the application is shown in the figure.

[0025] Figure 3 A structural schematic diagram of a bubble removing device provided by another embodiment of the application is shown in the figure.

[0026] Figure 4 A structural schematic diagram of a bubble removing device provided by another embodiment of the application is shown in the figure.

[0027] Figure 5 A structural schematic diagram of a bubble removing device provided by another embodiment of the application is shown in the figure.

[0028] BRIEF DESCRIPTION OF DRAWINGS

[0029] 100, bubble removing chamber; 110, first vacuum system; 111, first vacuum pump; 112, first vacuum electromagnetic valve; 120, second vacuum system; 121, second vacuum pump; 122, second vacuum electromagnetic valve; 130, first switching unit; 140, first pressure increasing system; 141, first pressure increasing pump; 142, first electromagnetic valve; 150, second pressure increasing system; 151, second pressure increasing pump; 152, second electromagnetic valve; 160, second switching unit; 170, pressure detection unit; 180, control unit. DETAILED DESCRIPTION

[0030] For the purpose of understanding the present application, a more complete description of the application will be rendered by reference to the associated drawings. The drawings are provided for purposes of illustration only and merely depict preferred embodiments of the application. However, the application can be implemented in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the application to those skilled in the art.

[0031] In the present application, unless specifically stated and limited otherwise, the terms "mounting", "connected", "connecting", "fixed", and "fixedly" are used broadly and encompass both direct and indirect mounting, connecting, and fixing, and can also refer to fixed attachment, detachable attachment, or integral connection. Mechanically or electrically, they can be directly connected, or connected through an intermediate medium, and can be internal communication between two elements or interaction between two elements. Unless otherwise explicitly limited, the above terms should be understood as having a broad meaning in the present application.

[0032] The terms "first", "second", and the like in the description do not denote any order, quantity, or importance, but are used for the purpose of description only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined with "first", "second" can explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise explicitly specified.

[0033] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the present application is only for the purpose of describing specific embodiments and is not intended to limit the present application. The term "and / or" used herein includes any and all combinations of one or more of the associated listed items.

[0034] Reference Figure 1In one embodiment, a defoaming device is provided, including a defoaming chamber 100, a first vacuum system 110, a second vacuum system 120, and a first switching unit 130. The first vacuum system 110 is connected to the defoaming chamber 100 and provides negative pressure to the defoaming chamber 100. The second vacuum system 120 is connected to the defoaming chamber 100 and provides negative pressure to the defoaming chamber 100. The first switching unit 130 is disposed in the connecting pipeline between the first vacuum system 110, the second vacuum system 120, and the defoaming chamber 100. When the first switching unit 130 is in a first switching state, the first vacuum system 110 is connected to the defoaming chamber 100, and the connection between the second vacuum system 120 and the defoaming chamber 100 is disconnected. When the first switching unit 130 is in a second switching state, the second vacuum system 120 is connected to the defoaming chamber 100, and the connection between the first vacuum system 110 and the defoaming chamber 100 is disconnected.

[0035] The defoaming device provided in this application embodiment is equipped with a first vacuum system 110 and a second vacuum system 120. Both the first vacuum system 110 and the second vacuum system 120 can be connected to the defoaming chamber 100 to provide negative pressure to the defoaming chamber 100. At the same time, a first switching unit 130 is provided in the connecting pipeline between the first vacuum system 110, the second vacuum system 120 and the defoaming chamber 100. The first switching unit 130 can switch between using the first vacuum system 110 and the second vacuum system 120. Specifically, when the first switching unit 130 is in the first switching state, the first vacuum system 110 is connected to the defoaming chamber 100 to provide negative pressure, and the second vacuum system 120 is disconnected from the defoaming chamber 100. When the first switching unit 130 is in the second switching state, the second vacuum system 120 is connected to the defoaming chamber 100 to provide negative pressure, and the first vacuum system 110 is disconnected from the defoaming chamber 100. With the cooperation of the first vacuum system 110, the second vacuum system 120 and the first switching unit 130, the other vacuum system can be seamlessly switched to when one of the vacuum systems fails, without interrupting the degassing process of the degassing equipment, ensuring that the wafer will not be scrapped due to process interruption or vacuuming process failure.

[0036] Among them, defoaming equipment can be used to process electronic devices, which include solid planar media and adhesive materials. The adhesive materials are bonded to the solid planar media. During the bonding process, due to the characteristics of the adhesive materials themselves and the influence of molecules in the air, air bubbles are very easy to be generated at the bonding interface or inside the adhesive materials. Air bubbles will affect the appearance of the product and may even greatly reduce the performance of the product. Therefore, defoaming equipment can effectively remove air bubbles between the adhesive materials and the solid planar media or inside the adhesive materials.

[0037] When using this defoaming device, electronic components can be placed inside the defoaming chamber 100. By adjusting the temperature and pressure of the defoaming chamber 100, air bubbles between the adhesive and the solid planar medium or inside the adhesive can be eliminated.

[0038] In this embodiment, the defoaming device is equipped with a dual vacuum system, which is defined as a first vacuum system 110 and a second vacuum system 120. The two vacuum systems are arranged in parallel. The first switching unit 130 can select to connect the first vacuum system 110 or the second vacuum system 120 to the pipeline to provide negative pressure to the defoaming chamber 100.

[0039] Reference Figure 2 In one embodiment, the first vacuum system 110 includes a first vacuum pump 111 and a first vacuum solenoid valve 112. The first vacuum pump 111 is connected to the defoaming chamber 100 via the first vacuum solenoid valve 112 and the first switching unit 130. That is, the first switching unit 130 is disposed between the first vacuum solenoid valve 112 and the defoaming chamber 100. When the first switching unit 130 switches to the first switching state, the pipeline between the first vacuum solenoid valve 112 and the defoaming chamber 100 is connected. At this time, the first vacuum solenoid valve 112 can be closed, and the first vacuum pump 111 can be started to evacuate the defoaming chamber 100 to provide a negative pressure environment. At this time, the pipeline between the second vacuum system 120 and the defoaming chamber 100 is disconnected.

[0040] Accordingly, the second vacuum system 120 includes a second vacuum pump 121 and a second vacuum solenoid valve 122. The second vacuum pump 121 is connected to the defoaming chamber 100 via the second vacuum solenoid valve 122 and the first switching unit 130. That is, the first switching unit 130 is also located between the second vacuum solenoid valve 122 and the defoaming chamber 100. When the first switching unit 130 switches to the second switching state, the pipeline between the second vacuum solenoid valve 122 and the defoaming chamber 100 is connected. At this time, the second vacuum solenoid valve 122 can be closed, and the second vacuum pump 121 can be started to evacuate the defoaming chamber 100 to provide a negative pressure environment. At this time, the pipeline between the first vacuum system 110 and the defoaming chamber 100 is disconnected.

[0041] In one embodiment, the first switching unit 130 includes a vacuum solenoid valve.

[0042] In this embodiment, in addition to employing a dual vacuum system, a dual pressurization system can also be used. (Refer to...) Figure 3 In one embodiment, the defoaming device may further include a first pressurization system 140, a second pressurization system 150, and a second switching unit 160.

[0043] Specifically, a first pressurization system 140 is connected to the defoaming chamber 100 and is used to pressurize the defoaming chamber 100. A second pressurization system 150 is connected to the defoaming chamber 100 and is used to pressurize the defoaming chamber 100. A second switching unit 160 is connected to the air inlet and is connected in series in the pipeline between the first pressurization system 140 and the second pressurization system 150. When the second switching unit 160 is in a first switching state, the first pressurization system 140 is connected to the pipeline containing the defoaming chamber 100, and the second pressurization system 150 is disconnected from the pipeline containing the defoaming chamber 100. When the second switching unit 160 is in a second switching state, the second vacuum system 120 is connected to the pipeline containing the defoaming chamber 100, and the first vacuum system 110 is disconnected from the pipeline containing the defoaming chamber 100.

[0044] In this embodiment, a first pressurization system 140 and a second pressurization system 150 are simultaneously provided. Both the first pressurization system 140 and the second pressurization system 150 can be connected to the defoaming chamber 100 to pressurize the defoaming chamber 100. A second switching unit 160 is also provided. The second switching unit 160 is connected to the air inlet and is connected in series in the pipeline between the first pressurization system 140 and the second pressurization system 150. The second switching unit 160 can switch between using the first pressurization system 140 and the second pressurization system 150. Specifically, when the second switching unit 160 is in the first switching state, the pipeline containing the air inlet, the first pressurization system 140, and the defoaming chamber 100 is connected, and the first pressurization system 140 pressurizes the defoaming chamber 100. At this time, the pipeline containing the air inlet, the second pressurization system 150, and the defoaming chamber 100 is disconnected. When the second switching unit 160 is in the second switching state, the pipelines connecting the air inlet, the second pressurization system 150, and the debubbling chamber 100 are connected, and the debubbling chamber 100 is pressurized through the second pressurization system 150. At this time, the pipelines connecting the air inlet, the first pressurization system 140, and the debubbling chamber 100 are disconnected. That is, through the cooperation of the first pressurization system 140, the second pressurization system 150, and the second switching unit 160, it is possible to seamlessly switch to the other pressurization system when one of the pressurization systems fails, without interrupting the debubbling process of the debubbling equipment, ensuring that the wafer is not scrapped due to process interruption or pressurization process failure.

[0045] Reference Figure 4In one embodiment, the first pressurization system 140 includes a first pressurization pump 141 and a first solenoid valve 142. The second switching unit 160 is connected to the defoaming chamber 100 via the first solenoid valve 142 and the first pressurization pump 141. That is, when the second switching unit 160 switches to the first switching state, the first solenoid valve 142 can be closed, and the first pressurization pump 141 can be started, so that gas can pressurize the defoaming chamber 100 through the air inlet, the first solenoid valve 142, and the first pressurization pump 141.

[0046] Accordingly, the second pressurization system 150 includes a second pressurization pump 151 and a second solenoid valve 152, and the second switching unit 160 is connected to the defoaming chamber 100 via the second solenoid valve 152 and the second pressurization pump 151. That is, when the second switching unit 160 switches to the second switching state, the second solenoid valve 152 can be closed and the second pressurization pump 151 can be started, so that gas can pressurize the defoaming chamber 100 through the air inlet, the second solenoid valve 152, and the second pressurization pump 151.

[0047] In one embodiment, the second switching unit 160 includes a solenoid valve.

[0048] Reference Figure 5 In one embodiment, the defoaming device further includes a pressure detection unit 170 and a control unit 180. The pressure detection unit 170 is connected to the defoaming chamber 100 and is used to detect the pressure inside the defoaming chamber 100. The control unit 180 is connected to the pressure detection unit 170, the first switching unit 130, and the second switching unit 160, respectively.

[0049] During the vacuuming process, the pressure detection unit 170 can detect the negative pressure in the defoaming chamber 100 in real time and send the detected negative pressure value to the control unit 180. When the control unit 180 determines that the current negative pressure value is abnormal, regardless of whether the problem is with the pipeline, solenoid valve, vacuum pump, or pressure gauge, it will be assumed that there is a problem with the current working vacuum system. At this time, the first switching unit 130 can be controlled to switch to another state so as to seamlessly switch to the backup vacuum system without checking specific components, ensuring that the entire defoaming equipment does not stop or be interrupted, thus ensuring the quality of the wafer.

[0050] Similarly, during the pressurization process, the pressure detection unit 170 can detect the pressure value in the defoaming chamber 100 in real time and send the detected pressure value to the control unit 180. When the control unit 180 determines that the current pressure value is abnormal, it will default to the judgment that there is a problem with the current pressurization system. At this time, the second switching unit 160 can be controlled to switch to another state so as to seamlessly switch to the backup pressurization system without checking specific components, ensuring that the entire defoaming equipment does not stop or be interrupted, and ensuring the quality of the wafer.

[0051] The pressure detection unit 170 may include a pressure sensor. The control unit 180 may include a programmable logic controller.

[0052] In one embodiment, the defoaming equipment provided in this embodiment further includes a UPS power supply unit, which is electrically connected to the first vacuum system 110, the second vacuum system 120, the first switching unit 130, the first booster system 140, the second booster system 150, and the second switching unit 160, respectively. The main power supply is connected to the above components via the UPS power supply unit. Even if a power outage outside the factory area causes the main power supply to fail, the UPS power supply unit can continue to supply power to the components of the defoaming equipment, further ensuring that the defoaming equipment operates without interruption during the defoaming process and avoiding economic losses due to wafer scrapping.

[0053] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0054] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this application should be determined by the appended claims.

Claims

1. A defoaming device, characterized in that, include: Except for the bubble chamber; A first vacuum system, connected to the defoaming chamber, is used to provide negative pressure to the defoaming chamber; A second vacuum system, connected to the defoaming chamber, is used to provide negative pressure to the defoaming chamber; The first switching unit is disposed in the connecting pipeline between the first vacuum system, the second vacuum system and the defoaming chamber. When the first switching unit is in the first switching state, the first vacuum system is connected to the defoaming chamber and the connection between the second vacuum system and the defoaming chamber is disconnected. When the first switching unit is in the second switching state, the second vacuum system is connected to the defoaming chamber and the connection between the first vacuum system and the defoaming chamber is disconnected.

2. The defoaming device according to claim 1, characterized in that, The first vacuum system includes a first vacuum pump and a first vacuum solenoid valve, wherein the first vacuum pump is connected to the defoaming chamber via the first vacuum solenoid valve and the first switching unit; The second vacuum system includes a second vacuum pump and a second vacuum solenoid valve. The second vacuum pump is connected to the defoaming chamber via the second vacuum solenoid valve and the first switching unit.

3. The defoaming device according to claim 1, characterized in that, The first switching unit includes a vacuum solenoid valve.

4. The defoaming device according to claim 1, characterized in that, The defoaming device also includes: A first pressurization system is connected to the defoaming chamber and is used to pressurize the defoaming chamber; The second pressurization system is connected to the defoaming chamber and is used to pressurize the defoaming chamber; The second switching unit is connected to the air intake end and is connected in series in the pipeline between the first boosting system and the second boosting system. When the second switching unit is in the first switching state, the pipeline where the first boosting system is located is connected to the pipeline where the defoaming chamber is located, and the pipeline where the second boosting system is located is disconnected from the pipeline where the defoaming chamber is located. When the second switching unit is in the second switching state, the pipeline where the second vacuum system is located is connected to the pipeline where the defoaming chamber is located, and the pipeline where the first vacuum system is located is disconnected from the pipeline where the defoaming chamber is located.

5. The defoaming device according to claim 4, characterized in that, The first boosting system includes a first boosting pump and a first solenoid valve, and the second switching unit is connected to the defoaming chamber via the first solenoid valve and the first boosting pump; The second pressurization system includes a second pressurization pump and a second solenoid valve. The second switching unit is connected to the defoaming chamber via the second solenoid valve and the second pressurization pump.

6. The defoaming device according to claim 5, characterized in that, The second switching unit includes a solenoid valve.

7. The defoaming device according to claim 4, characterized in that, The defoaming device further includes a pressure detection unit and a control unit. The pressure detection unit is connected to the defoaming chamber and is used to detect the pressure inside the defoaming chamber. The control unit is connected to the pressure detection unit, the first switching unit, and the second switching unit.

8. The defoaming device according to claim 7, characterized in that, The pressure detection unit includes a pressure sensor.

9. The defoaming device according to claim 7, characterized in that, The control unit includes a programmable logic controller.

10. The defoaming device according to claim 4, characterized in that, The defoaming device also includes a UPS power supply unit, which is electrically connected to the first vacuum system, the second vacuum system, the first switching unit, the first boosting system, the second boosting system, and the second switching unit.

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