Semiconductor wafer conveying system

Abstract

The utility model provides a semiconductor wafer conveying system. The systems include a suspended track, a first vehicle configured to travel along the suspended track, and an emergency wheel assembly configured to replace a first wheel assembly on the first vehicle while the first vehicle remains on the suspended track, the emergency wheel assembly including a wheel configured to freely rotate on an axis of the first vehicle. In some examples, a system may include a second vehicle configured to travel along a suspended track, a coupling device configured to couple a first vehicle to the second vehicle, and a controller configured to operate the second vehicle to move along the suspended track while being coupled to the first vehicle through the coupling device and thereby tow the first vehicle.

Description

Technical Field

[0001] This utility model relates to a semiconductor wafer transport system and its operation method. Background Technology

[0002] Front-opening wafer transport cassettes (FOUPs) are specialized containers used in the semiconductor integrated circuit (IC) manufacturing industry to transport and store semiconductor wafers in a clean and controlled environment. FOUPs improve wafer cleanliness and integrity at various stages of the semiconductor manufacturing process. The transport of FOUPs may vary depending on the stage of the manufacturing process and / or the layout of the facility. In some cases, automated material handling systems (AMHS), including overhead conveyance systems, can be used to transport FOUPs. These systems can include automated or remotely controlled vehicles that move along predetermined paths on overhead tracks. Generally, FOUPs are designed to minimize human intervention, reduce the risk of contamination, and improve the efficient movement of FOUPs between different handling tools. Utility Model Content

[0003] This application provides a semiconductor wafer transport system, which includes a suspension track disposed at a higher position within a semiconductor manufacturing facility, a first carrier configured to travel along the suspension track while carrying a semiconductor wafer, and an emergency wheel assembly configured to replace a first wheel assembly on the first carrier while the first carrier remains on the suspension track. The emergency wheel assembly includes a wheel configured to rotate freely on an axle of the first carrier. Attached Figure Description

[0004] The best understanding of all aspects of this disclosure will be achieved by reading the following detailed description in conjunction with the accompanying drawings. It should be noted that, in accordance with standard practice in the industry, the various features are not drawn to scale. In fact, the dimensions of the various features may be arbitrarily increased or decreased for clarity of explanation.

[0005] Figure 1 An automated carrier is shown, according to some embodiments, for transporting semiconductor wafers along a suspended track between stages in an integrated circuit manufacturing process;

[0006] Figure 2 This is a perspective view of an emergency wheel assembly, according to some embodiments, designed to facilitate the movement of a disabled automated vehicle;

[0007] Figure 3 According to some embodiments Figure 2 Exploded view of some components of the wheel assembly;

[0008] Figure 4 According to some embodiments Figure 3 A perspective view of the wheel assembly;

[0009] Figure 5 This is a top view of the coupling device used in an automated vehicle with traction failure according to some embodiments;

[0010] Figure 6 According to some embodiments Figure 5 A perspective view of part of the connecting device;

[0011] Figure 7 This is a cross-sectional view of the first attachment member of the connecting device according to some embodiments;

[0012] Figure 8 It is a cross-sectional view of an elongated member of a connecting device according to some embodiments; and

[0013] Figure 9 This is a flowchart illustrating an exemplary method for moving a failed automated vehicle according to some embodiments. Detailed Implementation

[0014] The following disclosure provides numerous different embodiments or instances for implementing various features of this subject matter. Specific examples of components and arrangements are described below to simplify this disclosure. Of course, these are merely examples and are not intended to be limiting. Furthermore, reference numerals and / or letters may be repeated in various instances of this disclosure. Such repetition is for the purpose of brevity and clarity, and does not itself indicate a relationship between the various embodiments and / or configurations discussed.

[0015] As used herein, terms such as “first,” “second,” and “third” describe various elements, components, regions, layers, and / or parts, but these elements, components, regions, layers, and / or parts should not be limited. These terms may be used only to distinguish one element, component, region, layer, or part from another. The terms such as “first,” “second,” and “third” as used herein do not imply sequence or order unless the context clearly indicates otherwise.

[0016] Those skilled in the art will readily understand, upon full reading of this disclosure, that the structures disclosed herein can be used with a variety of technologies and can be incorporated into a variety of industries and manufacturing processes.

[0017] Furthermore, for ease of explanation, spatial relative terms such as "over," "overlying," "above," "upper," "top," "under," "underlying," "below," "lower," "bottom," and similar terms may be used herein to describe the relationship between one element or feature shown in the figures and another (other) element or feature. These spatial relative terms are intended to encompass different orientations of the device in use or operation, in addition to those shown in the figures. The device may have other orientations (rotated 90 degrees or in other orientations), and the spatial relative descriptive terms used herein may be interpreted accordingly. When spatial relative terms (such as those listed above) are used to describe a first element relative to a second element, the first element may be directly located on the other element, or there may be intermediate elements or layers present. When a component or layer is referred to as being "on" another component or layer, it is directly on and in contact with that other component or layer.

[0018] It should be noted that references to "an embodiment," "embodiment," "example embodiment," "exemplary," "example," etc., in the specification indicate that the described embodiment may include specific features, structures, or characteristics, but each embodiment may not necessarily include those specific features, structures, or characteristics. Furthermore, such terms do not necessarily refer to the same embodiment. Additionally, when a specific feature, structure, or characteristic is described in connection with an embodiment, whether explicitly described or not, the effect of such feature, structure, or characteristic on other embodiments will be within the knowledge of those skilled in the art.

[0019] Some embodiments of this disclosure will now be described with reference to the accompanying drawings, wherein the same reference numerals are generally used throughout the text to refer to the same elements. In the following description, numerous specific details are set forth for purposes of explanation in order to provide a thorough understanding of the claimed subject matter. However, it will be apparent that the claimed subject matter may be practiced without these specific details. In other instances, structures and arrangements are shown in block diagrams to facilitate the description of the claimed subject matter.

[0020] Automated material handling systems (AMHS) including overhead conveyor systems (e.g., overhoist transport, OHT) can be used to transport semiconductor wafers, such as front-opening wafer cassettes (FOUPs), front-opening wafer stacks (FOSBs), pallets, cassettes, etc., by using automated or remotely controlled vehicles that move along predetermined paths on suspended tracks within the semiconductor manufacturing / facilities. In the event that a vehicle moving along the suspended track is damaged and cannot move, a recovery procedure must be performed to move the damaged vehicle along the suspended track in order to repair it and / or allow other vehicles to travel along the track. Such recovery procedures can present significant challenges because the damaged vehicle is located at a high position on the suspended track.

[0021] This document presents embodiments of systems and methods for recovering a damaged vehicle that has failed on a suspended track. For convenience, the systems and methods will be described with reference to overhead conveyor systems installed within semiconductor manufacturing facilities. However, the systems and methods are not limited to this application and / or the semiconductor integrated circuit (IC) manufacturing industry. In various embodiments, the systems and methods include replacing the motorized wheel assembly of the damaged vehicle with a free-spinning wheel assembly, and then towing the damaged vehicle with another vehicle connected thereto.

[0022] Figure 1 This illustrates a portion of a semiconductor wafer transport system 100 within a semiconductor manufacturing facility according to various embodiments. The semiconductor wafer transport system 100 includes one or more tracks comprising a suspended track 110 configured at a high position within the facility and carriers configured to travel along the suspended track 110 for various purposes, such as carrying one or more semiconductor wafers (not shown) between various semiconductor processing tools within the facility. The carriers may be configured to move along the suspended track 110 on wheel assemblies. In some examples, the wheel assemblies may be motorized to provide self-propulsion for the carriers. The carriers may be automated, i.e., traveling along the suspended track 110 at a time, speed, and destination according to pre-programmed instructions, or may be remotely initiated, operated, or controlled by an operator. Each carrier may include a controller configured to operate the carrier to move along the suspended track 110 according to pre-programmed instructions and / or at the direction of a remote device. The controller may include various electronic devices configured to perform operations on the carriers, such as one or more processors, memory devices, and communication buses. In some examples, the vehicle may include a wireless communication device for remote communication with one or more individual systems or devices.

[0023] exist Figure 1In this embodiment, a first vehicle 112 and a second vehicle 120 are depicted as being connected to a suspension track 110 for travel thereon. A non-limiting example of the first vehicle 112 and the second vehicle 120 could be a chain conveyor vehicle, such as the Daifuku Webb chain conveyor CLW-07 / 0711. The first vehicle 112 and the second vehicle 120 are configured to be suspended below the suspension track 110 and include a motorized wheel assembly (not shown) configured to be on top of and roll along the suspension track 110. In this example, for instance, the first vehicle 112 is damaged due to a motor failure and is unable to self-propel along the suspension track 110. To restore the first vehicle 112, the second vehicle 120 has been connected to the first vehicle 112 via a coupling device 160. Furthermore, the motorized wheel assembly of the first vehicle 112 has been replaced by an emergency wheel assembly 130, which has wheels 134 configured to rotate freely on the respective axles of the first vehicle 112 (e.g., ...). Figure 2 (As shown). The operator is shown using remote device 122 to initiate and / or guide the movement of the second vehicle 120 along the suspension track 110. As the second vehicle 120 moves along the suspension track 110, the first vehicle 112 is pulled behind the second vehicle 120 due to the coupling device 160. In this way, the operator can move the first vehicle 112 to a location on the suspension track 110 where repair or replacement of the first vehicle 112 can be performed without posing excessive risk to maintenance personnel and / or obstructing other vehicles on the suspension track 110.

[0024] The emergency wheel assembly 130 can have various structures that facilitate the free rolling of the first vehicle 112 along the suspension track 110. For example, Figure 2-4 Various aspects of an emergency wheel assembly 130 according to various embodiments are shown. In this example, the first vehicle 112 includes a motor assembly 132 configured to rotate an axle 136 having a first wheel assembly (not shown). The first wheel assembly is configured to rotate in a fixed relationship with the axle 136, thereby propelling the first vehicle 112 along a suspension track 110. (Refer to first...) Figure 2 The first wheel assembly has been replaced by the emergency wheel assembly 130, which is configured such that wheel 134 rotates freely on axle 136. As used herein, the terms free-rotation, freely rotate, and the like refer to wheel 134 rotating and rolling along suspension track 110 in response to forces applied to the first vehicle 112. That is, wheel 134 is configured to rotate on axle 136, while axle 136 itself does not rotate.

[0025] The emergency wheel assembly 130 includes a wheel 134, a pivot portion 142 fixed or fastened to the wheel 134, a pair of bearings 146 and 148 configured to allow free rotation of the wheel 134 on an axle 136, a spacer 150 configured to be disposed between the pair of bearings 146 and 148 and the axle 136, and a fixing device 144 configured to fix the emergency wheel assembly 130 to the axle 136. Figure 3 An exploded view of wheel 134, pivot 142, a pair of bearings 146 and 148, and spacer 150 is shown. Figure 4 A top perspective view of the assembled wheel 134, hub 142, a pair of bearings 146 and 148, and spacer 150 is shown.

[0026] The coupling device 160 may have various configurations to physically and releasably couple the first vehicle 112 to the second vehicle 120 and maintain the connection therebetween as the second vehicle 120 pulls the first vehicle 112 along the suspension track 110. In some embodiments, the coupling device 160 may have a rigid or semi-rigid structure configured to reduce or prevent collisions between the first vehicle 112 (i.e., the damaged vehicle) and the second vehicle 120 (i.e., the pulling vehicle) during traction. The coupling device 160 may include one or more swivel joints to improve ease of movement about curves within the suspension track 110.

[0027] Figure 5 and Figure 6 Various aspects of a coupling device 160 according to various embodiments are illustrated. In this example, the coupling device 160 includes a first attachment member 164 configured to be fixed to a first carrier 112, a second attachment member 166 configured to be fixed to a second carrier 120, and an elongated member 162 configured to be coupled at a first end to the first attachment member 164 to define a first rotary joint 168, and at a second end configured opposite to the first end to the second attachment member 166 to define a second rotary joint 170. Both the first and second rotary joints 168 and 170 are configured to allow the elongated member 162 to pivot relative to the first attachment member 164 and / or the second attachment member 166 to improve ease of movement about curves in the suspension track 110. The first attachment member 164, the second attachment member 166, and the elongated member 162 may comprise or be formed of various materials, including various metals, polymers, or composite materials. Specific non-restricted materials may include various low-carbon steels, medium-carbon steels, and high-carbon steels.

[0028] The first attachment member 164 and the second attachment member 166 can be releasably or permanently attached to the first carrier 112 and the second carrier 120 using various structures suitable for the specific structures of the first carrier 112 and the second carrier 120, respectively. In this example, the first attachment member 164 and the second attachment member 166 respectively include first and second mounting plates 184 and 186, which are configured to contact the first carrier 112 and the second carrier 120, respectively, and are secured thereto by fasteners (e.g., bolts).

[0029] like Figure 6 As shown, the first and second rotary couplings 168 and 170 may include interdigitated portions at the ends of the elongated member 162, the first attachment member 164, and the second attachment member 166. In this example, the first attachment member 164 includes an arcuate first portion 190 configured to be disposed in a first groove defined between arcuate second and third portions 192 at a first end of the elongated member 162, such that holes therethrough are axially aligned. Similarly, the second attachment member 166 includes an arcuate fourth portion 194 configured to be disposed in a second groove defined between arcuate fifth and sixth portions 196 at a second end of the elongated member 162, such that holes therethrough are axially aligned. The first end of the elongated member 162 is releasably connected at a first rotatable engagement 168 to a first attachment member 164 via a first pin 172, which is disposed within its bore, and the second end of the elongated member 162 is releasably connected at a second rotatable engagement 170 to a second attachment member 166 via a second pin 174, which is disposed within its bore. In some examples, the first pin 172 and the second pin 174 may comprise or be formed of various materials, such as various metals, polymers, and composite materials, such as steel or aluminum.

[0030] Each of the first attachment member 164, the second attachment member 166, and the elongated member 162 has a rigid body / structure configured to reduce or prevent collisions between the first vehicle 112 and the second vehicle 120 during towing. Additionally, the elongated member 162 includes a first pair of anti-oversteering members 176 and 178 adjacent to its first end and a second pair of anti-oversteering members 180 and 182 adjacent to its second end. The anti-oversteering members 176, 178, 180, and 182 project outwardly from the sides of the elongated member 162 and are configured to function as physical barriers to limit pivoting between the first and second attachment members 164 and 166 and the elongated member 162, thereby limiting the angle between them during pivoting of the first and second rotary couplings 168. By limiting the angle between the first and second attachment members 164 and 166 and the elongated member 162, the possibility of collisions between the first vehicle 112 and the second vehicle 120 during towing is further reduced or prevented. In some embodiments, the angle between the first and second attachment members 164 and 166 and the elongated member 162 may be limited to 90 degrees or less, such as 80 degrees or less, such as 70 degrees or less, such as 60 degrees or less, such as 50 degrees or less, such as 45 degrees or less, such as 45 to 90 degrees. In some embodiments, for example, an angle greater than 90 degrees may allow contact between the first vehicle 112 and the second vehicle 120 during towing of the first vehicle 112.

[0031] The first attachment member 164, the second attachment member 166, and the elongated member 162 may include various structural configurations. In some examples, the first attachment member 164, the second attachment member 166, and the elongated member 162 have a body / structure formed by stacked layers. For example, Figure 7 and Figure 8 The diagram includes a cross-sectional view showing a non-limiting example of a first attachment member 164 and an elongated member 162 having a laminated structure. Figure 7 The first attachment member 164 is shown to include an outer layer defined by opposing first and third members 187 and 189, and an inner layer defined by a second member 188. In this example, the second member 188 has a longer longitudinal dimension than the first and third members 187 and 189 to provide an arcuate first portion 190 at its distal end. In various examples, the first, second, and third members 187, 188, and 189 of the first attachment member 164 may have the same or different cross-sectional thicknesses and may have various longitudinal lengths. Although not shown, the second attachment member 166 may have a similar cross-sectional thickness to the first attachment member 164. Figure 7 The first attachment member 164 is an example of a similar structure. Figure 8The elongated member 162 is shown to include an outer layer defined by opposing first and third members 197 and 199, and an inner layer defined by a second member 198. In this example, the first and third members 197 and 199 have a longer longitudinal dimension than the second member 198 to provide arcuate second and third portions 192 at their first distal ends and arcuate fifth and sixth portions 196 at their second distal ends. In various examples, the first, second, and third members 197, 198, and 199 of the elongated member 162 may have the same or different cross-sectional thicknesses and various longitudinal lengths.

[0032] refer to Figure 9 An exemplary method 200 for restoring a damaged vehicle on a suspended track is illustrated. In some embodiments, method 200 can be used to recover from... Figure 1 The suspension track 110 of the semiconductor wafer transport system 100 restores the damaged vehicle. Method 200 can begin from 210.

[0033] At 212, method 200 includes advancing a first vehicle (e.g., first vehicle 112) along a suspended track configured at a higher position within the facility. In some embodiments, the first vehicle may be advanced by an onboard motor according to pre-programmed instructions or instructions received wirelessly from a remote system.

[0034] At 214, method 200 includes determining that the first vehicle is damaged and unable to travel along the suspension track. In some embodiments, the determination of damage to the first vehicle may be based on feedback received from the first vehicle, such as calculation errors or sensor signals (e.g., motion sensors, position sensors, etc.). In some embodiments, the determination of damage to the first vehicle may be based on feedback from systems separate from the first vehicle (e.g., cameras, motion detectors, etc.). In some embodiments, the determination of damage to the first vehicle may be determined by personnel at the facility, for example, through visual confirmation.

[0035] At 216, method 200 includes replacing the first wheel assembly of a first vehicle, located on a suspension track, with an emergency wheel assembly (e.g., emergency wheel assembly 130). The emergency wheel assembly includes wheels configured to rotate freely on the axle of the first vehicle. In some embodiments, the replacement of the wheel assembly is performed by facility personnel at a higher position. In some embodiments, the first vehicle includes more than one first wheel assembly, and method 200 includes replacing each first wheel assembly with a corresponding emergency wheel assembly. In some embodiments, the emergency wheel assembly is provided by modifying the first wheel assembly. For example, the first wheel assembly may be removed, or the first wheel assembly may be modified such that its wheels can rotate freely on its axle. For example, the first wheel assembly may be modified to include one or more bearings.

[0036] At 218, method 200 includes coupling a first vehicle to a second vehicle using a coupling device (e.g., coupling device 160). In some embodiments, coupling the first vehicle to the second vehicle may include releasably coupling a first end of an elongated member of the coupling device to a first attachment member of the first vehicle and defining a first swivel engagement with a first pin, and releasably coupling a second end of the elongated member of the coupling device, disposed opposite to the first end, to a second attachment member of the second vehicle and defining a second swivel engagement with a second pin. In some embodiments, method 200 may include pushing the second vehicle along a suspension track to proximity to the first vehicle prior to coupling the first vehicle to the second vehicle using the coupling device.

[0037] At 220, method 200 includes advancing a second vehicle along a suspension track while connecting a first vehicle to the second vehicle via a coupling device, thereby traction of the first vehicle along the suspension track. In some embodiments, the second vehicle may be advanced by an onboard motor according to pre-programmed instructions or instructions received from a remote system. In some embodiments, method 200 may include rotating a wheel about an axle of the first vehicle via bearings of an emergency wheel assembly while the second vehicle is tractioning the first vehicle.

[0038] In some embodiments, method 200 may include advancing a second vehicle about a curve in a suspended track, with the first vehicle coupled to the second vehicle. In some embodiments, movement about the curve in the suspended track causes pivoting of a first rotary engagement of the coupling. In some embodiments, movement about the curve in the suspended track causes pivoting of a second rotary engagement of the coupling.

[0039] In some embodiments, the coupling device includes a first rotary engagement member connected to first and second members of the coupling device. In such embodiments, method 200 may include limiting the pivoting of the first rotary engagement member with an anti-oversteering member of the coupling device, thereby limiting the angle between the first and second members during the pivoting of the first rotary engagement member.

[0040] In some embodiments, the facility is a semiconductor manufacturing facility and method 200 may include advancing a first vehicle along a suspension track while carrying a semiconductor wafer therein.

[0041] Method 200 can end with 222.

[0042] Therefore, this disclosure provides methods and systems for recovering damaged vehicles that have failed on suspended tracks, which can significantly reduce the risk of injury to facility personnel and reduce facility operating costs.

[0043] According to one embodiment, a semiconductor wafer transport system is provided, comprising a suspension track disposed at a higher position within a semiconductor manufacturing facility, a first carrier configured to travel along the suspension track while carrying a semiconductor wafer, and an emergency wheel assembly configured to replace a first wheel assembly on the first carrier while the first carrier remains on the suspension track, the emergency wheel assembly including a wheel configured to rotate freely on an axle of the first carrier.

[0044] In some embodiments, the semiconductor wafer transport system further includes a second carrier configured to travel along a suspension track; a coupling device configured to physically and releasably connect the first carrier to the second carrier and maintain therebetween as the second carrier pulls the first carrier along the suspension track; and a controller configured to operate the second carrier to move along the suspension track while being coupled to the first carrier by the coupling device, thereby pulling the first carrier. In some embodiments, the coupling device includes a first attachment member configured to be fixed to the first carrier; a second attachment member configured to be fixed to the second carrier; and at least two rotary joints configured between the first and second attachment members, each rotary joint being pivotally configured relative to either the first or second attachment member. In some embodiments, the coupling device includes an elongated member configured to be coupled at a first end to the first attachment member to define at least two rotary joints, and at a second end configured opposite to the first end to the second attachment member to define at least two rotary joints. In some embodiments, a first end of the elongated member is releasably connected at a first swivel joint to a first attachment member via a first pin, and a second end of the elongated member is releasably connected at a second swivel joint to a second attachment member via a second pin. In some embodiments, the coupling device includes first and second members, a swivel joint connecting to the first and second members, and an anti-oversteering member configured to limit pivoting of the swivel joint when the first vehicle is towed by a second vehicle, thereby limiting the angle between the first and second members. In some embodiments, the emergency wheel assembly includes a bearing configured to provide free rotation of the wheel about an axle.

[0045] According to another embodiment, a method is provided that includes advancing a first vehicle on a first wheel assembly along a suspended track at an elevated position within a semiconductor manufacturing facility, wherein the first vehicle carries a semiconductor wafer therein; determining that the first vehicle is damaged and unable to travel along the suspended track; replacing the first wheel assembly with an emergency wheel assembly while the first vehicle is located on the suspended track; wherein the emergency wheel assembly includes a wheel configured to rotate freely on an axle of the first vehicle and the first vehicle moving along the suspended track on the emergency wheel assembly.

[0046] In some embodiments, the method further includes coupling a first vehicle to a second vehicle using a coupling device; and remotely operating the second vehicle to push the second vehicle along a suspension track while the first vehicle is coupled to the second vehicle via the coupling device, thereby traction of the first vehicle along the suspension track on an emergency wheel assembly. In some embodiments, the method further includes advancing the second vehicle about a curve in the suspension track while coupling the first vehicle to the second vehicle, wherein movement about the curve in the suspension track causes a first rotary engagement of the coupling device to pivot. In some embodiments, movement about the curve in the suspension track causes a second rotary engagement of the coupling device to pivot. In some embodiments, the first rotary engagement engages first and second members of the coupling device, and the method includes limiting the pivoting of an anti-oversteering member of the coupling device about the first rotary engagement while traction of the first vehicle with the second vehicle, thereby limiting the angle between the first and second members. In some embodiments, the coupling device connecting a first vehicle to a second vehicle includes: releasably connecting a first end of an elongated member of the coupling device to a first attachment member of the first vehicle via a first pin to define a first rotatable engagement; and releasably connecting a second end of the elongated member of the coupling device, which is disposed opposite to the first end, to a second attachment member of the second vehicle via a second pin to define a second rotatable engagement. In some embodiments, the method further includes pushing the second vehicle along a suspension track to proximity to the first vehicle before connecting the first vehicle to the second vehicle using the coupling device.

[0047] According to another embodiment, a method is provided that includes advancing a first vehicle on a first wheel assembly along a suspended track at an elevated position within a semiconductor manufacturing facility, wherein the first vehicle is configured to carry a semiconductor wafer therein; determining that the first vehicle is damaged and unable to travel along the suspended track; connecting the first vehicle to a second vehicle using a coupling device; and remotely operating the second vehicle to advance the second vehicle along the suspended track, while the first vehicle is connected to the second vehicle via the coupling device, thereby traction of the first vehicle along the suspended track.

[0048] In some embodiments, the method further includes replacing the first wheel assembly with an emergency wheel assembly when the first vehicle is on the suspension track, wherein the emergency wheel assembly includes a wheel configured to rotate freely on an axle of the first vehicle. In some embodiments, the method further includes advancing the second vehicle about a curve in the suspension track while coupling the first vehicle to the second vehicle, wherein movement about the curve in the suspension track causes a first rotary engagement of the coupling to pivot. In some embodiments, movement about the curve in the suspension track causes a second rotary engagement of the coupling to pivot. In some embodiments, the first rotary engagement is coupled to first and second members of the coupling, and the method includes limiting the pivoting of an anti-oversteering member of the coupling about the first rotary engagement while the first vehicle is towed by the second vehicle, thereby limiting the angle between the first and second members. In some embodiments, connecting a first vehicle to a second vehicle with a coupling device includes: releasably coupling a first end of an elongated member of the coupling device to a first attachment member of the first vehicle via a first pin to define a first rotatable engagement; and releasably coupling a second end of the elongated member of the coupling device, which is disposed opposite to the first end, to a second attachment member of the second vehicle via a second pin to define a second rotatable engagement.

[0049] The foregoing outlines features of several embodiments to enable those skilled in the art to better understand the nature of this disclosure. Those skilled in the art should understand that they can readily use this disclosure as a basis for designing or modifying other processes and structures to achieve the same purposes and / or advantages as the embodiments described herein. Those skilled in the art should also recognize that such equivalent constructions do not depart from the spirit and scope of this disclosure, and that they can make various changes, substitutions, and modifications without departing from the spirit and scope of this disclosure.

Claims

1. A semiconductor wafer transport system, characterized in that, include: Suspended tracks are positioned at a high location within the semiconductor manufacturing facility; The first vehicle is configured to travel along the suspended track while carrying semiconductor wafers; as well as An emergency wheel assembly is configured to replace a first wheel assembly on the first vehicle, while the first vehicle remains on the suspension track, the emergency wheel assembly including a wheel configured to rotate freely on an axle of the first vehicle.

2. The semiconductor wafer transport system as described in claim 1, characterized in that, Including: A second vehicle is configured to travel along the suspended track; A coupling device configured to physically and releasably couple the first vehicle to the second vehicle and maintain the coupling therebetween as the second vehicle pulls the first vehicle along the suspension track; and The controller is configured to operate the second vehicle to move along the suspension track while simultaneously connecting it to the first vehicle via the coupling device, thereby towing the first vehicle.

3. The semiconductor wafer transport system as described in claim 2, characterized in that, The connecting device includes: The first attachment member is configured to be fixed to the first vehicle; A second attachment member, configured to be fixed to the second carrier; and At least two swivel joints are disposed between the first attachment member and the second attachment member, each swivel joint being configured to pivot relative to the first attachment member or the second attachment member.

4. The semiconductor wafer transport system as described in claim 3, characterized in that, The connecting device includes an elongated member configured to connect at its first end to the first attachment member to define a first rotary joint of the at least two rotary joints, and at its second end, configured opposite the first end, to the second attachment member to define a second rotary joint of the at least two rotary joints.

5. The semiconductor wafer transport system as described in claim 4, characterized in that, The first end of the elongated member is releasably connected to the first attachment member at the first swivel joint via a first pin, and the second end of the elongated member is releasably connected to the second attachment member at the second swivel joint via a second pin.

6. The semiconductor wafer transport system as described in claim 2, characterized in that, The coupling device includes first and second components, a swivel joint connected to the first and second components, and an anti-oversteering member configured to limit the pivoting of the swivel joint when the second vehicle tows the first vehicle, thereby limiting the angle between the first and second components.

7. The semiconductor wafer transport system as described in claim 6, characterized in that, The anti-oversteering member protrudes outward from the side of the elongated member of the coupling device.

8. The semiconductor wafer transport system as described in claim 1, characterized in that, The emergency wheel assembly includes a bearing configured to allow the wheel to rotate freely about the axis.

9. The semiconductor wafer transport system as described in claim 8, characterized in that, The emergency wheel assembly further includes a spacer configured to be disposed between a pair of the bearings.

10. The semiconductor wafer transport system as claimed in claim 1, characterized in that, The emergency wheel assembly includes a pivot portion that is fixed or fastened to the wheel.

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