Semiconductor packaging material receiving support

Abstract

The utility model belongs to the technical field of semiconductor production, and particularly relates to a semiconductor packaging material receiving support which comprises a fixed seat and further comprises a movable platform which is movably arranged at the top of the fixed seat; the horizontal driving mechanism is connected to the moving platform in a drivable manner and is used for driving the moving platform to move horizontally; a fixing frame; a material receiving table; a longitudinal adjustment mechanism; the longitudinal power mechanism is connected to the second threaded lead screw in a drivable mode and used for driving the second threaded lead screw to rotate. According to the utility model, the material receiving table is stably supported through the fixing frame, and the height and the horizontal position of the material receiving table can be adjusted through the cooperation of the horizontal driving mechanism, the longitudinal adjusting mechanism and the longitudinal power mechanism, so that the material receiving table can meet different semiconductor devices and reliably correspond to a feeding station and a packaging station; and the processing efficiency is improved.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor manufacturing technology, and specifically relates to a semiconductor packaging material receiving bracket. Background Technology

[0002] Semiconductor packaging material carriers are auxiliary equipment in the semiconductor packaging process. Their main function is to support and fix semiconductor packaging materials, such as chips, packaging substrates, and lead frames, to ensure that these materials can be accurately positioned in each packaging process (such as die bonding, wire bonding, potting, etc.), providing a stable working foundation for subsequent packaging operations.

[0003] In the prior art, semiconductor packaging receiving brackets are usually used in conjunction with a loading device to receive semiconductor devices delivered from the loading device.

[0004] However, in actual use, it was found that the position of the semiconductor packaging mounting bracket needs to be adjusted frequently based on different processing requirements to ensure that the mounting bracket can meet different semiconductor devices and reliably correspond to the loading station and packaging station, resulting in low efficiency.

[0005] To address the aforementioned problems, this utility model proposes a semiconductor packaging mounting bracket. Utility Model Content

[0006] To address the aforementioned problems in the existing technology, this utility model provides a semiconductor packaging mounting bracket, which is convenient to use and easy to adjust.

[0007] To achieve the above objectives, this utility model provides the following technical solution: a semiconductor packaging receiving bracket, including a fixing base, and further comprising:

[0008] A mobile platform, which is movably mounted on top of the fixed base;

[0009] A horizontal drive mechanism is drivably connected to the mobile platform for driving the mobile platform to move horizontally.

[0010] A mounting bracket is fixed to the top of the mobile platform;

[0011] A receiving platform, which is movably connected to the fixed frame;

[0012] A longitudinal adjustment mechanism includes a mounting plate, a second movable block fixed to the back of the mounting plate, and a second threaded screw. The receiving platform is fixedly connected to the front of the mounting plate, and the second threaded screw passes through the second movable block and is connected to the second movable block by means of thread engagement.

[0013] A longitudinal power mechanism is drivably connected to the second threaded screw and is used to drive the second threaded screw to rotate.

[0014] As a preferred embodiment of this utility model, the horizontal driving mechanism includes:

[0015] The first moving block is fixed to the bottom surface of the moving platform;

[0016] A first threaded screw, which passes through the first moving block and is connected to the first moving block by means of thread engagement;

[0017] A first drive motor is fixed on the fixed base and is used to drive the first threaded screw to rotate.

[0018] As a preferred embodiment of this utility model, the horizontal drive mechanism further includes:

[0019] The first guide rail, two of which are symmetrically fixed to the top surface of the fixed base;

[0020] The first guide slider is fixed to the bottom surface of the moving platform and slides in cooperation with the first guide rail.

[0021] As a preferred embodiment of this utility model, the longitudinal adjustment mechanism further includes:

[0022] The second guide rail is symmetrically fixed to the outer wall of the fixing frame;

[0023] The second guide slider is fixed to the back of the mounting plate and slides in cooperation with the second guide rail.

[0024] As a preferred embodiment of this utility model, the longitudinal power mechanism includes:

[0025] A support plate is fixed to the top of the fixing frame, and a second threaded screw is rotatably installed between the fixing seat and the support plate, with the top of the second threaded screw penetrating the support plate.

[0026] Driven synchronous pulley, the driven synchronous pulley is fixed to the top of the No. 2 threaded screw;

[0027] An active synchronizing pulley is rotatably mounted on the top of the support plate;

[0028] A synchronous belt, wherein the driven synchronous pulley and the driving synchronous pulley are connected by a synchronous belt drive;

[0029] The second drive motor is fixed to the bottom surface of the support plate and is used to drive the active synchronous wheel to rotate.

[0030] As a preferred embodiment of this utility model, the fixing frame is symmetrically distributed in two sets, and the receiving platform is installed between the two sets of fixing frames.

[0031] As a preferred technical solution of this utility model, the longitudinal adjustment mechanism and the longitudinal power mechanism are symmetrically distributed in two sets, which are used to synchronously drive the receiving platform to rise and fall from both ends.

[0032] As a preferred technical solution of this utility model, it also includes:

[0033] Two slotted photoelectric sensors are fixed at intervals to the outer wall of the mounting frame;

[0034] The sensing element is fixed to the outer wall of the receiving platform and cooperates with the slot-shaped photoelectric sensor.

[0035] Compared with the prior art, the beneficial effects of this utility model are:

[0036] In this invention, the receiving platform is stably supported by a fixed frame, and the height and horizontal position of the receiving platform can be adjusted by the cooperation of a horizontal drive mechanism, a vertical adjustment mechanism and a vertical power mechanism, ensuring that the receiving platform can meet different semiconductor devices and reliably correspond to the loading station and the packaging station, thereby improving processing efficiency.

[0037] Other additional advantages and beneficial effects of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this invention. Attached Figure Description

[0038] The accompanying drawings are provided to further illustrate the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention, but do not constitute a limitation thereof. In the drawings:

[0039] Figure 1 This is a schematic diagram of the structure of this utility model;

[0040] Figure 2 This utility model Figure 1 A schematic diagram of the enlarged longitudinal adjustment mechanism in the middle;

[0041] Figure 3 This utility model Figure 1 A schematic diagram of the enlarged longitudinal power mechanism in the diagram;

[0042] Figure 4 This utility model Figure 1 A magnified structural diagram at point A in the diagram.

[0043] In the diagram: 1. Fixed base; 2. Moving platform; 3. Horizontal drive mechanism; 31. Moving block No. 1; 32. Lead screw No. 1; 33. Drive motor No. 1; 34. Guide rail No. 1; 35. Guide slider No. 1; 4. Fixed frame; 5. Receiving platform; 6. Longitudinal adjustment mechanism; 61. Mounting plate; 62. Moving block No. 2; 63. Lead screw No. 2; 64. Guide rail No. 2; 65. Guide slider No. 2; 7. Longitudinal power mechanism; 71. Support plate; 72. Driven synchronous pulley; 73. Driven synchronous pulley; 74. Synchronous belt; 75. Drive motor No. 2; 8. Slotted photoelectric sensor; 9. Sensing plate. Detailed Implementation

[0044] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0045] Please see Figures 1-4 The present invention provides the following technical solution: a semiconductor packaging receiving bracket, including a fixed base 1, and further including: a moving platform 2, a horizontal driving mechanism 3, a fixed frame 4, a receiving table 5, a longitudinal adjustment mechanism 6, and a longitudinal power mechanism 7.

[0046] Furthermore, by Figure 1 and Figure 2As shown, in this embodiment, the mobile platform 2 is movably mounted on the top of the fixed base 1. The horizontal drive mechanism 3 is movably connected to the mobile platform 2 for driving the mobile platform 2 to move horizontally. The fixed frame 4 is fixed to the top of the mobile platform 2. The receiving platform 5 is movably connected to the fixed frame 4. The longitudinal adjustment mechanism 6 includes a mounting plate 61, a second moving block 62 fixed to the back of the mounting plate 61, and a second threaded screw 63. The receiving platform 5 is fixedly connected to the front of the mounting plate 61. The second threaded screw 63 passes through the second moving block 62 and is connected to the second moving block 62 by threaded engagement. The longitudinal power mechanism 7 is movably connected to the second threaded screw 63 for driving the second threaded screw 63 to rotate. After the above solution is implemented, during use, the device mounting base 1 is fixed to the packaging platform of the semiconductor packaging equipment with bolts. The horizontal drive mechanism 3 drives the moving platform 2 to move horizontally, so that the receiving platform 5 moves back and forth between the loading station and the packaging station. The receiving platform 5 is used to receive semiconductor devices transported from the loading device and, together with the horizontal drive mechanism 3, transports the semiconductor devices to the packaging station for packaging, thereby improving processing efficiency. In addition, when necessary, the longitudinal power mechanism 7 can be activated to drive the second threaded screw 63 to rotate, so that the second moving block 62 drives the receiving platform 5 to rise and fall under the threaded rotation action, thereby adjusting the height of the receiving platform 5 to ensure that the receiving platform 5 can meet different semiconductor devices and reliably correspond to the loading station and the packaging station.

[0047] It should be noted that, in actual use, a special fixture for semiconductor devices can also be fixed on the receiving platform 5 to clamp the semiconductor devices and ensure their stability.

[0048] Optionally, by Figure 1 As shown, in this embodiment, the horizontal drive mechanism 3 includes: a first moving block 31, a first threaded screw 32, and a first drive motor 33. The first moving block 31 is fixed to the bottom surface of the moving platform 2. The first threaded screw 32 passes through the first moving block 31 and is connected to the first moving block 31 by thread engagement. The first drive motor 33 is fixed on the fixed base 1 and is used to drive the first threaded screw 32 to rotate. With the above scheme, when in use, the first drive motor 33 is started to drive the first threaded screw 32 to rotate. Under the thread engagement, the first moving block 31 drives the moving platform 2 to move horizontally, so that the receiving platform 5 moves horizontally.

[0049] Preferably, by Figure 1As shown, in this embodiment, the horizontal drive mechanism 3 further includes: a first guide rail 34 and a first guide slider 35. The two first guide rails 34 are symmetrically fixed to the top surface of the fixed base 1, and the first guide slider 35 is fixed to the bottom surface of the moving platform 2 and slides in cooperation with the first guide rail 34. With the above solution, when the moving platform 2 moves, the moving platform 2 will drive the first guide slider 35 to move along the first guide rail 34, which further improves the stability of the moving platform 2.

[0050] Preferably, by Figure 1 and Figure 2 As shown in this embodiment, the longitudinal adjustment mechanism 6 further includes a second guide rail 64 and a second guide slider 65. The two second guide rails 64 are symmetrically fixed to the outer wall of the fixing frame 4, and the second guide slider 65 is fixed to the back of the mounting plate 61 and slides in cooperation with the second guide rail 64. With the above solution, when the mounting plate 61 moves during use, the mounting plate 61 will drive the second guide slider 65 to move along the second guide rail 64, which further improves the stability of the mounting plate 61.

[0051] Optionally, by Figures 1-3 As shown, in this embodiment, the longitudinal power mechanism 7 includes: a support plate 71, a driven synchronous pulley 72, a driving synchronous pulley 73, a synchronous belt 74, and a second drive motor 75. The support plate 71 is fixed to the top of the fixed frame 4. The second threaded screw 63 is rotatably installed between the fixed base 1 and the support plate 71, and the top of the second threaded screw 63 passes through the support plate 71. The driven synchronous pulley 72 is fixed to the top of the second threaded screw 63. The driving synchronous pulley 73 is rotatably installed on the top of the support plate 71. The driven synchronous pulley 72 and the driving synchronous pulley 73 are connected by the synchronous belt 74. The second drive motor 75 is fixed to the bottom surface of the support plate 71 and is used to drive the driving synchronous pulley 73 to rotate. With the above scheme, when in use, the second drive motor 75 is started to drive the driving synchronous pulley 73 to rotate. The driving synchronous pulley 73 drives the driven synchronous pulley 72 to rotate through the synchronous belt 74. The driven synchronous pulley 72 drives the second threaded screw 63 to rotate.

[0052] Preferably, by Figure 1 As shown, in this embodiment, there are two sets of fixed frames 4 symmetrically distributed, and the receiving platform 5 is installed between the two sets of fixed frames 4, which further improves the stability of the installation of the receiving platform 5.

[0053] Preferably, by Figure 1 As shown in this embodiment, the longitudinal adjustment mechanism 6 and the longitudinal power mechanism 7 are symmetrically distributed in two sets, which are used to synchronously drive the receiving platform 5 to rise and fall from both ends to ensure the stability of the receiving platform 5 when it rises and falls.

[0054] Preferably, by Figure 1 and Figure 4As shown, this embodiment also includes: a slotted photoelectric sensor 8 and a sensing plate 9. The two slotted photoelectric sensors 8 are fixed at intervals on the outer wall of the fixing frame 4. The sensing plate 9 is fixed on the outer wall of the receiving platform 5 and cooperates with the slotted photoelectric sensors 8. With the above solution, when the receiving platform 5 is raised and lowered, it will drive the sensing plate 9 to move. When the sensing plate 9 moves into the slotted photoelectric sensor 8, the second drive motor 75 stops, ensuring that the receiving platform 5 stays in a precise position, improving the reliability of the packaging operation, and effectively preventing the receiving platform 5 from being damaged by collision with other accessories during the raising and lowering process, thus improving the safety of the receiving platform 5.

[0055] It should be noted that the No. 1 drive motor 33, the No. 2 drive motor 75, and the slotted photoelectric sensor 8 are all commercially available conventional equipment. Those skilled in the art can make conventional selections according to their needs. Their working principles are common knowledge known to those skilled in the art and have been fully disclosed in the prior art, so they will not be elaborated on further in this article.

[0056] The circuit connection involved in this utility model is a common method used by those skilled in the art, and technical inspiration can be obtained through a limited number of experiments. It belongs to the widely used prior art.

[0057] Components not described in detail in this article are existing technologies.

[0058] The working principle and usage process of this utility model: When using the semiconductor packaging receiving bracket of this utility model, the device fixing base 1 is fixed to the packaging platform of the semiconductor packaging equipment with bolts, and the moving platform 2 is driven to move horizontally by the horizontal drive mechanism 3, so that the receiving table 5 moves back and forth between the loading station and the packaging station.

[0059] The receiving station 5 is used to receive semiconductor devices from the feeding device and, together with the horizontal drive mechanism 3, transports the semiconductor devices to the packaging station for packaging, thereby improving processing efficiency.

[0060] In addition, when necessary, the longitudinal power mechanism 7 can be activated to drive the second threaded screw 63 to rotate, so that the second moving block 62 can drive the receiving platform 5 to rise and fall under the threaded rotation action, adjust the height of the receiving platform 5, and ensure that the receiving platform 5 can meet different semiconductor devices and reliably correspond to the loading station and the packaging station.

[0061] Finally, it should be noted that the above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A semiconductor packaging mounting bracket, comprising a mounting base (1), characterized in that, Also includes: A mobile platform (2) is movably mounted on top of the fixed base (1); A horizontal drive mechanism (3) is drivably connected to the mobile platform (2) and is used to drive the mobile platform (2) to move horizontally; A fixing frame (4) is fixed to the top of the mobile platform (2); The receiving platform (5) is movably connected to the fixed frame (4). The longitudinal adjustment mechanism (6) includes a mounting plate (61), a second moving block (62) fixed to the back of the mounting plate (61), and a second threaded screw (63). The receiving platform (5) is fixedly connected to the front of the mounting plate (61). The second threaded screw (63) passes through the second moving block (62) and is connected to the second moving block (62) by thread engagement. A longitudinal power mechanism (7) is drivably connected to the second threaded screw (63) for driving the second threaded screw (63) to rotate.

2. The semiconductor packaging mounting bracket according to claim 1, characterized in that: The horizontal drive mechanism (3) includes: The first moving block (31) is fixed to the bottom surface of the moving platform (2); A first threaded screw (32) passes through the first moving block (31) and is connected to the first moving block (31) by means of thread engagement; A first drive motor (33) is fixed on the fixed base (1) and is used to drive the first threaded screw (32) to rotate.

3. The semiconductor packaging mounting bracket according to claim 1, characterized in that: The horizontal drive mechanism (3) further includes: The first guide rail (34) and the two first guide rails (34) are symmetrically fixed to the top surface of the fixed base (1); The first guide slider (35) is fixed to the bottom surface of the mobile platform (2) and slides in cooperation with the first guide rail (34).

4. A semiconductor packaging mounting bracket according to claim 1, characterized in that: The longitudinal adjustment mechanism (6) further includes: The two guide rails (64) are symmetrically fixed to the outer wall of the fixing frame (4); The second guide slider (65) is fixed to the back of the mounting plate (61) and slides in cooperation with the second guide rail (64).

5. A semiconductor packaging mounting bracket according to claim 1, characterized in that: The longitudinal power mechanism (7) includes: Support plate (71), the support plate (71) is fixed to the top of the fixed frame (4), the second threaded screw (63) is rotatably installed between the fixed seat (1) and the support plate (71), and the top of the second threaded screw (63) passes through the support plate (71). Driven synchronous pulley (72), the driven synchronous pulley (72) is fixed to the top of the second threaded screw (63); An active synchronizing wheel (73) is rotatably mounted on the top of the support plate (71); The driven synchronous pulley (72) and the driving synchronous pulley (73) are connected by a synchronous belt (74) for transmission. The second drive motor (75) is fixed to the bottom surface of the support plate (71) and is used to drive the active synchronous wheel (73) to rotate.

6. A semiconductor packaging mounting bracket according to claim 1, characterized in that: The fixing frame (4) is symmetrically distributed in two sets, and the receiving platform (5) is installed between the two sets of fixing frames (4).

7. A semiconductor packaging mounting bracket according to claim 1, characterized in that: The longitudinal adjustment mechanism (6) and the longitudinal power mechanism (7) are symmetrically distributed in two sets, which are used to synchronously drive the receiving platform (5) to rise and fall from both ends.

8. A semiconductor packaging mounting bracket according to claim 1, characterized in that: Also includes: Two slotted photoelectric sensors (8) are fixed at intervals to the outer wall of the fixing frame (4); The sensing element (9) is fixed to the outer wall of the receiving platform (5) and cooperates with the slot-shaped photoelectric sensor (8).

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