Bionic adhesion pad for grabbing semiconductor element

Abstract

The utility model discloses a bionic adhesion pad for grabbing a semiconductor element, which relates to the technical field of bionic adhesion pads and comprises a support plate, at least two adhesion components are fixedly mounted at the bottom end of the support plate, and each adhesion component comprises an adhesion sleeve, an anti-fouling coating, an external expansion circular sleeve and a high-elasticity inner support rod. The interior of each adhesion sleeve is designed to be hollow, each high-elasticity inner supporting rod is vertically installed in the adhesion sleeve, the surface of each adhesion sleeve is provided with an anti-fouling coating, so that a smooth surface can be formed, the adhesion force of stains is reduced, cleaning is easy, the tail end of each adhesion sleeve is folded inwards, the adhesion sleeves are designed to be conical integrally, and the adhesion sleeves are convenient to clean. The adhesion sleeve with the multiple protrusions can make contact with the surface of an object from different angles and positions when making contact with the object, so that the total contact area is increased, the adhesion force can be improved through the large contact area, and grabbing is firmer.

Description

TECHNICAL FIELD

[0001] The utility model relates to bionic adhesion pad technical field, especially bionic adhesion pad for semiconductor element grabbing. BACKGROUND

[0002] Bionic adhesion pad is a kind of special adhesion device inspired by the design of nature, including micro-nano structure surface, deformable material, special chemical coating etc., to increase the friction, van der waals force or other adhesion force with contact surface, in practical application, bionic adhesion pad usually needs the following technologies:

[0003] Adhesion structure, which can be made of special polymer materials or nanomaterials;

[0004] Support layer, which provides support for the adhesion layer;

[0005] Substrate, as the basic structure of the adhesion pad, connects the support layer and the external device;

[0006] The shape of bionic adhesion pad can be designed according to the shape of semiconductor element to achieve better fit, for example, for circular or square chip, the adhesion pad of corresponding shape can be designed to make the adhesion pad tightly wrap the element.

[0007] Bionic adhesion pad is made of high molecular material, and the adhesion structure is soft material, when grabbing hard semiconductor element, due to the limited strength of soft material, soft adhesion structure will deform excessively due to stress, resulting in unstable grabbing or element falling off. SUMMARY

[0008] In view of the deficiencies of the prior art, the utility model provides a bionic adhesion pad for semiconductor element grabbing, which solves the technical problem that the adhesion structure is soft material, when grabbing hard semiconductor element, due to the limited strength of soft material, soft adhesion structure will deform excessively due to stress, resulting in unstable grabbing or element falling off.

[0009] To achieve the above purpose, the utility model realizes the following technical scheme:

[0010] A bionic adhesion pad for semiconductor element grabbing, comprising a support plate, the bottom end of the support plate is fixedly installed with at least two adhesion assemblies, each adhesion assembly comprises an adhesion sleeve, an anti-fouling coating, an outwardly expanding sleeve and a high-elasticity inner support rod, the inside of each adhesion sleeve is designed as hollow, and each high-elasticity inner support rod is vertically installed in the inside of the adhesion sleeve.

[0011] Preferably, the lower half of each adhesion sleeve is designed to be inwardly folded, so that the end of the adhesion sleeve forms a conical design.

[0012] Each of the outer expansion sleeve is flat in design, and has the same outer dimension as the anti-fouling coating;

[0013] Each of the anti-fouling coating is coated on the surface of the adhesion sleeve, and contains silica nano material;

[0014] The support plate is internally fixedly provided with at least two built-in cross elastic sheets which are made of memory metal material;

[0015] The top end of the support plate is provided with two fixed clamping seats, and the inner part of each fixed clamping seat is screw-mounted with a fastening rod.

[0016] Compared with the prior art, the utility model has the advantages of the following beneficial effects:

[0017] In the utility model, the bottom end of the support plate is provided with a plurality of adhesion sleeves which are made of soft material, the high-elasticity inner supporting rods are vertically arranged in the adhesion sleeves, the high-elasticity inner supporting rods are made of memory metal material, two groups of built-in cross elastic sheets are arranged in the support plate, the adhesion sleeves and the support plate can be rigidly supported by the high-elasticity inner supporting rods and the built-in cross elastic sheets, and the gripping capacity of the semiconductor elements with different qualities can be improved.

[0018] In the utility model, the surface of the adhesion sleeve is provided with an anti-fouling coating, so that a smooth surface is formed, the adhesion of dirt is reduced, and the adhesion sleeve is easy to clean, the end of the adhesion sleeve is inwardly folded, the adhesion sleeve is conical in design, the plurality of protruding adhesion sleeves can be in contact with the surface of the object from different angles and positions when the adhesion sleeves are in contact with the object, so that the total contact area is increased, the large contact area can improve the adhesion, and the gripping is more firm. BRIEF DESCRIPTION OF DRAWINGS

[0019] The above description is only a summary of the technical scheme of the utility model, in order to more clearly understand the technical means of the utility model, and the content of the specification can be implemented, the following preferred embodiments of the utility model are described in detail in combination with the drawings.

[0020] Figure 1 It is a structure diagram of the support plate of the utility model;

[0021] Figure 2 It is a structure diagram of the built-in cross elastic sheet of the utility model;

[0022] Figure 3 It is a structure diagram of the adhesion sleeve of the utility model.

[0023] Legend: 11, support plate; 12, adhesion sleeve; 13, anti-fouling coating; 14, outwardly expanding circular sleeve; 15, high-elasticity inner supporting rod; 16, built-in cross spring. DETAILED DESCRIPTION

[0024] The embodiment of the present application provides a bionic adhesion pad for grabbing semiconductor elements, effectively solves the technical problem that the adhesion structure is a soft material, and the soft material has limited strength, and the soft adhesion structure is excessively deformed due to stress when hard semiconductor elements are grabbed, and the grabbed semiconductor elements are unstable or fall off. A plurality of adhesion sleeves are mounted at the bottom end of the support plate, the adhesion sleeves are also soft materials, the high-elasticity inner supporting rods are vertically mounted in the adhesion sleeves, the high-elasticity inner supporting rods are a kind of memory metal materials, two groups of built-in cross springs are fixedly mounted in the support plate, the high-elasticity inner supporting rods and the built-in cross springs can respectively increase the rigid support of the adhesion sleeves and the support plate, and the grabbing capacity of semiconductor elements with different masses is improved.

[0025] Embodiment: as shown in Figure 1 , Figure 2 and Figure 3 The technical scheme in the embodiment of the present application effectively solves the technical problem that the adhesion structure is a soft material, and the soft material has limited strength, and the soft adhesion structure is excessively deformed due to stress when hard semiconductor elements are grabbed, and the grabbed semiconductor elements are unstable or fall off. The general idea is as follows:

[0026] In view of the problems in the prior art, the utility model provides a bionic adhesion pad for grabbing semiconductor elements, including support plate 11, support plate 11's bottom end fixed mounting has at least two adhesion components, each adhesion component includes adhesion sleeve 12, anti-fouling coating 13, outwardly expanding circular sleeve 14, high-elasticity inner supporting rod 15, each adhesion sleeve 12's inside is hollow design, each high-elasticity inner supporting rod 15 is vertically installed in adhesion sleeve 12's inside, support plate 11's inside fixed mounting has at least two built-in cross springs 16 that cross each other, each built-in cross spring 16 is memory metal material, high-elasticity inner supporting rod 15 is vertically installed in adhesion sleeve 12's inside, high-elasticity inner supporting rod 15 is a kind of memory metal material, two groups of built-in cross springs 16 that cross fixedly are installed in support plate 11's inside, can respectively increase adhesion sleeve 12 and the rigid support of support plate 11 by high-elasticity inner supporting rod 15 and built-in cross spring 16;

[0027] The lower half of each adhesion sleeve 12 is designed to be inwardly retracted, forming a tapered design at the end of the adhesion sleeve 12. The multiple protruding adhesion sleeves 12 can contact the object surface from different angles and positions when contacting the object, thereby increasing the total contact area.

[0028] The outer dimension of each outer expansion sleeve 14 is the same as that of the anti-fouling coating 13. Each outer expansion sleeve 14 is designed to be flat. The outer expansion sleeve 14 installed at the end of the adhesive sleeve 12 further increases the contact point with the object, which helps to disperse the gripping force and reduce damage to the object caused by excessive local pressure.

[0029] Each anti-fouling coating 13 is applied to the surface of the adhesive sleeve 12. Each anti-fouling coating 13 contains silica nano material, which can form a smooth surface, reduce the adhesion of dirt, and be easy to clean.

[0030] The top end of the support plate 11 is provided with two fixed clamping seats. A fastening rod is screwed into each fixed clamping seat. By moving the support plate 11, the fixed clamping seat is connected with the mechanical arm, and the support plate 11 is installed on the end effector of the mechanical arm.

[0031] Working principle:

[0032] First, the support plate 11 is installed on the end effector of the mechanical arm, usually fixed by bolts, clamps or magnetic attraction, etc. The mechanical arm moves to the position of the semiconductor element according to the preset program or the guidance of the visual system. The support plate 11 is a soft material, which can be bent. The shape of the support plate 11 can be designed according to the shape of the semiconductor element to achieve better fitting. At the same time, the bottom end of the support plate 11 is provided with a plurality of adhesive sleeves 12, which are also soft materials. The high-elasticity inner supporting rod 15 is vertically installed in the adhesive sleeve 12. The high-elasticity inner supporting rod 15 is a memory metal material. Two groups of cross-fixed built-in cross springs 16 are installed in the support plate 11. The high-elasticity inner supporting rod 15 and the built-in cross spring 16 can respectively increase the rigid support of the adhesive sleeve 12 and the support plate 11, and improve the gripping capacity of semiconductor elements of different quality.

[0033] Secondly, the surface of the adhesive sleeve 12 is provided with an anti-fouling coating 13, which can form a smooth surface, reduce the adhesion of dirt, and be easy to clean. The end of the adhesive sleeve 12 is inwardly folded. The adhesive sleeve 12 is designed to be conical. The plurality of protruding adhesive sleeves 12 can contact the surface of the object from different angles and positions when contacting the object, thereby increasing the total contact area. The larger contact area can improve the adhesion, making the gripping more firm. The outer expansion sleeve 14 installed at the end of the adhesive sleeve 12 further increases the contact point with the object, which helps to disperse the gripping force and reduce damage to the object caused by excessive local pressure.

[0034] Finally, it should be noted that: apparently, the above embodiments are merely examples for clearly illustrating the utility model, and are not limited to the implementation. For ordinary skilled persons in the art, other different forms of changes or variations can be made on the basis of the above description. Here, it is not necessary and impossible to exhaust all the implementation. The obvious changes or variations derived therefrom are still within the protection scope of the utility model.

Claims

1. A bionic adhesive pad for gripping a semiconductor element, comprising a support plate (11), characterized in that The bottom end of the support plate (11) is fixedly provided with at least two adhesive assemblies, each of which comprises an adhesive sleeve (12), a stain-resistant coating (13), an outwardly expanding circular sleeve (14) and a high-elasticity inner supporting rod (15), the inner part of each adhesive sleeve (12) is hollow, and each high-elasticity inner supporting rod (15) is vertically arranged in the inner part of the adhesive sleeve (12).

2. The bionic adhesive pad for picking up a semiconductor element according to claim 1, wherein The lower half of each adhesive sleeve (12) is inwardly folded, so that the end of the adhesive sleeve (12) is tapered.

3. The bionic adhesive pad for picking up a semiconductor element according to claim 1, wherein The outer dimension of each outwardly expanding circular sleeve (14) is the same as that of the stain-resistant coating (13), and each outwardly expanding circular sleeve (14) is flat.

4. The bionic adhesive pad for picking up a semiconductor element according to claim 1, wherein Each stain-resistant coating (13) is coated on the surface of the adhesive sleeve (12), and each stain-resistant coating (13) contains silicon dioxide nano material.

5. The bionic adhesive pad for picking up a semiconductor element according to claim 1, wherein The inner part of the support plate (11) is fixedly provided with at least two built-in cross elastic sheets (16) which cross each other, and each built-in cross elastic sheet (16) is made of memory metal.

6. The bionic adhesive pad for picking up a semiconductor element according to claim 1, wherein The top end of the support plate (11) is provided with two fixed clamping seats, and each fixed clamping seat is internally screwed with a fastening rod.

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