Optical module and communication device

Abstract

The utility model provides an optical module and communication equipment, the optical module comprises a shell, a first circuit board and a second circuit board, and the first circuit board and the second circuit board are both arranged in the shell; the first circuit board comprises a first circuit board body and a plurality of first pins arranged on the first circuit board body, and the first pins are arranged close to the first end of the first circuit board body; the second circuit board comprises a second circuit board body and a plurality of second pins arranged at one end of the second circuit board body, and the second pins are arranged close to the third end of the second circuit board body; the shell is provided with a first electrical interface and a second electrical interface, the first circuit board and the second circuit board are stacked, the first circuit board corresponds to the first electrical interface, and the second circuit board corresponds to the second electrical interface; the first end and the third end are arranged along the first direction, and the first direction is parallel to the plugging direction of the first circuit board, so that the layout is more flexible.

Description

TECHNICAL FIELD

[0001] Embodiments of the present application relate to the field of optical communication technology, and in particular to an optical module and a communication device. BACKGROUND

[0002] At present, with the development of PON system in the field of optical access, one OLT module can adapt to three types of terminal devices. For example, a 50G three-mode optical module includes 50G PON, 10G PON and GPON three types. The module internally contains three relatively independent sets of hardware, which requires more layout space and more PINs to adapt.

[0003] However, due to the limitation of the size of the optical module, two circuit boards are usually selected, and the two circuit boards are usually arranged side by side, with the end parts flush and the same length, which is not conducive to the expansion of the space in the module and the layout is not flexible enough. CONTENT OF THE UTILITY MODEL

[0004] Embodiments of the present application provide an optical module and a communication device, which solve the problem of limited layout space of multiple-mode optical modules.

[0005] To achieve the above-mentioned purpose, embodiments of the present application adopt the following technical solutions:

[0006] In a first aspect, the present application provides an optical module, comprising: a housing, and a first circuit board and a second circuit board arranged in the housing, wherein the first circuit board is provided with a first gold finger, and the second circuit board is provided with a second gold finger, the first gold finger comprises: a plurality of first pins, the first pins are arranged close to a first end of the first circuit board; the second gold finger comprises: a plurality of second pins, the second pins are arranged close to a third end of the second circuit board; wherein the first substrate circuit board further comprises a second end opposite to the first end, and the second substrate circuit board further comprises a fourth end opposite to the third end; the third end is close to the first end, and the fourth end is close to the second end; the projection of the first gold finger on the second circuit board is arranged along a first direction, and the first direction is parallel to the insertion direction of the second circuit board. Thus, by arranging multiple circuit boards, more pins can be arranged in the circuit board without increasing the width of the circuit board, so that multiple transceiving channels can be integrated in one optical module, so that the network device can access multiple optical communication devices through one optical module, thereby increasing the number of optical communication devices that the network device can access, and improving the capacity of the optical communication network. Moreover, the first circuit board and the second circuit board are arranged in a staggered manner close to the end of the pin, that is, the first circuit board and the second circuit board are not flush close to the end of the pin, so that the layout of the first circuit board and the second circuit board is more flexible, and the length of the first circuit board and the second circuit board can be different, which is conducive to the expansion of the space in the module.

[0007] In an optional implementation, the length of the first circuit board along the first direction is greater than the length of the second circuit board along the first direction. In this way, the first circuit board is longer and has a larger size, which can increase the layout area in the optical module, and more devices can be arranged on the first circuit board, facilitating the expansion of the space in the module.

[0008] In an optional implementation, the third end is flush with the fourth end. In this way, the ends of the two circuit boards are flush, the shell is more regular in shape at this position, and the process difficulty is reduced.

[0009] In an optional implementation, the first circuit board and the second circuit board are arranged in a stack along a second direction perpendicular to the first direction. In this way, the two circuit boards are arranged in a stack, occupying less space, and facilitating the miniaturization of the optical module.

[0010] In an optional implementation, the first circuit board and the second circuit board are independently arranged. In this way, the first circuit board and the second circuit board do not need to be designed with connecting members, which can reduce the cost, and the connecting structure is not arranged, which can increase the layout area and the layout space in the optical module. In addition, the first circuit board and the second circuit board serve as two independent module systems, which can be independently used, increasing the flexibility of single-board control and facilitating the expansion of the module.

[0011] In an optional implementation, the plurality of first pins include a first control pin and a first power pin, and the plurality of second pins include a second control pin and a second power pin. The first control pin and the second control pin are used to transmit a first control signal, and the first power pin and the second power pin are used to transmit a first power signal. In this way, independent control and independent power supply of the two circuit boards can be implemented.

[0012] In an optional implementation, the first circuit board is provided with a first common power supply and a first microcontroller, and the second circuit board is provided with a second common power supply and a second microcontroller. In this way, the first common power supply is used to supply power to the chips and elements on the first circuit board, the first microcontroller is used to interact with (including receiving and controlling) the chips and elements on the first circuit board, and is used to interact with (including receiving and outputting) the first gold finger signal. The second common power supply is used to supply power to the chips and elements on the second circuit board, and the second microcontroller is used to interact with (including receiving and controlling) the chips and elements on the second circuit board, and is used to interact with (including receiving and outputting) the second gold finger signal. Independent control and independent power supply of the two circuit boards can be implemented, and on the premise of not increasing the module elements, the customer can realize mode shutdown according to the idle time, achieving the effect of green energy saving.

[0013] In an alternative implementation, the first circuit board and the second circuit board are electrically connected by a connector. In this way, by arranging the connector, the first circuit board and the second circuit board can share some components through the connector, and the occupied space can be saved, which is conducive to miniaturization of the optical module.

[0014] In an alternative implementation, the connector comprises a flexible circuit board and a circuit board connector. The circuit board can be a printed circuit board, and the flexible circuit board and the printed circuit board can be an integrated structure. The circuit board is a hard board, and the circuit board and the flexible circuit board form a rigid-flexible combined board. The flexible circuit board can also be a separate structure, and the flexible circuit board can be connected to the circuit board by welding. The connector can also be a circuit board connector, such as a board-to-board connector, which can realize the connection between the circuit boards.

[0015] In an alternative implementation, the first circuit board is provided with a first shared power supply and a first microcontroller, and the first shared power supply and the first microcontroller are electrically connected to the second circuit board through the connector. In this way, only one set of shared power supply and microcontroller needs to be arranged to realize the control and power supply of the two circuit boards, and the occupied space can be saved.

[0016] In an alternative implementation, the first circuit board and / or the second circuit board comprises a plurality of transceiving channels. In this way, a plurality of transceiving channels can be arranged on at least one circuit board.

[0017] In an alternative implementation, the first circuit board has opposite first and second surfaces, and some of the plurality of first pins are arranged on the first surface, and the remaining pins of the plurality of first pins are arranged on the second surface. In this way, the plurality of pins are distributed on different surfaces of the circuit board, so that a larger number of pins can be arranged in the circuit board without increasing the width of the circuit board, so that the plurality of transceiving channels can share one circuit board, thereby enabling the plurality of transceiving channels to be integrated in one optical module, so that the network device can access a plurality of optical communication devices through one optical module, thereby increasing the number of optical communication devices that the network device can access and improving the capacity of the optical communication network.

[0018] In a second aspect of the present application, a communication device is provided, comprising the optical module as described above. In this way, the communication device adopts the optical module as described above, which is conducive to improving the capacity of the optical communication network and realizing miniaturization design of the device. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 A structure schematic diagram of a passive optical network system provided by an embodiment of the present application is shown in the figure;

[0020] Figure 2A frame diagram of a three-mode optical module is provided for the embodiments of the present application.

[0021] Figure 3 A structural diagram of an optical module is provided for the embodiments of the present application.

[0022] Figure 4 A structural diagram of an optical module is provided for the embodiments of the present application.

[0023] Figure 5 A structural diagram of a circuit board is provided for the embodiments of the present application.

[0024] Figure 6 A channel distribution diagram of a circuit board is provided for the embodiments of the present application.

[0025] Figure 7 A channel distribution diagram of another circuit board is provided for the embodiments of the present application.

[0026] Figure 8 A channel distribution diagram of another circuit board is provided for the embodiments of the present application.

[0027] Figure 9 A module distribution diagram of a circuit board is provided for the embodiments of the present application.

[0028] Figure 10 A pin structure diagram of a circuit board is provided for the embodiments of the present application.

[0029] Figure 11 A pin structure diagram of another circuit board is provided for the embodiments of the present application.

[0030] Figure 12 A module distribution diagram of another circuit board is provided for the embodiments of the present application. DETAILED DESCRIPTION

[0031] In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the accompanying drawings.

[0032] Hereinafter, the terms "first", "second", and the like are used only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first", "second", and the like can explicitly or implicitly include one or more of the features. In the description of the present application, unless otherwise specified, the meaning of "a plurality of" is two or more.

[0033] In addition, in the present application, the orientation terms such as "upper", "lower" and the like are defined relative to the orientation in which the components are shown in the drawings, and it should be understood that these directional terms are relative concepts, which are used for relative description and clarification, and can be changed accordingly according to the change of the orientation in which the components are placed in the drawings.

[0034] Figure 1 A schematic structural diagram of a passive optical network system provided by an embodiment of the present application is shown in FIG. 1. Figure 1 The passive optical network system includes an optical line termination (OLT) 1, an optical distribution network (ODN) 2 and an optical network unit (ONU) 3, wherein the optical line termination 1 needs to use an optical module as an electro-optical or opto-electric conversion device.

[0035] The optical network unit can include a gigabit-capable passive optical network (GPON), a 10-gigabit-capable symmetric passive optical network (XGS-PON) or a 50-gigabit-capable passive optical network (50GPON), and the like.

[0036] In order to be compatible with the above-mentioned optical network unit, the optical line termination derives into a three-mode form (three generations coexist), as shown in FIG. 2. That is, one optical line termination can adapt to three kinds of optical network units. Figure 1

[0037] In some embodiments, the optical line termination includes a three-mode optical module.

[0038] Figure 2 A frame diagram of a three-mode optical module provided by an embodiment of the present application is shown in FIG. 3. Figure 2 ​As shown, the three-mode optical module includes a circuit board, and a gold finger, an optical digital signal processor oDSP (Optical Digital Signal Processing) chip, a 50GPON electric chip, a 10G-PON electric chip, a GPON electric chip and an optical transceiver assembly arranged on the circuit board. The optical transceiver assembly includes a 50GPON optical transceiver assembly, a 10G-PON optical transceiver assembly, a GPON optical transceiver assembly and a wavelength division multiplexer (WDM). The 50GPON optical transceiver assembly is electrically connected with the 50GPON electric chip. The 50GPON electric chip is connected with the gold finger through the optical digital signal processor chip. The 10G-PON optical transceiver assembly is electrically connected with the gold finger through the 10G-PON electric chip. The GPON optical transceiver assembly is electrically connected with the gold finger through the GPON electric chip.

[0039] Figure 3 A structure diagram of an optical module is provided in the present application. Figure 3 As shown, the optical module 10 includes a housing, and a first circuit board 14 and a second circuit board 15 arranged in the housing. The first circuit board 14 and the second circuit board 15 are flush.

[0040] The material of the housing includes but is not limited to metal and plastic. The housing includes a base 11 and a cover 12 which are detachably connected, and a skirt 16. The base 11 is detachably connected with the cover 12. The skirt 16 is used for electromagnetic compatibility (EMC), i.e. electromagnetic shielding. The gold finger is connected with a single-board electric interface connector. The optical interface includes an optical transceiver assembly.

[0041] The second circuit board 15 is provided with a plurality of second pins 151. The first circuit board 14 is not provided with pins. The first circuit board 14 can be connected with the second circuit board 15.

[0042] The first circuit board 14 and the second circuit board 15 are arranged side by side and have the same length. The layout is not flexible enough.

[0043] Therefore, an improved optical module 10 is provided in the present application. By adjusting the shape of the circuit board, the pins of the first circuit board 14 and the pins of the second circuit board 15 are arranged in a staggered manner. The layout area in the optical module 10 can be increased. Multiple sets of transceiver interfaces in one module can work independently through double interfaces.

[0044] Figure 4 A structure diagram of an optical module is provided in the present application. Figure 4 As shown, the optical module 10 includes a housing, a first circuit board 14 and a second circuit board 15. The first circuit board 14 and the second circuit board 15 are arranged in the housing.

[0045] The material of the housing includes but is not limited to metal and plastic. The housing includes a base 11 and a cover plate 12 which are detachably connected, and a skirt 16. The base 11 is detachably connected with the cover plate 12. An electrical interface is used to connect a single board. An optical interface is used to connect an optical waveguide (such as an optical fiber).

[0046] wherein, Figure 5 A structural schematic diagram of a circuit board is provided for an embodiment of the present application. As shown in Figure 4 、 Figure 5 The first circuit board 14 is provided with a first gold finger, which includes a plurality of first pins 141 arranged close to a first end 14a of the first circuit board 14. The first circuit board 14 further includes a second end 14b opposite the first end 14a.

[0047] The second circuit board 15 is provided with a second gold finger, which includes a second pin 151 arranged close to a third end 15a of the second circuit board 15. The second circuit board 15 further includes a fourth end 15b opposite the third end 15a.

[0048] In this way, by arranging a plurality of circuit boards, a larger number of pins can be arranged in the circuit boards without increasing the width of the circuit boards, so that a plurality of transceiving channels can be integrated in one optical module, enabling a network device to simultaneously access a plurality of optical communication devices through one optical module, thereby increasing the number of optical communication devices that can be accessed by the network device and improving the capacity of the optical communication network.

[0049] The first end 14a and the third end 15a are located on the same side of the optical module, and the first end 14a is arranged close to the third end 15a. The second end 14b and the fourth end 15b are located on the same side of the optical module, and the second end 14b is arranged close to the fourth end 15b.

[0050] The projection of the first gold finger on the second circuit board 15 is arranged along a first direction, which is parallel to the insertion direction of the second circuit board 15. The first direction is parallel to the x direction in Figure 4 .

[0051] In this way, the first circuit board and the second circuit board are arranged staggered close to the end of the pin, that is, the first circuit board and the second circuit board are not flush close to the end of the pin, making the layout of the first circuit board and the second circuit board more flexible, and enabling the first circuit board and the second circuit board to have different lengths.

[0052] The embodiments of the present application do not limit the positional relationship between the third end 15a and the fourth end 15b. In some embodiments, the third end 15a is flush with the fourth end 15b. In this way, some ends of the two circuit boards are flush, the shape of the shell is more regular at this position, and the process difficulty is reduced.

[0053] In some embodiments, the length of the first circuit board 14 along the first direction is greater than the length of the second circuit board 15 along the first direction, and the width of the first circuit board 14 is equal to the width of the second circuit board 15, for example. In this way, the size of the first circuit board 14 is larger, and more devices can be arranged on the first circuit board 14, which can increase the layout area in the optical module 10.

[0054] The embodiments of the present application do not limit the positional relationship between the first circuit board 14 and the second circuit board 15. In some embodiments, the first circuit board 14 and the second circuit board 15 are arranged in a stacked manner along a second direction, and the second direction is perpendicular to the first direction. The second direction is parallel to the z direction in the coordinate system shown in FIG. 1. Figure 4 In this way, the two circuit boards are arranged in a stacked manner, occupy less space, and are beneficial to the miniaturization of the optical module.

[0055] The embodiments of the present application do not limit the connection relationship between the first circuit board 14 and the second circuit board 15. In some embodiments, the first circuit board 14 and the second circuit board 15 are independently arranged.

[0056] In this way, the first circuit board 14 and the second circuit board 15 do not need to be designed with connecting members, which can reduce the cost. Moreover, without the connecting structure, the layout area and the layout space in the optical module 10 can be increased. In addition, the first circuit board 14 and the second circuit board 15 serve as two independent module systems, which can be independently used, increase the flexibility of single-board control, and facilitate module expansion.

[0057] In some embodiments, as shown in FIG. 1, the plurality of first pins 141 includes a first control pin 1410, and the plurality of second pins includes a second control pin (not shown in the figure). The first control pin 1410 and the second control pin are used to transmit the same signal, for example, a first control signal. Figure 10 In some embodiments, the plurality of first pins 141 further includes a first power pin, and the plurality of second pins includes a second power pin. The first power pin and the second power pin are used to transmit the same signal, for example, a first power signal. In this way, the first circuit board 14 and the second circuit board 15 respectively have some pins transmitting the same signal, so that the transceiver channels on the two circuit boards can be independently controlled, and the electrical connection between the two circuit boards is not needed to transmit the control signal, which can realize independent control and independent power supply of the two circuit boards.

[0058] In some embodiments, as Figure 9 shown, Figure 9 A schematic diagram of a module distribution of a circuit board is provided in embodiments of the present application. The first circuit board 14 is provided with a first common power supply and a first microcontroller. The first common power supply is configured to supply power to chips and elements on the first circuit board 14, and the first microcontroller is configured to interact with (including receiving and controlling) the chips and elements on the first circuit board 14, and to interact with (including receiving and outputting) the first gold finger signal.

[0059] The second circuit board 15 is provided with a second common power supply and a second microcontroller, and the second common power supply is configured to supply power to chips and elements on the second circuit board 15, and the second microcontroller is configured to interact with (including receiving and controlling) the chips and elements on the second circuit board 15, and to interact with (including receiving and outputting) the second gold finger signal.

[0060] In this way, the first circuit board 14 and the second circuit board 15 can be independently controlled and independently powered, and without increasing the number of module elements, the customer can realize mode shutdown during idle time to achieve green energy-saving effect.

[0061] In some embodiments, the first circuit board 14 and the second circuit board 15 are electrically connected by a connecting member.

[0062] Embodiments of the present application do not limit the type of connecting member. In some embodiments, the connecting member includes a flexible circuit board and a circuit board connector.

[0063] The circuit board can be a printed circuit board (PCB), and the flexible circuit board and the PCB can be an integrated structure, wherein the circuit board is a hard board, and the circuit board and the flexible circuit board form a rigid-flexible combined board.

[0064] The flexible circuit board can also be a separate structure, and the flexible circuit board can be connected to the circuit board by welding.

[0065] The circuit board connector can be a board-to-board connector, which can realize the connection between the circuit boards.

[0066] In some embodiments, the first circuit board 14 and the second circuit board 15 can share some devices through the connecting member. For example, as Figure 12 shown, Figure 12Another module distribution diagram of the circuit board is provided in the embodiment of the present application. The first circuit board 14 is provided with a first common power supply and a first microcontroller, and the first common power supply and the first microcontroller are electrically connected with the second circuit board 15 through the connecting piece.

[0067] The first common power supply can supply power for the first circuit board 14 and the second circuit board 15, and the first microcontroller can collect information and control components of the first circuit board 14 and the second circuit board 15.

[0068] In this way, only one set of common power supply and microcontroller needs to be arranged, so that the control and power supply of the two circuit boards can be realized, and the occupied space can be saved.

[0069] The position of the first common power supply and the first microcontroller is not limited in the embodiment of the present application. In some embodiments, as shown in Figure 12 The length of the first circuit board 14 is greater than the length of the second circuit board 15, the first common power supply and the first microcontroller can be arranged on the first circuit board 14, the layout space of the first circuit board 14 can be fully utilized, the occupation of the internal space of the optical module 10 is reduced, and the miniaturization of the optical module 10 is facilitated.

[0070] The number of transceiving channels of the first circuit board 14 and the second circuit board 15 is not limited in the embodiment of the present application. In some embodiments, Figure 6 A channel distribution diagram of the circuit board is provided in the embodiment of the present application. Figure 7 Another channel distribution diagram of the circuit board is provided in the embodiment of the present application. Figure 8 Another channel distribution diagram of the circuit board is provided in the embodiment of the present application. As shown in Figure 6 , Figure 7 , Figure 8 The first circuit board 14 and / or the second circuit board 15 include a plurality of transceiving channels.

[0071] In some embodiments, a plurality of transceiving channels can be arranged on the first circuit board 14 and the second circuit board 15.

[0072] For example, as shown in Figure 6 The first circuit board 14 includes: a first transceiving channel…an xth transceiving channel, a total of x transceiving channels. The second circuit board 15 includes: an (x+1)th transceiving channel…a yth transceiving channel, a total of y-x transceiving channels.

[0073] In other embodiments, the length of the first circuit board 14 is greater than the length of the second circuit board 15, for example, a plurality of transceiving channels can be arranged on the first circuit board 14, and the number of transceiving channels on the second circuit board 15 is less than the number of transceiving channels on the first circuit board 14.

[0074] As shown in Figure 7 The first circuit board 14 includes a first transceiving channel and a second transceiving channel. The second circuit board 15 includes a third transceiving channel.

[0075] In some other embodiments, a plurality of transceiving channels can also be arranged on the second circuit board 15, and the number of transceiving channels on the first circuit board 14 is less than the number of transceiving channels on the second circuit board 15.

[0076] As shown in Figure 8 The first circuit board 14 includes a first transceiving channel. The second circuit board 15 includes a second transceiving channel and a third transceiving channel.

[0077] The first transceiving channel can be a 50GPON transceiving channel, the second transceiving channel can be a 10G-PON transceiving channel, and the third transceiving channel can be a GPON transceiving channel. The embodiments of the present application do not limit the type of each transceiving channel, and the first transceiving channel can also be a 10G-PON or GPON transceiving channel. The three transceiving channels can be three different transceiving channels or the same transceiving channel, which all belong to the protection scope of the present application.

[0078] Each transceiving channel includes a physical layer (PHY) chip, a voltage of photodiode (Vpd) chip, and a voltage on (Von) chip.

[0079] The optical module 10 further includes a thermoelectric cooler drive (TEC DRV) chip, a power slow start controller (slow start), an independent power supply, a micro controller unit (MCU), and the like.

[0080] The micro controller unit is used for information collection and component control. The thermoelectric cooler drive chip is used for adjusting the temperature of the device.

[0081] As shown in Figure 9 The first circuit board 14 and the second circuit board 15 are independently arranged, the first circuit board 14 is provided with a first transceiving channel, and the second circuit board 15 is provided with a second transceiving channel and a third transceiving channel.

[0082] In some embodiments, the first transceiving channel includes a first physical layer transceiving chip, a first voltage of photodiode chip, and a first voltage on chip.

[0083] The second transceiving channel comprises a second physical layer chip, a second photodiode reverse bias voltage chip and a second direct current bias control chip.

[0084] The third transceiving channel comprises a third physical layer chip, a third photodiode reverse bias voltage chip and a third direct current bias control chip.

[0085] In some embodiments, the first circuit board 14 further comprises a thermoelectric cooler driving chip, a first independent power supply, a first common power supply and a first microcontroller, wherein the thermoelectric cooler is used to adjust the temperature of the device.

[0086] The second circuit board 15 further comprises a second independent power supply, a second common power supply and a second microcontroller. The voltage of the second common power supply is the same as that of the first common power supply, that is, the second common power supply and the first common power supply can be used by the first circuit board 14 and the second circuit board 15. The voltage of the second independent power supply is different from that of the first independent power supply, and the two cannot be used together.

[0087] In other embodiments, the thermoelectric cooler driving chip and the like can also be arranged on the second circuit board 15, or the thermoelectric cooler driving chip and the direct current bias control chip can be arranged on both the first circuit board 14 and the second circuit board 15.

[0088] In other embodiments, the first circuit board 14 and the second circuit board 15 are connected, and some devices such as the microcontroller and the common power supply can be used by both.

[0089] The embodiments of the present application do not limit the type of the optical module 10. The optical module 10 comprises a small form-factor pluggable plus (SFP), a quad small form-factor pluggable (QSFP), a 10 gigabit small form factor pluggable (XFP) and a C form-factor pluggable (CFP).

[0090] The embodiments of the present application do not limit the arrangement of the first pins 141 and the second pins 151. In some embodiments, as shown in FIG. 1B, Figure 10 Figure 10 FIG. 1C shows a pin structure of a circuit board according to an embodiment of the present application. The first circuit board 14 has opposite first and second surfaces. Some of the first pins 141a are arranged on the first surface, and the rest of the first pins 141b are arranged on the second surface. ​

[0091] The second circuit board 15 has opposite third and fourth surfaces, a portion of the plurality of second pins 151 being disposed on the third surface and the remaining second pins 151 of the plurality of second pins 151 being disposed on the fourth surface.

[0092] In some embodiments, as shown in Figure 11 Figure 11 Another pin structure of a circuit board is provided in the embodiments. The first pins 141 on the first surface are arranged into multiple rows in the plugging direction of the circuit board, and the first pins 141 on the second surface are arranged into multiple rows in the plugging direction of the circuit board.

[0093] For example, as shown in Figure 11 The first pins 141 on the first surface are arranged into two rows in the plugging direction of the circuit board, and the first pins 141 on the second surface are arranged into two rows in the plugging direction of the circuit board. The number of rows of pins arranged on the first surface and the second surface is moderate, which can increase the capacity of the optical communication network while reducing the board area of the slot connector on the single board.

[0094] In some embodiments, the number of first pins 141 in each row on the first surface and the second surface is equal. That is, the number of first pins 141 in the multiple rows of first pins 141 on the first surface is equal, the number of first pins 141 in the multiple rows of first pins 141 on the second surface is equal, and the number of first pins 141 in each row on the first surface is equal to the number of first pins 141 in each row on the second surface. In this way, the first pins 141 are uniformly distributed on the first surface and the second surface, and more first pins 141 can be arranged on the circuit board without increasing the width of the circuit board, so that the circuit board can be connected to more optical transmitting and receiving components, thereby further increasing the number of optical communication devices that can be accessed by the network device and improving the capacity of the optical communication network.

[0095] In some embodiments, the second pins 151 on the third surface are arranged into multiple rows in the plugging direction of the circuit board, and the second pins 151 on the fourth surface are arranged into multiple rows in the plugging direction of the circuit board.

[0096] For example, the second pins 151 on the third surface are arranged into two rows in the plugging direction of the circuit board, and the second pins 151 on the fourth surface are arranged into two rows in the plugging direction of the circuit board.

[0097] ​The number of second pins 151 in each row on the third surface and the fourth surface is equal. That is, the number of second pins 151 in the multiple rows of second pins 151 on the third surface is equal, the number of second pins 151 in the multiple rows of second pins 151 on the fourth surface is equal, and the number of second pins 151 in each row of second pins 151 on the third surface is equal to the number of second pins 151 in each row of second pins 151 on the fourth surface. In this way, the second pins 151 are evenly distributed on the third surface and the fourth surface, and a larger number of second pins 151 can be arranged on the circuit board without increasing the width of the circuit board, so that the circuit board can be connected to a larger number of optical transmitting and receiving assemblies, thereby further increasing the number of optical communication devices that the network device can access and improving the capacity of the optical communication network.

[0098] The optical module 10 provided by the embodiment of the present application can arrange a larger number of pins in the circuit board without increasing the width of the circuit board, so that a plurality of transceiving channels can share one circuit board, thereby integrating a plurality of transceiving channels in one optical module 10, so that the network device can access a plurality of optical communication devices at the same time through one optical module 10, thereby increasing the number of optical communication devices that the network device can access and improving the capacity of the optical communication network.

[0099] The optical module 10 provided by the embodiment of the present application can arrange a larger number of pins in the circuit board without increasing the width of the circuit board, so that a plurality of transceiving channels can share one circuit board, thereby integrating a plurality of transceiving channels in one optical module 10, so that the network device can access a plurality of optical communication devices at the same time through one optical module 10, thereby increasing the number of optical communication devices that the network device can access and improving the capacity of the optical communication network. Figure 9 Figure 12 The optical module 10 provided by the embodiment of the present application can arrange a larger number of pins in the circuit board without increasing the width of the circuit board, so that a plurality of transceiving channels can share one circuit board, thereby integrating a plurality of transceiving channels in one optical module 10, so that the network device can access a plurality of optical communication devices at the same time through one optical module 10, thereby increasing the number of optical communication devices that the network device can access and improving the capacity of the optical communication network.

[0100] As shown in Figure 9 , the optical module 10 includes a first circuit board 14 and a second circuit board 15, wherein the length of the first circuit board 14 along the x direction is greater than the length of the second circuit board 15 along the x direction. The first circuit board 14 and the second circuit board 15 are independently arranged.

[0101] The first circuit board 14 includes a plurality of first pins 141, and the first pins 141 are arranged close to the first end 14a of the first circuit board 14.

[0102] The second circuit board 15 includes a plurality of second pins 151, and the second pins 151 are arranged close to the third end 15a of the second circuit board 15.

[0103] ​The first circuit board 14 includes: a first physical layer transceiver chip, a first photodiode reverse bias voltage chip, a first DC bias control chip, a thermoelectric cooler driver chip, a DC bias control chip, a first independent power supply, a first shared power supply, a first microcontroller, etc., wherein the thermoelectric cooler is used to regulate the device temperature. The first DC bias control chip is used as a DC bias controller for an electroabsorption modulated laser (EML).

[0104] The second circuit board 15 also includes: a second physical layer chip, a second DC bias control chip, a second photodiode reverse bias voltage chip, a third physical layer chip, a third DC bias control chip, a third photodiode reverse bias voltage chip, a second independent power supply, a second common power supply, a second microcontroller, etc.

[0105] In this embodiment, the first circuit board 14 and the second circuit board 15 are independently configured.

[0106] In other embodiments, such as Figure 12 As shown, the optical module 10 includes a first circuit board 14 and a second circuit board 15, wherein the length of the first circuit board 14 along the x-direction is greater than the length of the second circuit board 15 along the x-direction. The first circuit board 14 and the second circuit board 15 are connected.

[0107] The first circuit board 14 includes a plurality of first pins 141, which are disposed near the first end 14a of the first circuit board 14.

[0108] The second circuit board 15 includes a plurality of second pins 151, which are disposed near the third end 15a of the second circuit board 15.

[0109] The first circuit board 14 is provided with a first transceiver channel, and the second circuit board 15 is provided with a second transceiver channel and a third transceiver channel.

[0110] The first transceiver channel includes: a first physical layer chip and a first photodiode reverse bias voltage chip.

[0111] The first circuit board 14 also includes: TEC, Von, first independent power supply, first common power supply, first microcontroller, etc., wherein the thermoelectric cooler is used to regulate the temperature of the device.

[0112] The second transceiver channel includes: a second physical layer chip and a second photodiode reverse bias voltage chip.

[0113] The third transceiver channel includes: a third physical layer chip and a third photodiode reverse bias voltage chip.

[0114] The second circuit board 15 further comprises a second independent power supply, etc. The first circuit board 14 and the second circuit board 15 can share some devices through a connecting member. In the embodiment, the second circuit board 15 and the first circuit board 14 can share the first shared power supply and the first microcontroller.

[0115] The embodiment of the present application does not limit the connection manner of the first circuit board 14 and the second circuit board 15. The first circuit board 14 and the second circuit board 15 can be electrically connected through a connecting member. The connecting member comprises a flexible circuit board and a circuit board connector.

[0116] The first shared power supply can supply power to the first circuit board 14 and the second circuit board 15, and the first microcontroller can collect information and control components of the first circuit board 14 and the second circuit board 15.

[0117] In this way, only one set of shared power supply and microcontroller needs to be arranged, so that the control and power supply of two circuit boards can be realized, and the occupied space can be saved.

[0118] In this way, the size of the second circuit board 15 can be further reduced, and the miniaturization of the optical module can be realized. Alternatively, in the case of maintaining the size of the second circuit board 15, a larger number of transceiving channels can be arranged on the second circuit board 15, so that the number of optical communication devices that can be accessed by the network device can be further increased, and the capacity of the optical communication network can be improved.

[0119] In the embodiment, the first circuit board 14 comprises a plurality of first pins 141, and the second circuit board 15 comprises a plurality of second pins 151.

[0120] The first circuit board 14 comprises a plurality of first pins 141, and the first circuit board 14 comprises a first surface and a second surface arranged oppositely. The first pins 141 on the first surface are arranged into a plurality of rows in the plug-in direction of the circuit board, and the first pins 141 on the second surface are arranged into a plurality of rows in the plug-in direction of the circuit board. Figure 12 Only one surface of the first circuit board 14 is shown, and the arrangement manner of the first pins 141 on the other surface of the first circuit board 14 can be referred to the shown surface.

[0121] As shown in the figure, Figure 12 The first pins 141 on the first surface are arranged into two rows in the plug-in direction of the circuit board. The number of rows of pins on the first surface is moderate, which can improve the capacity of the optical communication network while reducing the board area of the slot connector on the single board.

[0122] In some embodiments, the number of first pins 141 in each row on the first surface is equal. That is, the number of first pins 141 in the multiple rows of first pins 141 on the first surface is equal. In this way, the first pins 141 are evenly distributed on the first surface, and a larger number of first pins 141 can be arranged on the circuit board without increasing the width of the circuit board, so that the circuit board can be connected to a larger number of optical transmitting and receiving assemblies, thereby further increasing the number of optical communication devices that the network device can access and improving the capacity of the optical communication network.

[0123] The second pins 151 on the second circuit board 15 can be multiple rows or a single row, which all belong to the protection scope of the present application. Among them, Figure 12 Figure 12 The second pins 151 on the second circuit board 15 can be multiple rows or a single row, which all belong to the protection scope of the present application. Among them,

[0124] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto, any change or replacement within the technical scope disclosed in the present application should be covered in the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. An optical module, characterized in that, include: The housing, the first circuit board, and the second circuit board are both disposed within the housing. The first circuit board is provided with a first gold finger, which includes a plurality of first pins. The first pins are disposed near a first end of the first circuit board. The first circuit board also includes a second end opposite to the first end. The second circuit board is provided with a second gold finger, which includes a plurality of second pins. The second pins are disposed near the third end of the second circuit board. The second circuit board also includes a fourth end opposite to the third end. The third end is close to the first end, and the fourth end is close to the second end; the projection of the first gold finger on the second circuit board and the second gold finger are arranged along the first direction, which is parallel to the insertion direction of the second circuit board.

2. The optical module according to claim 1, characterized by The length of the first circuit board along the first direction is greater than the length of the second circuit board along the first direction.

3. The optical module according to claim 1 or 2, characterized by The third end is flush with the fourth end.

4. The optical module according to claim 1 or 2, characterized by The first circuit board and the second circuit board are stacked along a second direction, which is perpendicular to the first direction.

5. The optical module according to claim 1 or 2, characterized by The first circuit board and the second circuit board are set independently.

6. The optical module according to claim 5, characterized by The plurality of first pins include a first control pin and a first power supply pin, and the plurality of second pins include a second control pin and a second power supply pin. The first control pin and the second control pin are used to transmit the same signal, and the first power supply pin and the second power supply pin are used to transmit the same signal.

7. The optical module according to claim 6, characterized by The first circuit board is provided with a first common power supply and a first microcontroller; the second circuit board is provided with a second common power supply and a second microcontroller.

8. The optical module of claim 1, wherein, The first circuit board and the second circuit board are electrically connected by a connector.

9. The optical module according to claim 8, characterized by The connectors include: a flexible circuit board and a circuit board connector.

10. The optical module according to claim 8 or 9, characterized by The first circuit board is provided with a first common power supply and a first microcontroller, and the first common power supply and the first microcontroller are electrically connected to the second circuit board through the connector.

11. The optical module according to claim 1 or 2, characterized by The first circuit board and / or the second circuit board include multiple transceiver channels.

12. The optical module according to claim 1 or 2, characterized by The first circuit board has a first surface and a second surface opposite to each other, a portion of the plurality of first pins are disposed on the first surface, and the remaining pins of the plurality of first pins are disposed on the second surface.

13. A communication device, characterized by Includes the optical module as described in any one of claims 1-12.

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