Substrate and PCBA board
By designing a substrate with a three-segment solder pad structure, the problems of mismatched solder pad sizes and uneven solder quantity were solved, thereby improving the welding quality and ensuring the compatibility and welding reliability of components of different specifications.
Patent Information
- Application Number
- CN202520122275.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-17
- Publication Date
- 2026-02-13
- Estimated Expiration
- 2035-01-17
AI Technical Summary
In existing technologies, mismatched PCB pad sizes and uneven solder quantity lead to poor soldering quality, especially when compatible with components of different specifications, which can easily result in defects such as component misalignment, difficulty in controlling solder height, and open or false solder joints.
Design a substrate with a pad section consisting of three segments: a first pad segment, a second pad segment, and a third pad segment. These segments are combined to form a structure that can accommodate components of different specifications, ensuring consistent solder height and uniform distribution. A solder resist layer is used to separate the pad segments to prevent the solder from interfering with each other.
It improves welding quality, reduces the risk of defects such as component misalignment, difficulty in controlling solder height, and open or false soldering, and meets process requirements.
Smart Images
Figure CN223912646U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The application relates to the technical field of semiconductor devices, in particular to a substrate and a PCBA board. BACKGROUND
[0002] PCBA (Printed Circuit Board Assembly) is the entire process of a PCB bare board after SMT (Surface Mount Technology) or DIP (Dual In-line Package) plug-in. Generally, the PCB is provided with pads for mounting components, and the electronic components are mounted on the PCB through the pads, thereby forming the PCBA. In recent years, surface mounting technology has gradually developed into one of the mainstream electronic assembly technologies due to its advantage of not needing to drill lead holes on the PCB. When assembling components using this technology, the surface-mounted components are directly soldered to the pads on the PCB, and the components and the PCB are mechanically and electrically connected through the solder.
[0003] Different specifications of components often need to be compatible on the same PCB. Therefore, the pads on the PCB need to be enlarged, so that components of large size and components of small size can be compatible and mounted on the pads.
[0004] However, the solder between the PCB and the components should be uniform, highly consistent, and the height should not be too high, so as to ensure the reliability of the welding, so as to be able to resist the stress caused by the mismatch of the thermal expansion coefficients between the PCB and the components. Therefore, when mounting components of small size, the components may be pulled off due to the excessive size of the pads and the excessive amount of solder, the height of the solder is difficult to control, and defects such as air welding or false welding may occur, resulting in that the welding quality cannot meet the process requirements. Utility model content
[0005] Therefore, it is necessary to provide a substrate and a PCBA board which can avoid excessive size of pads and excessive amount of solder under the premise of being able to compatible mount components of different specifications, and thus ensure better welding quality.
[0006] A substrate, the same side surface of the substrate has a plurality of pad portions, each of the pad portions is arranged at intervals around a preset center area, and each of the pad portions comprises a first pad segment, a second pad segment and a third pad segment in sequence from one end close to the preset center area to one end away from the preset center area.
[0007] The first pad segment and the second pad segment of each of the pad portions are used for adapting to weld a first adapter, and the second pad segment and the third pad segment of each of the pad portions are used for adapting to weld a second adapter.
[0008] In some embodiments, in each of the pad portions, the area of the first pad segment is equal to the area of the third pad segment.
[0009] In some embodiments, in each of the pad portions, the first pad segment, the second pad segment and the third pad segment are arranged in a first direction, a second direction perpendicular to the first direction and parallel to a side surface of the substrate having the pad portion, the length dimension of the first pad segment and the third pad segment in the first direction is equal, and the width dimension of the first pad segment and the third pad segment in the second direction is equal.
[0010] In some embodiments, in each of the pad portions, the length dimension of the first pad segment, the second pad segment and the third pad segment in the first direction is L, and L satisfies: 0.150mm≤L≤0.200mm; and the width dimension of the first pad segment, the second pad segment and the third pad segment in the second direction is H, and H satisfies: 0.250mm≤H≤0.300mm.
[0011] In some embodiments, the substrate comprises a base layer, a metal layer and a solder mask layer arranged in sequence, the solder mask layer has a plurality of openings for exposing the metal layer, and each of the openings defines a region forming one of the pad portions on the metal layer.
[0012] The first pad segment and the second pad segment in each of the pad portions are separated by the solder mask layer, and the second pad segment and the third pad segment in each of the pad portions are separated by the solder mask layer.
[0013] In some embodiments, in each of the pad portions, the second pad segment comprises a first sub-pad segment and a second sub-pad segment in sequence from the end close to the first pad segment to the end close to the second pad segment.
[0014] The first pad segment and the first sub-pad segment of each of the pad portions are used for adapting to solder a first adapter, and the second sub-pad segment and the third pad segment of each of the pad portions are used for adapting to solder a second adapter.
[0015] In some embodiments, in each of the pad portions, the area of the first pad segment is equal to the sum of the area of the first sub-pad segment and the area of the second sub-pad segment.
[0016] In some embodiments, the substrate comprises a base layer, a metal layer and a solder mask layer arranged in sequence, the solder mask layer has a plurality of openings for exposing the metal layer, and each of the openings defines a region forming one of the pad portions.
[0017] The first pad segment and the first sub-pad segment in each of the pad sections are separated by the solder resist layer, the first sub-pad segment and the second sub-pad segment in each of the pad sections are separated by the group solder layer, and the second sub-pad segment and the third pad segment in each of the pad sections are separated by the solder resist layer.
[0018] A PCBA board, characterized in that the PCBA board comprises a PCB board and a packaged device, the PCB board is the substrate as described in any one of the above embodiments, and the packaged device is the first adapter or the second adapter; or
[0019] The PCBA board comprises a packaged device and a PCB board, the packaged device comprises a packaged substrate and components disposed on the packaged substrate, the packaged substrate is the substrate as described in any one of the above embodiments, and the PCB board is the first adapter A1 or the second adapter A2.
[0020] The above substrate and PCBA board, since each pad section on the substrate is arranged at intervals around a preset central region, and each pad section is sequentially divided into three sections from one end close to the preset central region to one end away from the preset central region, i.e., a first pad section, a second pad section, and a third pad section. Therefore, the first pad section and the second pad section of each pad section combine to form a first composite pad with a smaller size to adapt to a first adapter with a smaller welding size; the second pad section and the third pad section of each pad section combine to form a second composite pad with a larger size to adapt to a second adapter with a larger welding size, so that the first adapter and the second adapter can be welded to the substrate with the same amount of solder, thereby ensuring that the solder height between the first adapter and the substrate when the first adapter is welded to the first composite pad on the substrate is consistent with the solder height between the second adapter and the substrate when the second adapter is welded to the second composite pad on the substrate, and the distribution is uniform, greatly reducing the risk of component deviation, solder height difficulty to control, empty welding or false welding due to mismatching of pad size (pad size being too large or too small) and mismatching of solder amount (solder amount being too much or too little), and greatly improving the welding quality to better meet the process requirements. BRIEF DESCRIPTION OF DRAWINGS
[0021] Figure 1 It is a front view of the substrate in an embodiment of the present application;
[0022] Figure 2 It is a cross-sectional view of the substrate and the first adapter as shown in the welding; Figure 1
[0023] Figure 3 It is a cross-sectional view of the substrate and the second adapter as shown in the welding; Figure 1
[0024] Figure 4 a front view of a substrate in another embodiment of the present application;
[0025] Figure 5 a cross-sectional view of the substrate and the first adapter shown in Figure 4
[0026] Figure 6 a cross-sectional view of the substrate and the second adapter shown in Figure 4 DETAILED DESCRIPTION
[0027] In order to make the above objectives, features and advantages of the present application more clear and comprehensible, specific embodiments of the present application will be described below in detail with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. It will be apparent, however, to one skilled in the art that the present application can be practiced without using some or all of these specific details, and the present application is not limited to the specific embodiments disclosed below.
[0028] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.
[0029] In addition, the terms "first", "second", etc. are only used for the purpose of description and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined with "first", "second" can explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "plurality" is at least two, for example, two, three, etc., unless otherwise specifically limited.
[0030] In the present application, unless specifically defined otherwise, the terms "mount", "connected", "connecting", "fixed", and "fixedly" should be understood broadly, for example, can be fixedly connected, or can be detachably connected, or integrated; can be mechanically connected, or can be electrically connected; can be directly connected, or indirectly connected via an intermediate medium; can be the internal communication of two elements or the interaction relationship between two elements, unless specifically defined otherwise. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.
[0031] In the present application, unless specifically defined otherwise, the first feature is "on" or "under" the second feature can be that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature "above", "over" and "on" the second feature can be that the first feature is directly above or obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "under" and "under" the second feature can be that the first feature is directly below or obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.
[0032] It should be noted that when an element is referred to as "fixed to" or "disposed on" another element, it can be directly on the other element or there can be a mediating element. When an element is referred to as "connected to" another element, it can be directly connected to the other element or there can be a mediating element. The terms "vertical", "horizontal", "up", "down", "left", "right", and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation.
[0033] Please refer to Figures 1 to 3 The present application provides a substrate 10 having a plurality of pad portions 11 on the same side surface of the substrate 10. The pad portions 11 are arranged at intervals around a predetermined central area C, and each pad portion 11 includes a first pad segment 111, a second pad segment 112, and a third pad segment 113 in order from an end close to the predetermined central area C to an end away from the predetermined central area C. The first pad segment 111 and the second pad segment 112 of each pad portion 11 are used to fit and solder a first fitting member A1, and the second pad segment 112 and the third pad segment 113 of each pad portion 11 are used to fit and solder a second fitting member A2.
[0034] Therefore, the first pad section 111 and the second pad section 112 of each pad portion 11 are combined to form a first composite pad with a smaller size, so as to adapt to the first adapter A1 with a smaller size; the second pad section 112 and the third pad section 113 of each pad portion 11 are combined to form a second composite pad with a larger size, so as to adapt to the second adapter A2 with a larger size. Thus, the first adapter A1 and the second adapter A2 can be welded to the substrate 10 with the same amount of solder, so as to ensure that the solder height between the first adapter A1 and the substrate 10 when the first adapter A1 is welded to the first composite pad on the substrate 10 is consistent with the solder height between the second adapter A2 and the substrate 10 when the second adapter A2 is welded to the second composite pad on the substrate 10, and the solder height is uniformly distributed. Thus, the risk of defects such as component deviation, difficult solder height control, empty welding or false welding due to mismatching of pad size (excessive or insufficient pad size) and mismatching of solder amount (excessive or insufficient solder amount) is greatly reduced, and the welding quality is greatly improved, so as to better meet the process requirements.
[0035] It should be noted that the first pad section 111 and the second pad section 112 of each pad portion 11 are combined to form a first composite pad, and the first adapter A1 has a first adapter pad matched with the first composite pad, so as to ensure that the first adapter pad of the first adapter A1 can be welded to the first composite pad formed by the first pad section 111 and the second pad section 112 of each pad portion 11 through solder. That is, when welded to the first adapter A1, solder is only needed to be coated on the first pad section 111 and the second pad section 112 of each pad portion 11, and no solder is needed to be coated on the third pad section 113.
[0036] Similarly, the second pad section 112 and the third pad section 113 of each pad portion 11 are combined to form a second composite pad, and the second adapter A2 has a second adapter pad matched with the second composite pad, so as to ensure that the second adapter pad of the second adapter A2 can be welded to the second composite pad formed by the second pad section 112 and the third pad section 113 of each pad portion 11 through solder. That is, when welded to the second adapter A2, solder is only needed to be coated on the second pad section 112 and the third pad section 113 of each pad portion 11, and no solder is needed to be coated on the first pad section 111.
[0037] It should be noted that the adapter can be used as the mounting carrier, and the substrate 10 is welded to the first adapter pad of the first adapter A1 through the first composite pad, or the substrate 10 is welded to the second adapter pad of the second adapter A2 through the second composite pad; or the substrate 10 can be used as the mounting carrier, and the first adapter A1 is welded to the first composite pad of the substrate 10 through the first adapter pad, or the second adapter A2 is welded to the second composite pad of the substrate 10 through the second adapter pad.
[0038] It should be noted that the first adapter A1 and the second adapter A2 can be the same adapter, and specifically, the part of the adapter having the first adapter pad constitutes the first adapter A1, and the part of the adapter having the second adapter pad constitutes the second adapter A2.
[0039] It should also be noted that in the present application, the composite pads of two sizes are formed by the combination of different pad segments at the same position of the substrate 10, so that the first adapter A1 and the second adapter A2 are adapted by the composite pads of the two sizes respectively, thereby improving the mounting adaptability of the substrate 10. It can be understood that different mounting positions on the mounting carrier have different stresses (there are high stress areas and low stress areas), and some components, such as MEMS inertial measurement units (IMU), MEMS accelerometers, MEMS gyroscopes and the like, are sensitive to stress, and the installation of such components at different positions of the mounting carrier has a greater impact on their performance. The substrate 10 in the present application can be mounted by the first composite pad and the second composite pad whether it is used as a mounting carrier or mounted on a mounting carrier, for example, the first adapter A1 can be replaced by the second adapter A2 at the original position of the substrate 10, avoiding the inability to be installed at the original position of the substrate 10 due to the inadaptability of the second adapter A2, and further avoiding the poor performance caused by the change of the installation position.
[0040] Alternatively, each pad portion 11 is arranged along the edge line of a square. Of course, each pad portion 11 can also be arranged along the edge line of a rectangle, a circle, or an ellipse, without limitation.
[0041] In the embodiment, the area of the first pad segment 111 is equal to the area of the third pad segment 113 in each pad portion 11. In this way, the area of the first composite pad formed by the first pad segment 111 and the second pad segment 112 of each pad portion 11 is equal to the area of the second composite pad formed by the second pad segment 112 and the third pad segment 113 of each pad portion 11, so that the amount of solder used when the first adapter A1 and the first composite pad are welded can be completely consistent with the amount of solder used when the second adapter A2 and the second composite pad are welded, thereby ensuring that the distance between the first adapter A1 and the substrate 10 (i.e., the solder height) when the first adapter A1 and the first composite pad are welded is consistent with the distance between the second adapter A2 and the substrate 10 (i.e., the solder height) when the second adapter A2 and the second composite pad are welded, further reducing the risk of defects such as component deviation, difficult-to-control solder height, and empty welding or false welding.
[0042] In the embodiment, the arrangement direction of the first pad segment 111, the second pad segment 112, and the third pad segment 113 in each pad portion 11 is the first direction X1, and the direction perpendicular to the first direction X1 and parallel to the side surface of the substrate 10 having the pad portion 11 is the second direction X2. In each pad portion 11, the length dimension of the first pad segment 111 and the third pad segment 113 in the first direction X1 is equal, and the width dimension of the first pad segment 111 and the third pad segment 113 in the second direction X2 is equal, so that the area of the first pad segment 111 is equal to the area of the third pad segment 113.
[0043] Further, in each pad portion 11, the length dimension of the first pad segment 111, the second pad segment 112, and the third pad segment 113 in the first direction X1 is equal, and the width dimension of the first pad segment 111, the second pad segment 112, and the third pad segment 113 in the second direction X2 is equal, which is conducive to batch production of the pad portion 11.
[0044] Of course, in other embodiments, the length dimension of the first pad segment 111 and the third pad segment 113 in the first direction X1 can not be equal, and the width dimension of the first pad segment 111 and the third pad segment 113 in the second direction X2 can not be equal, as long as the area of the first pad segment 111 is equal to the area of the third pad segment 113, which is not specially limited here.
[0045] It can be understood that the area of the first pad section 111 refers to the surface area of the first pad section 111 coated with solder when the first pad section 111 and the second pad section 112 of each pad portion 11 are soldered with the first adapter A1. Similarly, the area of the third pad section 113 refers to the surface area of the third pad section 113 coated with solder when the second pad section 112 and the third pad section 113 of each pad portion 11 are soldered with the second adapter A2.
[0046] It should be noted that the sizes of the first pad section 111, the second pad section 112 and the third pad section 113 are mainly related to the following factors: the minimum placement accuracy of the substrate 10 aligned with the first adapter A1 or the second adapter A2 during soldering, the opening definition accuracy of the solder mask layer 12 described below, and the dimensional tolerance of the solder mask layer 12. Based on the consideration of the above-mentioned accuracy and tolerance, in an embodiment, in each pad portion 11, the length dimension of the first pad section 111, the second pad section 112 and the third pad section 113 in the first direction X1 is L, and L satisfies: 0.150mm≤L≤0.200mm; the width dimension of the first pad section 111, the second pad section 112 and the third pad section 113 in the second direction X2 is H, and H satisfies: 0.250mm≤H≤0.300mm. In some embodiments, L=0.100mm, H=0.200mm; or, L=0.150mm, H=0.250mm; or, L=0.200mm, H=0.300mm. Preferably, L=0.150mm, H=0.250mm.
[0047] In addition, based on the consideration of the above-mentioned accuracy and tolerance, in an embodiment, in each pad portion 11, the distance between the first pad section 111 and the second pad section 112 in the first direction X1 is D1, and D1 satisfies: D1≥0.025mm; similarly, the distance between the second pad section 112 and the third pad section 113 in the first direction X1 is D2, and D2 satisfies: D2≥0.025mm.
[0048] In an embodiment of the present application, the substrate 10 comprises a base layer, a metal layer and a solder mask layer 12 which are sequentially stacked. The base layer serves to support the metal layer and the solder mask layer 12, so that the substrate 10 has a certain strength. The metal layer is generally composed of Cu, Ni, Au or other metals or alloys, and forms a circuit through patterning. The solder mask layer 12 is used to protect the surface of the metal layer. The solder mask layer 12 has a plurality of openings 121 for exposing the metal layer, and each opening 121 defines an area on the metal layer to form an above-mentioned pad portion 11. That is, each pad portion 11 is separated by the solder mask layer 12, so that the solder on one pad portion 11 does not flow to other pad portions 11 during soldering, thereby further improving the soldering quality.
[0049] Optionally, the material of the solder resist layer 12 can be solder resist ink. The solder resist ink has the characteristic of preventing solder (e.g. solder paste) from adhering, so that the solder cannot be welded with the components in the area sprayed with the solder resist ink, so that the soldering operation on the adjacent pad segments does not affect each other.
[0050] Further, the first pad segment 111 and the second pad segment 112 in each pad part 11 are separated by the solder resist layer 12, and the second pad segment 112 and the third pad segment 113 in each pad part 11 are also separated by the solder resist layer 12, so as to realize the segmentation of the pad part 11 by the solder resist layer 12.
[0051] It should be noted that the second pad segment 112 is not limited to one segment, and in other embodiments, the second pad segment 112 can also include two or more segments, so that each pad part 11 includes four or more segments. Please refer to Figures 4 to 6 As shown, specifically, in each pad part 11, the second pad segment 112 includes a first sub-pad segment 1121 and a second sub-pad segment 1122 from one end close to the first pad segment 111 to one end close to the third pad segment 113. The first pad segment 111 and the first sub-pad segment 1121 of each pad part 11 combine to form a first composite pad for adapting the soldering of the first adapter A1. The second sub-pad segment 1122 and the third pad segment 113 of each pad part 11 combine to form a second composite pad for adapting the soldering of the second adapter A2. In this way, when soldering with the first adapter A1 is needed, solder is applied on the first pad segment 111 and the first sub-pad segment 1121 of each pad part 11, and the first adapter A1 is soldered with the first composite pad formed by the first pad segment 111 and the first sub-pad segment 1121 of each pad part 11 by using the solder; when soldering with the second adapter A2 is needed, solder is applied on the second sub-pad segment 1122 and the third pad segment 113 of each pad part 11, and the second adapter A2 is soldered with the second composite pad formed by the second sub-pad segment 1122 and the third pad segment 113 of each pad part 11 by using the solder, so that the first adapter A1 and the second adapter A2 can be soldered to the substrate 10 with the same amount of solder, thereby ensuring that the solder height between the first adapter A1 and the substrate 10 when the first composite pad on the first adapter A1 and the substrate 10 is soldered is consistent with the solder height between the second adapter A2 and the substrate 10 when the second composite pad on the second adapter A2 and the substrate 10 is soldered, and the distribution is uniform, greatly reducing the risk of component deviation, difficulty in controlling solder height, empty welding or false welding due to mismatching of pad size (excessive or insufficient pad size), mismatching of solder amount (excessive or insufficient solder amount), and improving the soldering quality to better meet the process requirements.
[0052] It should be noted that in the present embodiment, the first pad segment 111 and the first sub-pad segment 1121 of each pad portion 11 jointly form a first composite pad, and the first adapter A1 has a first adapter pad matching the first composite pad, so as to ensure that the first adapter pad of the first adapter A1 can be soldered with the first composite pad formed by the first pad segment 111 and the first sub-pad segment 1121 of each pad portion 11. That is, when soldering with the first adapter A1, solder only needs to be applied on the first pad segment 111 and the first sub-pad segment 1121 of each pad portion 11, and no solder needs to be applied on the second sub-pad segment 1122 and the third pad segment 113.
[0053] Similarly, the second sub-pad segment 1122 and the third pad segment 113 of each pad portion 11 jointly form a second composite pad, and the second adapter A2 has a second adapter pad matching the second composite pad, so as to ensure that the second adapter pad of the second adapter A2 can be soldered with the second composite pad formed by the second sub-pad segment 1122 and the third pad segment 113 of each pad portion 11. That is, when soldering with the second adapter A2, solder only needs to be applied on the second sub-pad segment 1122 and the third pad segment 113 of each pad portion 11, and no solder needs to be applied on the first pad segment 111 and the first sub-pad segment 1121.
[0054] Further, in each pad portion 11, the sum of the area of the first pad segment 111 and the area of the first sub-pad segment 1121 is equal to the sum of the area of the second sub-pad segment 1122 and the area of the third pad segment 113. In this way, the area of the first composite pad formed by the first pad segment 111 and the first sub-pad segment 1121 of each pad portion 11 is equal to the area of the second composite pad formed by the second sub-pad segment 1122 and the third pad segment 113 of each pad portion 11, so that the amount of solder used when soldering the first adapter A1 and the first composite pad can be completely consistent with the amount of solder used when soldering the second adapter A2 and the second composite pad, and further, the distance between the first adapter A1 and the substrate 10 (i.e., the solder height) when soldering the first adapter A1 and the first composite pad is consistent with the distance between the second adapter A2 and the substrate 10 (i.e., the solder height) when soldering the second adapter A2 and the second composite pad, further reducing the risk of defects such as component deviation, difficulty in controlling solder height, empty welding, or false welding.
[0055] Further, in each pad portion 11, the length dimension of the first pad segment 111 and the third pad segment 113 in the first direction X1 is equal, the width dimension of the first pad segment 111 and the third pad segment 113 in the second direction X2 is equal, the length dimension of the first sub-pad segment 1121 and the second sub-pad segment 1122 in the first direction X1 is equal, and the width dimension of the first sub-pad segment 1121 and the second sub-pad segment 1122 in the second direction X2 is equal, so that the sum of the areas of the first pad segment 111 and the first sub-pad segment 1121 is equal to the sum of the areas of the second sub-pad segment 1122 and the third pad segment 113, and further, the area of the first composite pad formed by the combination of the first pad segment 111 and the first sub-pad segment 1121 of each pad portion 11 is equal to the area of the second composite pad formed by the combination of the second sub-pad segment 1122 and the third pad segment 113 of each pad portion 11.
[0056] It can be understood that the area of the first sub-pad segment 1121 refers to the surface area of the first sub-pad segment 1121 coated with solder when the first adapter A1 is welded with the first pad segment 111 and the first sub-pad segment 1121 of each pad portion 11. Similarly, the area of the second sub-pad segment 1122 refers to the surface area of the second sub-pad segment 1122 coated with solder when the second adapter A2 is welded with the second sub-pad segment 1122 and the third pad segment 113 of each pad portion 11.
[0057] Further, the first sub-pad segment 1121 and the second sub-pad segment 1122 in each pad portion 11 are separated by the solder mask layer 12, so that the segmentation of the second pad segment 112 is realized by the solder mask layer 12.
[0058] Based on the above-mentioned substrate 10, the application further provides a PCBA board. The PCBA board comprises a PCB board and a packaging device, the PCB board is the substrate 10 in any of the above-mentioned embodiments, and the packaging device is the first adapter A1 or the second adapter A2. The packaging device is welded to the first composite pad or the second composite pad on the substrate 10 through the first adapter pad or the second adapter pad of the packaging device, so as to realize the mechanical connection and electrical connection between the packaging device and the substrate 10.
[0059] Based on the above-mentioned substrate 10, the application further provides a PCBA board. The PCBA board comprises a PCB board and a packaging device, the packaging device comprises a packaging substrate and components disposed on the packaging substrate, the packaging substrate is the substrate 10 in any of the above-mentioned embodiments, and the PCB board is the first adapter A1 or the second adapter A2. The packaging device can be selectively welded to the PCB board through the first composite pad or the second composite pad on the packaging substrate, so as to realize the mechanical connection and electrical connection between the components on the packaging substrate and the PCB board.
[0060] Any combination of the technical features in the above-described embodiments can be made, and for the sake of brevity, not all possible combinations are described, however, it is to be understood that the application embraces all such possible combinations.
[0061] The above-described embodiments only express several implementation manners of the present application, and the description is relatively specific and detailed, but it should not be understood as a limitation on the patent scope of the application. It should be pointed out that for ordinary skilled persons in the art, some modifications and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the patent protection scope of the present application should be subject to the appended claims.
Claims
1. A substrate, characterized by, The same side surface of the substrate has a plurality of pad portions (11), each of the pad portions (11) is arranged at intervals around a preset center area (C), each of the pad portions (11) sequentially comprises a first pad segment (111), a second pad segment (112) and a third pad segment (113) from one end close to the preset center area (C) to one end away from the preset center area (C). The first pad segment (111) and the second pad segment (112) of each of the pad portions (11) are used for adapting to solder a first adapter (A1), and the second pad segment (112) and the third pad segment (113) of each of the pad portions (11) are used for adapting to solder a second adapter (A2).
2. The substrate of claim 1, wherein In each of the pad portions (11), the area of the first pad segment (111) is equal to the area of the third pad segment (113).
3. The substrate of claim 1, wherein In each of the pad portions (11), the arrangement direction of the first pad segment (111), the second pad segment (112) and the third pad segment (113) is a first direction (X1), a direction perpendicular to the first direction (X1) and parallel to the side surface of the substrate having the pad portions (11) is a second direction (X2), the length dimension of the first pad segment (111) and the third pad segment (113) in the first direction (X1) is equal, and the width dimension of the first pad segment (111) and the third pad segment (113) in the second direction (X2) is equal.
4. The substrate of claim 3, wherein, In each of the pad portions (11), the length dimension of the first pad segment (111), the second pad segment (112) and the third pad segment (113) in the first direction (X1) is L, and L satisfies: 0.150mm≤L≤0.200mm; and the width dimension of the first pad segment (111), the second pad segment (112) and the third pad segment (113) in the second direction (X2) is H, and H satisfies: 0.250mm≤H≤0.300mm.
5. The substrate of claim 1, wherein, The substrate comprises a base layer, a metal layer and a solder resist layer (12) which are sequentially stacked, the solder resist layer (12) has a plurality of openings (121) for exposing the metal layer, and each of the openings (121) defines an area on the metal layer to form one of the pad portions (11).
6. The substrate of claim 5, wherein, The first pad segment (111) and the second pad segment (112) in each of the pad portions (11) are separated by the solder resist layer (12), and the second pad segment (112) and the third pad segment (113) in each of the pad portions (11) are separated by the solder resist layer (12).
7. The substrate of claim 1, wherein In each of the pad portions (11), the second pad segment (112) sequentially comprises a first sub-pad segment (1121) and a second sub-pad segment (1122) from one end close to the first pad segment (111) to one end close to the second pad segment (112). The first pad segment (111) and the first sub-pad segment (1121) of each of the pad portions (11) are used for adapting soldering of a first adapter (A1), and the second sub-pad segment (1122) and the third pad segment (113) of each of the pad portions (11) are used for adapting soldering of a second adapter (A2).
8. The substrate of claim 7, wherein, In each of the pad portions (11), the sum of the area of the first pad segment (111) and the area of the first sub-pad segment (1121) is equal to the sum of the area of the second sub-pad segment (1122) and the area of the third pad segment (113).
9. The substrate of claim 7, wherein, The substrate comprises a base layer, a metal layer and a solder mask layer (12) which are sequentially stacked, the solder mask layer (12) has a plurality of openings (121) for exposing the metal layer, and each of the openings (121) defines a region on the metal layer to form a pad portion (11); The first pad segment (111) and the first sub-pad segment (1121) in each of the pad portions (11) are separated by the solder mask layer (12), the first sub-pad segment (1121) and the second sub-pad segment (1122) in each of the pad portions (11) are separated by the solder mask layer (12), and the second sub-pad segment (1122) and the third pad segment (113) in each of the pad portions (11) are separated by the solder mask layer (12).
10. A PCBA board characterized by, The PCBA board comprises a PCB board and a packaged device, the PCB board is the substrate according to any one of claims 1 to 9, and the packaged device is the first adapter (A1) or the second adapter (A2); or The PCBA board comprises a packaged device and a PCB board, the packaged device comprises a packaged substrate and components disposed on the packaged substrate, the packaged substrate is the substrate according to any one of claims 1 to 9, and the PCB board is the first adapter (A1) or the second adapter (A2). The PCBA board comprises a packaged device and a PCB board, the packaged device comprises a packaged substrate and components disposed on the packaged substrate, the packaged substrate is the substrate according to any one of claims 1 to 9, and the PCB board is the first adapter (A1) or the second adapter (A2).