Liquid-cooled uniform-temperature heat sink plate for thermal resistance test

Abstract

The utility model provides a liquid-cooled uniform-temperature heat sink plate for a thermal resistance test, which adopts an open-type liquid-cooled unit as a cold source, and a heat flow in a thermal resistance test of a heat flow method is led out of a test device through a special-shaped flow channel in the heat sink plate, so that the device reaches heat balance and a thermal resistance value is measured. The liquid-cooled uniform-temperature heat sink plate for the thermal resistance test provided by the embodiment of the utility model has the following advantages: compared with a liquid nitrogen type heat sink, the liquid-cooled heat sink plate can greatly reduce the experimental economic cost; the personnel safety risk in the experiment process can be greatly reduced; the complexity of the system can be reduced to a certain extent, and the operation difficulty is reduced; as the liquid-cooled heat sink plate adopts the quick-connection water-cooling plug, a laboratory general high-power liquid-cooled unit can be used as a cold source, the universality of equipment can be improved, and the cost can be reduced; the liquid-cooled heat sink plate adopts an external liquid-cooled unit for heat dissipation, and the unit adopts efficient forced air cooling for heat dissipation, so that the upper limit of heat dissipation power is higher, and the liquid-cooled heat sink plate can cope with a large-heat-flux thermal resistance test working condition.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of heat sink plates, in particular to a liquid-cooled uniform-temperature heat sink plate for thermal resistance testing. BACKGROUND

[0002] The thermal resistance testing device is mainly used for measuring the contact thermal resistance of the contact surface of a test body or the thermal resistance of the body of the test body, calculating the temperature field gradient by measuring the temperature of different sections of the test body, solving the contact surface temperature difference and heat flow, and obtaining the contact thermal resistance value at the contact surface through the temperature field Fourier law.

[0003] In recent years, the heat power of electronic equipment has increased year by year, and higher requirements are put forward for the heat dissipation capacity of the equipment system. In the heat flow channel, the contact thermal resistance is the main thermal resistance term, and accurate measurement of the contact thermal resistance value can effectively guide the thermal design work. In the heat flow method thermal resistance testing device, the heat sink end is an indispensable system node, and the stable and efficient design performance can effectively ensure the measurement accuracy of the testing system. In the traditional laboratory thermal resistance test, liquid nitrogen is generally used as the heat sink end of the testing system. The continuous gasification of liquid nitrogen absorbs heat, so that the heat source end and the heat sink end generate a sufficient temperature difference to generate a heat flow, and a certain temperature difference is generated at the contact surface of the test body to provide measurement parameters for thermal resistance calculation.

[0004] However, there are the following problems: ① The heat sink of the traditional laboratory thermal resistance testing system is in the form of liquid nitrogen. During storage and measurement, the gasification rate of liquid nitrogen is extremely high at normal temperature and pressure, and it needs to be stored and used in a pressure container, which has a high management cost. The high preparation cost of liquid nitrogen leads to high procurement and purchase, which is not conducive to the cost control of the laboratory environment; ② Because the temperature of liquid nitrogen is extremely low (-196℃), in the testing system using liquid nitrogen as the heat sink end, a secondary heat source needs to be additionally installed near the heat sink end to prevent the temperature at the contact surface of the test body from being too low to cause an increase in measurement error. The secondary heating device needs to input a certain power, which will increase the input power load and the system complexity; ③ The liquid nitrogen cold source will continue to evaporate during the experiment, and an additional auxiliary system such as a pipeline and a valve body needs to be set up for exhaust. Because the temperature of the evaporated nitrogen gas is low, there is a risk of frostbite and suffocation, and a certain safety zone needs to be set up at the exhaust point, which occupies more site resources.

[0005] Therefore, how to provide a liquid-cooled heat sink plate to guide the heat flow in the heat flow method thermal resistance testing out of the testing device, so that the device reaches thermal equilibrium and measures the thermal resistance value, has become a technical problem to be solved at present. CONTENT OF THE INVENTION

[0006] The embodiment of the present application provides a liquid-cooled uniform-temperature heat sink plate for thermal resistance testing, which is used to solve the problem of how to guide the heat flow in the heat flow method thermal resistance testing out of the testing device, so that the device reaches thermal equilibrium and measures the thermal resistance value.

[0007] In a first aspect of the embodiments of the present application, a liquid-cooled uniform-temperature heat sink plate for thermal resistance testing is provided, comprising:

[0008] The heat sink plate adopts a general-purpose liquid cooling machine as a cold source, and is connected with the general-purpose liquid cooling machine through a liquid cooling socket of the heat sink plate.

[0009] The flow channel of the heat sink plate is a reciprocating flow channel.

[0010] In an optional embodiment, the reciprocating flow channel is a special-shaped internal flow channel formed by vacuum brazing technology, which is used to improve the uniformity of the heat sink plate.

[0011] In an optional embodiment, the reciprocating flow channel includes three reciprocating circulation structures, and a contact surface of a test body is located at a circulation center region of the reciprocating flow channel.

[0012] In an optional embodiment, the heat sink plate is a base of a thermal resistance testing system, and a liquid inlet and a liquid return are further arranged on the heat sink plate in a diametrical direction.

[0013] The present application provides a liquid-cooled uniform-temperature heat sink plate for thermal resistance testing, which adopts an open liquid cooling unit as a cold source, and through a special-shaped flow channel in the heat sink plate, the heat flow in the heat flow method thermal resistance testing is discharged from the testing device, so that the device reaches thermal equilibrium and the thermal resistance value is measured.

[0014] The liquid-cooled uniform-temperature heat sink plate for thermal resistance testing provided by the embodiments of the present application has the following advantages: compared with a liquid nitrogen heat sink, the liquid-cooled heat sink plate can greatly reduce the experimental economic cost; can greatly reduce the personnel safety risk in the experimental process; can reduce the complexity of the system to a certain extent and reduce the operation difficulty; since the liquid-cooled heat sink plate adopts a quick water-cooling plug, a general-purpose high-power liquid cooling unit in a laboratory can be used as a cold source, which can improve the equipment versatility and reduce the cost; since the liquid-cooled heat sink plate adopts an external liquid cooling unit for heat dissipation, the unit adopts high-efficiency forced air cooling for heat dissipation, and the upper limit of the heat dissipation power is higher, which can cope with the large heat flow density thermal resistance testing working condition.

[0015] The above description is only a summary of the technical solutions of the present application. In order to more clearly understand the technical means of the present application, the content of the specification can be implemented, and in order to make the above and other purposes, characteristics and advantages of the present application more obvious and easy to understand, the following specific embodiments of the present application are described. BRIEF DESCRIPTION OF DRAWINGS

[0016] Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the detailed description of the preferred embodiments below. The accompanying drawings are included to provide a better understanding of the preferred embodiments, and are not intended to limit the scope of the application. Moreover, in the drawings, like reference numerals refer to similar components, and:

[0017] Figure 1 A structural schematic diagram of a liquid-cooled uniform heat sink plate for thermal resistance testing provided by an embodiment of the present application;

[0018] Figure 2 A reciprocating flow channel structural schematic diagram of a liquid-cooled uniform heat sink plate for thermal resistance testing provided by an embodiment of the present application;

[0019] Figure 3 A reciprocating flow channel size schematic diagram of a liquid-cooled uniform heat sink plate for thermal resistance testing provided by an embodiment of the present application. DETAILED DESCRIPTION

[0020] Exemplary embodiments of the present disclosure will be described in detail with reference to the drawings. Although exemplary embodiments of the present disclosure are shown in the drawings, it is understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments set forth herein. Rather, these embodiments are provided so that the present disclosure can be more thoroughly understood and the scope of the present disclosure can be accurately conveyed to those skilled in the art.

[0021] The current method for measuring thermal resistance is usually the heat flow method for measuring thermal resistance, which requires a heat sink device at the end of the heat flow to serve as the terminal of the heat flow channel. Liquid nitrogen type cold source (low temperature interface) and oil-cooled constant temperature pool (high temperature interface) are commonly used in the design of the heat sink device.

[0022] To solve the above problems, the present application provides a liquid-cooled heat sink plate, which uses an open liquid-cooled unit as a cold source and uses a special-shaped flow channel in the heat sink plate to guide the heat flow in the heat flow method for thermal resistance testing out of the testing device, so that the device reaches thermal equilibrium and the thermal resistance value is measured.

[0023] The acceleration scheme provided by the present application has the following advantages compared with the traditional method:

[0024] ① Traditional laboratory thermal resistance test system heat sink is in the form of liquid nitrogen, during storage and measurement, due to the high evaporation rate of liquid nitrogen at room temperature and normal pressure, it needs to be stored and used in a pressure container, which has high management cost. Due to the high preparation cost of liquid nitrogen, the procurement cost is high, which is not conducive to the cost control of the laboratory environment. Compared with the cost problem of liquid nitrogen cold source, the liquid cooled heat sink plate uses an open liquid cooling unit as a cold source, and the internal circulation uses pure water as a cold mass. During storage, it does not need additional maintenance, and it can be powered during operation. Compared with the liquid nitrogen heat sink, the liquid cooled heat sink plate form has lower cost during storage and use.

[0025] ② Due to the extremely low temperature of liquid nitrogen (-196℃), in the test system with liquid nitrogen as the heat sink end, a secondary heat source needs to be additionally installed near the heat sink end to prevent the temperature of the test body contact surface from being too low to cause measurement error. The secondary heating device needs to input a certain power, which will increase the input power load and system complexity. The liquid cooled heat sink plate has a higher temperature (compared with liquid nitrogen), which can meet the temperature gradient requirements of the thermal resistance test system, and does not need to additionally install a secondary heating device, effectively simplifying the structure of the thermal resistance test platform system.

[0026] ③ Liquid nitrogen cold source will continue to evaporate during the experiment, and additional auxiliary systems such as exhaust pipes and valves need to be set up. Due to the low temperature of the evaporated nitrogen gas, there is a risk of frostbite and suffocation, so a certain safety zone needs to be set up at the discharge point, occupying more space resources. The new liquid cooled heat sink plate uses a mature liquid cooling unit as a cold source, which does not need additional maintenance during shutdown, occupies less area, and only discharges hot air at the radiator during use, which has low temperature (similar to air conditioner outdoor unit) and no safety risk. Compared with the liquid nitrogen heat sink, the storage and use cost and risk are effectively reduced.

[0027] The present application optimizes the heat sink end (cold source) of the traditional experimental thermal resistance test system, optimizes the traditional liquid nitrogen heat sink end to a liquid cooled heat sink plate form, and optimizes the heat uniformity of the internal flow channel of the heat sink plate according to the temperature measurement characteristics (test block external measurement point) of the test system. Through the optimization of the flow channel, the temperature uniformity inside and outside the test body is effectively improved. This structure form effectively reduces the structural complexity, storage and use risk of the heat sink end of the thermal resistance test system, and further reduces the experimental cost. A "special-shaped flow channel" is designed, which effectively improves the temperature uniformity compared with the traditional flow channel, and ensures the accuracy of the measurement temperature of the test system.

[0028] Specifically, referring to Figure 1 , Figure 1 A structure diagram of a liquid cooled heat sink plate for thermal resistance test provided by the embodiment of the present application. As Figure 1As shown, the heat sink plate uses a general liquid cooling machine as a cold source, and the liquid cooling socket of the heat sink plate is connected with the general liquid cooling machine; the flow channel of the heat sink plate is a reciprocating flow channel. It should be noted that the heat sink plate is a water-cooled heat sink plate.

[0029] Specifically, the reciprocating flow channel is a special-shaped internal flow channel formed by vacuum brazing technology, and the uniformity of the heat sink plate can be improved by optimizing the layout of the flow channel.

[0030] More specifically, the reciprocating flow channel includes three reciprocating circulation structures, and the contact surface of the test body and the heat sink plate is located in the circulation center area of the reciprocating flow channel.

[0031] In the embodiments of the present application, the heat sink plate is the base of the thermal resistance test system, and the heat sink plate is also provided with a liquid inlet and a liquid return in the diameter direction.

[0032] In practical application, the heat sink plate as the cold end of the thermal resistance test system provides a cold source for the heat flow thermal resistance test system, and at the same time, as the structural base of the system, provides sufficient rigid support for the test body during the pressurization process of the test platform.

[0033] The embodiments of the present application combine milling, vacuum brazing and other processes to provide a heat sink plate with good uniformity, the internal flow channel of the heat sink plate is 4mm wide and 5mm high, adopts "reciprocating" circulation, and the contact surface of the test body and the heat sink plate is located in the circulation center area of the reciprocating flow channel. For specific structure, see Figure 2 and Figure 3 , Figure 2 The reciprocating flow channel structure diagram of the liquid-cooled uniform heat sink plate for thermal resistance test provided by the embodiments of the present application is shown in the figure; Figure 3 The reciprocating flow channel size diagram of the liquid-cooled uniform heat sink plate for thermal resistance test provided by the embodiments of the present application is shown in the figure.

[0034] As shown in Figure 2 and Figure 3 , the flow channel structure is processed by numerical control machine, and the internal flow channel of the heat sink plate is processed by vacuum brazing process after machining. The optimized reciprocating flow direction can effectively improve the temperature uniformity of the test body contact area.

[0035] The liquid-cooled uniform heat sink plate for thermal resistance test provided by the present application has the following advantages:

[0036] ①Cost advantage: The traditional liquid nitrogen cold source has high preparation cost of liquid nitrogen, high requirement for transportation and storage equipment, resulting in high experimental use cost; the liquid-cooled heat sink plate uses a general liquid cooling machine as a cold source, which can be repeatedly started and stopped, and has no special environmental requirements for daily standby, so the experimental use cost is low.

[0037] ②Safety advantage: first, the liquid nitrogen cold source has a very low temperature (-196℃), which has the risk of frostbite during use; the working medium in the liquid cooling heat sink plate is normal temperature pure water, and the pressure in the flow channel is low, which has no safety risk to the operator; second, during the use of the liquid nitrogen cold source, low-temperature nitrogen gas is continuously generated due to the heat absorption and gasification of liquid nitrogen, and needs to be discharged externally. In the discharge area, low-temperature nitrogen gas can cause suffocation and frostbite risk to personnel; the liquid cooling heat sink plate uses a liquid cooling unit as a cold source, and the cold source uses an open forced air cooling heat dissipation, and the exhaust hot air is not higher than 5℃ of the ambient temperature, which has no safety impact on personnel.

[0038] ③Because the temperature of the liquid nitrogen cold source is very low, during the use of the thermal resistance test system, a gas container needs to be additionally set for storage, and a secondary heating device needs to be additionally installed on the test device. The nitrogen gas after gasification needs to be discharged through an additional discharge pipeline, valve body and other devices, which increases the complexity and failure rate of the test system; the liquid cooling heat sink plate test system uses a quick-connection type liquid cooling socket to connect with a general-purpose liquid cooling unit in the laboratory, and the heat sink plate is integrally formed without the need for additional devices, which is simple in structure and high in reliability.

[0039] ④The heat uniformity of the internal flow channel of the heat sink plate is optimized, and a reciprocating flow channel is designed. Through the optimization of the flow channel, the temperature uniformity of the inside and outside of the contact surface between the test body and the heat sink plate is effectively improved, and compared with the traditional flow channel, the temperature uniformity is effectively improved, which ensures the accuracy of the measurement temperature of the test system.

[0040] In the above embodiments, the description of each embodiment has its own emphasis, and the parts not described in detail in a certain embodiment can be referred to the related description of other embodiments.

[0041] The preferred embodiments disclosed in the above description are only used to help explain the present description. The alternative embodiments do not describe all the details and limit the application to the specific embodiments described. Obviously, according to the content of the embodiments of the present description, many modifications and changes can be made. The present description selects and specifically describes these embodiments in order to better explain the principles and practical applications of the embodiments of the present description, so that those skilled in the art can well understand and use the present description. The present description is limited by the claims and their entire scope and equivalents.

Claims

1. A liquid-cooled uniform heat-sink plate for thermal resistance testing, characterized by, The application relates to a heat sink plate for a thermal resistance test system. The heat sink plate is connected with a general liquid cooling machine as a cold source through liquid cooling sockets of the heat sink plate. The flow channel of the heat sink plate is a reciprocating flow channel.

2. The liquid-cooled uniform heat-sink plate for thermal resistance test according to claim 1, characterized in that, The reciprocating flow channel is a special-shaped internal flow channel formed through vacuum brazing technology and used for improving the temperature uniformity of the heat sink plate.

3. The liquid-cooled uniform heat-sink plate for thermal resistance test according to claim 2, characterized in that, The reciprocating flow channel comprises three reciprocating circulation structures, and a contact surface of a test body is located in a circulation center area of the reciprocating flow channel.

4. The liquid-cooled uniform heat-sink plate for thermal resistance test according to claim 1, characterized in that, The heat sink plate is a base of the thermal resistance test system, and liquid inlet and liquid return openings are further arranged on the heat sink plate in a diametric direction.

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