LED device and display module

Abstract

The utility model relates to the field of LED packaging, in particular to an LED device and a display module. The LED device provided by the utility model comprises a substrate; an LED chip, wherein the LED chip is arranged on the substrate; the transparent diaphragm is arranged on the LED chip, and the transparent diaphragm is arranged on the LED chip; the light-emitting membrane is arranged on the transparent membrane, and the interval between the light-emitting membrane and the LED chip in the vertical direction ranges from 100 micrometers to 5 cm; alternatively, the present invention comprises: a substrate; an LED chip, wherein the LED chip is arranged on the substrate; the fixed support is arranged on the peripheral side of the base plate; the LED chip is arranged on the fixing support, the light-emitting membrane is arranged on the fixing support, and the interval between the light-emitting membrane and the LED chip in the vertical direction ranges from 100 micrometers to 5 cm. According to the utility model, the luminous membrane is isolated from the LED chip, so that the overall luminous efficiency of the LED device is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of LED packaging, and specifically relates to an LED device and display module. BACKGROUND

[0002] The afterglow powder is a kind of fluorescent powder with light storage capacity, and the fluorescent powder can still have the ability of emitting light when not excited, so it is also called night light powder.The LED device is a typical semiconductor device, which can only be powered in one direction to make it emit light, and the general power supply is 50Hz alternating current, so it faces the problem of producing flicker.The traditional LED flicker problem usually needs to be solved by increasing the capacitance filter or using a more complex power supply driving circuit, which will increase the cost and system complexity.The packaging design using long afterglow fluorescent powder can directly use the afterglow characteristics of the material to smooth the brightness change, reduce or avoid relying on complex circuit design, reduce cost and device complexity.Therefore, the light storage function of the afterglow powder is used to compensate for the LED flicker generated in the alternating current conversion process, which has great advantages.

[0003] Firstly, the afterglow powder is used for the packaging of LED device, which has good price advantage.In low-cost LED systems, the flicker phenomenon is particularly obvious, because these systems often use simple rectifiers and driving circuits.By adding long afterglow fluorescent powder, the light emitting performance can be significantly improved without greatly increasing the circuit complexity, so that the low-cost LED system can also provide high-quality lighting.On the other hand, because the long afterglow fluorescent powder can emit light for a long time, the light output will be more stable, reducing the phenomenon of sudden change of brightness.Compared with the brightness reduction of traditional LED at the trough of rectifier output, the afterglow performance can fill the brightness gap to produce more uniform lighting effect.

[0004] However, there is a big problem in using afterglow powder for LED packaging, that is, how to improve the light efficiency.On the one hand, the afterglow powder has relatively low photoluminescence intensity compared with the traditional LED fluorescent powder because it needs to ensure the light storage capacity.On the other hand, in the traditional LED packaging, the fluorescent powder is directly coated on the surface of the chip, which is affected by the high temperature of the chip, resulting in the decline of the light emitting efficiency of the fluorescent powder and the weakening of the afterglow performance.In addition, the fluorescent powder is close to the LED chip, and the fluorescent powder will be affected by a lot of heat when the LED works, resulting in performance decline and even accelerated material aging.In addition, the fluorescent powder close to the chip is easily affected by reflection and reabsorption of light, resulting in optical loss.

[0005] Now the method of improving light efficiency mainly has improving chip efficiency, using high efficiency semiconductor material, such as gallium nitride (GaN) and indium gallium nitride (InGaN), can improve the internal quantum efficiency of LED chip.These materials have high luminous efficiency in blue and green light band, suitable for high efficiency LED chip manufacturing.Through the introduction of microstructure (such as rough surface, Bragg mirror, microlens array, etc.) on the surface of LED chip, the total reflection of light in the chip can be reduced, and the light extraction efficiency can be increased, so as to improve the overall light efficiency.Selecting high efficiency LED drive circuit can minimize power loss and improve light efficiency.Especially selecting constant current drive circuit can ensure that the LED works under stable current and avoid efficiency loss caused by current fluctuation.The biggest problem of these methods is the increase of cost, the complexity of technology, the limitation in practical application and the like.

[0006] Therefore, how to improve the overall light efficiency of the afterglow powder packaged LED device in a low cost and simple way and with large universality, and take into account the compensation of the strobe characteristics, becomes a huge problem. Practical new type content

[0007] Therefore, the technical problem to be solved by the present application is to provide an LED device and a display module, the light-emitting film provided by the present application is packaged on the LED chip at a certain interval, and the overall light efficiency is high.

[0008] The present application provides an LED device in the first aspect, which comprises:

[0009] A substrate;

[0010] An LED chip, which is arranged on the substrate;

[0011] A transparent film, which is arranged on the LED chip;

[0012] A light-emitting film, which is arranged on the transparent film, and the vertical interval between the light-emitting film and the LED chip is 100 μm-5 cm.

[0013] The present application provides an LED device in the second aspect, which comprises:

[0014] A substrate;

[0015] An LED chip, which is arranged on the substrate;

[0016] A fixing support, which is arranged on the periphery of the substrate;

[0017] A light-emitting film sheet is arranged on the fixing support, and the spacing between the light-emitting film sheet and the vertical direction of the LED chip is 100 μm-5 cm.

[0018] In the first and second aspects of the present application, the spacing between the light-emitting film sheet and the vertical direction of the LED chip is preferably 500 μm-2 cm, more preferably 500 μm-5 mm, and more preferably 500 μm-2 mm.

[0019] In the first embodiment of the second aspect of the present application, the light-emitting film sheet is fixedly connected to the fixing support.

[0020] In the second embodiment of the second aspect of the present application, a sliding mechanism is slidingly connected to the fixing support, and the light-emitting film sheet is fixedly connected to the sliding mechanism, and the sliding mechanism is used to slide the light-emitting film sheet in the vertical direction of the fixing support.

[0021] In the third embodiment of the second aspect of the present application, a transparent platform for placing the light-emitting film sheet is arranged on the fixing support.

[0022] Specifically, the transparent platform can be fixedly connected to the fixing support.

[0023] Specifically, the transparent platform can also be slidingly connected to the fixing support.

[0024] The present application also provides a display module comprising at least one LED device according to any one of the above technical solutions.

[0025] The utility model provides a kind of LED device and display module.The utility model provides LED device including: substrate;LED chip, the LED chip is arranged on the substrate;Transparent film piece, the transparent film piece is arranged on the LED chip;Emitting film piece, the emitting film piece is arranged on the transparent film piece, and the emitting film piece and the vertical direction interval of the LED chip is 100 μm~5 cm;Or, it includes: substrate;LED chip, the LED chip is arranged on the substrate;Fixed support, the fixed support is arranged on the substrate periphery side;Emitting film piece, the emitting film piece is arranged on the fixed support, and the emitting film piece and the vertical direction interval of the LED chip is 100 μm~5 cm.The utility model encapsulates in the emitting film piece above LED chip by the way of off-core packaging with certain interval, can isolate the heat source of emitting film piece and LED chip, significantly reduce the temperature of emitting film piece, reduce the influence of temperature on the performance of emitting film piece, not only solve the problems such as high cost, complex technology, great limitation of existing packaging LED device, but also improve the overall light efficiency of LED device, and take into account the characteristics of flash compensation. BRIEF DESCRIPTION OF DRAWINGS

[0026] Figure 1 It is the schematic diagram of the LED device of the utility model;

[0027] Figure 2 It is the LED device structure diagram provided by the first aspect of the utility model;

[0028] Figure 3 It is the LED device structure diagram provided by the first embodiment of the second aspect of the utility model;

[0029] Figure 4 It is the LED device structure diagram provided by the second embodiment of the second aspect of the utility model;

[0030] Figure 5 It is the LED device structure diagram provided by the third embodiment of the second aspect of the utility model. DETAILED DESCRIPTION

[0031] The utility model discloses a kind of LED device and display module.The person skilled in the art can learn from the content of this paper, and appropriately improve process parameters to realize.It is particularly pointed out that all similar replacements and changes are obvious to the person skilled in the art, and they are regarded as including in the utility model.The method and application of the utility model have been described by preferred embodiment, and relevant personnel obviously can change or appropriately change and combine the method and application of this paper without departing from the content, spirit and scope of the utility model, to realize and apply the utility model technology.

[0032] This invention encapsulates a light-emitting film on top of an LED chip at a specific interval using a centrifugal encapsulation method. This isolates the light-emitting film from the heat source of the LED chip, significantly reducing the temperature of the film, minimizing the impact of temperature on its performance, improving luminous efficiency, and extending afterglow time. Simultaneously, fixing the film away from the LED chip helps reduce optical losses and avoids high-brightness spots directly generated by the chip. After passing through the phosphor layer away from the chip, light distribution becomes more uniform, reducing spot and color difference issues. Furthermore, since the afterglow performance of rare-earth-doped long-afterglow phosphors is closely related to temperature, using the centrifugal encapsulation structure of this invention to encapsulate the light-emitting film made with such phosphors allows for temperature control, thereby regulating the afterglow time of the LED device and better compensating for flicker caused by the periodic switching of alternating current. Figure 1 As shown, Figure 1 This is a schematic diagram of the LED device described in this utility model, where 1 is the substrate, 2 is the LED chip, and 4 is the light-emitting film. The light-emitting film needs to be fixed above the LED chip so that there is a gap between the light-emitting film and the LED chip.

[0033] In a first aspect, the present invention provides an LED device comprising:

[0034] substrate;

[0035] LED chip, wherein the LED chip is disposed on the substrate;

[0036] A transparent film is disposed on the LED chip;

[0037] A light-emitting film is disposed on the transparent film, and the vertical distance between the light-emitting film and the LED chip is 100 μm to 5 cm.

[0038] like Figure 2 As shown, Figure 2 This is a structural diagram of an LED device provided by the first aspect of the present invention, wherein 1 is a substrate, 2 is an LED chip, 3 is a transparent film, and 4 is a light-emitting film. The LED device provided by the first aspect of the present invention includes a transparent film 3 disposed on the LED chip 2 and a light-emitting film 4 disposed on the transparent film 3. The thickness of the transparent film 3 and the vertical spacing between the light-emitting film 4 and the LED chip 2 are the same, and the transparent film 3 provides a vertical spacing between the light-emitting film 4 and the LED chip 2. Specifically, the vertical spacing between the light-emitting film 4 and the LED chip 2 is 100 μm to 5 cm, preferably 500 μm to 2 cm, more preferably 500 μm to 5 mm, and even more preferably 500 μm to 2 mm.

[0039] In a second aspect, the present invention provides an LED device comprising:

[0040] substrate;

[0041] LED chip, wherein the LED chip is disposed on the substrate;

[0042] A fixing bracket is disposed on the periphery of the substrate;

[0043] A light-emitting film is disposed on the fixed bracket, and the vertical distance between the light-emitting film and the LED chip is 100 μm to 5 cm.

[0044] The LED device provided in the second aspect of this utility model includes a fixing bracket disposed on the periphery of the substrate and a light-emitting film disposed on the fixing bracket, wherein the fixing bracket provides a vertical gap between the light-emitting film and the LED chip. The vertical gap between the light-emitting film and the LED chip is 100 μm to 5 cm, preferably 500 μm to 2 cm, more preferably 500 μm to 5 mm, and even more preferably 500 μm to 2 mm.

[0045] like Figure 3 As shown, Figure 3 This is a structural diagram of an LED device provided for a first embodiment of the second aspect of the present invention, wherein 1 is a substrate, 2 is an LED chip, 4 is a light-emitting film, and 5 is a fixing bracket. In the first embodiment of the second aspect of the present invention, the light-emitting film 4 is fixedly connected to the fixing bracket 5. Specifically, the light-emitting film 4 is fixedly connected to the fixing bracket 5 at a corresponding position according to the vertical distance between the light-emitting film 4 and the LED chip 2. The present invention does not have a special limitation on the manner in which the light-emitting film 4 is fixedly connected to the fixing bracket 5; in some embodiments of the present invention, the light-emitting film 4 is fixedly connected to the fixing bracket 5 by adhesive.

[0046] like Figure 4 As shown, Figure 4The LED device structure diagram provided by the second embodiment of the second aspect of the utility model, wherein 1 is a substrate, 2 is an LED chip, 4 is a light-emitting film piece, 5 is a fixed support, and 6 is a sliding mechanism. In the second embodiment of the second aspect of the utility model, the fixed support 5 is slidably connected with the sliding mechanism 6, the light-emitting film piece 4 is fixedly connected to the sliding mechanism 6, and the sliding mechanism 6 is used to slide the light-emitting film piece 4 in the vertical direction of the fixed support 5. Specifically, the fixed support 5 is provided with the sliding mechanism 6, the sliding mechanism 6 is slidably connected to the fixed support 5, the light-emitting film piece 4 is fixedly connected to the sliding mechanism 6, the sliding mechanism 6 enables the light-emitting film piece 4 to slide in the vertical direction of the fixed support 5, so that the interval between the light-emitting film piece 4 and the LED chip in the vertical direction can be freely adjusted.

[0047] As shown in Figure 5 , Figure 5 The LED device structure diagram provided by the third embodiment of the second aspect of the utility model, wherein 1 is a substrate, 2 is an LED chip, 4 is a light-emitting film piece, 5 is a fixed support, and 7 is a transparent platform. In the third embodiment of the second aspect of the utility model, the fixed support 5 is provided with a transparent platform 7 for placing the light-emitting film piece 4. The transparent platform of the utility model is used to bear the light-emitting film piece, and it can transmit light, and the light-emitting film piece 4 is attached to the transparent platform 7. Specifically, the transparent platform 7 of the utility model can be fixedly connected to the fixed support 5, according to the interval size between the light-emitting film piece 4 and the LED chip 2 in the vertical direction, the transparent platform 7 is fixedly connected to the corresponding position of the fixed support 5. The transparent platform 7 of the utility model can also be slidably connected to the fixed support 5, and the mode of the sliding connection is not specially limited, the sliding connection can be realized by a sliding mechanism, or the sliding connection can be realized by a sliding rail, and the transparent platform 7 can slide in the vertical direction of the fixed support 5, so that the interval between the transparent platform 7 and the LED chip 2 in the vertical direction can be freely adjusted, so that the light-emitting film piece 4 arranged on the transparent platform 7 has the same interval size as the LED chip 2 in the vertical direction.

[0048] The utility model is further described in combination with the following embodiments:

[0049] Embodiment 1

[0050] SrAl2O4:Eu 2+ ,Dy 3+ residual glow powder and SrS:Eu 2+ The residual glow powder and SrS:Eu are used to prepare a light functional film piece with LED packaging glue, and the light functional film piece is used for off-core packaging. The steps are as follows: first, SrAl2O4:Eu2+ , Dy 3+ persistent powder and SrS:Eu 2+ The persistent powder was mixed uniformly at a ratio of 1:0.01; then the A component and the B component of the Renning LN-103 A / B epoxy resin were weighed at a ratio of 2:1; the mixed persistent fluorescent powder was added to the mixed LED packaging glue, and after being mixed uniformly again, it was left to stand and defoamed; the mixed LED packaging glue containing the persistent powder was coated on a flat substrate in a certain time by means of scraping to make a layer of flexible light functional film sheet added with the fluorescent powder, which was placed in an oven set at a temperature of 60°C for curing for 3 hours to form. Then, the A component and the B component of the Renning LN-103 A / B epoxy resin LED packaging glue were weighed at a ratio of 2:1, and after being mixed uniformly, they were left to stand for a period of time to defoam; the mixed epoxy LED packaging glue was poured into a mold, a layer of transparent film sheet without the addition of fluorescent powder was made, the thickness of the transparent film sheet was controlled to be 2 millimeters through the mold and the amount of glue, and it was placed in an oven set at a temperature of 70°C for curing for 5 hours to form. Finally, two layers of film sheets were obtained, one was the light functional film sheet containing the persistent fluorescent powder, and the other was the colorless transparent film sheet without the fluorescent powder; the transparent film sheet without the persistent powder was directly pasted on the LED chip, and the light functional film sheet containing the persistent powder was pasted above the transparent film sheet, so that the LED device with off-chip packaging was formed, the off-chip distance a was 2 millimeters, and the light parameters were shown in Table 1.

[0051] Example 2

[0052] using SrAl2O4:Eu 2+ , Dy 3+ persistent powder and SrS:Eu 2+ The persistent powder and the commercial fluorescent powder YAG were prepared into a light functional film sheet together with the LED packaging glue; the light functional film sheet was used for off-chip packaging. The steps were as follows: first, the SrAl2O4:Eu 2+ , Dy 3+ persistent powder, SrS:Eu 2+The afterglow powder and the commercial fluorescent powder YAG are mixed uniformly in a ratio of 1:0.01:0.03; the Dow Corning DC184 machine silicone A component and B component are weighed in a ratio of 10:1, the mixed afterglow fluorescent powder is added into the mixed LED packaging glue, and then the mixture is mixed uniformly again and left to stand for defoaming; the mixed LED packaging glue containing the afterglow powder is coated on a flat substrate in a layer of light functional film containing the fluorescent powder by means of spin coating within a certain time, and then the light functional film is placed in an oven to be cured at a temperature of 60°C for 4 hours; then, the Dow Corning DC184 machine silicone A component and B component are weighed in a ratio of 10:1, and then the mixture is mixed uniformly and left to stand for a period of time for defoaming; the mixed silicone LED packaging glue is poured into a mold in a layer of transparent film without the fluorescent powder, the thickness of the transparent film is controlled to be 1 mm by means of the mold and the amount of the glue, and then the transparent film is placed in an oven to be cured at a temperature of 70°C for 5 hours. Finally, two layers of films are obtained, one is the light functional film containing the afterglow fluorescent powder, and the other is the colorless transparent film without the fluorescent powder; the transparent film without the afterglow powder is directly pasted on the LED chip, and the light functional film containing the afterglow powder is pasted above the transparent film, so that the LED device is formed by off-chip packaging, the off-chip distance a is 1 mm, and the light parameters are shown in Table 1.

[0053] Example 3

[0054] SrAl2O4:Eu 2+ ,Dy 3+ afterglow powder, SrS:Eu 2+ The afterglow powder and the LED packaging glue are used to prepare a light functional film; the light functional film is used for off-chip packaging. The steps are as follows: first, the SrAl2O4:Eu 2+ ,Dy 3+ afterglow powder and SrS:Eu 2+The afterglow powder is mixed uniformly at a ratio of 1:0.01; the Dow Corning DC184 machine silicone A component and the B component are weighed at a ratio of 10:1, the mixed afterglow fluorescent powder is added into the mixed LED packaging glue, and then the mixture is mixed again, uniformly, and is left to stand and defoam; the mixed LED packaging glue containing the afterglow powder is coated on a flat substrate in a spin coating manner to make a light functional film containing the fluorescent powder, and is placed in an oven to be cured at a temperature of 70°C for 4 hours; then, the Dow Corning DC184 machine silicone A component and the B component are weighed at a ratio of 10:1, are mixed uniformly, and are left to stand and defoam for a period of time; the mixed silicone LED packaging glue is poured into a mold to make a transparent film without the fluorescent powder, the thickness of the transparent film is controlled to be 3 mm by the amount of the glue in the mold, and the transparent film is placed in an oven to be cured at a temperature of 70°C for 5 hours. Finally, two films are obtained, one is the light functional film containing the afterglow fluorescent powder, and the other is the colorless transparent film without the fluorescent powder; the transparent film without the afterglow powder is directly attached to the LED chip, and the light functional film containing the afterglow powder is attached above the transparent film, so that the LED device is formed, the distance a between the LED chip and the light functional film is 1 mm, and the light parameters are shown in Table 1.

[0055] Example 4

[0056] SrAl2O4:Eu 2+ ,Dy 3+ The afterglow powder and the commercial YAG yellow powder and 1113 nitride fluorescent powder are used to prepare a light functional film; the light functional film is used for off-chip packaging. The steps are as follows: first, the SrAl2O4:Eu 2+ ,Dy 3+The afterglow powder, commercial YAG yellow powder and commercial 1113 nitride fluorescent powder are mixed uniformly at a ratio of 1:0.01:0.03; the Dow Corning DC184 machine silicone A component and B component are weighed at a ratio of 10:1, the mixed afterglow fluorescent powder is added into the mixed LED packaging glue, and then the mixture is mixed uniformly again and left to stand for defoaming; a dam is made on a flat substrate, the mixed LED packaging glue containing the afterglow powder is poured into the dam within a certain time, and the dam is placed in an oven to be cured at a temperature of 60°C for 4 hours to form a film, and the thickness of the light functional film is controlled by the height of the dam. Then, the Dow Corning DC184 machine silicone A component and B component are weighed at a ratio of 10:1, and the mixture is left to stand for a period of time for defoaming, and then the mixed silicone LED packaging glue is poured into a mold, a layer of transparent film without fluorescent powder is made, the thickness of the transparent film is controlled to be 1 mm by the amount of the glue in the mold, and the mold is placed in an oven to be cured at a temperature of 70°C for 3 hours to form a film. Finally, two layers of films are obtained, one is the light functional film containing the afterglow fluorescent powder, and the other is the colorless transparent film without the afterglow fluorescent powder, the transparent film without the afterglow fluorescent powder is directly attached to the LED chip, and the light functional film containing the afterglow fluorescent powder is attached above the transparent film, and a LED device with off-chip packaging is formed, the off-chip distance a is 1 mm, and the light parameters are shown in Table 1.

[0057] Example 5

[0058] SrAl2O4:Eu 2+ ,Dy 3+ The afterglow powder and the LED packaging glue are used to prepare a light functional film, and the light functional film is used for off-chip packaging. The steps are as follows. First, the Dow Corning DC184 machine silicone A component and B component are weighed at a ratio of 10:1, SrAl2O4:Eu 2+ ,Dy 3+The afterglow powder and the LED encapsulating glue are mixed in the LED encapsulating glue in a proportion of 6:1, and after being mixed sufficiently and uniformly, the afterglow powder is left to stand and defoamed; the mixed LED encapsulating glue containing the afterglow powder is coated on a flat substrate in a certain time by a spin coating method to make a light functional film piece added with the afterglow powder, and the light functional film piece is placed in an oven to be cured at a temperature of 70°C for 4 hours to be formed; then, the Dow Corning DC184 silicone glue A component and B component are weighed in a proportion of 10:1, and after being mixed sufficiently and uniformly, the silicone LED encapsulating glue is left to stand and defoamed for a period of time, and then the mixed silicone LED encapsulating glue is poured into a mold to make a transparent film piece without adding the afterglow powder, the thickness of the transparent film piece is controlled to be 1 millimeter by the amount of the mold and the glue, and the transparent film piece is placed in an oven to be cured at a temperature of 70°C for 3 hours to be formed. Finally, two film pieces are obtained, one is the light functional film piece containing the afterglow powder and the other is the colorless transparent film piece without the afterglow powder, the transparent film piece without the afterglow powder is directly pasted on the LED chip, and the light functional film piece containing the afterglow powder is pasted above the transparent film piece, so that the LED device is formed by the off-chip packaging, the off-chip distance a is 1 millimeter, and the light parameters are shown in Table 1.

[0059] Example 6

[0060] SrAl2O4:Eu 2+ ,Dy 3+ The afterglow powder, the 1113 nitride fluorescent powder and the commercial fluorescent powder YAG are used to prepare a light functional film piece; the light functional film piece is used for off-chip packaging. The steps are as follows: first, the SrAl2O4:Eu 2+ ,Dy 3+ The afterglow powder, the 1113 nitride fluorescent powder and the commercial fluorescent powder YAG are mixed in a proportion of 1:0.03:0.01; the Dow Corning DC184 silicone glue A component and B component are weighed in a proportion of 10:1, the mixed afterglow fluorescent powder is added into the mixed LED encapsulating glue, and after being mixed sufficiently and uniformly, the afterglow powder is left to stand and defoamed; the mixed LED encapsulating glue containing the afterglow powder is coated on a flat substrate in a certain time by a spin coating method to make a light functional film piece added with the afterglow powder, and the light functional film piece is placed in an oven to be cured at a temperature of 70°C for 4 hours to be formed; the light functional film piece containing the afterglow powder is placed on a bracket designed to place the light functional film piece, so that the LED device is formed by the off-chip packaging, the off-chip distance a is 3 centimeters, and the light parameters are shown in Table 1.

[0061] Table 1

[0062]

[0063] The above merely describes a preferred embodiment of the present application, and the protection scope of the present application is not limited thereto, and any skilled person in the art, according to the technical scheme and inventive concept of the present application, can make equivalent substitutions or changes within the technical range disclosed by the present application, which should be encompassed in the protection scope of the present application.

Claims

1. An LED device, characterized by, It comprises: a substrate (1); an LED chip (2) disposed on the substrate (1); a transparent film (3) disposed on the LED chip (2); a light-emitting film (4) disposed on the transparent film (3), and the vertical distance between the light-emitting film (4) and the LED chip (2) is 100 μm-5 cm. Or, it comprises: a substrate (1); an LED chip (2) disposed on the substrate (1); a fixed support (5) disposed on the side of the substrate (1); a light-emitting film (4) disposed on the fixed support (5), and the vertical distance between the light-emitting film (4) and the LED chip (2) is 100 μm-5 cm.

2. The LED device of claim 1, wherein, The vertical distance between the light-emitting film (4) and the LED chip (2) is 500 μm-2 cm.

3. The LED device of claim 1, wherein, The vertical distance between the light-emitting film (4) and the LED chip (2) is 500 μm-5 mm.

4. The LED device of claim 1, wherein, The vertical distance between the light-emitting film (4) and the LED chip (2) is 500 μm-2 mm.

5. The LED device according to any one of claims 1 to 4, characterized in that The light-emitting film (4) is fixedly connected to the fixed support (5).

6. The LED device according to any one of claims 1 to 4, wherein A sliding mechanism (6) is slidably connected to the fixed support (5), and the light-emitting film (4) is fixedly connected to the sliding mechanism (6), and the sliding mechanism (6) is used to slide the light-emitting film (4) in the vertical direction of the fixed support (5).

7. The LED device of any one of claims 1-4, wherein, A transparent platform (7) for placing the light-emitting film (4) is arranged on the fixed support (5).

8. The LED device of claim 7, wherein, The transparent platform (7) is fixedly connected to the fixed support (5).

9. The LED device of claim 7, wherein, The transparent platform (7) is slidably connected to the fixed support (5).

10. A display module, characterized by It comprises at least one LED device according to any one of claims 1-9.

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