Etching cleaning machine

Abstract

The utility model relates to the field of photovoltaic solar substrate production, in particular to an etching cleaning machine, and aims to solve the problem that an existing etching cleaning machine is prone to liquid inlet blockage. In order to achieve the purpose, the etching cleaning machine comprises a cleaning tank and a water inlet cavity, the water inlet cavity comprises a first cavity wall, the first cavity wall is located in the cleaning tank and faces the side wall of the cleaning tank, and liquid homogenizing holes are formed in the first cavity wall. Due to the fact that the first cavity wall of the water inlet cavity is arranged in the cleaning tank and faces the side wall of the cleaning tank, the first cavity wall is perpendicular to the bottom wall of the cleaning tank, and an acute angle or an obtuse angle is formed. Therefore, when liquid medicine enters the cleaning tank through the liquid uniformizing holes to clean a substrate, any fragments or impurities generated in the cleaning process can naturally fall onto the bottom wall of the cleaning tank instead of falling onto the first cavity wall, so that the possibility of blocking the liquid uniformizing holes is reduced, the problem of blocking possibly occurring in the cleaning process is remarkably reduced, and the service life of the substrate is prolonged. And the flowing smoothness of the liquid is ensured.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of photovoltaic solar substrate production, and particularly provides an etching cleaning machine. BACKGROUND

[0002] In the process of photovoltaic cells, the etching cleaning machine (such as a chain cleaning machine) is a key device for removing the glassy substance layer containing boron, phosphorus and other elements on the back and periphery of a substrate such as a silicon wafer.

[0003] When the etching cleaning machine is working, it needs to inject a chemical solution into the cleaning tank of the etching cleaning machine to etch and clean the substrate. However, the liquid inlet of the cleaning tank of the etching cleaning machine on the market is distributed on the bottom plate of the cleaning tank. When debris is generated, the falling debris is easy to block the liquid inlet, affecting the liquid inlet efficiency and being difficult to clean. In the case of a transmission roller in the cleaning tank, since the center distance of the transmission roller is very small, the transmission roller must be removed after the cleaning tank is emptied to clean the debris, which is relatively cumbersome and time-consuming, greatly affecting the operation time of the equipment.

[0004] Correspondingly, there is a need for a new etching cleaning machine to solve the above problems. CONTENT OF THE UTILITY MODEL

[0005] The present application aims to solve the above technical problems, i.e. to solve the problem of easy liquid inlet blockage of the existing etching cleaning machine.

[0006] The present application provides an etching cleaning machine, comprising: a cleaning tank; a water inlet cavity, the water inlet cavity comprising a first cavity wall, the first cavity wall being located in the cleaning tank and facing the side wall of the cleaning tank, and the first cavity wall being provided with a liquid equalizing hole.

[0007] In the optional technical solution of the above etching cleaning machine, the liquid equalizing holes are distributed in a matrix on the first cavity wall.

[0008] In the optional technical solution of the above etching cleaning machine, the cleaning tank comprises oppositely arranged first and second side walls, and the first and second side walls are both provided with the water inlet cavity, the first cavity wall of the water inlet cavity on the first side wall facing the second side wall, and the first cavity wall of the water inlet cavity on the second side wall facing the first side wall.

[0009] In the optional technical solution of the above etching cleaning machine, the cleaning tank comprises oppositely arranged third and fourth side walls, the bottom wall of the cleaning tank is provided with a first liquid outlet, the bottom wall is downwardly inclined from the third side wall to the first liquid outlet, and the bottom wall is also downwardly inclined from the fourth side wall to the first liquid outlet.

[0010] In the optional technical scheme of the etching cleaning machine, the etching cleaning machine further comprises a first cleaning pipe and a second cleaning pipe arranged in the cleaning tank, the first cleaning pipe is arranged on one side of the bottom wall and along the length direction of the third side wall, and the second cleaning pipe is arranged on one side of the bottom wall and along the length direction of the fourth side wall, and the side wall of the first cleaning pipe and the second cleaning pipe is provided with a water outlet hole.

[0011] In the optional technical scheme of the etching cleaning machine, the outer side of the bottom wall is provided with a box body, and the box body is provided with an opening, and the opening is communicated with the first liquid outlet.

[0012] In the optional technical scheme of the etching cleaning machine, the bottom of the box body is provided with a second liquid outlet, the second liquid outlet is provided with a filtering device, the side of the box body is provided with a cleaning opening, and the cleaning opening is provided with a cover.

[0013] In the optional technical scheme of the etching cleaning machine, the side wall of the cleaning tank is provided with a mounting opening, the water inlet cavity is arranged in the mounting opening, the water inlet cavity further comprises a second cavity wall, the second cavity wall is located outside the cleaning tank, and the second cavity wall is provided with a liquid inlet.

[0014] In the optional technical scheme of the etching cleaning machine, the etching cleaning machine comprises a main tank and a partition plate, the partition plate is arranged in the main tank and is lower than the main tank, the partition plate divides the main tank into the cleaning tank and an overflow tank, the overflow tank is provided with an overflow opening, the water inlet cavity is provided with a liquid inlet, the overflow opening is communicated with the liquid inlet through a communication structure, and the communication structure is provided with a circulating pump.

[0015] In the optional technical scheme of the etching cleaning machine, the bottom wall of the overflow tank is provided with a liquid collecting groove protruding outward, and the overflow opening is arranged on the bottom wall of the liquid collecting groove.

[0016] As can be understood by those skilled in the art, the etching cleaning machine of the present application comprises a cleaning tank and a water inlet cavity, the water inlet cavity comprises a first cavity wall, the first cavity wall is located in the cleaning tank and faces the side wall of the cleaning tank, and the first cavity wall is provided with a liquid distribution hole. Since the first cavity wall of the water inlet cavity is arranged in the cleaning tank and faces the side wall of the cleaning tank, the first cavity wall is perpendicular to the bottom wall of the cleaning tank, forms an acute angle or an obtuse angle. When the liquid enters the cleaning tank through the liquid distribution hole to clean the substrate, any debris or impurities generated during the cleaning process will naturally fall onto the bottom wall of the cleaning tank, rather than falling onto the first cavity wall, thereby reducing the possibility of blocking the liquid distribution hole and significantly reducing the possibility of blocking during the cleaning process, ensuring the smoothness of the liquid flow. BRIEF DESCRIPTION OF DRAWINGS

[0017] The preferred embodiments of this application are described below with reference to the accompanying drawings, in which:

[0018] Figure 1 This is a schematic diagram (a) of the etching and cleaning machine of this application;

[0019] Figure 2 This is a schematic diagram (II) of the etching and cleaning machine of this application;

[0020] Figure 3 This is a top view of the etching and cleaning machine of this application;

[0021] Figure 4 This application is Figure 3 Sectional view at point AA.

[0022] Explanation of reference numerals in the attached figures:

[0023] 100-Main tank; 101-Baffle; 102-Cleaning tank; 1021-First side wall; 1022-Second side wall; 1023-Third side wall; 1024-Fourth side wall; 1025-Bottom wall; 10251-First liquid outlet; 103-Overflow tank; 1031-Collection tank; 1032-Overflow outlet; 200-Water inlet cavity; 201-First cavity wall; 2011-Equalization hole; 202-Second cavity wall; 2021-Liquid inlet; 301-First cleaning pipe; 302-Second cleaning pipe; 303-Water outlet; 400-Box body; 401-Second liquid outlet; 402-Cleaning port; 403-Cover body; 501-Main pipe; 502-Branch pipe; 601-First water inlet pipe; 602-Second water inlet pipe; 700-Drain pipe. Detailed Implementation

[0024] Preferred embodiments of this application are described below with reference to the accompanying drawings. Those skilled in the art should understand that these embodiments are merely illustrative of the technical principles of this application and are not intended to limit the scope of protection of this application. Those skilled in the art can make adjustments as needed to adapt to specific application scenarios.

[0025] It should be noted that, in the description of this application, unless otherwise expressly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0026] To address the problem of liquid inlet blockage in existing etching and cleaning machines, this application proposes an etching and cleaning machine, such as... Figure 1 As shown, the structure of the etching and cleaning machine will be briefly introduced first.

[0027] The etching cleaning machine of the present application comprises a cleaning tank 102 and a water inlet cavity 200, the water inlet cavity 200 comprises a first cavity wall 201, the first cavity wall 201 is located in the cleaning tank 102 and faces the side wall of the cleaning tank 102, and the first cavity wall 201 is provided with a liquid equalizing hole 2011.

[0028] Since the first cavity wall 201 of the water inlet cavity 200 is arranged in the cleaning tank 102 and faces the side wall of the cleaning tank 102, the first cavity wall 201 is perpendicular to the bottom wall 1025 of the cleaning tank 102, forms an acute angle or an obtuse angle. This makes any debris or impurities generated during the cleaning process naturally fall onto the bottom wall 1025 of the cleaning tank 102 when the liquid medicine enters the cleaning tank 102 through the liquid equalizing hole 2011 to clean the substrate, thereby reducing the possibility of blocking the liquid equalizing hole 2011, significantly reducing the possibility of blocking during the cleaning process, and ensuring the smoothness of the liquid flow.

[0029] As shown in the specific embodiment of the etching cleaning machine of the present application. Figures 1 to 4 As shown in the specific embodiment of the etching cleaning machine of the present application.

[0030] The etching cleaning machine of the present application comprises a main tank 100 and a partition plate 101, the partition plate 101 is arranged in the main tank 100 and is lower than the main tank 100, the number of the partition plate 101 can be specifically two, and the partition plate 101 divides the main tank 100 to form overflow tanks 103 on both sides and a cleaning tank 102 in the middle. Among them, the partition plate 101 and the main tank 100 can be integrally formed, or can be sealingly connected, etc., which is not limited by the present application. The cleaning tank 102 comprises oppositely arranged first and second side walls 1021 and 1022, and the first and second side walls 1021 and 1022 are both provided with a water inlet cavity 200, and the water inlet cavity 200 on both sides comprises a first cavity wall 201 located in the cleaning tank 102. Among them, the first cavity wall 201 of the water inlet cavity 200 on the first side wall 1021 faces the second side wall 1022, the first cavity wall 201 of the water inlet cavity 200 on the second side wall 1022 faces the first side wall 1021, the first cavity wall 201 of the water inlet cavity 200 on both sides is provided with a liquid equalizing hole 2011, and the liquid equalizing holes 2011 on both sides are in matrix distribution (multi-row and multi-column distribution). In order to facilitate the overflow circulation, the water inlet cavity 200 of the present application is provided with a liquid inlet 2021, the overflow tank 103 is provided with an overflow port 1032, the overflow port 1032 is communicated with the liquid inlet 2021 through a communication structure (not shown in the figure), and a circulating pump is arranged on the communication structure. The communication structure can comprise a first overflow pipe, a second overflow pipe and a secondary tank, one end of the first overflow pipe is communicated with the overflow port 1032, the other end is communicated with the secondary tank, one end of the second overflow pipe is communicated with the secondary tank, the other end is communicated with the liquid inlet 2021, and the circulating pump can be arranged on the first overflow pipe or the second overflow pipe.

[0031] Possibly, the first side wall 1021 has a mounting port (not shown in the figure), and the water inlet cavity 200 is arranged in the mounting port. Specifically, the water inlet cavity 200 can be integrally formed in the mounting port, or can be sealingly connected with the mounting port through a sealing gasket or the like sealing structure, or can be installed on the mounting port through welding or adhesion, and the present application does not limit the specific manner of arranging the water inlet cavity 200 in the mounting port. The water inlet cavity 200 further comprises a second cavity wall 202, which is located outside the cleaning tank 102, and the first cavity wall 201 can be arranged opposite to the second cavity wall 202. The second cavity wall 202 is provided with a liquid inlet port 2021, and the number of the liquid inlet port 2021 can be multiple, and three liquid inlet ports 2021 are taken as an example for introduction. The communication structure further comprises a main pipe 501 and a branch pipe 502, and the three liquid inlet ports 2021 are connected to the main pipe 501 through the branch pipe 502 respectively. The main pipe 501 is provided with a water collecting port, and the second overflow pipe is in communication with the water collecting port. The second side wall 1022 also has a mounting port for connecting with the water inlet cavity 200 on the side. The specific connection manner of the water inlet cavity 200 on the second side wall 1022 with the mounting port, the structure of the water inlet cavity 200, and the connection manner of the water inlet cavity 200 with the branch pipe 502 are the same as or similar to those of the water inlet cavity 200 on the first side wall 1021 with the mounting port, the structure of the water inlet cavity 200, and the connection manner of the water inlet cavity 200 with the branch pipe 502, and will not be described in detail.

[0032] After the initial liquid preparation is completed in the device auxiliary tank, the prepared liquid in the auxiliary tank is sequentially delivered to the water inlet cavities 200 on both sides through the second overflow pipe, the main pipe 501, and the branch pipe 502, and then uniformly flows into the cleaning tank 102 through the first cavity wall 201 of the water inlet cavities 200 on both sides, and then overflows into the overflow tanks 103 on both sides as the liquid level in the cleaning tank 102 gradually rises. Finally, the liquid is returned to the auxiliary tank through the overflow port 1032 on the overflow tank 103 and the first overflow pipe, and the cycle is repeated. In order to facilitate the connection of the overflow tank 103 with the device auxiliary tank and to avoid liquid accumulation caused by large liquid flow in the overflow tank 103, the bottom wall of the overflow tank 103 on both sides has an outwardly protruding liquid collecting groove 1031, and the overflow port 1032 is arranged on the bottom wall of the liquid collecting groove 1031. The liquid collecting groove 1031 can be integrally formed with the overflow tank 103, or can be fixedly or detachably installed on the opening of the bottom wall of the overflow tank 103.

[0033] In the normal operation process of the device, in order to ensure the uniformity of the liquid medicine, the device needs to continuously overflow and circulate. In order to reduce or avoid the blockage of the uniform liquid hole 2011 by the fragments generated in the etching process of the silicon wafer, the first cavity wall 201 of the water inlet cavity 200 having the uniform liquid hole 2011 is arranged to face the side wall of the cleaning tank 102, so that the first cavity wall 201 is perpendicular to the bottom wall 1025 of the cleaning tank 102, forming an acute angle or an obtuse angle. This makes any fragments or impurities generated during the cleaning process naturally fall onto the bottom wall 1025 of the cleaning tank 102 when the liquid medicine enters the cleaning tank 102 through the uniform liquid hole 2011 to clean the substrate, thereby reducing or avoiding the blockage of the uniform liquid hole 2011. The blockage problem that may occur during the cleaning process is significantly reduced, ensuring the smoothness of the liquid flow.

[0034] In addition, since the uniform liquid holes 2011 on the first cavity wall 201 are arranged in a matrix, the liquid medicine can be uniformly injected into the cleaning tank 102 in the form of multiple point sources, significantly reducing the liquid surface disturbance. In this way, not only the uniformity and quality of the etching process can be improved, but also the etching rate of each area can be ensured to be consistent, avoiding etching defects caused by uneven flow. In addition, uniform liquid distribution reduces the disturbance of bubbles and particles generated during the flow process, improves the cleanliness of the silicon wafer surface, further reduces the defect rate, and optimizes the efficiency and reliability of the entire etching process. On the other hand, even if some uniform liquid holes 2011 are blocked, the other uniform liquid holes 2011 can still work normally, thereby ensuring uniform injection of the liquid medicine and maintaining the stability of the liquid surface and the consistency of the etching effect. In addition, the arrangement of the water inlet cavity 200 on the first side wall 1021 and the second side wall 1022 arranged opposite to each other can further ensure that the liquid medicine in the cleaning tank 102 is more uniformly distributed, improve the uniformity and quality of the etching process, and reduce the impact of blockage on the overall process.

[0035] Possibly, the cleaning tank 102 includes a third side wall 1023 and a fourth side wall 1024 arranged opposite to each other, and the bottom wall 1025 of the cleaning tank 102 is provided with a first liquid outlet 10251. The bottom wall 1025 is inclined downward from the third side wall 1023 to the first liquid outlet 10251, and the bottom wall 1025 is also inclined downward from the fourth side wall 1024 to the first liquid outlet 10251. That is, the bottom wall 1025 of the cleaning tank 102 is designed in a "V" shape. The two ends of the third side wall 1023 are connected to the first side wall 1021 and the second side wall 1022, respectively, and the two ends of the fourth side wall 1024 are also connected to the first side wall 1021 and the second side wall 1022, respectively.

[0036] The cleaning tank 102 can be in a cuboid structure, the third side wall 1023 and the fourth side wall 1024 can be located at two sides of the cleaning tank 102 in the length direction, and the first side wall 1021 and the second side wall 1022 can be located at two sides of the cleaning tank 102 in the width direction. The first liquid outlet 10251 is preferably in a strip shape and extends along the width direction of the cleaning tank 102, but this is not a limitation, and the first liquid outlet 10251 can also be replaced by a square-shaped outlet, a special-shaped outlet, etc. The third side wall 1023 and the fourth side wall 1024 are configured as the partition plate 101 described above, and of course can also be two sides of the main tank. In addition, the opposite two sides of the water inlet cavity 200 in the length direction can be attached to the third side wall 1023 and the fourth side wall 1024 to improve the water inlet efficiency and avoid the gap at the edge of the water inlet cavity 200 to clamp the debris and cause blockage.

[0037] The etching cleaning machine further comprises a first cleaning pipe 301 and a second cleaning pipe 302 arranged in the cleaning tank 102. The first cleaning pipe 301 is arranged on one side of the bottom wall 1025 of the third side wall 1023 and extends along the length direction of the third side wall 1023 (i.e., the direction from the first side wall 1021 to the second side wall 1022). The second cleaning pipe 302 is arranged on one side of the bottom wall 1025 of the fourth side wall 1024 and extends along the length direction of the fourth side wall 1024 (i.e., the direction from the first side wall 1021 to the second side wall 1022). Water outlets 303 are arranged on the side walls of the first cleaning pipe 301 and the second cleaning pipe 302. The corresponding water outlets 303 can be distributed along the length direction of the corresponding first cleaning pipe 301 and second cleaning pipe 302. Further, the two sides of the first cleaning pipe 301 in the length direction can be attached to the water inlet cavities 200 on the first side wall 1021 and the second side wall 1022, and the two sides of the second cleaning pipe 302 in the length direction can also be attached to the water inlet cavities 200 on the first side wall 1021 and the second side wall 1022, so as to improve the water inlet amount and avoid the gap at the edge to cause blockage.

[0038] Possibly, the first cleaning pipe 301 is provided with a first hole on the side wall, and the etching cleaning machine further comprises a first water inlet pipe 601. One end of the first water inlet pipe 601 is communicated with the first hole, and the other end is sealed to pass through the bottom wall 1025 of the cleaning tank 102 and connected to an external water source. Similarly, the second cleaning pipe 302 is provided with a second hole on the side wall, and the etching cleaning machine further comprises a second water inlet pipe 602. One end of the second water inlet pipe 602 is communicated with the second hole, and the other end is sealed to pass through the bottom wall 1025 of the cleaning tank 102 and connected to an external water source.

[0039] The first cleaning pipe 301 can be installed in the following manner: the bottom wall 1025 of the cleaning tank 102 is provided with a plurality of first supports distributed at intervals, and the first cleaning pipe 301 is installed on the first supports. However, this is not a limitation. The installation manner of the first cleaning pipe 301 can be adjusted, for example, the first cleaning pipe 301 is installed on the bottom wall 1025 of the cleaning tank 102 in a welding or clamping manner, etc. These adjustments do not deviate from the principles of the present application and are within the protection scope of the present application. The second cleaning pipe 302 can be installed in the following manner: the bottom wall 1025 of the cleaning tank 102 is provided with a plurality of second supports distributed at intervals, and the second cleaning pipe 302 is installed on the second supports. Similarly, the installation manner of the second cleaning pipe 302 can be adjusted, for example, the second cleaning pipe 302 is installed on the bottom wall 1025 of the cleaning tank 102 in a welding or clamping manner, etc. These adjustments do not deviate from the principles of the present application and are within the protection scope of the present application.

[0040] Possibly, the bottom wall 1025 of the cleaning tank 102 is provided with a box body 400, and the box body 400 has an opening that is in communication with the first liquid outlet 10251. The opening can cover the first liquid outlet 10251, for example, the opening is detachably connected with the periphery of the first liquid outlet 10251, for example, connected in a clamping or bolt connection manner, etc. Of course, the opening can also be fixedly connected by welding, bonding, etc. Or the opening and the first liquid outlet 10251 are directly sleeved in the same shape, etc. The present application does not limit the specific implementation manner of the opening in communication with the first liquid outlet 10251. The adjustment of the specific connection manner does not deviate from the principles of the present application and is within the protection scope of the present application.

[0041] Possibly, the bottom of the box body 400 is provided with a second liquid outlet 401, and the second liquid outlet 401 is provided with a filtering device, which can be a filter screen, a filter element, a filter bag, or a filter, etc. to ensure that almost all debris is retained in the box body 400. The side of the box body 400 is provided with a cleaning port 402, and the cleaning port 402 is provided with a cover body 403. The cover body 403 and the cleaning port 402 can be connected in a threaded connection, a buckle connection, and a sealing ring connection, etc. The number of cleaning ports 402 can be one or more. When there are multiple cleaning ports 402, a cover body 403 is provided on each cleaning port 402. In addition, the second liquid outlet 401 can be in communication with a liquid discharge pipe 700 to discharge the liquid to a structure such as a waste discharge system, etc. An electromagnetic valve can be arranged on the liquid discharge pipe 700 to facilitate the control of the on-off of the liquid discharge pipe 700.

[0042] When the etching cleaning machine needs to change the liquid, the liquid needs to be quickly discharged to the waste system, and then the second liquid is prepared after the liquid is completely discharged. During the liquid discharge process, the bottom wall 1025 is inclined downward from the third side wall 1023 to the first liquid outlet 10251, and the bottom wall 1025 is also inclined downward from the fourth side wall 1024 to the first liquid outlet 10251. Not only can it effectively guide the flow and improve the liquid discharge efficiency, but also can effectively inhibit the local accumulation of liquid caused by the slight deformation of the bottom wall 1025 of the cleaning tank 102, which cannot be completely discharged. In addition, the "V" type design structure of the bottom wall 1025 of the cleaning tank 102 can flush the debris deposited on the bottom wall 1025 of the cleaning tank 102 into the box body 400 during liquid discharge, which is convenient for centralized cleaning.

[0043] In order to ensure that the debris deposited on the bottom wall 1025 of the cleaning tank 102 is completely flushed into the box body 400, after the liquid discharge of the etching cleaning machine is completed, pure water can be automatically (of course, it can also be replaced by manually) injected into the first cleaning pipe 301 and the second cleaning pipe 302. The pure water flows out through the water outlet hole 303 on the side wall of the first cleaning pipe 301 and the second cleaning pipe 302, and automatically flushes the bottom wall 1025 of the cleaning tank 102. After the above flushing step is completed, the cover body 403 installed on the side of the box body 400 is removed to quickly clean the debris deposited in the box body 400. After cleaning, the cover body 403 is installed in the original position. After the above liquid discharge, flushing and debris cleaning steps are completed, the device can be operated to prepare the second liquid.

[0044] It should be noted that the first cleaning pipe 301 of the present application is arranged on one side of the bottom wall 1025 at the third side wall 1023 and arranged along the length direction of the third side wall 1023. The second cleaning pipe 302 is arranged on one side of the bottom wall 1025 at the fourth side wall 1024 and arranged along the length direction of the fourth side wall 1024. The side wall of the first cleaning pipe 301 and the second cleaning pipe 302 is provided with a water outlet hole 303, and the bottom wall 1025 is inclined downward from the third side wall 1023 to the first liquid outlet 10251. The bottom wall 1025 is also inclined downward from the fourth side wall 1024 to the first liquid outlet 10251. The first cleaning pipe 301 and the second cleaning pipe 302 are located near the highest point of the bottom wall 1025. The pure water flowing out of the water outlet hole 303 on the side wall of the first cleaning pipe 301 and the second cleaning pipe 302 can cover the bottom wall 1025 of the cleaning tank 102 at a larger angle and range, and can flow faster under the action of gravity, ensuring that the pure water can cover each position of the bottom wall 1025 of the cleaning tank 102, and ensuring the comprehensiveness and thoroughness of cleaning.

[0045] It should be noted that the above embodiments are only used to illustrate the principles of the present application, and are not intended to limit the protection scope of the present application. Those skilled in the art can adjust the above structure without departing from the principles of the present application, so that the present application can be applied to more specific application scenarios.

[0046] As an alternative embodiment, the second cavity wall 202 can be configured as a bottom wall of the water inlet cavity 200.

[0047] As an alternative embodiment, the third side wall 1023 and the first side wall 1021 are the same side wall, and the fourth side wall 1024 and the second side wall 1022 are the same side wall.

[0048] As an alternative embodiment, the number of partitions 101 can be one or the like, as long as the partitions 101 can separate the main groove 100 to form the cleaning groove 102 and the overflow groove 103.

[0049] As an alternative embodiment, the first water inlet pipe 601 can be omitted, and one end of the first cleaning pipe 301 is sealed to extend out of the side wall of the cleaning groove 102 and connected to a water source.

[0050] As an alternative embodiment, the second water inlet pipe 602 can be omitted, and one end of the second cleaning pipe 302 is sealed to extend out of the side wall of the cleaning groove 102 and connected to a water source.

[0051] As an alternative embodiment, the water inlet cavity 200 can be provided only on one side wall of the cleaning groove 102.

[0052] As an alternative embodiment, the first cleaning pipe 301 and the second cleaning pipe 302 can be omitted.

[0053] As an alternative embodiment, the box body 400 can be omitted.

[0054] As an alternative embodiment, the box body 400 can not have a second liquid outlet 401, and can not have a cleaning port 402.

[0055] As an alternative embodiment, the water inlet cavity 200 can be provided in the cleaning groove 102, that is, the second cavity wall 202 of the cleaning groove 102 is also located in the cleaning groove 102.

[0056] As an alternative embodiment, the liquid collecting groove 1031 can be omitted.

[0057] As an alternative embodiment, the communication structure only includes an overflow pipe and does not include a secondary groove. In this case, the prepared liquid can be directly placed into the overflow groove 103.

[0058] As an alternative embodiment, the number of liquid inlet openings 2021 on the second cavity wall 202 can be only one, in which case the branch pipes 502 and the main pipe 501 can be omitted.

[0059] So far, the technical solution of the present application has been described in combination with the preferred embodiments shown in the drawings, but it is easy for those skilled in the art to understand that the protection scope of the present application is obviously not limited to these specific embodiments. Those skilled in the art can make equivalent changes or replacements to the related technical features without departing from the principles of the present application, and the technical solutions after these changes or replacements will all fall within the protection scope of the present application.

Claims

1. An etch cleaning machine characterized by, The etching cleaning machine comprises a cleaning tank (102), a water inlet cavity (200), and a liquid distribution hole (2011) provided on a first cavity wall (201) of the water inlet cavity (200).

2. The etching cleaning machine according to claim 1, wherein the liquid distribution holes (2011) are arranged in a matrix on the first cavity wall (201).

3. The etching cleaning machine according to claim 1, wherein the cleaning tank (102) comprises a first side wall (1021) and a second side wall (1022) arranged oppositely, and the water inlet cavity (200) is provided on each of the first side wall (1021) and the second side wall (1022), and the first cavity wall (201) of the water inlet cavity (200) on the first side wall (1021) faces the second side wall (1022), and the first cavity wall (201) of the water inlet cavity (200) on the second side wall (1022) faces the first side wall (1021).

4. The etching cleaning machine according to claim 1, wherein the cleaning tank (102) comprises a third side wall (1023) and a fourth side wall (1024) arranged oppositely, and a first liquid outlet (10251) is provided on a bottom wall of the cleaning tank (102), and the bottom wall is arranged downwardly from the third side wall (1023) to the first liquid outlet (10251), and the bottom wall is also arranged downwardly from the fourth side wall (1024) to the first liquid outlet (10251).

5. The etching cleaning machine according to claim 4, further comprising a first cleaning pipe (301) and a second cleaning pipe (302) arranged in the cleaning tank (102), the first cleaning pipe (301) is arranged on one side of the bottom wall at the third side wall (1023) and arranged along the length direction of the third side wall (1023), the second cleaning pipe (302) is arranged on one side of the bottom wall at the fourth side wall (1024) and arranged along the length direction of the fourth side wall (1024), and a water outlet hole (303) is provided on the side wall of each of the first cleaning pipe (301) and the second cleaning pipe (302).

6. The etching cleaning machine according to claim 4, wherein a box body (400) is arranged on the outside of the bottom wall, and the box body (400) has an opening which is communicated with the first liquid outlet (10251).

7. The etching cleaning machine according to claim 6, wherein a second liquid outlet (401) is provided on the bottom of the box body (400), a filter device is provided on the second liquid outlet (401), a cleaning opening (402) is provided on the side of the box body (400), and a cover body (403) is arranged on the cleaning opening (402).

8. The etching cleaning machine according to claim 1, ​ ​ ​ ​ ​ ​ ​ ​ The sidewall of the cleaning tank (102) has a mounting port, the water inlet cavity (200) is arranged in the mounting port, the water inlet cavity (200) further comprises a second cavity wall (202), the second cavity wall (202) is located outside the cleaning tank (102), and the second cavity wall (202) is provided with a liquid inlet (2021).

9. The etching cleaning machine according to claim 1, characterized in that, The etching cleaning machine comprises a main tank (100) and a partition plate (101), the partition plate (101) is arranged in the main tank (100) and is lower than the main tank (100), the partition plate (101) divides the main tank (100) into the cleaning tank (102) and an overflow tank (103), the overflow tank (103) is provided with an overflow port (1032), the water inlet cavity (200) is provided with a liquid inlet (2021), the overflow port (1032) is connected with the liquid inlet (2021) through a communication structure, and the communication structure is provided with a circulating pump.

10. The etching cleaning machine according to claim 9, characterized in that, The bottom wall of the overflow tank (103) has an outwardly protruding liquid collecting groove (1031), and the overflow port (1032) is arranged on the bottom wall of the liquid collecting groove (1031).

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