Automatic film changing device for wafer table

Abstract

The utility model relates to an automatic film changing device for a wafer table, which belongs to the technical field of film changing and comprises a mounting seat, a material grabbing structure is arranged on one side of the mounting seat and used for moving a chip film to the mounting seat, and a fixing structure is arranged on the mounting seat and used for fixing the chip film on the mounting seat. The fixing structure is used for fixing the chip film placed on the mounting seat; the fixing structure comprises a clamping rod and a pushing assembly, the clamping rod is rotationally connected with the mounting base through a pin shaft, an annular flange is arranged at the top of the mounting base, an opening is formed in one side of the flange, the clamping rod is located at the opening, the clamping rod is connected with the mounting base through an elastic piece, and the pushing assembly is connected with the clamping rod. And the pushing assembly is used for pushing the clamping rod to rotate around the pin shaft. According to the utility model, the movement of the chip film is realized through the mechanical arm and the suction cup, and meanwhile, the clamping rod is controlled to rotate through the air cylinder, so that the chip film is automatically clamped and fixed, namely, automatic film replacement is realized, and the film replacement efficiency is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to a wafer table automatic film changing device belongs to film changing technical field. BACKGROUND

[0002] Semiconductor die attach (Semiconductor Die Attach or Die Bonding) is a key step in the semiconductor manufacturing process, mainly refers to the cutting into small pieces of semiconductor chip (wafer cutting after "die attach") firmly paste or weld to the process of packaging substrate.

[0003] Among them, the wafer needs to be placed on the chip film in the semiconductor manufacturing process, when the chip on the chip film is used up, then need to place the new wafer on the wafer table, this action is called film changing, in the prior art, film changing is usually manual operation, the replacement efficiency is low, reduces the ability of machine table continuous production operation, affects the machine table output.

[0004] Therefore, there needs to be a wafer table automatic film changing device to improve the film changing efficiency. UTILITY MODEL CONTENTS

[0005] The utility model solves the technical problems that: in order to overcome the prior art's insufficient, provide a kind of wafer table automatic film changing device that improves film changing efficiency.

[0006] The utility model solves the technical scheme that the above problems are adopted: a kind of wafer table automatic film changing device, including mounting seat, the side of mounting seat is provided with grabbing structure, the grabbing structure is used to move chip film to mounting seat, fixed structure is provided on the mounting seat, and the fixed structure is used to realize the fixation of chip film placed on the mounting seat;

[0007] The fixed structure includes clamping rod and push assembly, the clamping rod is rotatably connected with mounting seat by pin shaft, the top of mounting seat is provided with annular flange, the side of flange is opened, the clamping rod is located at opening, the clamping rod is connected with mounting seat by elastic member, and the push assembly is used to push clamping rod to rotate around pin shaft.

[0008] As preferred, the clamping rod includes clamping part and push part, and the pin shaft is located between the clamping part and the push part.

[0009] As preferred, the clamping surface of the clamping part is arc-shaped.

[0010] As preferred, anti-skid lines are arranged on the clamping surface of the clamping part.

[0011] As preferred, the elastic member is a torsion spring, the torsion spring is sleeved on the pin shaft, and the two ends of the torsion spring are connected with the mounting seat and the clamping rod respectively.

[0012] As preferred, the pushing assembly comprises a pushing block and a cylinder, the pushing block being connected with the piston end of the cylinder.

[0013] As preferred, the clamping rods are provided with two, and the two clamping rods are symmetrically arranged.

[0014] As preferred, the grabbing structure comprises a trough and a mechanical arm, the trough being used for placing the chip film, and the execution end of the mechanical arm being connected with a suction cup.

[0015] As preferred, the mounting seat is provided with a rotating system, and the rotating system is used for driving the mounting seat to rotate.

[0016] As preferred, the rotating system is an electric motor.

[0017] Compared with the prior art, the advantages of the present application are that:

[0018] The wafer table automatic film changing device of the present application realizes the automatic film changing and improves the film changing efficiency by moving the chip film through the mechanical arm and the suction cup, rotating the clamping rod through the cylinder to realize the automatic clamping and fixing of the chip film. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 Fig. 1 is a structural schematic view of the wafer table automatic film changing device of the present application;

[0020] Figure 2 Fig. 4 is a connection structural schematic view of the mounting seat and the fixing mechanism;

[0021] Figure 3 Fig. 5 is a structural schematic view of the mounting seat;

[0022] Figure 4 Fig. 6 is a structural schematic view of the two clamping rods;

[0023] Figure 5 Fig. 7 is a structural schematic view of a single clamping rod;

[0024] Figure 6 Fig. 8 is a structural schematic view of the pushing assembly.

[0025] Among them:

[0026] Mounting seat 1, trough 2, mechanical arm 3, suction cup 4, clamping rod 5, pin shaft 6, flange 7, opening 8, torsional spring 9, pushing block 10, cylinder 11, electric motor 12, chip film 13;

[0027] Clamping part 501, pushing part 502. DETAILED DESCRIPTION

[0028] As Figures 1-6As shown, the wafer table automatic film changing device in the embodiment comprises a mounting seat 1, one side of the mounting seat 1 is provided with a grabbing structure, the grabbing structure is used to move the chip film 13 to the mounting seat 1, the mounting seat 1 is provided with a fixing structure, the fixing structure is used to fix the chip film 13 placed on the mounting seat 1;

[0029] The grabbing structure comprises a trough 2 and a mechanical arm 3, the trough 2 is used to place the chip film 13, the execution end of the mechanical arm 3 is connected with a suction cup 4, during work, the suction cup 4 is moved to the chip film 13 in the trough 2 through the mechanical arm 3, one of the chip films 13 is adsorbed through the suction cup 4, then the chip film 13 adsorbed on the suction cup 4 is moved to the mounting seat 1 through the mechanical arm 3, of course, the chip film 13 used up on the mounting seat 1 can also be moved to the recycling position through the mechanical arm 3 and the suction cup 4;

[0030] The fixing structure comprises a clamping rod 5 and a pushing assembly, the clamping rod 5 is rotationally connected with the mounting seat 1 through a pin shaft 6, the top of the mounting seat 1 is provided with an annular flange 7, one side of the flange 7 is provided with an opening 8, the clamping rod 5 is located at the opening 8, the clamping rod 5 is connected with the mounting seat 1 through an elastic piece, the pushing assembly is used to push the clamping rod 5 to rotate around the pin shaft 6;

[0031] The clamping rod 5 comprises a clamping part 501 and a pushing part 502, the pin shaft 6 is located between the clamping part 501 and the pushing part 502, the clamping surface of the clamping part 501 is arc-shaped;

[0032] The clamping surface of the clamping part 501 is provided with anti-skid lines, the friction between the clamping part 501 and the chip film 13 is improved through the anti-skid lines, and the fixing effect of the clamping rod 5 on the chip film 13 is improved;

[0033] The elastic piece is a torsion spring 9, the torsion spring 9 is sleeved on the pin shaft 6, and two ends of the torsion spring 9 are connected with the mounting seat 1 and the clamping rod 5 respectively;

[0034] The pushing assembly comprises a pushing block 10 and a cylinder 11, the pushing block 10 is connected with the piston end of the cylinder 11;

[0035] The clamping rod 5 is provided with two, and the two clamping rods 5 are symmetrically arranged;

[0036] When the chip film 13 on the mounting seat 1 needs to be replaced, the pushing block 10 is driven to move by the air cylinder 11, the pushing portion 502, i.e. the clamping rod 5, is pushed to rotate around the pin shaft 6 by the movement of the pushing block 10, the clamping portion 501 is rotated away from the center of the flange 7, the clamping rod 5 is separated from the chip film 13, and the torsional spring 9 is deformed, then the used chip film 13 in the flange 7 is removed by the mechanical arm 3 and the suction cup 4, and a new chip film 13 is placed in the flange 7, after that, the pushing block 10 is reversely moved by the air cylinder 11, and the pushing block 10 is separated from the pushing portion 502, at this time, the clamping rod 5 is reversely rotated to reset by the elastic force of the torsional spring 9, and the clamping portion 501 clamps the outer wall of the new chip film 13 in the flange 7, the clamping and fixing of the chip film 13 are realized, the automatic film replacement is realized, and the film replacement efficiency is improved.

[0037] The mounting seat 1 is provided with a rotating system, the rotating system is used for driving the mounting seat 1 to rotate, when the new chip film 13 is placed on the mounting seat 1, the mounting seat 1 is driven to rotate by the rotating system, the mounting seat 1 drives the chip film 13 to rotate, and the angle of the chip film 13 on the mounting seat 1 is adjusted.

[0038] The rotating system is a motor 12.

[0039] In summary, the movement of the chip film 13 is realized by the mechanical arm 3 and the suction cup 4, and the clamping rod 5 is rotated to realize the automatic clamping and fixing of the chip film 13, i.e. the automatic film replacement is realized, and the film replacement efficiency is improved.

[0040] In addition to the above-mentioned embodiments, the utility model also includes other implementation manners, and the technical solutions formed by equivalent transformation or equivalent replacement should fall within the protection scope of the utility model claims.

Claims

1. A wafer table automatic film changing device comprising a mounting seat (1), characterized in that: One side of the mounting base (1) is provided with a material grabbing structure for moving the chip film (13) to the mounting base (1), and the mounting base (1) is provided with a fixing structure for fixing the chip film (13) placed on the mounting base (1). The fixing structure comprises a clamping rod (5) and a pushing assembly, the clamping rod (5) is rotatably connected with the mounting base (1) through a pin shaft (6), the top of the mounting base (1) is provided with an annular flange (7), one side of the flange (7) is provided with an opening (8), the clamping rod (5) is located at the opening (8), the clamping rod (5) is connected with the mounting base (1) through an elastic element, and the pushing assembly is used for pushing the clamping rod (5) to rotate around the pin shaft (6).

2. The wafer table automatic film changing device according to claim 1, wherein: The clamping rod (5) comprises a clamping portion (501) and a pushing portion (502), and the pin shaft (6) is located between the clamping portion (501) and the pushing portion (502).

3. The wafer table automatic film changing device of claim 2, wherein: The clamping surface of the clamping portion (501) is arc-shaped.

4. The automatic film changing device for wafer table according to claim 2, wherein: The clamping surface of the clamping portion (501) is provided with anti-skid lines.

5. The automatic film changing device for wafer table according to claim 1, wherein: The elastic element is a torsion spring (9), the torsion spring (9) is sleeved on the pin shaft (6), and the two ends of the torsion spring (9) are connected with the mounting base (1) and the clamping rod (5) respectively.

6. The automatic film changing device for wafer table according to claim 1, wherein: The pushing assembly comprises a pushing block (10) and a cylinder (11), and the pushing block (10) is connected with the piston end of the cylinder (11).

7. The automatic film changing device for wafer table according to claim 1, wherein: The clamping rod (5) is provided with two clamping rods (5), and the two clamping rods (5) are symmetrically arranged.

8. The automatic film changing device for wafer table according to claim 1, characterized in that: The material grabbing structure comprises a material groove (2) and a mechanical arm (3), the material groove (2) is used for placing the chip film (13), and the execution end of the mechanical arm (3) is connected with a suction cup (4).

9. The wafer table automatic film changing device according to any one of claims 1-8, wherein: The mounting base (1) is provided with a rotating system, and the rotating system is used for driving the mounting base (1) to rotate.

10. The wafer table automatic film changing device of claim 9, wherein: The rotating system is a motor (12).

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