Silicon wafer basket
By designing load-bearing columns and teeth with specific spacing and support structures in the silicon wafer basket, the problems of thin silicon wafer bending and adhesion are solved, enabling efficient cleaning and high-quality silicon wafer production, and adapting to the loading of silicon wafers of various specifications.
Patent Information
- Application Number
- CN202422973872.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-03
- Publication Date
- 2026-02-13
- Estimated Expiration
- 2034-12-03
AI Technical Summary
Existing silicon wafer baskets cannot match silicon wafers of various sizes, causing thin silicon wafers to be easily bent and deformed, and adjacent silicon wafers to easily stick together, increasing cleaning costs and reducing production quality.
A silicon wafer basket is designed, employing a support column and support tooth structure. The spacing between adjacent support teeth is 4mm-8mm, the thickness of the support teeth is 2mm-2.5mm, and the tooth length is 30mm-40mm. Combined with end plates and baffle structures, an adaptively adjustable support space is formed to ensure the bending spacing and support force of thin silicon wafers and avoid wafer sticking.
It effectively reduces wafer sticking rate during thin silicon wafer loading, improves cleaning efficiency and production quality, reduces silicon wafer loss, and adapts to the loading needs of silicon wafers of different sizes and specifications.
Smart Images
Figure CN223912837U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the technical field of silicon wafer flower basket especially relates to a silicon wafer flower basket. BACKGROUND
[0002] The silicon wafer flower basket is also called polycrystalline silicon core block loading frame or silicon wafer carrier, and its main function is to carry silicon wafers to facilitate the processing and production of the silicon wafers. The existing silicon wafer flower basket cannot match various specifications of silicon wafers, and when the thickness of the silicon wafers is thin, the silicon wafers are prone to bending and deformation, and the adjacent two silicon wafers are prone to adhesion, which causes the silicon wafers to be prone to water marks or dirt during processing and cleaning, increases the cleaning cost of the silicon wafers, and reduces the quality of the silicon wafer products. SUMMARY
[0003] The utility model discloses to solve the defects of prior art, provide a kind of silicon wafer flower basket, can reduce the sticking rate of thin silicon wafer when being loaded in silicon wafer flower basket, effectively guarantee the cleaning efficiency and production quality of silicon wafer.
[0004] To solve the above technical problems, the utility model provides a kind of silicon wafer flower basket, including flower basket frame and the multiple bearing columns of being installed in the inside of the flower basket frame, part of the bearing column and another part of the bearing column are located at the opposite two sides of the flower basket frame respectively, each bearing column is connected with multiple bearing teeth, and multiple bearing teeth are spaced along the axial direction of the bearing column, each bearing tooth extends along the direction perpendicular to the bearing column, and the predetermined interval is formed between any adjacent two bearing teeth, and the predetermined interval is 4mm-8mm.
[0005] According to the silicon wafer flower basket of the embodiment, the two parts of the bearing column arranged oppositely on the two sides of the flower basket frame and the bearing space formed between the adjacent two bearing teeth, when the silicon wafer flower basket is needed to carry the silicon wafer, the silicon wafer can be inserted into the bearing space.
[0006] When the thin silicon wafer is placed in the bearing space, the deformation amount of the silicon wafer is greater than that of the thick silicon wafer in the bearing space. At this time, by keeping the predetermined interval between the adjacent two bearing teeth at 4mm-8mm, when two thin silicon wafers are placed in the adjacent two bearing spaces, sufficient bending interval can be formed between the two thin silicon wafers, effectively reducing the sticking rate of the thin silicon wafer when being loaded in the silicon wafer flower basket. Further, when the silicon wafer is carried by the silicon wafer flower basket for cleaning and drying, the adjacent two thin silicon wafers will not be stuck to each other, and the silicon wafer will not have water marks or dirt, effectively ensuring the cleaning efficiency and production quality of the silicon wafer, and reducing the silicon wafer loss rate.
[0007] As an improvement of the above scheme, the thickness of the bearing tooth is 2mm-2.5mm.
[0008] The thickness of the bearing tooth is 2mm-2.5mm, so that the bending distance between the two adjacent bearing spaces can meet the deformation of the thin silicon wafer.
[0009] As an improvement of the above scheme, each bearing tooth extends along the width direction of the basket frame, and the bearing tooth forms a predetermined tooth length of 30mm-40mm.
[0010] The predetermined tooth length of the bearing tooth is designed to be 30mm-40mm, so as to provide sufficient support force for the silicon wafer, to offset the force of the moisture on the silicon wafer to a certain extent, thereby reducing the deformation of the silicon wafer caused by the residual moisture, and further reducing the wafer sticking rate when the silicon wafer is loaded in the silicon wafer basket.
[0011] As an improvement of the above scheme, it further comprises:
[0012] The basket frame is formed with oppositely arranged first and second end plates, and the bearing column is located between the first and second end plates; the two ends of the silicon wafer stopper are connected with the first and second end plates, respectively.
[0013] The silicon wafer stopper is located below the bearing tooth, and the bearing tooth at the top of the basket frame forms a bearing surface, and a predetermined loading depth is formed between the bearing surface and the top of the silicon wafer stopper, and the predetermined loading depth is 80mm-150mm.
[0014] The first and second end plates and the plurality of bearing columns therebetween form a complete basket frame, which is convenient for carrying a plurality of silicon wafers. And the predetermined loading depth is set to 80mm-150mm to increase the overall support range of the silicon wafer in the bearing space of the silicon wafer basket, thereby improving the loading stability of the silicon wafer in the silicon wafer basket, avoiding the shaking during movement and causing the collision between the adjacent silicon wafers, and further reducing the wafer sticking rate.
[0015] As an improvement of the above scheme, the first and second end plates are formed with an adjusting groove and a plurality of height grooves, wherein each height groove is connected with the adjusting groove, the adjusting groove extends along the height direction of the first and second end plates, and a specific angle is formed between the height groove and the adjusting groove.
[0016] The end of the silicon wafer stopper moves between the adjusting groove and the plurality of height grooves, and the end of the silicon wafer stopper is detachably connected to one of the height grooves.
[0017] The utility model discloses a first end plate and second end plate are formed with adjusting groove and multiple height grooves, and then the position of the end of the silicon wafer stop lever in the multiple height grooves is adjusted, and the height of the top of the silicon wafer stop lever in the silicon wafer basket is correspondingly adjusted, so that the silicon wafer basket can have different predetermined loading depths according to different height groove heights, and the predetermined loading depth of the silicon wafer basket can be adaptively adjusted according to the actual required silicon wafer width, and the adaptability of the silicon wafer basket to different size specifications of silicon wafers is enhanced.
[0018] As an improvement of the above-mentioned scheme, each of the bearing teeth is connected to two adjacent bearing columns, and the distance between any two adjacent bearing columns is the same.
[0019] The utility model discloses a bearing column between any two adjacent bearing columns is designed as the same, to avoid the distance between the two bearing teeth distributed along the height direction of the silicon wafer basket is not uniform, and the problem of knocking or jamming in the process of inserting the silicon wafer, thereby reducing the collapse of the edge of the silicon wafer due to knocking and other adverse phenomena.
[0020] As an improvement of the above-mentioned scheme, the bearing teeth and the bearing column are integrally formed.
[0021] The utility model discloses a bearing tooth and bearing column are designed as integrally formed connection mode, to improve the overall structure strength of the silicon wafer basket, avoid the deformation or damage of the silicon wafer basket when bearing weight and stress, at the same time, simplify the manufacturing process of the silicon wafer basket.
[0022] As an improvement of the above-mentioned scheme, the bearing teeth and the bearing column are detachably connected.
[0023] The utility model discloses a bearing tooth and bearing column are designed as detachable connection mode, to adaptively adjust the distance between the bearing teeth according to the actual silicon wafer thickness and silicon wafer deformation, to further ensure that the silicon wafers will not be adhered to each other when loaded in the silicon wafer basket, and affect the cleaning efficiency of the silicon wafers.
[0024] As an improvement of the above-mentioned scheme, one of the bearing teeth and the bearing column forms a plug-in column, and the other forms a plug-in hole, and the bearing teeth and the bearing column are connected through the plug-in column and the plug-in hole.
[0025] As an improvement of the above-mentioned scheme, the plug-in column is formed on the bearing tooth, and the bearing column is formed with multiple plug-in holes; among any three adjacent plug-in holes, a first gap is formed between the plug-in hole in the middle and the plug-in hole on the left side, a second gap is formed between the plug-in hole in the middle and the plug-in hole on the right side, and the first gap and the second gap are not equal.
[0026] The utility model discloses a plug -in column is formed in the bearing tooth, and the bearing column is formed with a plurality of plug -in holes, in any three adjacent plug -in holes, the first gap is formed between the plug -in hole in the middle and the plug -in hole on the left side, the second gap is formed between the plug -in hole in the middle and the plug -in hole on the right side, the first gap and the second gap are not equal, so that when the plug -in column is inserted into different plug -in holes, different spacing can be formed, so that the bearing basket can adapt to silicon wafer of different sizes, and the spacing can be adjusted according to actual demand to adapt to silicon wafer of different specifications. BRIEF DESCRIPTION OF DRAWINGS
[0027] Figure 1 It is the three -dimensional structure schematic diagram of silicon wafer basket in an embodiment of the utility model;
[0028] Figure 2 It is the overhead structure schematic diagram of silicon wafer basket in an embodiment of the utility model;
[0029] Figure 3 It is Figure 1 The enlarged structure schematic diagram of A place in middle;
[0030] Figure 4 It is the front view structure schematic diagram of first end plate or second end plate in another embodiment of the utility model;
[0031] Figure 5 It is the position arrangement schematic diagram of adjacent bearing tooth on the bearing column in another embodiment of the utility model.
[0032] Figure 6 It is the three -dimensional structure schematic diagram of bearing tooth with plug -in column in another embodiment of the utility model. DETAILED DESCRIPTION
[0033] In order to make the purpose, technical scheme and advantage of the utility model more clear, the utility model will be described further in detail below with the drawings. Only this declaration, the up, down, left, right, front, back, inside, outside and other orientation words appearing or about to appear in the utility model in the text, only with the drawings of the utility model for the base, its is not the specific limitation of the utility model.
[0034] The silicon wafer basket provided by the utility model can reduce the wafer sticking rate when thin silicon wafer is loaded in the silicon wafer basket by forming sufficient bending spacing between two thin silicon wafers, and effectively guarantees the cleaning efficiency of the silicon wafer.
[0035] In one specific embodiment of the utility model, as Figures 1 to 3As shown, the silicon wafer basket comprises a basket frame 1 and a plurality of bearing columns 2 mounted inside the basket frame 1, wherein part of the bearing columns 2 are located on the opposite sides of the basket frame 1 respectively, each bearing column 2 is connected with a plurality of bearing teeth 3, the plurality of bearing teeth 3 are arranged at intervals along the axial direction of the bearing column 2 (i.e. the X-axis direction in the figure) Figure 1 , each bearing tooth 3 extends along the direction perpendicular to the bearing column 2, and a predetermined interval is formed between any two adjacent bearing teeth 3, in some embodiments, the predetermined interval is set to 4mm-8mm, to ensure that the predetermined interval is much larger than the thickness of the silicon wafer to be carried.
[0036] According to the silicon wafer basket of the present embodiment, the two part bearing columns 2 arranged on the opposite sides of the basket frame 1 and the adjacent two bearing teeth 3 form a bearing space, when the silicon wafer basket needs to carry the silicon wafer, the silicon wafer can be inserted into the bearing space.
[0037] When the thin silicon wafer is placed in the bearing space, the deformation amount of the silicon wafer is greater than that of the thick silicon wafer in the bearing space. At this time, by keeping the predetermined interval between the adjacent two bearing teeth 3 to 4mm-8mm, when two thin silicon wafers are placed in the adjacent two bearing spaces, the bending interval between the two thin silicon wafers can be sufficient, effectively reducing the wafer sticking rate when the thin silicon wafer is loaded in the silicon wafer basket. Further, when the silicon wafer is carried by the silicon wafer basket for cleaning and drying, the adjacent two thin silicon wafers will not be stuck together to cause silicon wafer watermark or dirt, effectively ensuring the cleaning efficiency and production quality of the silicon wafer, and reducing the wafer loss rate.
[0038] It should be noted that the predetermined interval between any two adjacent bearing teeth 3 can be determined according to the actual thickness of the silicon wafer to be placed. For example, when the minimum thickness of the silicon wafer to be placed in the silicon wafer basket is 80μm, the predetermined interval between any two adjacent bearing teeth 3 is 8mm; when the thickness of the silicon wafer to be placed in the silicon wafer basket is 140μm, the predetermined interval is 4mm, to ensure that the interval between the adjacent two bearing spaces in the silicon wafer basket can adapt to the deformation amount of the silicon wafer with a thickness of 80μm-140μm in the basket.
[0039] Further, since the interval between the adjacent two bearing spaces is determined according to the interval between the adjacent bearing teeth 3 and the thickness of the bearing teeth 3, to further ensure that the bending interval between the adjacent two bearing spaces can meet the deformation amount of the thin silicon wafer, the thickness of the bearing teeth 3 is 2mm-2.5mm.
[0040] When the minimum thickness of the silicon wafer to be placed in the silicon wafer basket is 80μm, the thickness of each bearing tooth 3 is preferably 2mm, so that when the thin silicon wafer is placed in the bearing space, the interval between the adjacent two silicon wafers is 6.8mm, so that the interval between the adjacent two silicon wafers is greater than the deformation amount of the silicon wafer, effectively avoiding the adhesion of the adjacent silicon wafers.
[0041] Among them, each bearing tooth 3 is along the width direction of the basket frame 1 (i.e., Figure 1 Extending along the Y-axis, the bearing tooth 3 forms a predetermined tooth length of 30mm-40mm. Preferably, the predetermined tooth length of the bearing tooth 3 is 35mm to provide sufficient support for the silicon wafer, thereby offsetting the force exerted on the silicon wafer by moisture to a certain extent, reducing the increased deformation of the silicon wafer due to residual moisture, and further reducing the wafer adhesion rate when the silicon wafer is loaded into the silicon wafer basket.
[0042] In this embodiment, as Figure 1 As shown, the silicon wafer basket also includes silicon wafer support rods 4. The basket frame 1 has a first end plate 11 and a second end plate 12 arranged opposite to each other. The support column 2 is located between the first end plate 11 and the second end plate 12. The two ends of the silicon wafer support rod 4 are respectively connected to the first end plate 11 and the second end plate 12, so as to form a complete basket frame 1 by using the first end plate 11, the second end plate 12 and the multiple support columns 2 between them, which facilitates the support of multiple silicon wafers.
[0043] Specifically, the two ends of the bearing column 2 and the two ends of the silicon wafer stop bar 4 can be detachably installed on the first end plate 11 and the second end plate 12 by fasteners such as bolts or studs. The distance between the opposite bearing columns 2 on both sides of the silicon wafer basket is greater than or equal to the length of the silicon wafer to be supported, so that the long side of the thin silicon wafer can be inserted into the bearing space of the silicon wafer basket to complete the support of the silicon wafer by the silicon wafer basket.
[0044] The silicon wafer stop bar 4 is located below the bearing tooth 3, and the bearing tooth 3 at the top of the basket frame 1 forms a bearing surface 31. A predetermined loading depth is formed between the bearing surface 31 and the top of the silicon wafer stop bar 4. The predetermined loading depth is 80mm-150mm, which increases the overall support range of the silicon wafer in the bearing space of the silicon wafer basket, thereby improving the loading stability of the silicon wafer in the silicon wafer basket, avoiding shaking during movement and causing collisions between adjacent silicon wafers, and further reducing the silicon wafer adhesion rate.
[0045] It should be noted that the predetermined loading depth between the bearing surface 31 and the silicon wafer stop bar 4 can be adjusted and determined according to the required width of the silicon wafer. Preferably, the predetermined loading depth is equal to the required width of the silicon wafer to ensure that the silicon wafer does not protrude beyond the top of the bearing space when it is loaded. This ensures that the silicon wafer basket can accommodate the size specifications of the silicon wafers and further prevents adjacent silicon wafers from colliding due to shaking when the basket moves. For example, when the loaded silicon wafer is 182mm long and 105mm wide, the predetermined loading depth is preferably 105mm.
[0046] In another embodiment of this utility model, to facilitate adjusting the predetermined loading depth of the silicon wafer basket according to the actual silicon wafer size, such as...Figure 4 As shown, the first end plate 11 and the second end plate 12 are both formed with an adjusting groove 13 and a plurality of height grooves 14, each of which is connected with the adjusting groove 13, the adjusting groove 13 extends along the height direction of the first end plate 11 and the second end plate 12, and the height grooves 14 form a specific angle with the first adjusting groove 13. The end of the silicon wafer stopper 4 moves between the adjusting groove 13 and the plurality of height grooves 14, and the end of the silicon wafer stopper 4 is detachably connected to one of the height grooves 14.
[0047] Further, by adjusting the position of the end of the silicon wafer stopper 4 in the plurality of height grooves 14, the height of the top of the silicon wafer stopper 4 in the silicon wafer basket can be correspondingly adjusted, so that the silicon wafer basket can have different predetermined loading depths according to different height grooves 14, and the predetermined loading depth of the silicon wafer basket can be adaptively adjusted according to the actual required loading width of the silicon wafer, thereby enhancing the adaptability of the silicon wafer basket to different size specifications of the silicon wafer.
[0048] Preferably, the specific angle formed between each height groove 14 and the adjusting groove 13 is 90°, and each height groove 14 forms an L-shaped groove structure with the adjusting groove 13. Of course, the height grooves 14 can also be inclined downward relative to the adjusting groove 13, which can be selected and arranged according to actual conditions.
[0049] In this embodiment, as shown in Figures 1 to 3 The plurality of bearing teeth 3 are arranged in two layers inside the basket frame 1, and the two layers of bearing teeth 3 are arranged in parallel at the same interval between the plurality of bearing columns 2 distributed along the height direction of the silicon wafer basket, so that the silicon wafer is inserted into the bearing space along the height direction of the silicon wafer basket.
[0050] Further, as shown in Figures 1 to 3 Each bearing tooth 3 is connected to two adjacent bearing columns 2, and the interval between any two adjacent bearing columns 2 is the same, so as to avoid the problem of uneven interval between two bearing teeth 3 distributed along the height direction of the silicon wafer basket (i.e. the direction of the Z axis in Figure 1 which can cause bumping or jamming during the insertion of the silicon wafer, thereby reducing the edge collapse and other adverse phenomena caused by bumping at the chamfered edge of the silicon wafer. Preferably, the interval between any two adjacent bearing columns 2 is 31mm.
[0051] In this embodiment, the bearing tooth 3 and the bearing column 2 can be integrally formed in a connection mode, so as to improve the overall structural strength of the silicon wafer basket, avoid deformation or damage of the silicon wafer basket when bearing weight and stress, and simplify the manufacturing process of the silicon wafer basket. Preferably, the bearing tooth 3 and the bearing column 2 are integrally formed by injection molding.
[0052] In another embodiment, the carrier teeth 3 and the carrier columns 2 can also be detachably connected, so as to adaptively adjust the spacing between the carrier teeth 3 according to the actual thickness of the silicon wafer and the deformation of the silicon wafer, to further ensure that the silicon wafers do not adhere to each other when loaded in the silicon wafer basket, thereby affecting the cleaning efficiency of the silicon wafers.
[0053] Specifically, to achieve detachable connection between the carrier teeth 3 and the carrier columns 2, as shown in Figure 5 and Figure 6 , one of the carrier teeth 3 and the carrier columns 2 forms a plug-in column 32, and the other forms a plug-in hole 21, and the carrier teeth 3 and the carrier columns 2 are connected by plug-in column 32 and plug-in hole 21. Furthermore, when using the silicon wafer basket to carry thick silicon wafers, the density of the carrier teeth 3 inserted into the plug-in hole 21 of the carrier column 2 can be increased to ensure that adjacent thick silicon wafers do not adhere to each other while increasing the loading capacity of the silicon wafer basket as much as possible. When using the silicon wafer basket to carry thin silicon wafers, the density of the carrier teeth 3 inserted into the plug-in hole 21 of the carrier column 2 can be reduced to enable the bending spacing between adjacent carrier spaces to meet the deformation of the thin silicon wafers, thereby ensuring that adjacent thin silicon wafers do not adhere to each other.
[0054] More specifically, the plug-in column 32 is formed on the carrier tooth 3, and the carrier column 2 is formed with a plurality of plug-in holes 21. In any three adjacent plug-in holes 21, the plug-in hole 21 located in the middle and the plug-in hole 21 located on the left form a first gap, and the plug-in hole 21 located in the middle and the plug-in hole 21 located on the right form a second gap, and the first gap and the second gap are not equal. Furthermore, the carrier teeth 3 can be inserted into adjacent plug-in holes 21 with different gaps by plug-in column 32, so that adjacent carrier teeth 3 can correspondingly have different predetermined spacings between carrier teeth 3 according to plug-in holes 21 with different gaps, so as to adaptively adjust the predetermined spacing according to different specifications of silicon wafers.
[0055] For example, as shown in Figure 5 , any two plug-in holes 21 of adjacent first gaps are regarded as a group of plug-in hole groups, and in adjacent two groups of plug-in hole groups, the predetermined spacing between adjacent two carrier teeth 3 can form three different spacings. That is, when the plug-in column 32 of the carrier tooth 3 is inserted into the plug-in holes 21 close to each other in the adjacent two groups of plug-in holes, the minimum predetermined spacing d1 between the adjacent two carrier teeth 3 is formed; when the plug-in column 32 of the carrier tooth 3 is inserted into the plug-in holes 21 away from each other in the adjacent two groups of plug-in holes, the maximum predetermined spacing d3 between the adjacent two carrier teeth 3 is formed; when the plug-in column 32 of the carrier tooth 3 is inserted into the plug-in holes 21 arranged alternately in the adjacent two groups of plug-in holes, the intermediate predetermined spacing d2 between the adjacent two carrier teeth 3 is formed.
[0056] It should be noted that in special cases, the two adjacent bearing teeth 3 can be inserted into two insertion holes 21 spaced apart by multiple insertion holes 21 to further adapt to the thickness of the silicon wafer.
[0057] A specific embodiment of the present application will be described below.
[0058] It should be noted that in the existing flower basket, the spacing between adjacent silicon wafers is 3.5mm, the silicon wafer bearing tooth 3 in the flower basket is 24mm long, and the loading depth of the silicon wafer is 170mm. When the existing flower basket is used to load thin silicon wafers with a length of 182mm, a width of 105mm, and a thickness of 80μm-100μm, the spacing between adjacent silicon wafers is too small to meet the deformation amount of the thin silicon wafer, and the bearing tooth 3 cannot provide sufficient support for the silicon wafer, resulting in that the adjacent silicon wafers are easily adhered and cannot be separated during cleaning.
[0059] In the embodiment, the predetermined spacing between any two adjacent bearing teeth 3 is set to 4.8mm, and the thickness of each bearing tooth 3 is set to 2mm, so that a bearing space with a spacing of 6.8mm is formed between the two adjacent silicon wafers. Compared with the existing flower basket, the spacing between the two adjacent silicon wafers is increased by 3.3mm, thereby providing sufficient bending spacing for the deformation of the silicon wafer. At the same time, the tooth length of the bearing tooth 3 is set to 35mm, which is increased by 11mm compared with the existing flower basket, so as to provide sufficient support for the silicon wafer. Further, by using the silicon wafer flower basket provided in the embodiment, sufficient bending spacing can be provided for the deformation of the silicon wafer, and sufficient support can be provided for the silicon wafer, thereby effectively solving the adhesion problem of the thin silicon wafer with a length of 182mm, a width of 105mm, and a thickness of 80μm-100μm, reducing the re-washing rate of the silicon wafer, improving the quality and production efficiency of the silicon wafer, reducing the waste of silicon material, and saving costs.
[0060] In addition, the overall size of the silicon wafer flower basket in the embodiment is consistent with the existing flower basket, so as to ensure that small-size and thin-thickness silicon wafers can be produced under the cooperation of the existing silicon wafer insertion and silicon wafer cleaning equipment, the cost of replacing the entire equipment is saved, and the benefits are increased.
[0061] The above describes the preferred embodiments of the present application. It should be noted that for ordinary skilled persons in the technical field, without departing from the principles of the present application, a number of improvements and refinements can be made, which are also considered within the protection scope of the present application.
Claims
1. A silicon wafer flower basket, characterized in that, The device includes a flower basket frame and multiple support columns installed inside the flower basket frame. Some of the support columns and another part of the support columns are located on opposite sides of the flower basket frame. Each support column is connected to multiple support teeth, which are spaced apart along the axial direction of the support column. Each support tooth extends in a direction perpendicular to the support column, and a predetermined spacing is formed between any two adjacent support teeth, which is 4mm-8mm. Each of the supporting teeth extends along the width direction of the basket frame, and the supporting teeth form a predetermined tooth length of 30mm-40mm.
2. The silicon wafer flower basket according to claim 1, characterized in that, The thickness of the bearing tooth is 2mm-2.5mm.
3. The silicon wafer flower basket according to claim 1, characterized in that, Also includes: A silicon wafer stop bar, wherein the basket frame has a first end plate and a second end plate arranged opposite to each other, and the supporting column is located between the first end plate and the second end plate; the two ends of the silicon wafer stop bar are respectively connected to the first end plate and the second end plate; The silicon wafer stop bar is located below the bearing tooth, and the bearing tooth located at the top of the basket frame forms a bearing surface. A predetermined loading depth is formed between the bearing surface and the top of the silicon wafer stop bar, and the predetermined loading depth is 80mm-150mm.
4. The silicon wafer flower basket according to claim 3, characterized in that, Both the first end plate and the second end plate are formed with an adjustment groove and a plurality of height grooves, wherein each height groove is connected to the adjustment groove, the adjustment groove extends along the height direction of the first end plate and the second end plate, and a specific angle is formed between the height groove and the adjustment groove; The end of the silicon wafer stop bar moves between the adjustment groove and the plurality of height grooves, and the end of the silicon wafer stop bar is detachably connected to one of the height grooves.
5. The silicon wafer flower basket according to claim 1, characterized in that, Each of the bearing teeth is connected to two adjacent bearing posts, and the spacing between any two adjacent bearing posts is the same.
6. The silicon wafer flower basket according to claim 1, characterized in that, The bearing tooth is integrally formed with the bearing column.
7. The silicon wafer flower basket according to claim 1, characterized in that, The bearing tooth is detachably connected to the bearing post.
8. The silicon wafer flower basket according to claim 7, characterized in that, One of the bearing tooth and the bearing post forms a plug-in post, and the other forms a plug-in hole. The bearing tooth and the bearing post are connected by the plug-in post and the plug-in hole.
9. The silicon wafer flower basket according to claim 8, characterized in that, The insertion post is formed on the bearing tooth, and the bearing post has a plurality of insertion holes; In any three adjacent plug holes, a first gap is formed between the middle plug hole and the left plug hole, and a second gap is formed between the middle plug hole and the right plug hole. The first gap and the second gap are not equal.