Height adjuster on bonding carrier

Abstract

The utility model belongs to the field of semiconductor manufacturing equipment, and particularly relates to a height adjuster on a bonding carrier, which comprises a limit rod, a sleeve arranged on the limit rod, a pin shaft arranged between the limit rod and the sleeve, and a graduated scale arranged on the limit rod, so that the sleeve accurately moves on the limit rod. The height of the sleeve is adjusted according to the thickness of a silicon wafer during bonding, and the sleeve and the limiting rod are fixed through the pin shaft, so that the stability between the sleeve and the limiting rod is improved; compared with the prior art, the bonding precision is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of semiconductor manufacturing equipment more particularly, it relates to a height regulator on the bonding carrier. BACKGROUND

[0002] In the semiconductor manufacturing process, the bonding plays the key role of fixing the silicon wafer and carrying out the precision operation, and the high precision adjustment is important to ensure the bonding quality and production efficiency of the silicon wafer, with the continuous development of semiconductor technology, the requirement of height regulator is also higher and higher.

[0003] Traditional height regulator such as Figure 1 As shown in the figure: it includes screw 01 and spring 02, the one end of screw 01 and the one end of spring 02 resist, by rotating screw 01, screw 01 and spring 02 are extruded, the distance between silicon wafers can be adjusted, and the height adjustment is realized by manually rotating screw 01;

[0004] When working, the silicon wafer is prevented from being attached by screw 01, when the thickness of the silicon wafer is inconsistent, the height thereof cannot be adjusted more accurately, because the silicon wafer is fixed by screw 01, in the bonding process, the silicon wafer is shifted or damaged due to the loosening of screw 01, thereby reducing the bonding accuracy. UTILITY MODEL CONTENT

[0005] In view of the deficiencies in the prior art, the utility model aims at providing a height regulator on the bonding carrier for improving the bonding accuracy.

[0006] To achieve the above object, the utility model provides the following technical scheme:

[0007] A height regulator on the bonding carrier, including the limit rod, the limit rod is equipped with the sleeve, the sleeve is on the limit rod outer wall and with the limit rod outer wall sliding connection,

[0008] The pin shaft is vertically distributed between the limit rod and the sleeve,

[0009] The one end of the pin shaft is inserted into the sleeve and is inserted into the limit rod outer wall.

[0010] The limit rod outer wall is equipped with the scale on the limit rod outer wall,

[0011] The scale is arranged between the limit rod and the sleeve.

[0012] The utility model is further provided with: the limit rod outer wall is equipped with a plurality of longitudinal distribution's plug-in hole, the one end of pin shaft is equipped with the clamping block, and the clamping block is inserted into the plug-in hole and is fixed with the plug-in hole.

[0013] The utility model is further provided with: the sleeve one side is equipped with the hole site for the pin shaft to insert, and the hole site is communicated with the plug-in hole.

[0014] By adopting the technical scheme, the utility model has the advantages that:

[0015] By setting the scale on the limiting rod, the sleeve is accurately moved on the limiting rod, so that the height of the sleeve is adjusted according to the thickness of the silicon wafer during bonding, thereby improving bonding accuracy; the sleeve and the limiting rod are fixed through the pin shaft, thereby improving the stability between the sleeve and the limiting rod. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 For the prior art;

[0017] Figure 2 For the structure schematic view of the utility model embodiment.

[0018] The limiting rod 1, the sleeve 2, the pin shaft 3, the scale 4, the plug hole 5, the clamping block 6, the hole position 7. DETAILED DESCRIPTION

[0019] The technical scheme in the utility model embodiments will be clearly and completely described below with reference to the drawings in the utility model embodiments. Obviously, the described embodiments are only a part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of the utility model.

[0020] In the description of the utility model, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the utility model.

[0021] As Figure 2 As shown in the figure, the height adjuster on the bonding carrier includes a limiting rod 1, and a sleeve 2 moves up and down along the limiting rod 1. Through the scale 4 on the limiting rod 1, the height of the sleeve 2 can be accurately adjusted according to the data on the scale 4.

[0022] Then the clamping block 6 on the pin shaft 3 first passes through the hole position 7 on the sleeve 2, and then extends into the plug hole 5. At this time, the pin shaft 3 is extruded towards the limiting rod 1, so that the clamping block 6 is clamped and fixed in the plug hole 5, realizing the fixation of the limiting rod 1 and the sleeve 2.

[0023] Since the nine plug-in holes 5 are arranged on the outer wall of the limiting rod 1, one of the plug-in holes 5 can be selected according to the thickness of the silicon wafer, so that the height of the sleeve 2 can be adjusted flexibly. After adjustment, the plug-in hole 5 should be communicated with the hole position 7, so that the pin shaft 3 can pass through the hole position 7 and the plug-in hole 5 and be fixed. At this time, the sleeve 2 and the limiting rod 1 can be fixed by the pin shaft 3.

[0024] By arranging the scale 4 on the limiting rod 1, the sleeve 2 can be accurately moved on the limiting rod 1, so that the height of the sleeve 2 can be adjusted according to the thickness of the silicon wafer during bonding, thereby improving the bonding accuracy. The sleeve 2 and the limiting rod 1 are fixed by the pin shaft 3, thereby improving the stability between the sleeve 2 and the limiting rod 1.

[0025] The above only describes the preferred embodiments of the present application and is not intended to limit the present application. Any common changes and replacements within the technical scheme of the present application should be included in the protection scope of the present application.

Claims

1. A height adjuster on a bonding carrier, characterized by, Including limit rod (1), The sleeve (2) is arranged on the outer wall of the limit rod (1) and is in sliding connection with the outer wall of the limit rod (1), The pin shaft (3) is vertically distributed with the limit rod (1), One end of the pin shaft (3) extends into the sleeve (2) and is inserted with the outer wall of the limit rod (1), The outer wall of the limit rod (1) is provided with a scale (4) on the outer wall of the limit rod (1), The scale (4) is arranged between the limit rod (1) and the sleeve (2).

2. A height adjuster for a bonding carrier according to claim 1, wherein A plurality of longitudinally distributed plug-in holes (5) are formed in the outer wall of the limit rod (1), one end of the pin shaft (3) is provided with a clamping block (6), and the clamping block (6) extends into the plug-in hole (5) and is fixed with the plug-in hole (5).

3. A height adjuster for a bonding carrier according to claim 2, wherein The sleeve (2) is provided with a hole (7) on one side for the pin shaft (3) to extend into, and the hole (7) is in communication with the plug-in hole (5).

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