Integrated circuit packaging chip mounting pressing plate

Abstract

The utility model relates to the technical field of integrated circuit packaging, in particular to a chip mounting pressing plate for integrated circuit packaging, which comprises a pressing plate body and a pressure distribution plate, the pressing plate body comprises a positioning part and a pressing part, the positioning part is provided with a lead frame positioning hole, the side surface of the pressing part is fixedly connected with a pressing sheet, the pressing sheet is provided with a plurality of racks, and the racks are arranged on the pressing sheet. The pressure distribution plate is located below the pressing plate body, two rows of symmetrical vacuum holes are formed in the pressure distribution plate, and the rack gap corresponds to the vacuum holes in position. The problem that the chip is damaged or the qualified rate of products is low due to the fact that the pressure distribution of the chip mounting pressing plate is not uniform in the pressing process is solved.

Description

TECHNICAL FIELD

[0001] The utility model relates to integrated circuit packaging technical field, concretely is a kind of integrated circuit packaging and sheet pressing plate. BACKGROUND

[0002] Chip bare chip produced by manufacturer cannot be directly used, first, bare chip is silicon material, easy to break, second, bare chip cannot be powered, thus needs to be packaged, its process is wrapped by high molecular resin material, adds a resin shell to chip, and output point and input point are connected on carrier by lead to form pin.In integrated circuit chip packaging process, bare chip is taken off from bearing medium, and accurately placed to packaging substrate or lead frame by sheet pressing plate, and sheet pressing plate is the key tool in packaging process.

[0003] At present, sheet pressing plate is unevenly distributed in pressing process due to some problems such as complex structure and unreasonable material selection, which can easily cause lead frame to be deformed and warped, cause chip to be damaged or be poorly packaged, affect the performance and reliability of integrated circuit, and also affect packaging efficiency. SUMMARY

[0004] The utility model solves the technical problems in that provide a kind of integrated circuit packaging and sheet pressing plate, solve the uneven distribution of pressure in the pressing process of sheet pressing plate, cause chip to be damaged or the problem of low product qualification rate.

[0005] The utility model provides basic scheme: a kind of integrated circuit packaging and sheet pressing plate, including pressing plate body, pressure distribution plate, the pressing plate body includes positioning part, pressing part, the positioning part is equipped with lead frame positioning hole, the pressing part side is fixedly connected with a pressing sheet, the pressing sheet is provided with multiple racks, the pressure distribution plate is located below pressing plate body, two rows of vacuum holes are symmetrically set on the pressure distribution plate, the number of each column vacuum hole is multiple, and vacuum hole and each rack gap position correspond.

[0006] Preferably, the positioning part is further provided with a base positioning hole for positioning with the base.

[0007] Preferably, the upper end surface of the pressure distribution plate is provided with a positioning groove, and the positioning groove includes a first positioning groove and a second positioning groove located on the left and right sides of the pressing plate body respectively.

[0008] Further preferably, the number of the first positioning groove and the second positioning groove is two.

[0009] Further preferably, the groove bottom of the positioning groove is provided with a first positioning hole and a second positioning hole, the first positioning hole is used for positioning with the base, and the second positioning hole is used for positioning with the lead frame.

[0010] Preferably, the pressing plate body is made of ceramic or metal composite material.

[0011] Preferably, the distance between the two rows of vacuum holes is 1.5-3mm.

[0012] Further preferably, the distance between the two rows of vacuum holes is 2mm.

[0013] Preferably, the aperture of the vacuum hole is 0.1-0.3mm.

[0014] Further preferably, the aperture of the vacuum hole is 0.2mm.

[0015] The utility model discloses the beneficial effect is: through setting up the lead frame positioning hole on the positioning part of pressing plate body, be used for accurate positioning to lead frame, ensure that the position is accurate in the pressing process of chip, be equipped with vacuum hole on pressure distribution board, and through vacuum hole adsorption chip, and in the pressing process, the airflow follows vacuum hole flow, and the uniform distribution of pressure, avoid the chip damage or bad package caused by uneven pressure, improve the yield and reliability of integrated circuit package.

[0016] Preferably, the positioning part is also provided with a base positioning hole for positioning with the base, and through the base positioning hole and the base positioning, the lead frame positioning hole is positioned with the lead frame, to ensure the accurate position of the chip placement, and the position is not deviated in the pressing process, effectively improving the reliability of chip packaging, and further improving the product quality and the pass rate.

[0017] Preferably, the upper end surface of the pressure distribution board is provided with a positioning groove, and the positioning groove includes a first positioning groove and a second positioning groove located on the left and right sides of the pressing plate body respectively. The groove bottom of the positioning groove is provided with a first positioning hole and a second positioning hole, and the first positioning hole is used for positioning with the base, and the second positioning hole is used for positioning with the lead frame. The positioning groove is arranged on the two sides of the pressure distribution board to be used for centering and limiting with the substrate and the lead frame, so as to ensure the accurate and reliable position in the pressing process.

[0018] Preferably, the pressing plate body is made of ceramic or metal composite material, and by using high-strength and low-thermal expansion coefficient material, the high performance and reliability of the pressing plate in the high-temperature packaging process are improved.

[0019] Preferably, the distance between the two rows of vacuum holes is 1.5-3mm. The aperture of the vacuum hole is 0.1-0.3mm. The distance on the pressing plate body is adapted to the size of the adsorbed chip, and the through hole with small aperture is arranged to ensure that the pressure is uniformly applied to the surface of the chip. BRIEF DESCRIPTION OF DRAWINGS

[0020] Fig. 1 It is the structure schematic view of the pressing plate body of the utility model.

[0021] Fig. 2 It is the structure schematic view of the pressure distribution plate of the utility model.

[0022] The marks in the description drawing include: pressing part 11, positioning part 12, lead frame positioning hole 121, base positioning hole 122, pressure distribution plate 2, vacuum hole 21, first positioning groove 22, second positioning groove 23, pressing sheet 3. Specific implementation

[0023] The following is further explained in detail through specific implementation:

[0024] Referring to Figs. 1-2 An integrated circuit packaging die pressing plate, comprising a pressing plate body and a pressure distribution plate 2. The pressing plate body adopts ceramic or metal composite material. The pressing plate body comprises a positioning part 12 and a pressing part 11. The positioning part 12 is provided with a lead frame positioning hole 121. The positioning part 12 is also provided with a base positioning hole 122 for positioning with a base. The pressing part 11 is fixedly connected with a pressing sheet 3 on the side surface. The pressing sheet 3 is provided with a plurality of racks. In this embodiment, 17 racks are provided. The pressure distribution plate 2 is located below the pressing plate body. Two rows of vacuum holes 21 are symmetrically arranged on the pressure distribution plate 2. The number of each row of vacuum holes 21 is a plurality. In this embodiment, the number of each row of vacuum holes 21 is 16. The vacuum holes 21 correspond to the gap positions of each rack.

[0025] A positioning groove is arranged on the upper end surface of the pressure distribution plate 2. A first positioning hole and a second positioning hole are arranged on the groove bottom of the positioning groove. The first positioning hole is used for positioning with a base. The second positioning hole is used for positioning with a lead frame. The positioning groove comprises a first positioning groove 22 and a second positioning groove 23, which are respectively arranged on the left and right sides of the pressing plate body. The number of the first positioning groove 22 and the second positioning groove 23 is both two.

[0026] The distance between the two rows of vacuum holes 21 is 1.5-3mm, which is adjusted according to the size of the chip and the packaging requirements to ensure that the pressure is uniformly applied to the surface of the chip. In this embodiment, the distance between the two rows of vacuum holes 21 is 2mm.

[0027] The aperture of the vacuum hole 21 is 0.1-0.3mm. In this embodiment, the aperture of the vacuum hole 21 is 0.2mm.

[0028] When the chip is pressed, the pressure is applied to the pressing plate body, and because the pressing plate body is provided with the pressure distribution plate 2 under the pressing plate body and the pressing strip corresponds to the position of the vacuum hole 21, the pressure on the pressing plate body is transmitted to the pressure distribution plate 2 through the pressing strip, so that the pressure on the pressure distribution plate 2 is uniformly applied to the chip, thereby avoiding the problems of chip damage or product failure caused by uneven pressure distribution.

[0029] The above is only an embodiment of the present application, and the common knowledge of specific structures and characteristics in the scheme is not described in detail, the ordinary skilled in the art knows all the ordinary technical knowledge in the technical field of the present application before the application date or the priority date, can know all the prior art in the field, and has the ability to apply conventional experimental means before the date, the ordinary skilled in the art can improve and implement the present scheme under the inspiration given in the present application, some typical known structures or known methods should not be an obstacle for the ordinary skilled in the art to implement the present application. It should be pointed out that for those skilled in the art, without departing from the structure of the present application, a number of modifications and improvements can be made, which should also be considered as the protection scope of the present application, which will not affect the effect and practicality of the present application. The protection scope of the present application should be subject to the content of its claims, and the specific implementation mode in the specification can be used to explain the content of the claims.

Claims

1. An integrated circuit package die attach paddle, comprising: The application relates to a pressing plate body, a pressure distribution plate (2), the pressing plate body comprises a positioning part (12) and a pressing part (11), the positioning part (12) is provided with a lead frame positioning hole (121), the pressing part (11) is fixedly connected with a pressing sheet (3) on the side surface, the pressing sheet (3) is provided with a plurality of racks, the pressure distribution plate (2) is located below the pressing plate body, two rows of vacuum holes (21) are symmetrically arranged on the pressure distribution plate (2), the number of vacuum holes (21) in each row is multiple, and the vacuum holes (21) correspond to the gap positions of the racks.

2. The integrated circuit package die attach pad of claim 1, wherein: The positioning part (12) is further provided with a base positioning hole (122) for positioning with a base.

3. The integrated circuit package die attach pad of claim 1, wherein: The upper end surface of the pressure distribution plate (2) is provided with positioning grooves, the positioning grooves comprise first positioning grooves (22) and second positioning grooves (23) which are respectively located on the left and right sides of the pressing plate body.

4. The integrated circuit package die attach pad of claim 3, wherein: The number of the first positioning grooves (22) and the second positioning grooves (23) is both two.

5. The integrated circuit package die attach pad of claim 3, wherein: The groove bottom of the positioning grooves is provided with first positioning holes and second positioning holes, the first positioning holes are used for positioning with a base, and the second positioning holes are used for positioning with a lead frame.

6. The integrated circuit package die attach pad of claim 1, wherein: The pressing plate body is made of ceramic or metal composite material.

7. The integrated circuit package die attach pad of claim 1, wherein: The distance between the two rows of vacuum holes (21) is 1.5-3 mm.

8. The integrated circuit package die attach pad of claim 7, wherein: The distance between the two rows of vacuum holes (21) is 2 mm.

9. The integrated circuit package die attach pad of claim 1, wherein: The aperture of the vacuum holes (21) is 0.1-0.3 mm.

10. The integrated circuit package die attach pad of claim 9, wherein: The aperture of the vacuum holes (21) is 0.2 mm.

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